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WINCOM TECH Co., Ltd.
Product Specification
MB-TFT-35-S4-S
CUSTOMER CUSTOMER PART NO. APPROVED BY DATE
Approved For Specifications
n
Approved For Specifications & Sample CHECKED BY ORGANIZED BY
APPROVED BY
MB-TFT-35-S4-S
RECORD OF REVISION
Version A Contents Original Date January. 2007 Note
Company Confidential Ver All Rights Reserved(c)WINCOM
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MB-TFT-35-S4-S
1 Feature
This single-display module is suitable for cell phone application. The MainLCD adopts one backlight with High brightness 6-lamps white LED. (1) Construction: 3.5" a-Si color TFT-LCD, White LED Backlight, and FPC. (2) Main LCD: 2.1 Amorphous-TFT 3.5-inch display, transmissive, normally white type, and 6 o'clock. 2.2 320(RGB) X240 dots Matrix. 2.3 Narrow-contact ledge technique. 2.4 Main LCD Driver IC: HX8218C01 x 1 and HX8615A x 1. 2.5 Real 16.7M colors display. (3) Low cross talk by frame rate modulation. (4) Direct data display with display RAM. (5) Partial display function: You can save power by limiting the display space. (6) RGB interface. (7) Abundant command functions: Area scroll function Display direction switching function Power saving function (8) Video signal interface: Parallel RGB. Electric volume control function: you are able to program the temperature compensation function
2 Mechanical specifications
Dimensions and weight Item External shape dimensions Pixel size Main LCD Active area Specifications 76.9(W) x 63.9 (H) x 3.16(D) 0.073 (W) x 0.219(H) 70.08 (W) x 52.56 (H) Unit mm mm mm
3 Absolute max Ratings and environment
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MB-TFT-35-S4-S
o
3-1 Absolute max Ratings Item Power supply voltage Power supply voltage Input voltage 3-2 Environment Item Storage temperature Operating temperature
o
(Ta=25 C, GND=0V) Min. -0.3 -0.3 -0.3 Max. +7.0 +7.0 VDD+0.3 Unit V V V Remarks
Symbol VDD VCC VIN
Specifications
o
Max. +80 C
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Min. -30 C
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Remarks Note 1: Non-condensing Note 1: Non-condensing
Max. +70 C
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Min. -20 C
1Ta+40 CMax.85%RH
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Ta+40 CThe max. Humidity should not exceed the
o
humidity with 40 C 85%RH.
4 Electrical specifications
o
4-1 Electrical characteristics of LCM Item Power supply S-IC High-level input voltage S-IC Low-level input voltage G-IC High-level input voltage G-IC Low-level input voltage Consumption current of LED
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(IOV =3.0V, Ta=25 C)
CC
Symbol VCC VIHC VILC VIHC VILC VLED-ON
Conditions
MIN. +3 0.7 IOV 0 0.7 IOV 0
CC
TYP. +3.3
MAX. +3.6 IOV
CC
Unit V V V V V V
0.3 IOV IOV
CC
CC
CC
0.3 IOV 20.4 21.6
CC
I =20 mA
F
-
4
MB-TFT-35-S4-S 4-2 LED back light specification Item
Forward voltage Forward current Power Consumption Uniformity (with L/G)
Symbol
Vf If PBL Vf If
Conditions
If =20mA 6-chip series If =20mA I =20mA
f
MIN.
80%*1 3200 White
TYP. MAX.
20.4 20 408 21.6 -
Unit
V mA mW
Bare LED Luminous intensity
Luminous color Chip connection
20.4 V 20mA
cd/m2
6-chip series connection
5 Optical characteristics
Main LCD 5.1 Optical characteristics LED backlight transmissive module: Item Response time Contrast ratio Verti cal Horiz ontal Symbol Temp. Min. Std. Max. Tr +Tf CR 25 C 25 C 25 C 25 C
o o o o
Unit ms -
Conditions (Note 2) =0 , =0 (Note 4) CR10 (Note 3)
o o
240 90 110
25 300 100 120
-
Visual angle
Degree
Visual angle direction priority Brightness 5.2 CIE (x, y) chromaticity ( Ta = 25C)
6:00 250 Cd/ m2
(Note 5) VLED=20.4V, 20mA Full White pattern
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MB-TFT-35-S4-S Item Red Green Blue White Symbol X Y X Y X Y X Y Transmissive Min. Typ. Max 0.628 0.326 0.332 0.315 0.145 0.152 0.325 0.354 0.628 0.326 0.315 0.576 0.145 0.152 0.325 0.354 0.588 0.608 0.306 0.316 0.292 0.312 0.295 0.305 0.125 0.135 0.122 0.137 0.285 0.305 0.314 0.334 Conditions
NOTE 1: Optical characteristic measurement system
NOTE 2: Response time definition
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MB-TFT-35-S4-S
NOTE 3:, definition
NOTE 4: Contrast definition
NOTE 5: Visual angle direction priority
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MB-TFT-35-S4-S
6 Block Diagram
Block diagram (Main LCD) Display format: A-Si TFT transmissive, Normally white type, 6 o'clock. Display composition: 240 x RGB x 320 dots LCD Driver: HX8218C01/HX8615A Back light: White LED x 6(I =20mA)
LED
6.1 Whole chip block diagram
Fig 6.1 Whole chip block diagram
6.2 Timing controller block diagram
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MB-TFT-35-S4-S
Fig 6.2 Timing controller block diagram
6.3 Source driver block diagram
Fig 6.3 Source driver block diagram
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MB-TFT-35-S4-S
7 Interface specifications
Pin No. 1 2 3 4 5 6 7 8 9 10 11 12~19 20~27 28~35 36 37 38 39,40 41,42 43 44,45 46 47 48 49 50,51 52 53,54 Terminal LED-K1 LED-K2 LED-A1 LED-A2 NC NC M RESET CS SCL SDI B0~B7 G0~G7 R0~R7 HSYNC VSYNC DCLK VDD VCC C4 VGL NC VGH NC NC VCOM ENB GND The signal to generate Vcom Reset Chip Select Serial Clock Serial Data Blue Data Green Data Red Data Horizontal Sync input Vertical Sync input Data Clock Analog Power Digital Power Stable Capacitor connection Gate OFF Power Gate ON Power Functions LED Anode LED Anode LED Cathode LED Cathode
VCOM power Data Enable Control Ground
8 Waveform 8.1 Timing Controller Timing Chart
Clock and Data waveforms
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MB-TFT-35-S4-S ITU-R BT601
ITU-R BT656
24 bit RGB mode for 960x240
3-Wire Timing Diagram
Reset Function
The HX8216C01/HX8615A is internally initialized by RESET input. During the reset period, no instruction or GRAM data access from MPU can be accepted. The reset input must be held for at lease 1ms. Do not access the
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MB-TFT-35-S4-S GRAM or initially set the instruction until the R-C oscillation frequency is stable after power has been supplied (10ms).
9 QUALITIES AND RELIABILITY 9.1 TEST CONDITIONS
Tests should be conducted under the following conditions: Ambient temperature: 25 5C Humidity: 60 25% RH.
9.2 SAMPLING PLAN
Sampling method shall be in accordance with MIL-STD-105E, level II, normal single sampling plan.
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MB-TFT-35-S4-S
9.3 ACCEPTABLE QUALITY LEVEL
A major defect is defined as one that could cause failure to or materially reduce the usability of the unit for its intended purpose. A minor defect is one that does not materially reduce the usability of the unit for its intended purpose or is an infringement from established standards and has no significant bearing on its effective use or operation.
9.4 APPEARANCE
An appearance test should be conducted by human sight at approximately 30 cm distance from the LCD module under fluorescent light. The inspection area of LCD panel shall be within the range of following limits.
9.5 INSPECTION QUALITY CRITERIA
No Item Outline Dimension Positionfinding Dimension Assemble Dimension Criterion
01
In accord with drawing
02
In accord with drawing
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MB-TFT-35-S4-S Round type: non display 3.1 Small area LCD Unit: mm y x D0.1 0.1D0.15 D0.15 Ignore 2 0 Dimension Qualified Quantity
03
LCD black spots, white spots (Round type)
3.2Large area LCD Dimension y D0.1 x 0.1D0.15 0.15D0.20 D0.20 2 1 0 Qualified Quantity Ignore
C-STN: if D0.1, unqualified
4.1 Small area LCD Length 04 LCD black spots, white spots (Line Style) 1.0 2.0 1.0 -
Unit : mm Width 0.015 0.015W 0.025 0. 025W 0.05 D0.05 Qualified Quantity Ignore 2 1 1 According to circle
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MB-TFT-35-S4-S 4.2Large area LCD Length 2.0 1.0 CSTN: If W Width 0.015 0.015W 0.025 0.025W 0.05 D0.05 Qualified Quantity Ignore 2 1 According to circle
0.015, unqualified Ignore beyond viewing area 05 LCD Scratch Threadlike Fiber Same to NO.3 circle Sightline and surface of LCD is vertical Same to NO.3 line style It is not admissible that POL is beyond the edge of glass, else, unqualified. It is essential that POL be over the 50 percent of width of frame, else, unqualified. According to the drawing in case of special definition. Scratch Reject
06
POL
07
IC/FPC Bonding
Intensity Of Adhesion
If lower than specification, reject
Gold Fold Twist
Reject
Silicon 07 IC/FPC Bonding FPC Gold Sever
According to outline, no gold outside, seal can not be higher than LCD
Reject
08
SMT
Lack of Component Polarity Inverse
If exist, reject
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MB-TFT-35-S4-S Leak Solder Virtual Solder Short Circuit In Solder Point
If exist, reject
If exist, reject
Tin Ball
If exist, reject
Tin Acumination Height Solder Point
If visual, reject
If higher 0.5mm than component. Reject Either side higher 0.5mm than component, Reject
Height of component
X Solder Pad Component
Component Shift
D y Z X<3/4Z y.1/3D reject reject
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MB-TFT-35-S4-S 08 PCB SMT Few Tin pad
If 20 reject D Component
Component Deflection Pad Y If Component Carcass Sideways Y >1/3 D reject
If exist with visual inspection, reject A: Tin accrete the solder side completely, hollowly, Ok B: Tin accrete the solder side completely, full circle arc, ok C: Jointing include whole solder side, height of tin>50 percents of height of component, reject A: Tin accrete the solder side completely, hollowly, Ok B: height of tin > 1/3 of solder side of component, ok C: height of tin 1/3 of solder side of component, reject
Lot Tin
Few Tin
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MB-TFT-35-S4-S Normal
Jointing side
08
SMT
Short circuit Open circuit 1Rolling strake with visual inspection, forbid 2Difference of color in viewing area with visual inspection (full white redgreenblue), forbid 3Display change with visual inspection, forbid
For bid
Quality of CSTN Display
09
Light
X y White 0.05 0.05 Red 0.05 0.05 Green 0.05 0.05 Blue 0.05 0.05 According to the specification or sample customer have approved
Drive LCD under normal condition, 25 =0 =0 Test whiteredgreen blue with DMS Record
10
Color Of CIE Coordinate
In accord with product specification
Drive condition is according to specification Measure location is in Follow Picture 3Adjust brightness instrument torero, burrow against the surface of LCD, press "measure", record when the display is steady. (YOKOGAWA-3298)
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MB-TFT-35-S4-S
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Brightness
According to specification Measure location According to product specification Measure instrument ( DMS-501 )
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CR (Max)
According to specification
According to product specification Measure instrument (DMS-501)
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Response Time
According to specification Compare with the sample customer supply According to the use of product (main FPC of foldaway cell phone 6 thousand)
According to product specification Measure instrument (DMS-501)
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Viewing angle
Compare with the sample customer supply when assemble Measure instrument Bend angle: 150 Fix FPC in the casement when customer supply
15
Vibration Ring Frequency Of FPC Bend
16
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MB-TFT-35-S4-S
9.7 RELIABILITY
Test Item High Temperature Operation Low Temperature Operation High Temperature Storage Low Temperature Storage Humidity Test Thermal Shock Test Test Conditions 703C, t=96 hrs -203C, t=96 hrs 803C, t=96 hrs -303C, t=96 hrs 40C, Humidity 90%, 96 hrs -30C ~ 25C ~ 80C 30 min. 5 min. 30 min. (1 cycle) Total 5 cycle Sweep frequency10~55~10 Hz/1min Amplitude: 0.75mm Test direction: X.Y.Z/3 axis Duration: 30min/each axis 150pF 330 ohm +8kV, 10times air discharge Note 1,2 1,2 1,2 1,2 1,2
Vibration Test (Packing)
2
Static Electricity
Note 1: Condensation of water is not permitted on the module. Note 2: The module should be inspected after 1-hour storage in normal conditions (15-35C, 45-65%RH). Definitions of life end point: l Current drain should be smaller than the specific value. l Function of the module should be maintained. l Appearance and display quality should not have degraded noticeably. l Contrast ratio should be greater than 50% of the initial value.
10 USE PRECAUTIONS 10.1 Handling precautions
1) The polarizing plate may break easily so be careful when handling it. Do not touch, press or rub it with a hard-material tool like tweezers. 2) Do not touch the polarizing plate surface with bare hands so as not to make it dirty. If the surface or other related part of the polarizing plate is dirty, soak a soft cotton cloth or chamois leather in benzine and wipe off with it. Do not use chemical liquids such as acetone, toluene and isopropyl alcohol. Failure to do so may bring chemical reaction phenomena and deteriorations. 3) Remove any spit or water immediately. If it is left for hours, the suffered part may deform or decolorize.
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MB-TFT-35-S4-S 4) If the LCD element breaks and any LC stuff leak, do not suck or lick it. Also if LC stuff is stuck on your skin or clothing, wash thoroughly with soap and water immediately.
10.2 Installing precautions
1) The PCB has many ICs that may be damaged easily by static electricity. To prevent breaking by static electricity from the human body and clothing, earth the human body properly using the high resistance and discharge static electricity during the operation. In this case, however, the resistance value should be approx. 1M and the resistance should be placed near the human body rather than the ground surface. When the indoor space is dry, static electricity may occur easily so be careful. We recommend the indoor space should be kept with humidity of 60% or more. When a soldering iron or other similar tool is used for assembly, be sure to earth it. 2) When installing the module and ICs, do not bend or twist them. Failure to do so may crack LC element and cause circuit failure. 3) To protect LC element, especially polarizing plate, use a transparent protective plate (e.g., acrylic plate, glass etc) for the product case. 4) Do not use an adhesive like a both-side adhesive tape to make LCD surface (polarizing plate) and product case stick together. Failure to do so may cause the polarizing plate to peel off.
10.3 Storage precautions
1) Avoid a high temperature and humidity area. Keep the temperature between 0C and 35C and also the humidity under 60%. 2) Choose the dark spaces where the product is not exposed to direct sunlight or fluorescent light. 3) Store the products as they are put in the boxes provided from us or in the same conditions as we recommend.
10.4 Operating precautions
1) Do not boost the applied drive voltage abnormally. Failure to do so may break ICs. When applying power voltage, check the electrical features beforehand and be careful. Always turn off the power to the LC module controller before removing or inserting the LC module input connector. If the input connector is removed or inserted while the power is turned on, the LC module internal circuit may break. 2) The display response may be late if the operating temperature is under the normal standard, and the display may be out of order if it is above the normal
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MB-TFT-35-S4-S standard. But this is not a failure; this will be restored if it is within the normal standard. 3) The LCD contrast varies depending on the visual angle, ambient temperature, power voltage etc. Obtain the optimum contrast by adjusting the LC dive voltage. 4) When carrying out the test, do not take the module out of the lowtemperature space suddenly. Failure to do so will cause the module condensing, leading to malfunctions. 5) Make certain that each signal noise level is within the standard (L level: 0.2Vdd or less and H level: 0.8Vdd or more) even if the module has functioned properly. If it is beyond the standard, the module may often malfunction. In addition, always connect the module when making noise level measurements. 6) The CMOS ICs are incorporated in the module and the pull-up and pulldown function is not adopted for the input so avoid putting the input signal open while the power is ON. 7) The characteristic of the semiconductor element changes when it is exposed to light emissions, therefore ICs on the LCD may malfunction if they receive light emissions. To prevent these malfunctions, design and assemble ICs so that they are shielded from light emissions. 8) Crosstalk occurs because of characteristics of the LCD. In general, crosstalk occurs when the regularized display is maintained. Also, the LC drive voltage affects crosstalk. Design the contents of the display, considering crosstalk.
10.5 Other
1) Do not disassemble or take the LC module into pieces. The LC modules once disassembled or taken into pieces are not the guarantee articles. 2) The residual image may exist if the same display pattern is shown for hours. This residual image, however, disappears when another display pattern is shown or the drive is interrupted and left for a while. But this is not a problem on reliability.
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MB-TFT-35-S4-S
1 4
CUSTOMER'S CODE: ()
2 5 6 SPECIFICATION FOR BACKLIGHT
()
3
7

EDITION: () EDITION: ()
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Date:
WINCOM TECH CO., LTD.
06/09/01
Page:
1/1
M.B MODEL NO.:
55.360.2
2.07
D
72.880.2 *76.90.1
D
C
*63.90.1
C
11 MECHANIC DRAWING
B
B
Curcuit Diagram:
A
CIRCUIT DIAGRAM LED: 6 DIES
A
()DATE () REV
Customer Name:
Approval Date:
Approved by:
DESCRIPTION
()
()DATE () REV
DESCRIPTION
()
Please Confirm This Drawing On/Before

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3
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Company Confidential Ver All Rights Reserved(c)WINCOM
R O S H
NOTES: 1.6-Chip WHITE LED 2.20mA/Chip 3.250CD/m 80% 4.:0.2 5.-20C ~ 70C 6.-30C ~ 80C 7. 8.
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2.01

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