![]() |
|
If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
Datasheet File OCR Text: |
RoHS Compliant GaAs MMIC Voltage Variable Absorptive Attenuator DC - 12 GHz Features * * * * * * * * Single or Dual Bias Control Easily Cascadable Small Size Attenuation Flatness DC - 12 GHz 0.2 dB Low Control Current Consumption Low Phase Shift Up to 20 dB Matched Attenuation with Dual Bias RoHS* Compliant MAAA2000G V3 Functional Schematic Description M/A-COM's MAAA2000G is a broadband GaAs MESFET MMIC voltage variable absorptive attenuator. Typical applications are for WLAN IEEE 802.11a+b/g, WiMAX IEEE 802.16, and MIMO. Other applications include test equipment requiring ultra fast switching speed. The MAAA2000G is fabricated using a 1.0 micro gate length GaAs MESFET process. The process features full chip passivation for increased performance and reliability. Ordering Information Part Number MAAA2000G 1. Die quantity varies. Package DIE 1 Electrical Specifications: 0/-5 Vdc, 50 , -55C to +85C Parameter Insertion Loss 2 Test Conditions DC - 1.0 GHz DC - 2.0 GHz DC - 12.0 GHz DC - 1.0 GHz DC - 2.0 GHz DC - 12.0 GHz DC - 2.0 GHz DC - 2.0 GHz 2.0 - 12.0 GHz 10% to 90% RF, 90% to 10% RF 50% Control to 90% RF, 50% Control to 10% RF In-band 0.5 - 4.0 GHz 0 to -0.2 V -5 V Units dB dB dB Ratio Ratio Ratio dB dB dB ns ns mV dBm A A Min. -- -- -- -- -- -- 23 40 12 -- -- -- -- -- -- Typ. -- -- -- -- -- -- -- -- -- 7 10 20 15 -- 50 Max. 1.2 1.4 1.5 1.5:1 1.5:1 1.8:1 -- -- -- -- -- -- -- 9 100 VSWR Relative Attenuation (Matched) (Reflective) (Matched) Trise, Tfall Ton, Toff Transients Input 1 dB Compression VIN Low VIN High 2. Loss changes 0.00025 dB/C (-55C to +85C.) 1 *Restrictions on Hazardous Substances, European Union Directive 2002/95/EC. M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. M/A-COM makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does M/A-COM assume any liability whatsoever arising out of the use or application of any product(s) or information. * North America Tel: 800.366.2266 / Fax: 978.366.2266 * Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 * Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 Visit www.macom.com for additional data sheets and product information. RoHS Compliant GaAs MMIC Voltage Variable Absorptive Attenuator DC - 12 GHz Typical Performance Curves @ 25C Insertion Loss 2.0 MAAA2000G V3 Isolation 55 45 1.5 35 1.0 25 0.5 15 0.0 0 2 4 6 8 10 12 5 0 2 4 6 8 10 12 Frequency (GHz) Frequency (GHz) VSWR 1.8 Attenuation @ 12 GHz 50 40 1.6 30 1.4 20 1.2 VB Series VA Shunt Matched Attn. below 23.5 dB 10 1.0 0 2 4 6 8 10 12 0 -5 -4 -3 -2 -1 0 Frequency (GHz) Gate Voltage Attenuation @ 12 GHz 14 12 10 8 6 4 2 0 -5 -4 -3 -2 -1 0 VB Series VA Shunt Absolute Maximum Ratings 3,4 Parameter Control Voltage Max Input RF Power (500 MHz - 12 GHz) Storage Temperature Max Operating Temperature 3. 4. Absolute Maximum -8.5 VDC +34 dBm -65C to +175C +175C Exceeding any one or combination of these limits may cause permanent damage to this device. M/A-COM does not recommend sustained operation near these survivability limits. Gate Voltage 2 M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. M/A-COM makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does M/A-COM assume any liability whatsoever arising out of the use or application of any product(s) or information. * North America Tel: 800.366.2266 / Fax: 978.366.2266 * Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 * Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 Visit www.macom.com for additional data sheets and product information. RoHS Compliant GaAs MMIC Voltage Variable Absorptive Attenuator DC - 12 GHz Handling Procedures Permanent damage to the MAAA2000G may occur if the following precautions are not adhered to: Cleanliness - The MAAA2000G should be handled in a clean environment. DO NOT attempt to clean assembly after the MAAA2000G is installed. B. Static Sensitivity - All die handling equipment and personnel should be DC grounded. C. Transients - Avoid instrument and power supply transients while bias is connected to the MAAA2000G. Use shielded signal and bias cables to minimize inductive pick-up. D. Bias - Apply voltage to either control port A1/B2 or A2/B1 only when the other is grounded. Neither port should be allowed to "float". E. General Handling - It is recommended that the MAAA2000G chip be handled along the long side of the die with a sharp pair of bend tweezers. DO NOT touch the surface of the chip with fingers or tweezers. A. MAAA2000G V3 Bonding Ball or wedge bond with 1.0 mil diameter pure gold wire. Thermosonic bonding with a nominal stage temperature of 150C and a ball bonding force of 40 to 50 grams or wedge bonding force of 18 to 22 grams is recommended. Ultrasonic energy and time should be adjusted to the minimum levels necessary to achieve reliable wirebonds. B. Wirebonds should be started on the chip and terminated on the package. GND bonds should be as short as possible; at least three and no more than four bond wires from ground pads to package are recommended. A. Mounting The MAAA2000G is back-metallized with Pd/Ni/Au (100/1,000/10,000A) metallization. It can be die-mounted using Au/Sn eutectic preforms or a thermally conductive epoxy. The package surface should be clean and flat before attachment. Eutectic Die Attach: A. An 80/20 Au/Sn preform is recommended with a work surface temperature of approximately 255C and a tool temperature of 265C. When hot 90/5 nitrogen/hydrogen gas is applied, solder temperature should be approximately 290C. B. DO NOT expose the MAAA2000G to a temperature greater than 320C for more than 20 seconds. No more than 3 seconds of scrubbing should be required for attachment. Epoxy Die Attach: A. Apply a minimum amount of epoxy and place the MAAA2000G into position. A thin epoxy fillet should be visible around the perimeter of the die. B. Cure epoxy per manufacturer's recommended schedule. C. Electrically conductive epoxy is recommended but is not required. 3 M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. M/A-COM makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does M/A-COM assume any liability whatsoever arising out of the use or application of any product(s) or information. * North America Tel: 800.366.2266 / Fax: 978.366.2266 * Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 * Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 Visit www.macom.com for additional data sheets and product information. |
Price & Availability of MAAA2000G
![]() |
|
|
All Rights Reserved © IC-ON-LINE 2003 - 2022 |
[Add Bookmark] [Contact Us] [Link exchange] [Privacy policy] |
Mirror Sites : [www.datasheet.hk]
[www.maxim4u.com] [www.ic-on-line.cn]
[www.ic-on-line.com] [www.ic-on-line.net]
[www.alldatasheet.com.cn]
[www.gdcy.com]
[www.gdcy.net] |