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MW4IC915 Freescale Semiconductor Replaced by MW4IC915NBR1(GNBR1). There are no form, fit or function changes with this part Rev. 6, 5/2006 Technical Data RF LDMOS Wideband Integrated Power Amplifiers replacement. N suffix added to part number to indicate transition to lead - free terminations. The MW4IC915MB/GMB wideband integrated circuit is designed for GSM and GSM EDGE base station applications. It uses Freescale's newest High Voltage (26 to 28 Volts) LDMOS IC technology and integrates a multi - stage structure. Its wideband On- Chip design makes it usable from 750 to 1000 MHz. The linearity performances cover all modulations for cellular applications: GSM, GSM EDGE, TDMA, N - CDMA and W - CDMA. Final Application * Typical Performance: VDD = 26 Volts, IDQ1 = 60 mA, IDQ2 = 240 mA, Pout = 15 Watts CW, Full Frequency Band (860 - 960 MHz) Power Gain -- 30 dB Power Added Efficiency -- 44% Driver Application * Typical GSM/GSM EDGE Performances: VDD = 26 Volts, IDQ1 = 60 mA, IDQ2 = 240 mA, Pout = 3 Watts Avg., Full Frequency Band (869 - 894 MHz and 921 - 960 MHz) Power Gain -- 31 dB Power Added Efficiency -- 19% Spectral Regrowth @ 400 kHz Offset = - 65 dBc Spectral Regrowth @ 600 kHz Offset = - 83 dBc EVM -- 1.5% * Capable of Handling 5:1 VSWR, @ 26 Vdc, 921 MHz, 15 Watts CW Output Power * Characterized with Series Equivalent Large - Signal Impedance Parameters * On - Chip Matching (50 Ohm Input, DC Blocked, >3 Ohm Output) * Integrated Quiescent Current Temperature Compensation with Enable/Disable Function * On - Chip Current Mirror gm Reference FET for Self Biasing Application(1) * Integrated ESD Protection * 200C Capable Plastic Package * In Tape and Reel. R1 Suffix = 500 Units per 44 mm, 13 inch Reel. MW4IC915MBR1 MW4IC915GMBR1 860 - 960 MHz, 15 W, 26 V GSM/GSM EDGE, N - CDMA RF LDMOS WIDEBAND INTEGRATED POWER AMPLIFIERS ARCHIVE INFORMATION CASE 1329 - 09 TO - 272 WB - 16 PLASTIC MW4IC915MBR1 CASE 1329A - 03 TO - 272 WB - 16 GULL PLASTIC MW4IC915GMBR1 VRD2 VRG2 VDS1 RFin VRD1 VRG1 VGS1 VGS2 VDS2/RFout GND VRD2 VRG2 VDS1 VRD1 RFin VRG1 VGS1 VGS2 NC GND 1 2 3 4 5 6 7 8 9 10 11 16 15 GND NC 14 RFout/ VDS2 13 12 NC GND Quiescent Current Temperature Compensation (Top View) Note: Exposed backside flag is source terminal for transistors. Figure 1. Functional Block Diagram Figure 2. Pin Connections 1. Refer to AN1987/D, Quiescent Current Control for the RF Integrated Circuit Device Family. Go to http://www.freescale.com/rf. Select Documentation/Application Notes - AN1987. (c) Freescale Semiconductor, Inc., 2006. All rights reserved. MW4IC915MBR1 MW4IC915GMBR1 1 RF Device Data Freescale Semiconductor ARCHIVE INFORMATION Table 1. Maximum Ratings Rating Drain- Source Voltage Gate- Source Voltage Storage Temperature Range Operating Junction Temperature Symbol VDSS VGS Tstg TJ Value - 0.5. +65 - 0.5. +15 - 65 to +175 200 Unit Vdc Vdc C C Table 2. Thermal Characteristics Characteristic Thermal Resistance, Junction to Case GSM Application (Pout = 15 W CW) Stage 1, 26 Vdc, IDQ = 60 mA Stage 2, 26 Vdc, IDQ = 240 mA Stage 1, 26 Vdc, IDQ = 60 mA Stage 2, 26 Vdc, IDQ = 240 mA Stage 1, 26 Vdc, IDQ = 60 mA Stage 2, 26 Vdc, IDQ = 240 mA Symbol RJC 7.3 1.7 7.3 1.8 7.4 1.9 Value (1) Unit C/W ARCHIVE INFORMATION CDMA Application (Pout = 3.75 W CW) Table 3. ESD Protection Characteristics Test Conditions Human Body Model Machine Model Charge Device Model Class 1 (Minimum) M3 (Minimum) C2 (Minimum) Table 4. Moisture Sensitivity Level Test Methodology Per JESD 22 - A113, IPC/JEDEC J - STD - 020 Rating 3 Package Peak Temperature 260 Unit C Table 5. Electrical Characteristics (TC = 25C unless otherwise noted) Characteristic Symbol Min Typ Max Unit Functional Tests (In Freescale Test Fixture, 50 ohm system) VDS = 26 Vdc, IDQ1 = 90 mA, IDQ2 = 240 mA, Pout = 15 W PEP, f1 = 869 MHz, f2 = 869.1 MHz and f1 = 960 MHz and f2 = 960.1 MHz, Two - Tone Power Gain Power Added Efficiency Intermodulation Distortion Input Return Loss Gps PAE IMD IRL 29 29 -- -- 31 31 - 40 - 15 -- -- - 29 - 10 dB % dBc dB 1. Refer to AN1955/D, Thermal Measurement Methodology of RF Power Amplifiers. Go to http://www.freescale.com/rf. Select Documentation/Application Notes - AN1955. (continued) MW4IC915MBR1 MW4IC915GMBR1 2 RF Device Data Freescale Semiconductor ARCHIVE INFORMATION GSM EDGE Application (Pout = 7.5 W CW) Table 5. Electrical Characteristics (TC = 25C unless otherwise noted) (continued ) Characteristic Quiescent Current Accuracy over Temperature with 1.8 k Gate Feed Resistors ( - 10 to 85C) (1) Gain Flatness in 40 MHz Bandwidth @ Pout = 3 W CW Deviation from Linear Phase in 40 MHz Bandwidth @ Pout = 3 W CW Delay @ Pout = 3 W CW Including Output Matching Part - to - Part Phase Variation @ Pout = 3 W CW Symbol IQT GF Delay Min -- -- -- -- -- Typ 5 0.2 0.6 2.5 15 Max -- -- -- -- -- Unit % dB ns Typical Performances (In Freescale Reference Board) VDS = 26 V, IDQ1 = 60 mA, IDQ2 = 240 mA, 869 MHz Typical GSM/GSM EDGE Performances (In Freescale Reference Board) VDS = 26 V, IDQ1 = 60 mA, IDQ2 = 240 mA, 869 MHz 1. Refer to AN1977/D, Quiescent Current Thermal Tracking Circuit in the RF Integrated Circuit Family. Go to http://www.freescale.com/rf. Select Documentation/Application Notes - AN1977. MW4IC915MBR1 MW4IC915GMBR1 RF Device Data Freescale Semiconductor 3 ARCHIVE INFORMATION L1 VDS1 + RF INPUT C1 Z1 R1 + C6 VGS2 R2 + C9 C8 C7 C5 C4 C2 C3 1 2 3 4 5 6 7 8 9 10 NC 11 16 NC 15 + C10 C11 C15 + C14 VDS2 14 Z2 Z3 C12 C13 Z4 M1 Z5 M2 Z6 M4 Z7 M3 Z8 C16 Z9 RF OUTPUT VGS1 NC 13 Quiescent Current Temperature Compensation 12 ARCHIVE INFORMATION Z1 Z2 Z3 Z4 Z5 0.086, 50 W Microstrip 0.133 x 0.236 Microstrip 0.435 x 0.283 Microstrip 0.171 x 0.283 Microstrip 0.429 x 0.283 Microstrip Z6 Z7 Z8 Z9 PCB 0.157 x 0.283 Microstrip 0.429 x 0.283 Microstrip 0.394 x 0.088 Microstrip 0.181 x 0.088 Microstrip Taconic TLX8, 0.030, r = 2.55 Figure 3. MW4IC915MBR1(GMBR1) Test Fixture Schematic Table 6. MW4IC915MBR1(GMBR1) Test Fixture Component Designations and Values Part C1, C6, C9, C14 C2, C5, C8, C11 C3, C4, C7, C10, C16 C12, C13 C15 L1 M1, M2, M3, M4 R1, R2 Description 22 mF, 35 V Tantalum Chip Capacitors 1000 pF Chip Capacitors 22 pF Chip Capacitors 10 pF Chip Capacitors 10 mF Tantalum Chip Capacitor 12.5 nH Inductor 0.283, 90_ Mitered Microstrip Bends 10 k, 1/4 W Chip Resistor (1206) Part Number TAJE226M035R 100B102JCA500X 100B220JCA500X 100B100JCA500X T491X226K035AS4394 Manufacturer AVX ATC ATC ATC Kemet MW4IC915MBR1 MW4IC915GMBR1 4 RF Device Data Freescale Semiconductor ARCHIVE INFORMATION C1 VDS1 C2 C3 C10 L1 C12 C13 C11 MW4IC915MB Rev 0 VDS2 C14 C15 C16 C5 C4 C7 C6 C8 C9 VGS2 R2 ARCHIVE INFORMATION R1 VGS1 Freescale has begun the transition of marking Printed Circuit Boards (PCBs) with the Freescale Semiconductor signature/logo. PCBs may have either Motorola or Freescale markings during the transition period. These changes will have no impact on form, fit or function of the current product. Figure 4. MW4IC915MBR1(GMBR1) Test Fixture Component Layout MW4IC915MBR1 MW4IC915GMBR1 RF Device Data Freescale Semiconductor 5 ARCHIVE INFORMATION VDS + R1 + RF INPUT C7 Z1 C10 C9 1 2 3 4 5 6 7 8 9 10 NC 11 16 NC 15 RF OUTPUT C4 C5 C6 14 Z2 Z3 C15 C1 Z4 Z5 C2 Z6 C3 Z7 NC 13 Quiescent Current Temperature Compensation 12 R2 VGS + C8 ARCHIVE INFORMATION R7 C11 C12 C16 P2 R4 R3 R6 C13 C14 C17 R5 P1 Z1 Z2 Z3 Z4 0.681 x 0.039, 50 W Microstrip 0.157 x 0.228 Microstrip 0.468 x 0.157 Microstrip 0.220 x 0.157 Microstrip Z5 Z6 Z7 PCB 0.566 x 0.043 Microstrip 0.165 x 0.043 Microstrip 0.078 x 0.043 Microstrip Taconic RF35, 0.02, r = 3.5 Figure 5. MW4IC915MBR1(GMBR1) Reference Board Schematic Table 7. MW4IC915MBR1(GMBR1) Reference Board Component Designations and Values Part C1, C15 C2 C3, C4, C9, C11, C13 C5, C10, C12, C14 C6, C7, C8 C16, C17 P1, P2 R1, R2, R3, R4, R5 R6, R7 Description 10 pF Chip Capacitors (0805), ACCU - P 5.6 pF Chip Capacitor (0805), ACCU - P 33 pF Chip Capacitors (0805), ACCU - P 10 nF Chip Capacitors (0805) 22 mF, 35 V Tantalum Capacitors 100 nF Chip Capacitors (0805) 5 k Potentiometer CMS Cermet Multi - turn 0 , 1/8 W Chip Resistors (0805) 10 k, 1/4 W Chip Resistors (1206) Part Number 08051J100GBT 08051J5R6BBT 08051J330GB 08055C103KAT TAJE226MO35R 08055C104KAT 3224W Manufacturer AVX AVX AVX AVX AVX AVX Bourns MW4IC915MBR1 MW4IC915GMBR1 6 RF Device Data Freescale Semiconductor ARCHIVE INFORMATION VDD GROUND R1 C7 C5 C4 C15 C6 C10 C9 ARCHIVE INFORMATION C13 C11 C14 C12 R6 C17 P1 R5 R3 C16 R4 R2 R7 P2 C1 MW4IC915MB Rev 0 C8 VGG GROUND Freescale has begun the transition of marking Printed Circuit Boards (PCBs) with the Freescale Semiconductor signature/logo. PCBs may have either Motorola or Freescale markings during the transition period. These changes will have no impact on form, fit or function of the current product. Figure 6. MW4IC915MBR1(GMBR1) Reference Board Component Layout MW4IC915MBR1 MW4IC915GMBR1 RF Device Data Freescale Semiconductor 7 ARCHIVE INFORMATION C2 C3 TYPICAL CHARACTERISTICS (FREESCALE TEST FIXTURE, 50 OHM SYSTEM) 34 PAE, POWER ADDED EFFICIENCY (%), Gps, POWER GAIN (dB) 32 30 28 26 24 22 20 18 16 14 860 880 900 VDD = 26 Vdc Pout = 15 W (PEP) IDQ1 = 90 mA, IDQ2 = 240 mA Two-Tone Measurement 100 kHz Tone Spacing 920 940 f, FREQUENCY (MHz) PAE IRL IMD3 0 -8 -16 -24 -32 -40 -48 -56 -64 -72 -80 960 Gps ARCHIVE INFORMATION IRL, INPUT RETURN LOSS (dB) IMD3, INTERMODULATION DISTORTION (dBc) Figure 7. Two - Tone Wideband Circuit Performance @ Pout = 15 Watts PEP PAE, POWER ADDED EFFICIENCY (%), Gps, POWER GAIN (dB) IRL, INPUT RETURN LOSS (dB) IMD3, INTERMODULATION DISTORTION (dB) IMD, INTERMODULATION DISTORTION (dBc) 34 0 -7 -14 IRL -21 VDD = 26 Vdc Pout = 6 W (PEP) IDQ1 = 90 mA, IDQ2 = 240 mA Two-Tone Measurement 100 kHz Tone Spacing -28 -35 -42 -49 -56 -63 880 900 920 940 -70 960 -20 32 30 28 26 24 22 20 18 16 14 860 IMD3 PAE Gps 3rd Order 5th Order 7th Order -30 -40 -50 -60 -70 -80 -90 0.1 1 VDD = 26 Vdc IDQ1 = 90 mA, IDQ2 = 240 mA f = 960 MHz 100 kHz Tone Spacing 10 100 Pout, OUTPUT POWER (WATTS) Avg. f, FREQUENCY (MHz) Figure 8. Two - Tone Wideband Circuit Performance @ Pout = 6 Watts Figure 9. Intermodulation Distortion Products versus Output Power TYPICAL CHARACTERISTICS (FREESCALE REFERENCE BOARD) 34 TC = -30_C 25_C 56 PAE, POWER ADDED EFFICIENCY (%) 48 Gps 85_C PAE 85_C 40 32 24 16 8 1 10 0 100 35 34 G ps , POWER GAIN (dB) 33 32 31 30 29 28 860 870 880 890 85_C 25_C TC = -30_C VDD = 26 Vdc Pout = 3 W CW IDQ1 = 60 mA, IDQ2 = 240 mA G ps , POWER GAIN (dB) 33 V = 26 Vdc DD IDQ1 = 60 mA, IDQ2 = 240 mA 32 f = 910 MHz 31 30 29 28 27 0.1 25_C -30_C 900 910 920 930 940 950 960 Pout, OUTPUT POWER (WATTS) f, FREQUENCY (MHz) Figure 10. Power Gain and Power Added Efficiency versus Output Power MW4IC915MBR1 MW4IC915GMBR1 8 Figure 11. Power Gain versus Frequency RF Device Data Freescale Semiconductor ARCHIVE INFORMATION TYPICAL CHARACTERISTICS (FREESCALE REFERENCE BOARD) - CONTINUED 34 33 G ps , POWER GAIN (dB) 32 31 30 29 28 860 85_C 870 880 890 900 910 920 930 940 950 960 25_C PAE, POWER ADDED EFFICIENCY (%) TC = -30_C VDD = 26 Vdc Pout = P1dB IDQ1 = 60 mA, IDQ2 = 240 mA 21 20 TC = -30_C 25_C 85_C 18 VDD = 26 Vdc Pout = 3 W CW IDQ1 = 60 mA, IDQ2 = 240 mA f, FREQUENCY (MHz) 19 ARCHIVE INFORMATION f, FREQUENCY (MHz) Figure 12. Power Gain versus Frequency Figure 13. Power Added Efficiency versus Frequency EVM, ERROR VECTOR MAGNITUDE (% rms) 4 3.5 3 2.5 2 1.5 1 0.5 0 SPECTRAL REGROWTH @ 400 kHz (dBc) VDD = 26 Vdc IDQ1 = 60 mA, IDQ2 = 240 mA EDGE Modulation f = 910 MHz TC = 85_C -50 25_C -30_C -55 -60 -65 -70 -75 -80 25_C TC = 85_C -30_C VDD = 26 Vdc IDQ1 = 60 mA, IDQ2 = 240 mA EDGE Modulation f = 910 MHz 0.1 1 10 100 0.1 1 10 100 Pout, OUTPUT POWER (WATTS) AVG. Pout, OUTPUT POWER (WATTS) Figure 14. Error Vector Magnitude versus Output Power Figure 15. Spectral Regrowth at 400 kHz versus Output Power SPECTRAL REGROWTH @ 600 kHz (dBc) -70 -72 -74 -76 -78 -80 -82 -84 -86 VDD = 26 Vdc IDQ1 = 60 mA, IDQ2 = 240 mA EDGE Modulation f = 910 MHz TC = -30_C 85_C 25_C 0.1 1 10 100 Pout, OUTPUT POWER (WATTS) Figure 16. Spectral Regrowth at 600 kHz versus Output Power MW4IC915MBR1 MW4IC915GMBR1 RF Device Data Freescale Semiconductor 9 ARCHIVE INFORMATION 17 860 870 880 890 900 910 920 930 940 950 960 Zo = 5 Zload f = 900 MHz f = 980 MHz ARCHIVE INFORMATION VDD = 26 V, IDQ1 = 60 mA, IDQ2 = 240 mA, Pout = P1dB f MHz 900 910 920 930 940 950 960 970 980 Zload Zload 3.23 - j4.30 3.24 - j4.36 3.25 - j4.42 3.25 - j4.47 3.23 - j4.52 3.21 - j4.56 3.16 - j4.60 3.11 - j4.65 3.04 - j4.70 = Test circuit impedance as measured from drain to ground. Device Under Test Output Matching Network Z in Z load Figure 17. Series Equivalent Input and Load Impedance MW4IC915MBR1 MW4IC915GMBR1 10 RF Device Data Freescale Semiconductor ARCHIVE INFORMATION NOTES ARCHIVE INFORMATION MW4IC915MBR1 MW4IC915GMBR1 RF Device Data Freescale Semiconductor 11 ARCHIVE INFORMATION NOTES ARCHIVE INFORMATION MW4IC915MBR1 MW4IC915GMBR1 12 RF Device Data Freescale Semiconductor ARCHIVE INFORMATION NOTES ARCHIVE INFORMATION MW4IC915MBR1 MW4IC915GMBR1 RF Device Data Freescale Semiconductor 13 ARCHIVE INFORMATION PACKAGE DIMENSIONS MW4IC915MBR1 MW4IC915GMBR1 14 RF Device Data Freescale Semiconductor MW4IC915MBR1 MW4IC915GMBR1 RF Device Data Freescale Semiconductor 15 MW4IC915MBR1 MW4IC915GMBR1 16 RF Device Data Freescale Semiconductor MW4IC915MBR1 MW4IC915GMBR1 RF Device Data Freescale Semiconductor 17 MW4IC915MBR1 MW4IC915GMBR1 18 RF Device Data Freescale Semiconductor MW4IC915MBR1 MW4IC915GMBR1 RF Device Data Freescale Semiconductor 19 How to Reach Us: Home Page: www.freescale.com E - mail: support@freescale.com USA/Europe or Locations Not Listed: Freescale Semiconductor Technical Information Center, CH370 1300 N. Alma School Road Chandler, Arizona 85224 +1 - 800- 521- 6274 or +1 - 480- 768- 2130 support@freescale.com Europe, Middle East, and Africa: Freescale Halbleiter Deutschland GmbH Technical Information Center Schatzbogen 7 81829 Muenchen, Germany +44 1296 380 456 (English) +46 8 52200080 (English) +49 89 92103 559 (German) +33 1 69 35 48 48 (French) support@freescale.com Japan: Freescale Semiconductor Japan Ltd. Headquarters ARCO Tower 15F 1 - 8 - 1, Shimo - Meguro, Meguro - ku, Tokyo 153 - 0064 Japan 0120 191014 or +81 3 5437 9125 support.japan@freescale.com Asia/Pacific: Freescale Semiconductor Hong Kong Ltd. Technical Information Center 2 Dai King Street Tai Po Industrial Estate Tai Po, N.T., Hong Kong +800 2666 8080 support.asia@freescale.com For Literature Requests Only: Freescale Semiconductor Literature Distribution Center P.O. Box 5405 Denver, Colorado 80217 1 - 800- 441- 2447 or 303 - 675- 2140 Fax: 303 - 675- 2150 LDCForFreescaleSemiconductor@hibbertgroup.com Information in this document is provided solely to enable system and software implementers to use Freescale Semiconductor products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits or integrated circuits based on the information in this document. Freescale Semiconductor reserves the right to make changes without further notice to any products herein. Freescale Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Freescale Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. "Typical" parameters that may be provided in Freescale Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals", must be validated for each customer application by customer's technical experts. Freescale Semiconductor does not convey any license under its patent rights nor the rights of others. Freescale Semiconductor products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Freescale Semiconductor product could create a situation where personal injury or death may occur. Should Buyer purchase or use Freescale Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold Freescale Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Freescale Semiconductor was negligent regarding the design or manufacture of the part. Freescalet and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. (c) Freescale Semiconductor, Inc. 2006. All rights reserved. RoHS- compliant and/or Pb - free versions of Freescale products have the functionality and electrical characteristics of their non - RoHS- compliant and/or non - Pb- free counterparts. For further information, see http://www.freescale.com or contact your Freescale sales representative. For information on Freescale's Environmental Products program, go to http://www.freescale.com/epp. MW4IC915MBR1 MW4IC915GMBR1 Rev. 20 6, 5/2006 MW4IC915 RF Device Data Freescale Semiconductor |
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