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| MCP102/103/121/131 Micropower Voltage Supervisors Features * Ultra low supply current: 1.75 A (steady-state max.) * Precision monitoring options of: - 1.90V, 2.32V, 2.63V, 2.93V, 3.08V, 4.38V and 4.63V * Resets microcontroller in a power-loss event * RST pin (Active-low): - MCP121: Active-low, open-drain - MCP131: Active-low, open-drain with internal pull-up resistor - MCP102 and MCP103: Active-low, push-pull * Reset Delay Timer (120 ms delay, typ.) * Available in SOT23-3, TO-92 and SC-70 packages * Temperature Range: - Extended: -40C to +125C (except MCP1XX-195) - Industrial: -40C to +85C (MCP1XX-195 only) * Pb-free devices Package Types SOT23-3/SC-70 RST 1 MCP102/121/131 TO-92 3 VSS RST VDD VSS VDD 2 SOT23-3/SC-70 VSS 1 MCP103 3 VDD RST 2 Block Diagram VDD R (1) Comparator + - Band Gap Reference VSS Note 1: MCP131 Only Reset Delay Circuit Output Driver Applications * Critical Microcontroller and Microprocessor Power-monitoring Applications * Computers * Intelligent Instruments * Portable Battery-powered Equipment RST General Description The MCP102/103/121/131 are voltage supervisor devices designed to keep a microcontroller in reset until the system voltage has reached and stabilized at the proper level for reliable system operation. Table 1 shows the available features for these devices. TABLE 1: Device DEVICE FEATURES Output Type Reset Package Pinout Delay (typ) (Pin # 1, 2, 3) Pull-up Resistor 120 ms 120 ms 120 ms No No RST, VDD, VSS VSS, RST, VDD RST, VDD, VSS RST, VDD, VSS VOUT, VSS, VDD VOUT, VSS, VDD See MCP111/112 Data Sheet (DS21889) See MCP111/112 Data Sheet (DS21889) Comment MCP102 Push-pull MCP103 Push-pull No No MCP121 Open-drain External MCP111 Open-drain External MCP112 Push-Pull No MCP131 Open-drain Internal (~95 k) 120 ms (c) 2005 Microchip Technology Inc. DS21906B-page 1 MCP102/103/121/131 1.0 ELECTRICAL CHARACTERISTICS Notice: Stresses above those listed under "Maximum Ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. Absolute Maximum Ratings VDD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7.0V Input current (VDD) . . . . . . . . . . . . . . . . . . . . . . . . . . . .10 mA Output current (RST) . . . . . . . . . . . . . . . . . . . . . . . . . .10 mA Rated Rise Time of VDD . . . . . . . . . . . . . . . . . . . . . . 100V/s All inputs and outputs (except RST) w.r.t. VSS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.6V to (VDD + 1.0V) RST output w.r.t. VSS . . . . . . . . . . . . . . . . . . . -0.6V to 13.5V Storage temperature . . . . . . . . . . . . . . . . . . -65C to + 150C Ambient temp. with power applied . . . . . . . -40C to + 125C Maximum Junction temp. with power applied . . . . . . . . 150C ESD protection on all pins . . . . . . . . . . . . . . . . . . . . . . . . . 2 kV DC CHARACTERISTICS Electrical Specifications: Unless otherwise indicated, all limits are specified for: VDD = 1V to 5.5V, RPU = 100 k (MCP121 only), TA = -40C to +125C. Parameters Operating Voltage Range Specified VDD Value to RST low Operating Current MCP102, MCP103, MCP121 MCP131 IDD Sym VDD VDD IDD Min 1.0 1.0 -- -- -- -- -- Note 1: 2: 3: 4: 5: Typ -- -- <1 -- <1 -- -- 1.75 20.0 1.75 75 90 Max 5.5 Units V V A A A A A IRST = 10 uA, VRST < 0.2V Reset Power-up Timer (tRPU) Inactive Reset Power-up Timer (tRPU) Active VDD > VTRIP and Reset Power-up Timer (tRPU) Inactive VDD < VTRIP and Reset Power-up Timer (tRPU) Inactive (Note 3) Reset Power-up Timer (tRPU) Active (Note 4) Conditions 6: Trip point is 1.5% from typical value. Trip point is 2.5% from typical value. RST output is forced low. There is a current through the internal pull-up resistor. This includes the current through the internal pull-up resistor and the reset power-up timer. This specification allows this device to be used in PICmicro(R) microcontroller applications that require In-Circuit Serial ProgrammingTM (ICSPTM) (see device-specific programming specifications for voltage requirements). This specification DOES NOT allow a continuos high voltage to be present on the open-drain output pin (VOUT). The total time that the VOUT pin can be above the maximum device operational voltage (5.5V) is 100s. Current into the VOUT pin should be limited to 2 mA and it is recommended that the device operational temperature be maintained between 0C to 70C (+25C preferred). For additional information, please refer to Figure 2-33. This parameter is established by characterization and not 100% tested. DS21906B-page 2 (c) 2005 Microchip Technology Inc. MCP102/103/121/131 DC CHARACTERISTICS (CONTINUED) Electrical Specifications: Unless otherwise indicated, all limits are specified for: VDD = 1V to 5.5V, RPU = 100 k (MCP121 only), TA = -40C to +125C. Parameters VDD Trip Point MCP1XX-195 Sym VTRIP Min 1.872 1.853 MCP1XX-240 2.285 2.262 MCP1XX-270 2.591 2.564 MCP1XX-300 2.886 2.857 MCP1XX-315 3.034 3.003 MCP1XX-450 4.314 4.271 MCP1XX-475 4.561 4.514 VDD Trip Point Tempco Threshold Hysteresis (min. = 1%, max = 6%) MCP1XX-195 MCP1XX-240 MCP1XX-270 MCP1XX-300 MCP1XX-315 MCP1XX-450 MCP1XX-475 RST Low-level Output Voltage RST High-level Output Voltage (MCP102 and MCP103 only) Internal Pull-up Resistor (MCP131 only) Open-drain High Voltage on Output (MCP121 only) VOL VOH RPU VODH TTPCO VHYS -- 0.019 0.023 0.026 0.029 0.031 0.044 0.046 -- VDD - 0.6 -- -- Typ 1.900 1.900 2.320 2.320 2.630 2.630 2.930 2.930 3.080 3.080 4.380 4.380 4.630 4.630 100 -- -- -- -- -- -- -- -- -- 95 -- Max 1.929 1.948 2.355 2.378 2.670 2.696 2.974 3.003 3.126 3.157 4.446 4.490 4.700 4.746 -- 0.114 0.139 0.158 0.176 0.185 0.263 0.278 0.4 -- -- 13.5 (5) Units V V V V V V V V V V V V V V ppm/C V V V V V V V V V k V IOL = 500 A, VDD = VTRIP(MIN) IOH = 1 mA, For MCP102/MCP103 only (push-pull output) VDD = 5.5V VDD = 3.0V, Time voltage > 5.5V applied 100s, current into pin limited to 2 mA, 25C operation recommended (Note 5, Note 6) TA = +25C Conditions TA = +25C (Note 1) TA = -40C to +85C (Note 2) TA = +25C (Note 1) Note 2 TA = +25C (Note 1) Note 2 TA = +25C (Note 1) Note 2 TA = +25C (Note 1) Note 2 TA = +25C (Note 1) Note 2 TA = +25C (Note 1) Note 2 Open-drain Output Leakage Current (MCP121 only) Note 1: 2: 3: 4: 5: IOD -- 0.1 -- A 6: Trip point is 1.5% from typical value. Trip point is 2.5% from typical value. RST output is forced low. There is a current through the internal pull-up resistor. This includes the current through the internal pull-up resistor and the reset power-up timer. This specification allows this device to be used in PICmicro(R) microcontroller applications that require In-Circuit Serial ProgrammingTM (ICSPTM) (see device-specific programming specifications for voltage requirements). This specification DOES NOT allow a continuos high voltage to be present on the open-drain output pin (VOUT). The total time that the VOUT pin can be above the maximum device operational voltage (5.5V) is 100s. Current into the VOUT pin should be limited to 2 mA and it is recommended that the device operational temperature be maintained between 0C to 70C (+25C preferred). For additional information, please refer to Figure 2-33. This parameter is established by characterization and not 100% tested. (c) 2005 Microchip Technology Inc. DS21906B-page 3 MCP102/103/121/131 VTRIP 1V VDD tRPU tRPD VOH 1V RST tRT VOL FIGURE 1-1: Timing Diagram. AC CHARACTERISTICS Electrical Specifications: Unless otherwise indicated, all limits are specified for: VDD = 1V to 5.5V, RPU = 100 k (MCP121 only), TA = -40C to +125C. Parameters VDD Detect to RST Inactive VDD Detect to RST Active Sym tRPU tRPD Min 80 -- Typ 120 130 Max 180 -- Units ms s Conditions Figure 1-1 and CL = 50 pF VDD ramped from VTRIP(MAX) + 250 mV down to VTRIP(MIN) - 250 mV, per Figure 1-1, CL = 50 pF (Note 1) For RST 10% to 90% of final value per Figure 1-1, CL = 50 pF (Note 1) RST Rise Time After RST Active (MCP102 and MCP103 only) Note 1: tRT -- 5 -- s These parameters are for design guidance only and are not 100% tested. TEMPERATURE CHARACTERISTICS Electrical Specifications: Unless otherwise noted, all limits are specified for: VDD = 1V to 5.5V, RPU = 100 k (MCP121 only), TA = -40C to +125C. Parameters Temperature Ranges Specified Temperature Range Specified Temperature Range Maximum Junction Temperature Storage Temperature Range Package Thermal Resistances Thermal Resistance, 3L-SOT23 Thermal Resistance, 3L-SC-70 Thermal Resistance, 3L-TO-92 JA JA JA -- -- -- 336 340 131.9 -- -- -- C/W C/W C/W TA TA TJ TA -40 -40 -- -65 -- -- -- -- +85 +125 +150 +150 C C C C MCP1XX-195 Except MCP1XX-195 Sym Min Typ Max Units Conditions DS21906B-page 4 (c) 2005 Microchip Technology Inc. MCP102/103/121/131 2.0 Note: TYPICAL PERFORMANCE CURVES The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. Note: Unless otherwise indicated, all limits are specified for: VDD = 1V to 5.5V, RPU = 100 k (MCP121 only; see Figure 4-1), TA = -40C to +125C. 1.8 1.6 1.4 1.2 1 0.8 0.6 0.4 0.2 0 100 120 -40 -20 0 20 40 60 80 Temperature (C) 16 MCP102-195 5.5V 5.0V 4.0V 2.8V 2.1V 1.7V 1.0V MCP102-195 5.5V 5.0V 14 12 IDD (uA) 10 8 6 4 2 0 100 120 120 -40 -20 0 20 40 60 80 4.0V 2.8V 2.1V IDD (uA) 140 Temperature (C) FIGURE 2-1: IDD vs. Temperature (Reset Power-up Timer Inactive) (MCP102-195). 35 30 25 IDD (uA) 20 15 10 5 0 100 120 140 -40 -20 0 20 40 60 80 1.0V 3.3V, 4.0V, 5.0V, 5.5V FIGURE 2-4: IDD vs. Temperature (Reset Power-up Timer Active) (MCP102-195). 80 MCP131-315 2.9V 70 60 IDD (uA) 50 40 30 20 10 0 MCP131-315 5.5V 5.0V 4.5V 4.0V 3.3V 100 Temperature (C) Temperature (C) FIGURE 2-2: IDD vs. Temperature (Reset Power-up Timer Inactive) (MCP131-315). 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 FIGURE 2-5: IDD vs. Temperature (Reset Power-up Timer Active) (MCP131-315). 16 MCP121-450 5.5V MCP121-450 5.5V 5.0V 4.8V 4.6V 14 12 10 8 6 4 2 0 5.0V 4.8V 4.6V 3.0V 1.0V IDD (uA) 4.1V 0 20 40 60 80 100 120 140 IDD (uA) 0 20 40 60 80 100 120 Temperature (C) Temperature (C) FIGURE 2-3: IDD vs. Temperature (Reset Power-up Timer Inactive) (MCP121-450). FIGURE 2-6: IDD vs. Temperature (Reset Power-up Timer Active) (MCP121-450). (c) 2005 Microchip Technology Inc. DS21906B-page 5 140 -40 -20 -40 -20 140 -40 -20 0 20 40 60 80 140 MCP102/103/121/131 Note: Unless otherwise indicated, all limits are specified for: VDD = 1V to 5.5V, RPU = 100 k (MCP121 only; see Figure 4-1), TA = -40C to +125C. 1.8 1.6 1.4 1.2 1 0.8 0.6 0.4 0.2 0 16 MCP102-195 +25C +125C +85C 0C -40C 14 12 IDD (uA) 10 8 6 4 2 0 MCP102-195 -40C IDD (uA) 0C +25C +70C +85C +125C Device in Reset tRPU inactive 1.0 2.0 3.0 VDD (V) 4.0 5.0 6.0 1.0 2.0 3.0 VDD (V) 4.0 5.0 6.0 FIGURE 2-7: IDD vs. VDD (Reset Power-up Timer Inactive) (MCP102-195). 35 30 25 IDD (uA) 15 10 5 0 -5 1.0 2.0 3.0 VDD (V) 4.0 5.0 6.0 +125C +70 C +85C MCP131-315 FIGURE 2-10: IDD vs.VDD (Reset Power-up Timer Active) (MCP102-195). 80 0C, +25C -40C 70 60 IDD (uA) 50 40 30 20 10 0 MCP131-315 -40C, 0C 20 Device in Reset tRPU inactive +25C +70C +85C +125C 1.0 2.0 3.0 VDD (V) 4.0 5.0 6.0 FIGURE 2-8: IDD vs. VDD (Reset Power-up Timer Inactive) (MCP131-315). 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 FIGURE 2-11: IDD vs.VDD (Reset Power-up Timer Active) (MCP131-315). 16 14 12 10 8 6 4 2 0 -2 MCP121-450 MCP121-450 +125C IDD (uA) +85C 0C -40C +25C 1.0 2.0 3.0 VDD (V) 4.0 5.0 6.0 IDD (uA) +70C Device in Reset tRPU inactive -40C 0C +25C +70C +85C +125C 1.0 2.0 3.0 VDD (V) 4.0 5.0 6.0 FIGURE 2-9: IDD vs. VDD (Reset Power-up Timer Inactive) (MCP121-450). FIGURE 2-12: IDD vs.VDD (Reset Power-up Timer Active) (MCP121-450). DS21906B-page 6 (c) 2005 Microchip Technology Inc. MCP102/103/121/131 Note: Unless otherwise indicated, all limits are specified for: VDD = 1V to 5.5V, RPU = 100 k (MCP121; see Figure 4-1), TA = -40C to +125C. 0.120 1.945 1.940 1.935 1.930 1.925 1.920 1.915 1.910 1.905 1.900 1.895 VTRIP, increasing VDD VHYS, Hysteresis VTRIP, decreasing VDD -60 -10 40 0.050 0.045 0.040 0.035 0.030 0.025 0.020 0.015 0.010 0.005 MCP102-195 0.000 90 140 0.100 0.080 VOL (V) Hyst (V) 0.060 0.040 0.020 0.000 MCP102-195 VDD = 1.7V +125C +85C +70C VTRIP (V) +25C 0C -40C -0.020 0.00 0.25 0.50 IOL (mA) 0.75 1.00 Temperature (C) FIGURE 2-13: VTRIP vs. Temperature vs. Hysteresis (MCP102-195). FIGURE 2-16: VOL vs. IOL (MCP102-195 @ VDD = 1.7V). 0.070 3.200 3.180 3.160 VTRIP (V) 3.140 3.120 3.100 3.080 3.060 VTRIP, increasing VDD -60 0.108 0.106 0.104 VHYS, Hysteresis 0.102 0.100 0.098 0.096 VTRIP, decreasing VDD 0.094 0.092 MCP131-315 0.090 -10 40 90 140 Temperature (C) 0.060 0.050 VOL (V) Hyst (V) 0.040 0.030 0.020 0.010 MCP131-315 VDD = 2.9V +125C +85C +70C 0C +25C -40C 0.000 0.00 0.25 0.50 IOL (mA) 0.75 1.00 FIGURE 2-14: VTRIP vs. Temperature vs. Hysteresis (MCP131-315). 4.550 4.500 VTRIP (V) 4.450 4.400 4.350 4.300 0.190 0.180 0.170 VTRIP, increasing VDD 0.160 VHYS, Hysteresis 0.150 0.140 VTRIP, decreasing VDD 0.130 0.120 0.110 MCP121-450 0.100 -60 -20 20 60 100 140 Temperature (C) FIGURE 2-17: VOL vs. IOL (MCP131-315 @ VDD = 2.9V). 0.060 0.050 MCP121-450 VDD = 4.1V +125C +70C +85C Hyst (V) 0.040 VOL (V) 0.030 0.020 0.010 +25C 0C -40C 0.000 0.00 0.25 0.50 IOL (mA) 0.75 1.00 FIGURE 2-15: VTRIP vs. Temperature vs. Hysteresis (MCP121-450). FIGURE 2-18: VOL vs. IOL (MCP121-450 @ VDD = 4.1V). (c) 2005 Microchip Technology Inc. DS21906B-page 7 MCP102/103/121/131 Note: Unless otherwise indicated, all limits are specified for: VDD = 1V to 5.5V, RPU = 100 k (MCP121 only; see Figure 4-1), TA = -40C to +125C. 0.140 0.120 0.100 VOL (V) 0.080 0.060 0.040 0.020 IOL = 0.00 mA IOL = 0.50 mA IOL = 0.25 mA MCP102-195 VDD = 1.7 V 2.110 IOL = 1.00 mA IOL = 0.75 mA 2.090 2.070 VOH (V) 2.050 2.030 2.010 1.990 1.970 120 1.950 0.00 0.25 0.50 IOL (mA) +125C +85C MCP102-195 VDD = 2.1V 0C -40C +70C +25C 0.000 -40 0 40 Temperature (C) 80 0.75 1.00 FIGURE 2-19: VOL vs. Temperature (MCP102-195 @ VDD = 1.7V). 0.070 0.060 0.050 VOL (V) 0.040 0.030 0.020 0.010 0.000 -40 0 40 Temperature (C) 80 120 IOL = 0.25 mA MCP131-315 VDD = 2.9V IOL = 1.00 mA FIGURE 2-22: VOH vs. IOL (MCP102-195 @ VDD = 2.1V). IOL = 0.75 mA IOL = 0.50 mA IOL = 0.00 mA FIGURE 2-20: VOL vs. Temperature (MCP131-315 @ VDD = 2.9V). 0.060 0.050 0.040 VOL (V) 0.030 0.020 0.010 0.000 -40 0 40 Temperature (C) 80 120 MCP121-450 VDD = 4.1V IOL = 1.00 mA IOL = 0.75 mA IOL = 0.50 mA IOL = 0.25 mA IOL = 0.00 mA FIGURE 2-21: VOL vs. Temperature (MCP121-450 @ VDD = 4.1V). DS21906B-page 8 (c) 2005 Microchip Technology Inc. MCP102/103/121/131 Note: Unless otherwise indicated, all limits are specified for: VDD = 1V to 5.5V, RPU = 100 k (MCP121 only; see Figure 4-1), TA = -40C to +125C. 300 250 tRPD (s) 200 150 100 50 0 -40 VDD decreasing from: 5V - 0V VDD decreasing from: 5V - 1.7V MCP102-195 160 150 tRPU (s) 140 130 120 110 100 VDD increasing from: 0V - 2.1V VDD increasing from: 0V - 2.8V MCP102-195 VDD decreasing from: VTRIP(max) + 0.25V to VTRIP(min) - 0.25V VDD increasing from: 0V - 4.0V VDD increasing from: 0V - 5.5V -15 10 35 60 Temperature (C) 85 110 -40 -15 10 35 60 85 110 Temperature (C) FIGURE 2-23: (MCP102-195). 250 tRPD vs. Temperature FIGURE 2-26: (MCP102-195). 160 tRPU vs. Temperature VDD decreasing from: VTRIP(max) + 0.25V to VTRIP(min) - 0.25V MCP131-315 200 tRPD (s) 150 100 50 0 -40 -15 10 35 60 85 110 Temperature (C) VDD decreasing from: 5V - 0V VDD decreasing from: 5V - 2.7V 150 tRPU (s) 140 130 120 110 100 -40 -15 VDD increasing from: 0V - 3.3V VDD increasing from: 0V - 4.0V MCP131-315 VDD increasing from: 0V - 4.5V VDD increasing from: 0V - 5.5V 10 35 60 Temperature (C) 85 110 FIGURE 2-24: (MCP131-315). 38 37.5 tRT (s) 37 36.5 36 35.5 35 -40 -15 tRPD vs. Temperature FIGURE 2-27: (MCP131-315). 145 tRPU vs. Temperature MCP121-450 VDD increasing from: 0V - 4.6V VDD increasing from: MCP121-450 140 135 tRPU (s) 130 125 120 VDD increasing from: 0V - 4.8V 0V - 4.8V VDD increasing from: 0V - 5.0V VDD increasing from: 0V - 5.5V VDD increasing from: 0V - 5.0V VDD increasing from: 0V - 5.5V 115 110 10 35 60 85 110 -40 -15 10 35 60 85 110 Temperature (C) Temperature (C) FIGURE 2-25: (MCP121-450). tRPD vs. Temperature FIGURE 2-28: (MCP121-450). tRPU vs. Temperature (c) 2005 Microchip Technology Inc. DS21906B-page 9 MCP102/103/121/131 Note: Unless otherwise indicated, all limits are specified for: VDD = 1V to 5.5V, RPU = 100 k (MCP121 only; see Figure 4-1), TA = -40C to +125C. 0.45 0.4 0.35 0.3 tRT (s) 0.25 0.2 0.15 0.1 0.05 0 -40 -15 10 35 60 85 110 Temperature (C) VDD increasing from: 0V - 5.5V VDD increasing from: 0V - 4.0V VDD increasing from: 0V - 5.0V Transient Duration (S) VDD increasing from: 0V - 2.1V MCP102-195 VDD increasing from: 0V - 2.8V 1400 MCP121-450 1200 1000 800 MCP102-195 600 400 200 MCP131-315 0 0.001 0.01 0.1 VTRIP(Min) - VDD 1 10 FIGURE 2-29: (MCP102-195). 45 43 41 39 37 35 33 31 29 27 25 tRT vs. Temperature FIGURE 2-32: Transient Duration vs. VTRIP (min) - VDD. 10m 1m 100 10 1 100n 10n 1n 100p 10p 1p 100f 1.00E-02 1.00E-03 1.00E-04 1.00E-05 1.00E-06 1.00E-07 1.00E-08 1.00E-09 1.00E-10 1.00E-11 1.00E-12 1.00E-13 VDD increasing from: 0V - 4.5V Open-Drain Leakage (A) VDD increasing from: 0V - 5.5V VDD increasing from: 0V - 5.0V tRT (s) +125C VDD increasing from: 0V - 4.0V VDD increasing from: 0V - 3.3V +25C - 40C MCP131-315 -40 -15 10 35 60 85 110 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 Temperature (C) Pull-Up Voltage (V) FIGURE 2-30: (MCP131-315). 38 37.5 tRT (s) 37 36.5 36 35.5 35 -40 -15 tRT vs. Temperature FIGURE 2-33: Open-Drain Leakage Current vs. Voltage Applied to VOUT Pin (MCP121-195). MCP121-450 VDD increasing from: 0V - 4.6V VDD increasing from: 0V - 4.8V VDD increasing from: 0V - 5.0V VDD increasing from: 0V - 5.5V 10 35 60 85 110 Temperature (C) FIGURE 2-31: (MCP121-450). tRT vs. Temperature DS21906B-page 10 (c) 2005 Microchip Technology Inc. MCP102/103/121/131 3.0 PIN DESCRIPTION The descriptions of the pins are listed in Table 3-1. TABLE 3-1: Pin No. MCP102 MCP121 MCP131 1 PIN FUNCTION TABLE Symbol MCP103 1 RST Output State VDD Falling: H = VDD > VTRIP L = VDD < VTRIP VDD Rising: H = VDD > VTRIP + VHYS L = VDD < VTRIP + VHYS Function 2 3 3 2 VDD VSS Positive power supply Ground reference (c) 2005 Microchip Technology Inc. DS21906B-page 11 MCP102/103/121/131 4.0 APPLICATION INFORMATION 4.1 RST Operation For many of today's microcontroller applications, care must be taken to prevent low-power conditions that can cause many different system problems. The most common causes are brown-out conditions, where the system supply drops below the operating level momentarily. The second most common cause is when a slowly decaying power supply causes the microcontroller to begin executing instructions without sufficient voltage to sustain volitile memory (RAM), thus producing indeterminate results. Figure 4-1 shows a typical application circuit. The MCP102/103/121/131 are voltage supervisor devices designed to keep a microcontroller in reset until the system voltage has reached and stabilized at the proper level for reliable system operation. These devices also operate as protection from brown-out conditions. VDD VDD VDD RPU PICmicro(R) Microcontroller MCLR (Reset input) (Active-low) VSS The RST output pin operation determines how the device can be used and indicates when the system should be forced into reset. To accomplish this, an internal voltage reference is used to set the voltage trip point (VTRIP). Additionally, there is a hysteresis on this trip point. When the falling edge of VDD crosses this voltage threshold, the reset power-down timer (TRPD) starts. When this delay timer times out, the RST pin is forced low. When the rising-edge of VDD crosses this voltage threshold, the reset power-up timer (TRPU) starts. When this delay timer times out, the RST pin is forced high, TRPU is active and there is additional system current. The actual voltage trip point (VTRIPAC) will be between the minimum trip point (VTRIPMIN) and the maximum trip point (VTRIPMAX). The hysteresis on this trip point and the delay timer (TRPU) are to remove any "jitter" that would occur on the RST pin when the device VDD is at the trip point. Figure 4-2 shows the waveform of the RST pin as determined by the VDD voltage, while Table 4-1 shows the state of the RST pin. The VTRIP specification is for falling VDD voltages. When the VDD voltage is rising, the RST will not be driven high until VDD is at VTRIP + VHYS. Once VDD has crossed the voltage trip point, there is also a minimal delay time (TRPD) before the RST pin is driven low. 0.1 F MCP1XX RST VSS Note 1: Resistor RPU may be required with the MCP121 due to the open-drain output. Resistor RPU may not be required with the MCP131 due to the internal pull-up resistor. The MCP102 and MCP103 do not require the external pull-up resistor. TABLE 4-1: Device RST PIN STATES State of RST Pin when: VDD < VTRIP VDD > Ouput Driver VTRIP + VHYS L L L L H H H (1) FIGURE 4-1: Typical Application Circuit. MCP102 MCP103 MCP121 MCP131 Push-pull Push-pull Open-drain (1) Open-drain (2) H (2) Note 1: Requires External Pull-up resistor 2: Has Internal Pull-up resistor VDD VTRIPMAX VTRIPMIN 1V VTRIPAC + VHYSAC VTRIPAC VTRIPAC RST tRPD < 1V is outside the device specifications tRPU tRPD tRPU FIGURE 4-2: RST Operation as Determined by the VTRIP and VHYS. DS21906B-page 12 (c) 2005 Microchip Technology Inc. MCP102/103/121/131 4.2 Negative Going VDD Transients 4.3 Reset Power-up Timer (tRPU) The minimum pulse width (time) required to cause a reset may be an important criteria in the implementation of a Power-on Reset (POR) circuit. This time is referred to as transient duration, defined as the amount of time needed for these supervisory devices to respond to a drop in VDD. The transient duration time is dependant on the magnitude of VTRIP - VDD. Generally speaking, the transient duration decreases with increases in VTRIP - VDD. Figure 4-3 shows a typical transient duration vs. reset comparator overdrive, for which the MCP102/103/121/131 will not generate a reset pulse. It shows that the farther below the trip point the transient pulse goes, the duration of the pulse required to cause a reset gets shorter. Figure 2-32 shows the transient response characteristics for the MCP102/103/121/131. A 0.1 F bypass capacitor, mounted as close as possible to the VDD pin, provides additional transient immunity (refer to Figure 4-1). Figure 4-4 illustrates the device current states. While the system is powering down, the device has a low current. This current is dependent on the device VDD and trip point. When the device VDD rises through the voltage trip point (VTRIP), an internal timer starts. This timer consumes additional current until the RST pin is driven (or released) high. This time is known as the Reset Power-up Time (tRPU). Figure 4-4 shows when tRPU is active (device consuming additional current). VDD VTRIP RST tRPU 5V Supply Voltage VTRIP(MIN) - VDD VTRIP(MAX) VTRIP(MIN) Reset Power-up Timer Active tTRANS Time (s) Reset Power-up Timer Inactive Reset Power-up Timer Inactive 0V FIGURE 4-3: Example of Typical Transient Duration Waveform. See Figures 2-1, 2-2 and 2-3 See Figures 2-1, 2-2 and 2-3 See Figures 2-4, 2-5 and 2-6 FIGURE 4-4: Waveform. 4.3.1 Reset Power-up Timer EFFECT OF TEMPERATURE ON RESET POWER-UP TIMER (TRPU) The Reset Power-up timer time-out period (tRPU) determines how long the device remains in the reset condition. This is affected by both VDD and temperature. Typical responses for different VDD values and temperatures are shown in Figures 2-26, 2-27 and 2-28. (c) 2005 Microchip Technology Inc. DS21906B-page 13 MCP102/103/121/131 4.4 Using in PICmicro(R) Microcontroller, ICSPTM Applications (MCP121 only) Figure 4-5 shows the typical application circuit for using the MCP121 for voltage superviory function when the PICmicro microcontroller will be programmed via the ICSP feature. Additional information is available in TB087, "Using Voltage Supervisors with PICmicro(R) Microcontroller Systems which Implement In-Circuit Serial ProgrammingTM", DS91087. Note: It is recommended that the current into the RST pin be current limited by a 1 k resistor. VDD/VPP 0.1F VDD RPU VDD PICmicro(R) MCU MCLR (Reset Input) (Active-low) VSS MCP121 RST VSS 1 k FIGURE 4-5: Typical Application Circuit for PICmicro(R) Microcontroller with the ICSPTM feature. DS21906B-page 14 (c) 2005 Microchip Technology Inc. MCP102/103/121/131 5.0 5.1 PACKAGING INFORMATION Package Marking Information 3-Lead TO-92 XXXXXX XXXXXX XXXXXX YWWNNN Example: MCP102 195I e3 TO^^ 547256 Example: 3-Pin SOT-23 MCP1xx = Part Number MCP102 MCP103 MCP121 MCP131 MCP1xxT-195I/TT MCP1xxT-240ETT JGNN JHNN JJNN JKNN JLNN JMNN JPNN TGNN THNN TJNN TKNN TLNN TMNN TPNN LGNN LHNN LJNN LKNN LLNN LMNN LPNN KGNN KHNN KJNN KKNN KLNN KMNN KPNN XXNN MCP1xxT-270E/TT MCP1xxT-300E/TT MCP1xxT-315E/TT MCP1xxT-450E/TT MCP1xxT-475E/TT Legend: XX...X Y WW NNN e3 * Note: Customer-specific information Year code (last digit of calendar year) Week code (week of January 1 is week `01') Alphanumeric traceability code Pb-free JEDEC designator for Matte Tin (Sn) This package is Pb-free. The Pb-free JEDEC designator ( e3 ) can be found on the outer packaging for this package. In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. (c) 2005 Microchip Technology Inc. DS21906B-page 15 MCP102/103/121/131 Package Marking Information (Continued) Example: 3-Pin SC-70 MCP1xx = Part Number MCP102 MCP103 MCP121 MCP131 MCP1xxT-195I/LB BGN BHN BJN BKN BLN BMN BPN FGN FHN FJN FKN FLN FMN FPN DGN DHN DJN DKN DLN DMN DPN CGN CHN CJN CKN CLN CMN CPN MCP1xxT-240E/LB MCP1xxT-270E/LB MCP1xxT-300E/LB MCP1xxT-315E/LB Top Side Bottom Side MCP1xxT-450E/LB MCP1xxT-475E/LB XXN YWW OR Part Number MCP1xxT-195I/LB MCP1xxT-240E/LB MCP1xxT-270E/LB MCP1xxT-300E/LB MCP1xxT-315E/LB Top Side MCP1xxT-450E/LB MCP1xxT-475E/LB Example: MCP1xx = MCP102 MCP103 MCP121 MCP131 BGNN BHNN BJNN BKNN BLNN BMNN BPNN FGNN FHNN FJNN FKNN FLNN FMNN FPNN DGNN DHNN DJNN DKNN DLNN DMNN DPNN CGNN CHNN CJNN CKNN CLNN CMNN CPNN XXNN DS21906B-page 16 (c) 2005 Microchip Technology Inc. MCP102/103/121/131 3-Lead Plastic Small Outline Transistor (TT) (SOT-23) E E1 2 B n p p1 D 1 c A A2 L A1 Units Dimension Limits n Number of Pins p Pitch p1 Outside lead pitch (basic) Overall Height A Molded Package Thickness A2 Standoff A1 Overall Width E Molded Package Width E1 Overall Length D Foot Length L Foot Angle c Lead Thickness Lead Width Mold Draft Angle Top Mold Draft Angle Bottom * Controlling Parameter Significant Characteristic B MIN INCHES* NOM 3 .038 .076 .040 .037 .002 .093 .051 .115 .018 5 .006 .017 5 5 MAX MIN .035 .035 .000 .083 .047 .110 .014 0 .004 .015 0 0 .044 .040 .004 .104 .055 .120 .022 10 .007 .020 10 10 MILLIMETERS NOM 3 0.96 1.92 0.89 1.01 0.88 0.95 0.01 0.06 2.10 2.37 1.20 1.30 2.80 2.92 0.35 0.45 0 5 0.09 0.14 0.37 0.44 0 5 0 5 MAX 1.12 1.02 0.10 2.64 1.40 3.04 0.55 10 0.18 0.51 10 10 Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side. JEDEC Equivalent: TO-236 Drawing No. C04-104 (c) 2005 Microchip Technology Inc. DS21906B-page 17 MCP102/103/121/131 3-Lead Plastic Small Outline Transistor (LB) (SC-70) E E1 B 2 p1 D 3 1 p a c A A2 b L A1 Units Dimension Limits Number of Pins Pitch Outside lead pitch (basic) Overall Height Molded Package Thickness Standoff Overall Width Molded Package Width Overall Length Foot Length Lead Thickness Lead Width Mold Draft Angle Top Mold Draft Angle Bottom p p1 A A2 A1 E E1 D L c B a b INCHES MIN 3 .026 BSC. .051 BSC. .031 .031 .000 .071 .045 .071 .004 .003 .006 8 8 MAX .043 .039 .0004 .094 .053 .089 .016 .010 .016 12 12 MILLIMETERS* MIN MAX 3 0.65 BSC. 1.30 BSC. 0.80 1.10 0.80 1.00 0.00 .010 1.80 2.40 1.15 1.35 1.80 2.25 0.10 0.41 0.08 0.25 0.15 0.40 8 12 8 12 *Controlling Parameter Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .005" (0.127mm) per side. JEITA (EIAJ) Equivalent: SC70 Drawing No. C04-104 DS21906B-page 18 (c) 2005 Microchip Technology Inc. MCP102/103/121/131 3-Lead Plastic Transistor Outline (TO) (TO-92) E1 D 1 n L 1 2 3 B p c A R INCHES* NOM MILLIMETERS NOM 3 1.27 3.30 3.62 4.45 4.71 4.32 4.64 2.16 2.29 12.70 14.10 0.36 0.43 0.41 0.48 4 5 2 3 Number of Pins 3 Pitch .050 Bottom to Package Flat A .130 .143 .155 Overall Width E1 .175 .186 .195 Overall Length D .170 .183 .195 Molded Package Radius R .085 .090 .095 Tip to Seating Plane L .500 .555 .610 c Lead Thickness .014 .017 .020 Lead Width B .016 .019 .022 4 5 6 Mold Draft Angle Top Mold Draft Angle Bottom 2 3 4 *Controlling Parameter Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side. JEDEC Equivalent: TO-92 Drawing No. C04-101 Units Dimension Limits n p MIN MAX MIN MAX 3.94 4.95 4.95 2.41 15.49 0.51 0.56 6 4 (c) 2005 Microchip Technology Inc. DS21906B-page 19 MCP102/103/121/131 5.2 Product Tape and Reel Specifications EMBOSSED CARRIER DIMENSIONS (8, 12, 16 AND 24 MM TAPE ONLY) Top Cover Tape FIGURE 5-1: A0 W K0 B0 P TABLE 1: Case Outline TT LB CARRIER TAPE/CAVITY DIMENSIONS Package Type SOT-23 SC-70 3L 3L Carrier Dimensions W mm 8 8 P mm 4 4 A0 mm 3.15 2.4 Cavity Dimensions B0 mm 2.77 2.4 K0 mm 1.22 1.19 Output Quantity Units 3000 3000 Reel Diameter in mm 180 180 FIGURE 5-2: 3-LEAD SOT-23/SC70 DEVICE TAPE AND REEL SPECIFICATIONS User Direction of Feed Device Marking W PIN 1 P Standard Reel Component Orientation DS21906B-page 20 (c) 2005 Microchip Technology Inc. MCP102/103/121/131 FIGURE 5-3: TO-92 DEVICE TAPE AND REEL SPECIFICATIONS User Direction of Feed P Device Marking MARK FACE MARK FACE MARK FACE Seal Tape Back Tape W Note: Bent leads are for Tape and Reel only. (c) 2005 Microchip Technology Inc. DS21906B-page 21 MCP102/103/121/131 NOTES: DS21906B-page 22 (c) 2005 Microchip Technology Inc. MCP102/103/121/131 APPENDIX A: REVISION HISTORY Revision B (March 2005) The following is the list of modifications: 1. Added Section 4.4 "Using in PICmicro(R) Microcontroller, ICSPTM Applications (MCP121 only)" on using the MCP121 in PICmicro microcontroller ICSP applications. Added VODH specifications in Section 1.0 "Electrical Characteristics" (for ICSP applications). Added Figure 2-33. Updated SC-70 package markings and added Pb-free marking information to Section 5.0 "Packaging information". Added Appendix A: "Revision History". 2. 3. 4. 5. Revision A (August 2004) * Original Release of this Document. (c) 2005 Microchip Technology Inc. DS21906B-page 23 MCP102/103/121/131 NOTES: DS21906B-page 24 (c) 2005 Microchip Technology Inc. MCP102/103/121/131 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. Device - X XXX X / XX Examples: a) MCP102T-195I/TT: Tape and Reel, 1.95V MicroPower Voltage Supervisor, push-pull, -40C to +85C, SOT-23B-3 package. MCP102-300E/TO: 3.00V MicroPower Voltage Supervisor, push-pull, -40C to +125C, TO-92-3 package. MCP103T-270E/TT: Tape and Reel, 2.70V MicroPower Voltage Supervisor, push-pull, -40C to +125C, SOT-23B-3 package. MCP103T-475E/LB: Tape and Reel, 4.75V MicroPower Voltage Supervisor, push-pull, -40C to +125C, SC-70-3 package. MCP121T-315I/LB: Tape and Reel, 3.15V MicroPower Voltage Supervisor, open-drain, -40C to +125C, SC-70-3 package. MCP121-300E/TO: 3.00V MicroPower Voltage Supervisor, open-drain, -40C to +125C, TO-92-3 package. MCP131T-195I/TT: Tape and Reel, 1.95V MicroPower Voltage Supervisor, open-drain, -40C to +85C, SOT-23B-3 package. MCP131-300E/TO: 3.00V MicroPower Voltage Supervisor, open-drain, -40C to +125C, TO-92-3 package. Tape/Reel Monitoring Temperature Package Range Option Options MCP102: MicroPower Voltage Supervisor, push-pull MCP102T: MicroPower Voltage Supervisor, push-pull (Tape and Reel) MCP103: MicroPower Voltage Supervisor, push-pull MCP103T: MicroPower Voltage Supervisor, push-pull (Tape and Reel) MCP121 MicroPower Voltage Supervisor, open-drain MCP121T: MicroPower Voltage Supervisor, open-drain (Tape and Reel) MCP131 MicroPower Voltage Supervisor, open-drain MCP131T: MicroPower Voltage Supervisor, open-drain (Tape and Reel) b) Device: a) b) Monitoring Options: 195 240 270 300 315 450 475 = = = = = = = 1.90V 2.32V 2.63V 2.93V 3.08V 4.38V 4.63V a) Temperature Range: I E = -40C to +85C (MCP11X-195 only) = -40C to +125C (Except MCP11X-195 only) b) Package: TT = SOT-23B, 3-lead LB = SC-70, 3-lead TO = TO-92, 3-lead a) b) (c) 2005 Microchip Technology Inc. DS21906B-page 25 MCP102/103/121/131 NOTES: DS21906B-page 26 (c) 2005 Microchip Technology Inc. Note the following details of the code protection feature on Microchip devices: * * Microchip products meet the specification contained in their particular Microchip Data Sheet. Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip's Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. Microchip is willing to work with the customer who is concerned about the integrity of their code. Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as "unbreakable." * * * Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip's code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip's products as critical components in life support systems is not authorized except with express written approval by Microchip. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, Accuron, dsPIC, KEELOQ, microID, MPLAB, PIC, PICmicro, PICSTART, PRO MATE, PowerSmart, rfPIC, and SmartShunt are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. AmpLab, FilterLab, Migratable Memory, MXDEV, MXLAB, PICMASTER, SEEVAL, SmartSensor and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, Application Maestro, dsPICDEM, dsPICDEM.net, dsPICworks, ECAN, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, MPASM, MPLIB, MPLINK, MPSIM, PICkit, PICDEM, PICDEM.net, PICLAB, PICtail, PowerCal, PowerInfo, PowerMate, PowerTool, rfLAB, rfPICDEM, Select Mode, Smart Serial, SmartTel, Total Endurance and WiperLock are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. (c) 2005, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. Microchip received ISO/TS-16949:2002 quality system certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona and Mountain View, California in October 2003. The Company's quality system processes and procedures are for its PICmicro(R) 8-bit MCUs, KEELOQ(R) code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip's quality system for the design and manufacture of development systems is ISO 9001:2000 certified. (c) 2005 Microchip Technology Inc. DS21906B-page 27 WORLDWIDE SALES AND SERVICE AMERICAS Corporate Office 2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-7200 Fax: 480-792-7277 Technical Support: http://support.microchip.com Web Address: www.microchip.com Atlanta Alpharetta, GA Tel: 770-640-0034 Fax: 770-640-0307 Boston Westborough, MA Tel: 774-760-0087 Fax: 774-760-0088 Chicago Itasca, IL Tel: 630-285-0071 Fax: 630-285-0075 Dallas Addison, TX Tel: 972-818-7423 Fax: 972-818-2924 Detroit Farmington Hills, MI Tel: 248-538-2250 Fax: 248-538-2260 Kokomo Kokomo, IN Tel: 765-864-8360 Fax: 765-864-8387 Los Angeles Mission Viejo, CA Tel: 949-462-9523 Fax: 949-462-9608 San Jose Mountain View, CA Tel: 650-215-1444 Fax: 650-961-0286 Toronto Mississauga, Ontario, Canada Tel: 905-673-0699 Fax: 905-673-6509 ASIA/PACIFIC Australia - Sydney Tel: 61-2-9868-6733 Fax: 61-2-9868-6755 China - Beijing Tel: 86-10-8528-2100 Fax: 86-10-8528-2104 China - Chengdu Tel: 86-28-8676-6200 Fax: 86-28-8676-6599 China - Fuzhou Tel: 86-591-8750-3506 Fax: 86-591-8750-3521 China - Hong Kong SAR Tel: 852-2401-1200 Fax: 852-2401-3431 China - Shanghai Tel: 86-21-5407-5533 Fax: 86-21-5407-5066 China - Shenyang Tel: 86-24-2334-2829 Fax: 86-24-2334-2393 China - Shenzhen Tel: 86-755-8203-2660 Fax: 86-755-8203-1760 China - Shunde Tel: 86-757-2839-5507 Fax: 86-757-2839-5571 China - Qingdao Tel: 86-532-502-7355 Fax: 86-532-502-7205 ASIA/PACIFIC India - Bangalore Tel: 91-80-2229-0061 Fax: 91-80-2229-0062 India - New Delhi Tel: 91-11-5160-8631 Fax: 91-11-5160-8632 Japan - Kanagawa Tel: 81-45-471- 6166 Fax: 81-45-471-6122 Korea - Seoul Tel: 82-2-554-7200 Fax: 82-2-558-5932 or 82-2-558-5934 Singapore Tel: 65-6334-8870 Fax: 65-6334-8850 Taiwan - Kaohsiung Tel: 886-7-536-4818 Fax: 886-7-536-4803 Taiwan - Taipei Tel: 886-2-2500-6610 Fax: 886-2-2508-0102 Taiwan - Hsinchu Tel: 886-3-572-9526 Fax: 886-3-572-6459 EUROPE Austria - Weis Tel: 43-7242-2244-399 Fax: 43-7242-2244-393 Denmark - Ballerup Tel: 45-4450-2828 Fax: 45-4485-2829 France - Massy Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79 Germany - Ismaning Tel: 49-89-627-144-0 Fax: 49-89-627-144-44 Italy - Milan Tel: 39-0331-742611 Fax: 39-0331-466781 Netherlands - Drunen Tel: 31-416-690399 Fax: 31-416-690340 England - Berkshire Tel: 44-118-921-5869 Fax: 44-118-921-5820 03/01/05 DS21906B-page 28 (c) 2005 Microchip Technology Inc. |
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