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Package information - MLP832
Surface mounted, 8 pin package Package outline
DIM A A1 A2 A3 b b1 D D2 D3
Millimeters Min. Max. 0.80 1.00 0.00 0.05 0.65 0.75 0.15 0.25 0.24 0.34 0.17 0.30 3.00 BSC 0.82 1.01 1.02 1.21
Inches Min. Max. 0.0315 0.0394 0.00 0.002 0.0256 0.0295 0.006 0.0098 0.0095 0.0134 0.0068 0.0118 0.118 BSC 0.0323 0.0398 0.0402 0.0476
DIM e E E2 L L2 r -
Millimeters Min. Max. 0.65 BSC 2.00 BSC 0.43 0.63 0.20 0.45 0.00 0.125 0.075 BSC 0 12 -
Inches Min. Max. 0.0256 BSC 0.0787 BSC 0.017 0.0248 0.0079 0.0177 0.00 0.005 0.0029 BSC 0 12 -
Note: Controlling dimensions are in millimeters. Approximate dimensions are provided in inches
Soldering footprint
0.65 0.025 0.75 0.029
0.9 0.035
0.40 0.015 0.10 0.004 0.80 0.031
0.35 0.013
1.30 0.051
1.20 0.047
Issue 2 - October 2005
(c) Zetex Semiconductors plc 2005
1
www.zetex.com
Package information - MLP832
Nominal weight
Nominal weight per device 12.9mg.
Tape and reel information
Orientation Tape width (mm) 8
Pin 1
Reel size (inches) 7 13
No. of components 3,000 10,000
Tape option indicator TA TC
8
Embossed carrier tape configuration
P0 K t
Top cover tape 10 pitches culmulative tolerance on tape 0.2mm (0.008")
D
P2
E
See Note 1
A0
See Note 1
F
W
B1
K0
See Note 1
B0 P
Embossment Center lines of cavity
D1
User direction of feed
Dimensions mm (inches) A0, B0, K0 B1 (max.) D D1 (max.) E F P
Tape size (mm) 8 See note
*
12 See note
*
16 See note
*
24 See note* 20.10 (0.791) 1.50 + 0.10 - 0.00 1.50 (0.059) 1.75 0.10 11.50 0.10 (0.453 0.004) 4.00 0.10 (0.157 0.004) to 20.00 0.10 (0.787 0.004) in 4.00 (0.157) increments 4.00 0.10 2.00 0.05 0.40 24.30 (0.957)
4.55 (0.179) 1.50 + 0.10 - 0.00 1.00 (0.039) 1.75 0.10 3.50 0.10 (0.138 0.004) 4.00 0.10 (0.157 0.004)
8.20 (0.323) 1.50 + 0.10 - 0.00 1.50 (0.059) 1.75 0.10 5.50 0.05 (0.217 0.002) 4.00 0.10 (0.157 0.004) 8.00 0.10 (0.315 0.004)
12.10 (0.476) 1.50 + 0.10 - 0.00 1.50 (0.059) 1.75 0.10 7.50 0.10 (0.295 0.004) 4.00 0.10 (0.157 0.004) 8.00 0.10 (0.315 0.004) 12.00 0.10 (0.472 0.004) 4.00 0.10 2.00 0.05 0.40 16.30 (0.642)
P0 P2 t (max.) W
4.00 0.10 2.00 0.05 0.40 8.00 (0.315)
4.00 0.10 2.00 0.05 0.40 12.00 0.30 (0.472 0.012)
Issue 2 - October 2005
(c) Zetex Semiconductors plc 2005
2
www.zetex.com
Package information - MLP832
NOTES: * A0, B0 and K0 dimensions are determined with respect to EIA/JEDEC rotational and lateral movement requirements (see fig. 1).
0.5mm maximum
20 maximum Component cavity center line
0.5mm maximum
B0
20 maximum Component center line A0
Component rotation - side view
Component lateral movement
Component rotation - top view
Figure 1 - rotational and lateral movement
Reel configuration
Tape slot in core for tape start. 2.5mm min. width, 10mm min. depth
T
B
A
D
N
C
Full radius
G
Tape size 8mm 12mm 16mm 24mm
A (max.) 179 (7.047) 330 (12.992) 330 (12.992) 330 (12.992)
B (min.) 1.5 (0.06) 1.5 (0.06) 1.5 (0.06) 1.5 (0.06)
C 13.00 0.02 (0.512 0.008) 13.00 0.02 (0.512 0.008) 13.00 0.02 (0.512 0.008) 13.00 0.02 (0.512 0.008)
D (min.) 25.0 (0.984) 20.2 (0.795) 20.2 (0.795) 20.2 (0.795)
N (min.) 50 (1.969) 50 (1.969) 50 (1.969) 60 (2.362)
G 8.4 +1.5 -0.0 (0.33 +0.06 - 0.00) 12.4 +2.0 -0.0 (0.49 +0.079 - 0.00) 16.4 +2.0 -0.0 (0.65 +0.079 - 0.00) 24.4 +2.0 -0.0 (0.96 +0.079 -0.00)
T (max.) 14.4 (0.567) 18.4 (0.724) 22.4 (0.882) 30.4 (1.197)
This publication is issued to provide outline information only which (unless agreed by the company in writing) may not be used, applied or reproduced for any purpose or form part of any order or contact or be regarded as a representation relating to the products or services concerned. The company reserves the right to alter without notice the specification, design, price or conditions of supply of any product or service.
Issue 2 - October 2005
(c) Zetex Semiconductors plc 2005
3
www.zetex.com

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