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MF272 810 nm - 70 MHz High Performance LED Data Sheet October 2004 Ordering Information MF272 MF272 ST MF272 SMA MF272 FC TO-46 Package ST Housing SMA Housing FC Housing -55 C to +125C Note: Rated Fiber coupled power apply only on the TO-46 package, for housing options fiber coupled power is typically 10% less Features * * * 810 nm Surface-Emitting LED 70 MHz Bandwidth Designed for 200/280 m fiber Description This high speed device is optimized at 810 nm wavelength which is of particular interest for use in radiation-hardened fiber. It operates in a wide temperature range and delivers very high power to 200 m core fiber, making it ideal in avionics and military datacom applications. Applications * * * Avionics Sensors Military LANs CASE CATHODE ANODE CATHODE ANODE Bottom View Anode in electrical contact with the case Figure 1 - Pin Diagram Figure 2 - Functional Schematic 1 Zarlink Semiconductor Inc. Zarlink, ZL and the Zarlink Semiconductor logo are trademarks of Zarlink Semiconductor Inc. Copyright 2001-2004, Zarlink Semiconductor Inc. All Rights Reserved. MF272 Optical and Electrical Characteristics - Case Temperature 25C Parameter Fiber-Coupled Power (Figures 3, 4, and 5) (Table 1) Rise and Fall Time (10-90%) Bandwidth (3 dBel) Peak Wavelength Spectral Width (FWHM) Forward Voltage (Figure 7) Reverse Current Capacitance Note 1: Data Sheet Symbol Pfiber tr,tf fc p VF IR C Min. 1300 Typ. 1600 7 70 Max. Unit W Test Condition IF = 100 mA (Note 1) IF = 100 mA (no bias) IF = 100 mA IF = 100 mA IF = 100 mA IF = 100 mA V R= 1 V VR-0V, f = 1 MHz Fiber: 200/280 m Step Index 10 ns MHz 790 810 50 2.2 250 830 2.4 20 nm nm V A pF Measured at the exit of 100 meters of fiber. Absolute Maximum Ratings Parameter Storage Temperature Operating Temperature (derating: Figure 6) Electrical Power Dissipation (derating: Figure 6) Continuous Forward Current (f<10 kHz) Peak Forward Current (duty cycle<50%,f>1 MHz Reverse Voltage Soldering Temperature (2 mm from the case for 10 sec.) Symbol Tstg Top Ptot IF IFRM VR Tsld Limit -55 to +125C -55 to +125C 250 mW 110 mA 180 mA 1.5 V 260C Thermal Characteristics Parameter Thermal Resistance - Infinite Heat Sink Thermal Resistance - No Heat Sink Temperature Coefficient - Optical Power Temperature Coefficient - Wavelength Symbol Rthjc Rthja dP/dTj d/dTj -0.4 0.3 Min. Typ. Max. 100 400 Unit C/W C/W %/C nm/C Typical Fiber-Coupled Power Core Diameter/Cladding Diameter Numerical Aperture 50/125 m 0.20 60 W 62.5/125 m 0.275 150 W 100/140 m 0.29 600 W 200/230 m 0.37 2000 W 200/280 m 0.24 1600 W 2 Zarlink Semiconductor Inc. MF272 100 90 80 Relative Fiber-Coupled Power (%) 70 60 50 40 30 20 10 0 0.5 0.75 1 1.25 1.5 1.75 2 2.25 2.5 2.75 3 z - Axial Displacem ent of Fiber (m) ) (m m Data Sheet r z r - optimal OC = 200 m Figure 3 - Relative Fiber-coupled Power vs. z - Axial Displacement of Fiber 100 r z Relative Fiber-Coupled Power (%) 80 z - optimal OC = 200 m 60 40 20 0 0 25 50 75 100 125 150 175 200 r - Radial Displacem ent of Fiber ( m ) Figure 4 - Relative Fiber-Coupled Power vs. r - Radial Displacement of Fiber 3 Zarlink Semiconductor Inc. MF272 100 90 Relative Fiber-Coupled Power (%) 80 70 60 50 40 30 20 10 0 0 20 40 60 80 100 120 140 160 180 Heat Sinked DC 50% Duty Cycle Data Sheet 200 Forw ard Current (m A) Figure 5 - Relative Fiber-coupled Power vs. Forward Current 300 275 Max. Electrical Power Dissipation (mW) 250 225 200 175 150 125 100 75 50 25 0 0 10 20 30 40 50 60 70 80 90 100 110 120 130 140 150 Infinite Heat Sink No Heat Sink Note: Maximum junction temperature can be increased to 150oC after additional burn-in and screening. Operating Tem perature (OC) Figure 6 - Max. Electrical Power Dissipation vs. Operating Temperature 4 Zarlink Semiconductor Inc. MF272 Data Sheet 200 175 150 Forward Current (mA) 125 100 75 50 25 0 0 0.25 0.5 0.75 1 1.25 1.5 1.75 2 2.25 2.5 2.75 3 Forw ard Voltage (V) Figure 7 - Forward Current vs. Forward Voltage 200 Note: Dashed line indicates that the pow er dissipation may exceed the maximum ratings. 160 Peak Forward Current (mA) b 120 Heat Sinked c a d 80 a) P fiber b) P fiber c) P fiber d) P fiber = const. 1450 W peak = const. 1200 W peak = const. 950 W peak = const. 700 W peak 40 0 -60 -40 -20 0 20 40 60 O 80 100 120 140 Operating Tem perature ( C) Figure 8 - Peak Forward Current vs. Operating Temperature 5 Zarlink Semiconductor Inc. For more information about all Zarlink products visit our Web Site at www.zarlink.com Information relating to products and services furnished herein by Zarlink Semiconductor Inc. or its subsidiaries (collectively "Zarlink") is believed to be reliable. However, Zarlink assumes no liability for errors that may appear in this publication, or for liability otherwise arising from the application or use of any such information, product or service or for any infringement of patents or other intellectual property rights owned by third parties which may result from such application or use. Neither the supply of such information or purchase of product or service conveys any license, either express or implied, under patents or other intellectual property rights owned by Zarlink or licensed from third parties by Zarlink, whatsoever. Purchasers of products are also hereby notified that the use of product in certain ways or in combination with Zarlink, or non-Zarlink furnished goods or services may infringe patents or other intellectual property rights owned by Zarlink. This publication is issued to provide information only and (unless agreed by Zarlink in writing) may not be used, applied or reproduced for any purpose nor form part of any order or contract nor to be regarded as a representation relating to the products or services concerned. The products, their specifications, services and other information appearing in this publication are subject to change by Zarlink without notice. No warranty or guarantee express or implied is made regarding the capability, performance or suitability of any product or service. Information concerning possible methods of use is provided as a guide only and does not constitute any guarantee that such methods of use will be satisfactory in a specific piece of equipment. It is the user's responsibility to fully determine the performance and suitability of any equipment using such information and to ensure that any publication or data used is up to date and has not been superseded. Manufacturing does not necessarily include testing of all functions or parameters. These products are not suitable for use in any medical products whose failure to perform may result in significant injury or death to the user. All products and materials are sold and services provided subject to Zarlink's conditions of sale which are available on request. Purchase of Zarlink's I2C components conveys a licence under the Philips I2C Patent rights to use these components in and I2C System, provided that the system conforms to the I2C Standard Specification as defined by Philips. Zarlink, ZL and the Zarlink Semiconductor logo are trademarks of Zarlink Semiconductor Inc. Copyright Zarlink Semiconductor Inc. All Rights Reserved. TECHNICAL DOCUMENTATION - NOT FOR RESALE |
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