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| MOSFET MODULE FEATURES * Dual MOS FETs Cascaded Circuit Dual 140A /500V OUTLINE DRAWING PDM1405HA Dimension(mm) * Prevented Body Diodes of MOSFETs by SBDs, and Ultra Fast Recovery Diodes Connected in Parallel * 300KHz High Speed Switching Possible Circuit TYPICAL APPLICATIONS * Power Supply for the Communications and the Induction Heating MAXMUM RATINGS Ratings Drain-Source Voltage (VGS=0V) Gate - Source Voltage Continuous Drain Current Duty=50% D.C. Approximate Weight : 460g Symbol VDSS VGSS ID IDM PD Tjw Tstg VISO FTOR PDM1405HA 500 +/ - 20 140 (Tc=25C) 100 (Tc=25C) 280 Tc=25C) 880 Tc=25C) -40 to +150 -40 to +125 2000 3.0 2.0 Unit V V A A W C C V N*m Pulsed Drain Current Total Power Dissipation Operating Junction Temperature Range Storage Temperature Range Isolation Voltage Terminals to Base AC, 1 min.) Module Base to Heatsink Mounting Torque Bus Bar to Main Terminals ELECTRICAL CHARACTERISTICS (@Tc=25C unless otherwise noted) Characteristic Symbol Test Condition Zero Gate Voltage Drain Current Gate-Source Threshold Voltage Gate-Source Leakage Current Static Drain-Source On-Resistance Drain-Source On-Voltage Forward Transconductance Input Capacitance Output Capacitance Reverse Transfer Capacitance Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time IDSS VGS(th) IGSS rDS(on) VDS(on) gfs Cies Coss Crss td(on) tr td(off) tf VDS=VDSS,VGS=0V Tj=125C, VDS=0.8VDSS,VGS=0V VDS=VGS, ID=3mA VGS=+/- 20V,VDS=0V VGS=10V, ID=70A VGS=10V, ID=70A VDS=15V, ID=70A VDS=25V,VGS=0V,f=1MHz VDD= 1/2VDSS ID=70A VGS= -5V, +10V RG= 5 ohm Min. 2.0 - Typ. 3.1 35 3.0 100 28 3.6 0.8 300 420 810 200 Max. 2.0 8.0 4.0 1.0 40 3.4 - Unit mA V A m-ohm V S nF nF nF ns FREE WHEELING DIODES RATINGS & CHARACTERISTICS (Tc=25C) Characteristic Symbol Test Condition Continuous Source Current Pulsed Source Current Diode Forward Voltage Reverse Recovery Time Reverse Recovery IS ISM VSD trr Qr D.C. IS=140A IS=140A, -dis/dt=100A/s Min. - Typ. 130 0.3 Max. 100 280 1.7 - Unit A A V ns C Unit C/W THERMAL CHARACTERISTICS Characteristic Symbol Thermal Resistance, Junction to Case Thermal Resistance, Case to Heatsink Rth(j-c) Rth(c-f) Test Condition MOS FET Diode Mounting surface flat, smooth, and greased Min. - Typ. - Max. 0.142 1.0 0.05 PDM1405HA Fig. 1 Typical Output Characteristics TC=25i 250 s Pulse Test Fig. 2 Typical Drain-Source On-Voltage Fig. 2 Vs. Gate-Source Voltage Fig. 3 Typical Drain-Source On Voltage Fig. 3 Vs. Junction Temperature 240 12 DRAIN TO SOURCE ON VOLTAGE VDS (on)(V) TC=25i 250 s Pulse Test 15 DRAIN TO SOURCE ON VOLTAGE VDS (on)(V) VGS=10V 250 s Pulse Test VGS=10V 200 DRAIN CURRENT ID (A) 8V 7V 10 ID=140A 12 160 6V 8 ID=145A 9 120 6 70A 6 80 5V 4 70A 40 2 35A 3 35A 0 0 2 4 6 8 10 DRAIN TO SOURCE VOLTAGE VDS (V) 12 0 0 4 8 12 GATE TO SOURCE VOLTAGE VGS (V) 16 0 -40 0 40 80 120 JUNCTION TEMPERATURE Tj ( ) 160 Fig. 4 Typical Capacitance Fig. 4 Vs. Drain-Source Voltage Fig. 5 Typical Gate Charge Fig. 5 Vs. Gate-Source Voltage VGS=0V f=1MHz Fig. 6 Typical Switching Time Fig. 6 Vs. Series Gate impedance ID=100A VDD= 100V 250V 400V 36 16 10 ID=70A VDD=250V TC=25i 80 s Pulse Test td(off) GATE TO SOURCE VOLTAGE VGS (V) 30 CAPACITANCE C (nF) 5 SWITCHING TIME t ( s) Ciss 12 tr td(on) tf 24 2 1 18 8 12 0.5 4 6 0.2 0 1 2 5 10 20 50 DRAIN TO SOURCE VOLTAGE VDS (V) 100 0 0 300 600 900 1200 1500 TOTAL GATE CHRAGE Qg (nC) 1800 0.1 2 5 10 20 50 100 SERIES GATE IMPEDANCE RG ( ) 200 Fig. 7 Typical Switching Time Fig. 7 Vs. Drain Current Fig. 8 Typical Source-Drain Diode Forward Fig. 8 Characteristics Fig. 9 Typical Reverse Recovery Characteristics 250 s Pulse Test IS=140A trr IS=100A Tj=125i 1000 RG=5 VDD=250V TC=25i 80 s Pulse Test td(off) 200 500 REVERSE RECOVERY TIME trr (ns) REVERSE CURRENT IR (A) 500 tr 200 tf SOURCE CURRENT IS (A) td(on) 160 200 SWITCHING TIME t (ns) 100 120 Tj=125i Tj=25i 100 50 IR 80 50 20 40 20 10 0 10 2 5 10 20 50 DRAIN CURRENT ID (A) 100 200 0 0.4 0.8 1.2 1.6 2.0 SOURCE TO DRAIN VOLTAGE VSD (V) NORMALIZED TRANSIENT THERMAL IMPEDANCE [rth(j-c) / Rth(j-c)] 2 1 0.5 0.2 0.1 0.05 0.02 2.4 5 0 100 200 300 400 -dis/dt (A/ s) 500 600 Fig. 10 Maximum Safe Operating Area TC=25i Tj=150iMAX Single Pulse 10 s 100 s Fig. 11-1 Normalized Transient Thermal impedance(MOSFET) 500 200 100 DRAIN CURRENT ID (A) 50 20 10 5 2 1 0.5 1 2 M O S F E T Operation in this area is limited by RDS (on) 1ms Per Unit Base Rth(j-c)=0.142i/W 1 Shot Pulse 0.01 -5 10 10 -4 10 -3 10 -2 10 -1 PULSE DURATION t (s) 1 10 10ms NORMALIZED TRANSIENT THERMAL IMPEDANCE [rth(j-c) / Rth(j-c)] Fig. 11-2 Normalized Transient Thermal impedance(DIODE) 2 1 0.5 0.2 0.1 0.05 0.02 0.01 -5 10 Per Unit Base Rth(j-c)=1.0i/W 1 Shot Pulse DC 5 10 20 50 100 200 5001000 DRAIN TO SOURCE VOLTAGE VDS (V) 10 -4 10 -3 10 -2 10 -1 PULSE DURATION t (s) 1 10 - 320 - |
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