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Datasheet File OCR Text:

PSD835G2V
Flash PSD, 3 V supply, for 8-bit MCUs 4 Mbit + 256 Kbit dual Flash memories and 64 Kbit SRAM
Features
Flash in-system programmable (ISP) peripheral for 8-bit MCUs Dual bank Flash memories - 4 Mbits of Primary Flash memory (8 uniform sectors, 64 Kbyte) - 256 Kbits of secondary Flash memory with 4 sectors - Concurrent operation: READ from one memory while erasing and writing the other 64 Kbit of battery-backed SRAM 52 reconfigurable I/O ports Enhanced JTAG serial port PLD with macrocells - Over 3000 gates of PLD: CPLD and DPLD - CPLD with 16 output macrocells (OMCs) and 24 input macrocells (IMCs) - DPLD - user defined internal chip select decoding 52 individually configurable I/O port pins They can be used for the following functions: - MCU I/Os - PLD I/Os - Latched MCU address output - Special function I/Os. - I/O ports may be configured as open-drain outputs. In-system programming (ISP) with JTAG - Built-in JTAG compliant serial port allows full-chip In-System Programmability - Efficient manufacturing allow easy product testing and programming - Use low cost FlashLINK cable with PC

TQFP80 (U)

Page register - Internal page register that can be used to expand the microcontroller address space by a factor of 256 Programmable power management High endurance: - 100 000 Erase/WRITE cycles of Flash memory - 1,000 Erase/WRITE cycles of PLD - 15 year data retention 3 V to 3.6 V single supply voltage Standby current as low as 25 A Memory speed - 90 ns Flash memory and SRAM access time for VCC = 3.0 V to 3.6 V - 120 ns Flash memory and SRAM access time for VCC = 3.0 V to 3.6 V ECOPACK(R) packages

April 2007
Rev 2
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www.st.com 1
Contents
PSD835G2V
Contents
1 Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
1.1 In-system programming (ISP) via JTAG . . . . . . . . . . . . . . . . . . . . . . . . . . 11
1.1.1 1.1.2 1.1.3 First time programming . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Inventory build-up of pre-programmed devices . . . . . . . . . . . . . . . . . . . 11 Expensive sockets . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
1.2
In-application programming (IAP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
1.2.1 1.2.2 1.2.3 Simultaneous read and write to Flash memory . . . . . . . . . . . . . . . . . . . 12 Complex memory mapping . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Separate Program and Data space . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
1.3
PSDsoft . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
2
PSD architectural overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
2.1 2.2 2.3 2.4 2.5 2.6 2.7 2.8 2.9 Memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Page Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 PLDs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 I/O Ports . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 MCU Bus Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 JTAG Port . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 In-system programming (ISP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 In-application re-programming (IAP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Power management unit (PMU) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
3 4 5 6
Development system . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 PSD register description and address offset . . . . . . . . . . . . . . . . . . . . 23 Register bit definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 Detailed operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
6.1 6.2 6.3 6.4 Memory blocks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 Primary Flash memory and Secondary Flash memory description . . . . . 30 Memory Block Select signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 Upper and Lower Block IN MAIN FLASH SECTOR . . . . . . . . . . . . . . . . . 30
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6.5 6.6
Ready/Busy (PE4) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 Memory operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
7
Instructions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
7.1 7.2 7.3 7.4 7.5 7.6 7.7 7.8 7.9 7.10 Power-up mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 READ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 Read Memory Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 Read Primary Flash Identifier . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 Read Memory Sector Protection Status . . . . . . . . . . . . . . . . . . . . . . . . . . 34 Read the Erase/Program Status Bits . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 Data polling flag (DQ7) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 Toggle flag (DQ6) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 Error flag (DQ5) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 Erase time-out flag (DQ3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
8
Programming Flash memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
8.1 8.2 Data polling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37 Data toggle . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
8.2.1 Unlock bypass . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
9
Erasing Flash memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
9.1 9.2 9.3 9.4 Flash Bulk Erase . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41 Flash Sector Erase . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41 Suspend Sector Erase . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42 Resume Sector Erase . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
10
Specific features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
10.1 10.2 10.3 Flash memory sector protect . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43 Reset Flash . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43 Reset (RESET) signal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
11 12
SRAM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44 Sector Select and SRAM Select . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
12.1 Example . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
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PSD835G2V
12.2 12.3
Memory select configuration for MCUs with separate program and data spaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45 Configuration modes for MCUs with separate program and data spaces 46
12.3.1 12.3.2 Separate space modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46 Combined Space Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
13 14 15
Page Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48 Memory ID registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49 PLDs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
15.1 15.2 15.3 15.4 15.5 15.6 15.7 15.8 15.9 The Turbo Bit in PSD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49 Decode PLD (DPLD) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52 Complex PLD (CPLD) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53 Output macrocell (OMC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55 Product term allocator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56
15.5.1 Loading and reading the output macrocells (OMC) . . . . . . . . . . . . . . . . 56
The OMC mask register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56 The Output Enable of the OMC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56 Input macrocells (IMC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58 External chip . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60
16
MCU bus interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62
16.1 16.2 16.3 16.4 16.5 16.6 16.7 PSD interface to a multiplexed 8-bit bus . . . . . . . . . . . . . . . . . . . . . . . . . . 62 PSD interface to a non-multiplexed 8-bit bus . . . . . . . . . . . . . . . . . . . . . . 63 MCU bus interface examples . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63 80C31 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64 80C251 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66 80C51XA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69 68HC11 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70
17
I/O ports . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71
17.1 17.2 17.3 General port architecture . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71 Port operating modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72 MCU I/O mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73
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17.4 17.5 17.6 17.7 17.8 17.9
PLD I/O mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73 Address out mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73 Address In mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75 Data Port mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75 Peripheral I/O mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75 JTAG in-system programming (ISP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76
17.10 Port Configuration Registers (PCR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76 17.11 Control Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76 17.12 Direction Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77 17.13 Drive Select Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77 17.14 Port Data Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78 17.15 Data In . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79 17.16 Data Out Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79 17.17 Output macrocells (OMC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79 17.18 OMC Mask Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79 17.19 Input macrocells (IMC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79 17.20 Enable Out . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80 17.21 Ports A,B and C - Functionality and Structure . . . . . . . . . . . . . . . . . . . . . 80 17.22 Port D - functionality and structure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81 17.23 Port E - functionality and structure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82 17.24 Port F - functionality and structure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82 17.25 Port G - functionality and structure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82
18
Power management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84
18.1 18.2 18.3 18.4 18.5 18.6 Automatic Power-down (APD) unit and Power-down mode . . . . . . . . . . . 85
18.1.1 Power-down mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85
Other power saving options . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86 PLD power management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86
18.3.1 SRAM Standby mode (battery backup) . . . . . . . . . . . . . . . . . . . . . . . . . 87
PSD Chip Select input (CSI, PD2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87 Input Clock . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87 Input control signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88
19
Reset timing and device status at reset . . . . . . . . . . . . . . . . . . . . . . . . 89
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19.1 19.2 19.3 19.4
Power-up reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 89 Warm reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 89 I/O pin, Register and PLD status at reset . . . . . . . . . . . . . . . . . . . . . . . . . 89 Reset of Flash memory Erase and Program cycles . . . . . . . . . . . . . . . . . 89
20
Programming in-circuit using the JTAG/ISP interface . . . . . . . . . . . . . 91
20.1 20.2 20.3 Standard JTAG signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 91 JTAG extensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92 Security and Flash memory protection . . . . . . . . . . . . . . . . . . . . . . . . . . . 92
21 22 23 24 25
AC/DC parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 93 Maximum rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96 AC and DC parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97 Package mechanical . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113 Part numbering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 115
Appendix A Pin assignments . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 116 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 117
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List of tables
List of tables
Table 1. Table 2. Table 3. Table 4. Table 5. Table 6. Table 7. Table 8. Table 9. Table 10. Table 11. Table 12. Table 13. Table 14. Table 15. Table 16. Table 17. Table 18. Table 19. Table 20. Table 21. Table 22. Table 23. Table 24. Table 25. Table 26. Table 27. Table 28. Table 29. Table 30. Table 31. Table 32. Table 33. Table 34. Table 35. Table 36. Table 37. Table 38. Table 39. Table 40. Table 41. Table 42. Table 43. Table 44. Table 45. Table 46. Table 47. Table 48. Pin description (for the TQFP80 package) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 PLD I/O . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 JTAG signals on Port E . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Methods of programming different functional blocks of the PSD . . . . . . . . . . . . . . . . . . . . 21 Register address offset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 Data-In Registers - Ports A, B, C, D, E, F, G . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 Data-Out Registers - Ports A, B, C, D, E, F, G . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 Direction Registers - Ports A, B, C, D, E, F, G. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 Control Registers - Ports E, F, G . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 Drive Registers - Ports A, B, D, E, G . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 Drive Registers - Ports C, F . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 Enable-Out Registers - Ports A, B, C, F . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 Input Macrocells - Ports A, B, C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 Output Macrocells A Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 Output Macrocells B Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 Mask Macrocells A Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 Mask Macrocells B Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 Flash Memory Protection Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 Flash Boot Protection Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 JTAG Enable Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 Page Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 PMMR0 Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 PMMR2 Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 VM Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 Memory_ID0 Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 Memory_ID1 Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 Memory block size and organization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 Instructions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 Status bit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 DPLD and CPLD Inputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 Output macrocell port and data bit assignments . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55 MCUs and their control signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62 80C251 configurations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66 Interfacing the PSD with the 80C251, with one read input . . . . . . . . . . . . . . . . . . . . . . . . . 67 Port operating modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74 Port operating mode settings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74 I/O port latched address output assignments . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75 Port Configuration Registers (PCR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77 Port pin direction control, Output Enable P.T. not defined . . . . . . . . . . . . . . . . . . . . . . . . . 78 Port pin direction control, Output Enable P.T. defined . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78 Port direction assignment example. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78 Drive Register pin assignment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78 Port Data Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79 Power-down mode's effect on ports . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85 PSD timing and Standby current during Power-down mode. . . . . . . . . . . . . . . . . . . . . . . . 86 APD counter operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88 Status during power-up reset, warm reset and power-down mode . . . . . . . . . . . . . . . . . . 90 JTAG port signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92
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List of tables Table 49. Table 50. Table 51. Table 52. Table 53. Table 54. Table 55. Table 56. Table 57. Table 58. Table 59. Table 60. Table 61. Table 62. Table 63. Table 64. Table 65. Table 66. Table 67. Table 68. Table 69. Table 70. Table 71. Table 72. Table 73.
PSD835G2V
Example of PSD typical power calculation at VCC = 3.0 V (with Turbo mode on) . . . . . . . 94 Example of PSD typical power calculation at VCC = 3.0 V (with Turbo mode Off) . . . . . . . 95 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96 Operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97 AC signal letters for PLD timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97 AC signal behavior symbols for PLD timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 98 AC measurement conditions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 98 Capacitance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 98 DC characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100 CPLD combinatorial timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 101 CPLD Macrocell Synchronous clock mode timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 102 CPLD Macrocell Asynchronous clock mode timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 102 Input macrocell timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 104 Read timing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 106 Write timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 108 Port F peripheral data mode read timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 109 Port F peripheral data mode write timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 110 Program, Write and Erase times. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 110 Power-down timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 111 Reset (RESET) Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 111 VSTBYON timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 111 ISC timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 112 TQFP80 - 80 lead Plastic Quad Flatpack, package mechanical data. . . . . . . . . . . . . . . . 114 Ordering information scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 115 PSD835G2V TQFP80. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 116
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PSD835G2V
List of figures
List of figures
Figure 1. Figure 2. Figure 3. Figure 4. Figure 5. Figure 6. Figure 7. Figure 8. Figure 9. Figure 10. Figure 11. Figure 12. Figure 13. Figure 14. Figure 15. Figure 16. Figure 17. Figure 18. Figure 19. Figure 20. Figure 21. Figure 22. Figure 23. Figure 24. Figure 25. Figure 26. Figure 27. Figure 28. Figure 29. Figure 30. Figure 31. Figure 32. Figure 33. Figure 34. Figure 35. Figure 36. Figure 37. Figure 38. Figure 39. Figure 40. Figure 41. Figure 42. Figure 43. Figure 44. Figure 45. Figure 46. Figure 47. Figure 48. TQFP80 connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 PSD block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 PSDsoft development tool . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 Example for Flash Sector Chip Select FS0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 Selecting the upper or lower block in a Primary Flash memory sector . . . . . . . . . . . . . . . . 31 Data polling flowchart . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38 Data toggle flowchart . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40 Priority level of memory and I/O components . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46 8031 memory modules - separate space. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46 8031 memory modules - combined space . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47 Page Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48 PLD diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51 DPLD logic array. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52 Macrocell and I/O Port . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54 CPLD output macrocell . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57 Input macrocell . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59 Handshaking communication using input macrocells . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60 External Chip Select . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61 An example of a typical 8-bit multiplexed bus interface . . . . . . . . . . . . . . . . . . . . . . . . . . . 63 An example of a typical 8-bit non-multiplexed bus interface. . . . . . . . . . . . . . . . . . . . . . . . 64 Interfacing the PSD with an 80C31. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65 Interfacing the PSD with the 80C251, with RD and PSEN Inputs . . . . . . . . . . . . . . . . . . . 68 Interfacing the PSD with the 80C51X, 8-bit data bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69 Interfacing the PSD with a 68HC11 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70 General I/O port architecture . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72 Peripheral I/O mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76 Port A, B and C structure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80 Port D structure. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81 Port E, F, G structure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83 APD unit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86 Enable power-down flow chart . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88 Power-up and warm reset (RESET) timing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 89 PLD ICC /frequency consumption . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 93 AC measurement I/O waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 98 AC measurement load circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 98 Switching waveforms - key . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 99 Input to Output Disable / Enable . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 101 Combinatorial Timing - PLD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 101 Synchronous Clock mode timing - PLD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 103 Asynchronous Reset / Preset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 103 Asynchronous Clock mode timing (product term clock) . . . . . . . . . . . . . . . . . . . . . . . . . . 103 Input macrocell timing (product term clock) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 104 Read timing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 105 Write timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 107 Peripheral I/O Read timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 109 Peripheral I/O Write timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 110 Reset (RESET) timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 111 ISC timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 112
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List of figures Figure 49.
PSD835G2V
TQFP80 - 80 lead Plastic Quad Flatpack, package outline . . . . . . . . . . . . . . . . . . . . . . . 113
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PSD835G2V
Description
1
Description
The PSD family of memory systems for microcontrollers (MCUs) brings In-SystemProgrammability (ISP) to Flash memory and programmable logic. The result is a simple and flexible solution for embedded designs. PSD devices combine many of the peripheral functions found in MCU based applications. The CPLD in the PSD devices features an optimized macrocell logic architecture. The PSD macrocell was created to address the unique requirements of embedded system designs. It allows direct connection between the system address/data bus, and the internal PSD registers, to simplify communication between the MCU and other supporting devices. The PSD family offers two methods to program the PSD Flash memory while the PSD is soldered to the circuit board: In-System Programming (ISP) via JTAG, and In-Application Programming (IAP).
1.1
In-system programming (ISP) via JTAG
An IEEE 1149.1 compliant JTAG In-System Programming (ISP) interface is included on the PSD enabling the entire device (Flash memories, PLD, configuration) to be rapidly programmed while soldered to the circuit board. This requires no MCU participation, which means the PSD can be programmed anytime, even when completely blank. The innovative JTAG interface to Flash memories is an industry first, solving key problems faced by designers and manufacturing houses, such as:
1.1.1
First time programming
How do I get firmware into the Flash memory the very first time? JTAG is the answer. Program the blank PSD with no MCU involvement.
1.1.2
Inventory build-up of pre-programmed devices
How do I maintain an accurate count of pre-programmed Flash memory and PLD devices based on customer demand? How many and what version? JTAG is the answer. Build your hardware with blank PSDs soldered directly to the board and then custom program just before they are shipped to the customer. No more labels on chips, and no more wasted inventory.
1.1.3
Expensive sockets
How do I eliminate the need for expensive and unreliable sockets? JTAG is the answer. Solder the PSD directly to the circuit board. Program first time and subsequent times with JTAG. No need to handle devices and bend the fragile leads.
1.2
In-application programming (IAP)
Two independent Flash memory arrays are included so that the MCU can execute code from one while erasing and programming the other. Robust product firmware updates in the field are possible over any communications channel (CAN, Ethernet, UART, J1850, etc.) using this unique architecture. Designers are relieved of these problems:
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Description
PSD835G2V
1.2.1
Simultaneous read and write to Flash memory
How can the MCU program the same memory from which it is executing code? It cannot. The PSD allows the MCU to operate the two Flash memory blocks concurrently, reading code from one while erasing and programming the other during IAP.
1.2.2
Complex memory mapping
How can I map these two memories efficiently? A programmable Decode PLD (DPLD) is embedded in the PSD. The concurrent PSD memories can be mapped anywhere in MCU address space, segment by segment with extremely high address resolution. As an option, the secondary Flash memory can be swapped out of the system memory map when IAP is complete. A built-in page register breaks the MCU address limit.
1.2.3
Separate Program and Data space
How can I write to Flash memory while it resides in Program space during field firmware updates? My 80C51 will not allow it. The PSD provides means to reclassify Flash memory as Data space during IAP, then back to Program space when complete.
1.3
PSDsoft
PSDsoft, a software development tool from ST, guides you through the design process stepby-step making it possible to complete an embedded MCU design capable of ISP/IAP in just hours. Select your MCU and PSDsoft takes you through the remainder of the design with point and click entry, covering PSD selection, pin definitions, programmable logic inputs and outputs, MCU memory map definition, ANSI-C code generation for your MCU, and merging your MCU firmware with the PSD design. When complete, two different device programmers are supported directly from PSDsoft: FlashLINK (JTAG) and PSDpro.
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PSD835G2V Figure 1. TQFP80 connections
70 GND 69 VCC 80 PD1 79 PD0 68 PB7 67 PB6 66 PB5 65 PB4 64 PB3 63 PB2 62 PB1 61 PB0 78 PE7 77 PE6 76 PE5 75 PE4 74 PE3 73 PE2 72 PE1 71 PE0
Description
PD2 1 PD3 2 AD0 3 AD1 4 AD2 5 AD3 6 AD4 7 GND 8 VCC 9 AD5 10 AD6 11 AD7 12 AD8 13 AD9 14 AD10 15 AD11 16 AD12 17 AD13 18 AD14 19 AD15 20
60 CNTL1 59 CNTL0 58 PA7 57 PA6 56 PA5 55 PA4 54 PA3 53 PA2 52 PA1 51 PA0 50 GND 49 GND 48 PC7 47 PC6 46 PC5 45 PC4 44 PC3 43 PC2 42 PC1 41 PC0
PG0 21
PG1 22
PG2 23
PG3 24
PG4 25
PG5 26
PG6 27
PG7 28
VCC 29
GND 30
PF0 31
PF1 32
PF2 33
PF3 34
PF4 35
PF5 36
PF6 37
PF7 38
RESET 39
CNTL2 40
AI04943
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Description Table 1.
Pin name
PSD835G2V Pin description (for the TQFP80 package)
Pin Type Description This is the lower Address/Data port. Connect your MCU address or address/data bus according to the following rules: If your MCU has a multiplexed address/data bus where the data is multiplexed with the lower address bits, connect AD0-AD7 to this port. If your MCU does not have a multiplexed address/data bus, connect A0-A7 to this port. If you are using an 80C51XA in burst mode, connect A4/D0 through A11/D7 to this port. ALE or AS latches the address. The PSD drives data out only if the read signal is active and one of the PSD functional blocks was selected. The addresses on this port are passed to the PLDs. This is the upper Address/Data port. Connect your MCU address or address/data bus according to the following rules: If your MCU has a multiplexed address/data bus where the data is multiplexed with the lower address bits, connect A8-A15 to this port. If your MCU does not have a multiplexed address/data bus, connect A8-A15 to this port. If you are using an 80C251 in page mode, connect AD8-AD15 to this port. If you are using an 80C51XA in burst mode, connect A12-A19 to this port. ALE or AS latches the address. The PSD drives data out only if the read signal is active and one of the PSD functional blocks was selected. The addresses on this port are passed to the PLDs. The following control signals can be connected to this port, based on your MCU: WR - active Low Write Strobe input. R_W - active High read/active Low write input. This port is connected to the PLDs. Therefore, these signals can be used in decode and other logic equations. The following control signals can be connected to this port, based on your MCU: RD - active Low Read Strobe input. E - E clock input. DS - active Low Data Strobe input. PSEN - connect PSEN to this port when it is being used as an active Low read signal. For example, when the 80C251 outputs more than 16 address bits, PSEN is actually the read signal. This port is connected to the PLDs. Therefore, these signals can be used in decode and other logic equations. This port can be used to input the PSEN (Program Select Enable) signal from any MCU that uses this signal for code exclusively. If your MCU does not output a Program Select Enable signal, this port can be used as a generic input. This port is connected to the PLDs as input. Active Low input. Resets I/O Ports, PLD macrocells and some of the Configuration Registers and JTAG registers. Must be Low at Power-up. Reset also aborts the Flash programming/erase cycle that is in progress.
ADIO0-7
3-7-10-12
I/O
ADIO8-15
13-20
I/O
CNTL0
59
I
CNTL1
60
I
CNTL2
40
I
Reset
39
I
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PSD835G2V Table 1.
Pin name PA0 PA1 PA2 PA3 PA4 PA5 PA6 PA7 PB0 PB1 PB2 PB3 PB4 PB5 PB6 PB7 PC0 PC1 PC2 PC3 PC4 PC5 PC6 PC7
Description
Pin description (for the TQFP80 package) (continued)
Pin 58 57 56 55 54 53 52 51 68 67 66 65 64 63 62 61 48 47 46 45 44 43 42 41 Type Description
These pins make up Port A. These port pins are configurable and can have the following functions: I/O CMOS MCU I/O - write to or read from a standard output or input port. or Open CPLD macrocell (McellA0-7) outputs. Drain Inputs to the PLDs. Latched, transparent or registered PLD input.
I/O CMOS or Open Drain
These pins make up Port B. These port pins are configurable and can have the following functions: MCU I/O - write to or read from a standard output or input port. CPLD macrocell (McellB0-7) output. Inputs to the PLDs. Latched, transparent or registered PLD input.
These pins make up Port C. These port pins are configurable and can have the I/O following functions: CMOS MCU I/O - write to or read from a standard output or input port. or Open Drain External Chip Select (ECS0-7) output. Latched, transparent or registered PLD input. PD0 pin of Port D. This port pin can be configured to have the following functions: I/O ALE/AS input latches addresses on ADIO0-ADIO15 pins. CMOS AS input latches addresses on ADIO0-ADIO15 pins on the rising edge. or Open Drain Input to the PLDs. Transparent PLD input. PD1 pin of Port D. This port pin can be configured to have the following functions: I/O MCU I/O - write to or read from a standard output or input port. CMOS or Open Input to the PLDs. Drain CLKIN - clock input to the CPLD macrocells, the APD Unit's Power-down counter, and the CPLD AND Array. PD2 pin of Port D. This port pin can be configured to have the following functions: MCU I/O - write to or read from a standard output or input port. Input to the PLDs. PSD Chip Select Input (CSI). When Low, the MCU can access the PSD memory and I/O. When High, the PSD memory blocks are disabled to conserve power. The trailing edge of CSI can be used to get the PSD out of power-down mode.
PD0
79
PD1
80
PD2
1
I/O CMOS or Open Drain
PD3
2
I/O PD3 pin of Port D. This port pin can be configured to have the following functions: CMOS MCU I/O - write to or read from a standard output or input port. or Open Drain Input to the PLDs.
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Description Table 1.
Pin name
PSD835G2V Pin description (for the TQFP80 package) (continued)
Pin Type I/O CMOS or Open Drain I/O CMOS or Open Drain I/O CMOS or Open Drain I/O CMOS or Open Drain Description PE0 pin of Port E. This port pin can be configured to have the following functions: MCU I/O - write to or read from a standard output or input port. Latched address output. TMS input for JTAG/ISP interface. PE1 pin of Port E. This port pin can be configured to have the following functions: MCU I/O - write to or read from a standard output or input port. Latched address output. TCK input for JTAG/ISP interface (Schmidt Trigger). PE2 pin of Port E. This port pin can be configured to have the following functions: MCU I/O - write to or read from a standard output or input port. Latched address output. TDI input for JTAG/ISP interface. PE3 pin of Port E. This port pin can be configured to have the following functions: MCU I/O - write to or read from a standard output or input port. Latched address output. TDO input for JTAG/ISP interface.
PE0
71
PE1
72
PE2
73
PE3
74
PE4
75
PE4 pin of Port E. This port pin can be configured to have the following functions: I/O MCU I/O - write to or read from a standard output or input port. CMOS Latched address output. or Open Drain TSTAT input for the ISP interface. Ready/Busy for in-circuit Parallel Programming. I/O CMOS or Open Drain I/O CMOS or Open Drain PE5 pin of Port E. This port pin can be configured to have the following functions: MCU I/O - write to or read from a standard output or input port. Latched address output. TERR active Low input for ISP interface. PE6 pin of Port E. This port pin can be configured to have the following functions: MCU I/O - write to or read from a standard output or input port. Latched address output. VSTBY SRAM standby voltage input for battery backup SRAM.
PE5
76
PE6
77
PE7
78
PE7 pin of Port E. This port pin can be configured to have the following functions: I/O MCU I/O - write to or read from a standard output or input port. CMOS Latched address output. or Open Drain VBATON battery backup indicator output. Goes High when power is drawn from an external battery. PF0 through PF7 pins of Port F. This port pins can be configured to have the following functions: I/O MCU I/O - write to or read from a standard output or input port. CMOS Input to the PLDs. or Open Drain Latched address outputs. As address A0-A3 inputs in 80C51XA mode. As data bus port (D07) in non-multiplexed bus configuration.
PF0-PF7
31-38
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PSD835G2V Table 1.
Pin name
Description
Pin description (for the TQFP80 package) (continued)
Pin Type I/O CMOS or Open Drain Description PG0 through PG7 pins of Port G. This port pins can be configured to have the following functions: MCU I/O - write to or read from a standard output or input port. Latched address outputs. Supply Voltage Ground pins
PG0-PG7
8, 30, 49, 50, 70 9, 29, 69 8, 30, 49, 50, 70
VCC GND
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Description
Figure 2.
ADDRESS/DATA/CONTROL BUS
PLD INPUT BUS PAGE REGISTER EMBEDDED ALGORITHM 8 SECTORS 4 MBIT PRIMARY FLASH MEMORY
CNTL0, CNTL1, CNTL2 SECTOR SELECTS FLASH DECODE PLD (DPLD) 82 SECTOR SELECTS SRAM SELECT PERIP I/O MODE SELECTS ADIO PORT CSIOP RUNTIME CONTROL AND I/O REGISTERS 8 EXT CS TO PORT C OR F 16 OUTPUT MACROCELLS PROG. PORT PORT F CLKIN PORT A & B 24 INPUT MACROCELLS PORT A ,B & C 64 KBIT BATTERY BACKUP SRAM PROG. MCU BUS INTRF. 256 KBIT SECONDARY FLASH MEMORY (BOOT OR DATA) 4 SECTORS
PSD block diagram
POWER MANGMT UNIT
VSTDBY (PE6 )
PROG. PORT
PA0 - PA7
AD0 - AD15
PORT A
PROG. PORT PORT B
PB0 - PB7
82
FLASH ISP CPLD (CPLD)
PF0 -PF7
PROG. PORT PORT C
PC0 - PC7
MACROCELL FEEDBACK OR PORT INPUT CLKIN
PORT F
PROG. PORT PORT D
PD0 - PD2
PG0 - PG7 PORT G
PROG. PORT
PROG. PORT GLOBAL CONFIG. & SECURITY PLD, CONFIGURATION & FLASH MEMORY LOADER JTAG SERIAL CHANNEL PORT E
PE0 - PE7
CLKIN (PD1)
PSD835G2V
AI05793b
PSD835G2V
PSD architectural overview
2
PSD architectural overview
PSD devices contain several major functional blocks. Figure 2. on page 18 shows the architecture of the PSD device family. The functions of each block are described briefly in the following sections. Many of the blocks perform multiple functions and are user configurable.
2.1
Memory
Each of the memory blocks is briefly discussed in the following paragraphs. A more detailed discussion can be found in Memory blocks on page 29. The 4Mbit (512K x 8) Flash memory is the primary memory of the PSD. It is divided into 8 equally-sized sectors that are individually selectable. The 256Kbit (32K x8) secondary Flash memory is divided into 4 equally-sized sectors. Each sector is individually selectable. The 64 Kbit SRAM is intended for use as a scratch-pad memory or as an extension to the MCU SRAM. If an external battery is connected to Voltage Standby (VSTBY, PC2), data is retained in the event of power failure. Each sector of memory can be located in a different address space as defined by the user. The access times for all memory types includes the address latching and DPLD decoding time.
2.2
Page Register
The 8-bit Page Register expands the address range of the MCU by up to 256 times. The paged address can be used as part of the address space to access external memory and peripherals, or internal memory and I/O. The Page Register can also be used to change the address mapping of sectors of the Flash memories into different memory spaces for IAP.
2.3
PLDs
The device contains two PLDs, the Decode PLD (DPLD) and the Complex PLD (CPLD), as shown in Table 2, each optimized for a different function. The functional partitioning of the PLDs reduces power consumption, optimizes cost/performance, and eases design entry. The DPLD is used to decode addresses and to generate Sector Select signals for the PSD internal memory and registers. The CPLD can implement user-defined logic functions. The DPLD has combinatorial outputs. The CPLD has 16 Output Macrocells (OMC) and 8 combinatorial outputs. The PSD also has 24 Input Macrocells (IMC) that can be configured as inputs to the PLDs. The PLDs receive their inputs from the PLD Input Bus and are differentiated by their output destinations, number of product terms, and macrocells. The PLDs consume minimal power by using Power-Management design techniques. The speed and power consumption of the PLD is controlled by the Turbo bit in PMMR0 and other bits in the PMMR2. These registers are set by the MCU at run-time. There is a slight penalty to PLD propagation time when invoking the power management features.
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PSD architectural overview
PSD835G2V
2.4
I/O Ports
The PSD has 52 I/O pins distributed over the seven ports (Port A, B, C, D, E, F and G). Each I/O pin can be individually configured for different functions. Ports can be configured as standard MCU I/O ports, PLD I/O, or latched address outputs for MCUs using multiplexed address/data buses. The JTAG pins can be enabled on Port E for In-System Programming (ISP). Ports F and G can also be configured as data ports for a non-multiplexed bus. Ports A and B can also be configured as a data port for a non-multiplexed bus.
2.5
MCU Bus Interface
PSD interfaces easily with most 8-bit MCUs that have either multiplexed or non-multiplexed address/data buses. The device is configured to respond to the MCU's control signals, which are also used as inputs to the PLDs. For examples, please see MCU bus interface examples on page 63. Table 2. PLD I/O
Name Decode PLD (DPLD) Complex PLD (CPLD) Inputs 82 82 Outputs 17 24 Product Terms 43 150
Table 3.
JTAG signals on Port E
Port E Pins JTAG Signal TMS TCK TDI TDO TSTAT TERR
PE0 PE1 PE2 PE3 PE4 PE5
2.6
JTAG Port
In-System Programming (ISP) can be performed through the JTAG signals on Port E. This serial interface allows complete programming of the entire PSD device. A blank device can be completely programmed. The JTAG signals (TMS, TCK, TSTAT, TERR, TDI, TDO) can be multiplexed with other functions on Port E. Table 3. on page 20 indicates the JTAG pin assignments.
2.7
In-system programming (ISP)
Using the JTAG signals on Port E, the entire PSD device (memory, logic, configuration) can be programmed or erased without the use of the MCU.
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PSD835G2V
PSD architectural overview
2.8
In-application re-programming (IAP)
The primary Flash memory can also be programmed in-system by the MCU executing the programming algorithms out of the secondary memory, or SRAM. Since this is a sizable separate block, the application can also continue to operate. The secondary memory can be programmed the same way by executing out of the primary Flash memory. The PLD or other PSD Configuration blocks can be programmed through the JTAG port or a device programmer. Table 4 indicates which programming methods can program different functional blocks of the PSD.
2.9
Power management unit (PMU)
The Power Management Unit (PMU) gives the user control of the power consumption on selected functional blocks based on system requirements. The PMU includes an Automatic Power-down (APD) Unit that turns off device functions during MCU inactivity. The APD Unit has a Power-down mode that helps reduce power consumption. The PSD also has some bits that are configured at run-time by the MCU to reduce power consumption of the CPLD. The Turbo bit in PMMR0 can be reset to 0 and the CPLD latches its outputs and goes to sleep until the next transition on its inputs. Additionally, bits in PMMR2 can be set by the MCU to block signals from entering the CPLD to reduce power consumption. Please see Power management on page 84 for more details. Table 4. Methods of programming different functional blocks of the PSD
Functional Block Primary Flash Memory Secondary Flash Memory PLD Array (DPLD and CPLD) PSD Configuration JTAG/ISP Yes Yes Yes Yes Device Programmer Yes Yes Yes Yes IAP Yes Yes No No
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Development system
PSD835G2V
3
Development system
The PSD family is supported by PSDsoft, a Windows-based (95, 98, NT) software development tool. A PSD design is quickly and easily produced in a point-and-click environment. The designer does not need to enter Hardware Description Language (HDL) equations, unless desired, to define PSD pin functions and memory map information. The general design flow is shown in Figure 3. PSDsoft is available from our web site (the address is given on the back page of this data sheet) or other distribution channels. PSDsoft directly supports two low cost device programmers form ST: PSDpro and FlashLINK (JTAG). Both of these programmers may be purchased through your local distributor/representative, or directly from our web site using a credit card. The PSD is also supported by third party device programmers. See our web site for the current list. Figure 3. PSDsoft development tool
Choose MCU and PSD
Automatically Configures MCU bus interface and other PSD attributes.
Define PSD Pin and Node Functions
Point-and-click definition of PSD pin functions, internal nodes and MCU system memory map
Define General Purpose Logic in CPLD
Point-and-click definition of combinatorial and registered logic in CPLD. Access to HDL is available if needed.
C Code Generation
GENERATE C CODE SPECIFIC TO PSD FUNCTIONS
Merge MCU Firmware with PSD Configuration
A composite object file is created containing MCU firmware and PSD configuration
MCU FIRMWARE HEX OR S-RECORD FORMAT
USER'S CHOICE OF MICROCONTROLLER COMPILER/LINKER
*.OBJ FILE
ST PSD Programmer
PSDPro, or FlashLINK (JTAG)
*.OBJ FILE AVAILABLE FOR 3rd PARTY PROGRAMMERS (CONVENTIONAL or JTAG/ISP)
AI04918b
22/118
PSD835G2V
PSD register description and address offset
4
PSD register description and address offset
Table 5 shows the offset addresses to the PSD registers relative to the CSIOP base address. The CSIOP space is the 256 Bytes of address that is allocated by the user to the internal PSD registers. Table 5 provides brief descriptions of the registers in CSIOP space. The following section gives a more detailed description.
Table 5.
Register address offset
Description Reads Port pin as input, MCU I/O input mode Selects mode between MCU I/O or Address Out Stores data for output to Port pins, MCU I/O output mode Configures Port pin as input or output Configures Port pins as either CMOS or Open Drain on some pins, while selecting high slew rate on other pins. Reads Input Macrocells 4C Reads the status of the output enable to the I/O Port driver Read - reads output of macrocells A Write - loads macrocell flipflops Read - reads output of macrocells B Write - loads macrocell flipflops Blocks writing to the Output Macrocells A 23 C0 Blocks writing to the Output Macrocells B Read only - Primary Flash Sector Protection Read only - PSD Security and Secondary Flash memory Sector Protection Enables JTAG Port Power Management Register 0 Power Management Register 2
Register name Port A Port B Port C Port D Port E Port F Port G Other(1) Data In Control Data Out Direction 04 06 05 07 14 14 15 15 00 01 10 11 30 32 34 36 40 42 44 46 41 43 45 47
Drive Select
08
09
18
19
38
48
49
Input Macrocell Enable Out
0A 0C
0B 0D 1C
1A 1B
Output Macrocells A
20
Output Macrocells B Mask Macrocells A Mask Macrocells B Primary Flash Protection Secondary Flash memory Protection JTAG Enable PMMR0 PMMR2
21
22
C2 C7 B0 B4
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PSD register description and address offset Table 5. Register address offset (continued)
PSD835G2V
Register name Port A Port B Port C Port D Port E Port F Port G Other(1) Page VM E0 E2
Description Page Register Places PSD memory areas in Program and/or Data space on an individual basis. Read only - Primary Flash memory and SRAM size Read only - Secondary Flash memory type and size
Memory_ID0 Memory_ID1
1. Other registers that are not part of the I/O ports.
F0 F1
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PSD835G2V
Register bit definition
5
Register bit definition
All the registers of the PSD are included here, for reference. Detailed descriptions of these registers can be found in the following sections. Table 6.
Bit 7 Port pin 7
Data-In Registers - Ports A, B, C, D, E, F, G(1)
Bit 6 Port pin 6 Bit 5 Port pin 5 Bit 4 Port pin 4 Bit 3 Port pin 3 Bit 2 Port pin 2 Bit 1 Port pin 1 Bit 0 Port pin 0
1. Bit Definitions (Read-only registers): Read Port pin status when Port is in MCU I/O input mode.
Table 7.
Bit 7 Port pin 7
Data-Out Registers - Ports A, B, C, D, E, F, G(1)
Bit 6 Port pin 6 Bit 5 Port pin 5 Bit 4 Port pin 4 Bit 3 Port pin 3 Bit 2 Port pin 2 Bit 1 Port pin 1 Bit 0 Port pin 0
1. Bit Definitions: Latched data for output to Port pin when pin is configured in MCU I/O output mode.
Table 8.
Bit 7 Port pin 7
Direction Registers - Ports A, B, C, D, E, F, G(1)
Bit 6 Port pin 6 Bit 5 Port pin 5 Bit 4 Port pin 4 Bit 3 Port pin 3 Bit 2 Port pin 2 Bit 1 Port pin 1 Bit 0 Port pin 0
1. Bit Definitions: Port pin 0 = Port pin is configured in Input mode (default). Port pin 1 = Port pin is configured in Output mode.
Table 9.
Bit 7 Port pin 7
Control Registers - Ports E, F, G(1)
Bit 6 Port pin 6 Bit 5 Port pin 5 Bit 4 Port pin 4 Bit 3 Port pin 3 Bit 2 Port pin 2 Bit 1 Port pin 1 Bit 0 Port pin 0
1. Bit Definitions: Port pin 0 = Port pin is configured in MCU I/O mode (default). Port pin 1 = Port pin is configured in Latched Address Out mode.
Table 10.
Bit 7 Port pin 7
Drive Registers - Ports A, B, D, E, G(1)
Bit 6 Port pin 6 Bit 5 Port pin 5 Bit 4 Port pin 4 Bit 3 Port pin 3 Bit 2 Port pin 2 Bit 1 Port pin 1 Bit 0 Port pin 0
1. Bit Definitions: Port pin 0 = Port pin is configured for CMOS Output driver (default). Port pin 1 = Port pin is configured for Open Drain output driver.
Table 11.
Bit 7 Port pin 7
Drive Registers - Ports C, F(1)
Bit 6 Port pin 6 Bit 5 Port pin 5 Bit 4 Port pin 4 Bit 3 Port pin 3 Bit 2 Port pin 2 Bit 1 Port pin 1 Bit 0 Port pin 0
1. Bit Definitions: Port pin 0 = Port pin is configured for CMOS Output driver (default). Port pin 1 = Port pin is configured in Slew Rate mode.
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Register bit definition Table 12.
Bit 7 Port pin 7
PSD835G2V Enable-Out Registers - Ports A, B, C, F(1)
Bit 6 Port pin 6 Bit 5 Port pin 5 Bit 4 Port pin 4 Bit 3 Port pin 3 Bit 2 Port pin 2 Bit 1 Port pin 1 Bit 0 Port pin 0
1. Bit Definitions (Read-only registers): Port pin 0 = Port pin is in tri-state driver (default). Port pin 1 = Port pin is enabled.
Table 13.
Bit 7 IMcell 7
Input Macrocells - Ports A, B, C(1)
Bit 6 IMcell 6 Bit 5 IMcell 5 Bit 4 IMcell 4 Bit 3 IMcell 3 Bit 2 IMcell 2 Bit 1 IMcell 1 Bit 0 IMcell 0
1. Bit Definitions (Read-only registers): Read Input Macrocell (IMC7-IMC0) status on Ports A, B and C.
Table 14.
Bit 7 Mcella 7
Output Macrocells A Register(1)
Bit 6 Mcella 6 Bit 5 Mcella 5 Bit 4 Mcella 4 Bit 3 Mcella 3 Bit 2 Mcella 2 Bit 1 Mcella 1 Bit 0 Mcella 0
1. Bit Definitions: Write Register: Load MCellA7-MCellA0 with 0 or 1. Read Register: Read MCellA7-MCellA0 output status.
Table 15.
Bit 7 Mcellb 7
Output Macrocells B Register(1)
Bit 6 Mcellb 6 Bit 5 Mcellb 5 Bit 4 Mcellb 4 Bit 3 Mcellb 3 Bit 2 Mcellb 2 Bit 1 Mcellb 1 Bit 0 Mcellb 0
1. Bit Definitions: Write Register: Load MCellB7-MCellB0 with 0 or 1. Read Register: Read MCellB7-MCellB0 output status.
Table 16.
Bit 7 Mcella 7
Mask Macrocells A Register(1)
Bit 6 Mcella 6 Bit 5 Mcella 5 Bit 4 Mcella 4 Bit 3 Mcella 3 Bit 2 Mcella 2 Bit 1 Mcella 1 Bit 0 Mcella 0
1. Bit Definitions: McellA_Prot 0 = Allow MCellA flip-flop to be loaded by MCU (default). McellA_Prot 1 = Prevent MCellA flip-flop from being loaded by MCU.
Table 17.
Bit 7 Mcellb 7
Mask Macrocells B Register(1)
Bit 6 Mcellb 6 Bit 5 Mcellb 5 Bit 4 Mcellb 4 Bit 3 Mcellb 3 Bit 2 Mcellb 2 Bit 1 Mcellb 1 Bit 0 Mcellb 0
1. Bit Definitions: McellB_Prot 0 = Allow MCellB flip-flop to be loaded by MCU (default). McellB_Prot 1 = Prevent MCellB flip-flop from being loaded by MCU.
Table 18.
Bit 7
Flash Memory Protection Register(1)
Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Sec7_Prot Sec6_Prot Sec5_Prot Sec4_Prot Sec3_Prot Sec2_Prot Sec1_Prot Sec0_Prot
1. Bit Definitions (Read-only register): Sec_Prot 1 = Primary Flash memory Sector is write protected. Sec_Prot 0 = Primary Flash memory Sector is not write protected.
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PSD835G2V Table 19.
Bit 7
Register bit definition Flash Boot Protection Register(1)
Bit 6 Bit 5 not used Bit 4 not used Bit 3 Bit 2 Bit 1 Bit 0 Sec3_Prot Sec2_Prot Sec1_Prot Sec0_Prot
Security_Bit not used
1. Bit Definitions: Sec_Prot 1 = Secondary Flash memory Sector is write protected. Sec_Prot 0 = Secondary Flash memory Sector is not write protected. Security_Bit 0 = Security Bit in device has not been set. Security_Bit 1 = Security Bit in device has been set.
Table 20.
Bit 7 not used
JTAG Enable Register(1)
Bit 6 not used Bit 5 not used Bit 4 not used Bit 3 not used Bit 2 not used Bit 1 not used Bit 0 JTAGEnable
1. Bit Definitions: JTAG_Enable 1 = JTAG Port is enabled. JTAG_Enable 0 = JTAG Port is disabled.
Table 21.
Bit 7 PGR 7
Page Register(1)
Bit 6 PGR 6 Bit 5 PGR 5 Bit 4 PGR 4 Bit 3 PGR 3 Bit 2 PGR 2 Bit 1 PGR 1 Bit 0 PGR 0
1. Bit Definitions: Configure Page input to PLD. Default is PGR7-PGR0=00.
Table 22.
Bit 7 not used (set to 0)
PMMR0 Register(1) (2)
Bit 6 not used (set to 0) Bit 5 Bit 4 Bit 3 Bit 2 not used (set to 0) Bit 1 APD Enable Bit 0 not used (set to 0) PLD PLD PLD MCells CLK Array CLK Turbo
1. The bits of this register are cleared to zero following Power-up. Subsequent Reset (Reset) pulses do not clear the registers. 2. Bit Definitions: APD Enable0 = Automatic Power-down (APD) is disabled. 1 = Automatic Power-down (APD) is enabled. PLD Turbo0 = PLD Turbo is on. 1 = PLD Turbo is off, saving power. PLD Array CLK0 = CLKIN to the PLD AND array is connected. Every CLKIN change powers up the PLD when Turbo bit is off. 1 = CLKIN to the PLD AND array is disconnected, saving power. PLD MCells CLK0 = CLKIN to the PLD Macrocells is connected. 1 = CLKIN to the PLD Macrocells is disconnected, saving power.
Table 23.
Bit 7 not used (set to 0)
PMMR2 Register(1)
Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 PLD Array Addr PLD Array PLD Array WRH ALE PLD Array PLD Array PLD Array not used CNTL2 CNTL1 CNTL0 (set to 0)
1. Bit Definitions: PLD Array Addr0 = Address A7-A0 are connected to the PLD array. 1 = Address A7-A0 are blocked from the PLD array, saving power. (Note: in XA mode, A3-A0 come from PF3-PF0, and A7-A4 come from ADIO7-ADIO4) PLD Array CNTL20 = CNTL2 input to the PLD AND array is connected. 1 = CNTL2 input to the PLD AND array is disconnected, saving power. PLD Array CNTL10 = CNTL1 input to the PLD AND array is connected. 1 = CNTL1 input to the PLD AND array is disconnected, saving power. PLD Array CNTL00 = CNTL0 input to the PLD AND array is connected. 1 = CNTL0 input to the PLD AND array is disconnected, saving power. PLD Array ALE0 = ALE input to the PLD AND array is connected. 1 = ALE input to the PLD AND array is disconnected, saving power. PLD Array WRH0 = WRH/DBE input to the PLD AND array is connected. 1 = WRH/DBE input to the PLD AND array is disconnected, saving power.
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Register bit definition Table 24.
Bit 7 Peripheral mode
PSD835G2V VM Register(1) (2)
Bit 6 not used (set to 0) Bit 5 not used (set to 0) Bit 4 FL_data Bit 3 Boot_data Bit 2 FL_code Bit 1 Boot_code Bit 0 SR_code
1. On reset, Bit1-Bit4 are loaded to configurations that are selected by the user in PSDsoft. Bit0 and Bit7 are always cleared on reset. Bit0-Bit4 are active only when the device is configured for the 8031 and compatible MCU families. 2. Bit Definitions: SR_code0 = PSEN cannot access SRAM. 1 = PSEN can access SRAM. Boot_code0 = PSEN cannot access Secondary NVM. 1 = PSEN can access Secondary NVM. FL_code0 = PSEN cannot access Primary Flash memory. 1 = PSEN can access Primary Flash memory. Boot_data0 = RD cannot access Secondary NVM. 1 = RD can access Secondary NVM. FL_data0 = RD cannot access Primary Flash memory. 1 = RD can access Primary Flash memory. Peripheral mode0 = Peripheral mode of Port F is disabled. 1 = Peripheral mode of Port F is enabled.
Table 25.
Bit 7 S_size 3
Memory_ID0 Register(1)
Bit 6 S_size 2 Bit 5 S_size 1 Bit 4 S_size 0 Bit 3 F_size 3 Bit 2 F_size 2 Bit 1 F_size 1 Bit 0 F_size 0
1. Bit Definitions: F_size[3:0]4h = Primary Flash memory size is 4 Mbit 5h = Primary Flash memory size is 8Mbit S_size[3:0]0h = There is no SRAM 1h = SRAM size is 16 Kbit 3h = SRAM size is 64 Kbit
Table 26.
Bit 7 not used (set to 0)
Memory_ID1 Register(1)
Bit 6 not used (set to 0) Bit 5 B_type 1 Bit 4 B_type 0 Bit 3 B_size 3 Bit 2 B_size 2 Bit 1 B_size 1 Bit 0 B_size 0
1. Bit Definitions: B_size[3:0]0h = There is no Secondary NVM 2h = Secondary NVM size is 256 Kbit B_type[1:0]0h = Secondary NVM is Flash memory 1h = Secondary NVM is EEPROM
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Detailed operation
6
Detailed operation
As shown in Figure 2. on page 18, the PSD consists of six major types of functional blocks:

Memory Blocks PLD Blocks MCU Bus Interface I/O Ports Power Management Unit (PMU) JTAG/ISP Interface
The functions of each block are described in the following sections. Many of the blocks perform multiple functions, and are user configurable.
6.1
Memory blocks
The PSD has the following memory blocks: - - - Primary Flash memory Secondary Flash memory SRAM
The Memory Select signals for these blocks originate from the Decode PLD (DPLD) and are user-defined in PSDsoft. Table 27. Memory block size and organization
Primary Flash memory Sector number 0 1 2 3 4 5 6 7 Total Secondary Flash memory SRAM
Sector size Sector Select Sector size Sector Select SRAM size SRAM Select (bytes) signal (bytes) signal (bytes) signal 64K 64K 64K 64K 64K 64K 64K 64K 512K FS0 FS1 FS2 FS3 FS4 FS5 FS6 FS7 8 Sectors 32K 4 Sectors 16K 8K 8K 8K 8K CSBOOT0 CSBOOT1 CSBOOT2 CSBOOT3 16K RS0
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Detailed operation
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6.2
Primary Flash memory and Secondary Flash memory description
The primary Flash memory is divided evenly into eight equal sectors. The secondary Flash memory is divided into four equal sectors of eight KBytes each. Each sector of either memory block can be separately protected from Program and Erase cycles. Flash memory may be erased on a sector-by-sector basis and programmed Word-by-Word. Flash sector erasure may be suspended while data is read from other sectors of the block and then resumed after reading. During a Program or Erase cycle in Flash memory, the status can be output on Ready/Busy (PE4). This pin is set up using PSDsoft.
6.3
Memory Block Select signals
The DPLD generates the Select signals for all the internal memory blocks (see PLDs on page 49). Each of the eight sectors of the primary Flash memory has a Select signal (FS0FS7) which can contain up to three product terms. Each of the four sectors of the secondary Flash memory has a Select signal (CSBOOT0-CSBOOT3) which can contain up to three product terms. Having three product terms for each Select signal allows a given sector to be mapped in different areas of system memory. When using an MCU with separate Program and Data space, these flexible Select signals allow dynamic re-mapping of sectors from one memory space to the other before and after IAP.
6.4
Upper and Lower Block IN MAIN FLASH SECTOR
The PSD835G2's main Flash memory has eight 64-KByte sectors. The 64-KByte sector size may cause some difficulty in code mapping for an 8-bit MCU with only 64-KByte address space. To resolve this mapping issue, the PSD835G2 provides additional logic (see Figure 5. on page 31) for the user to split the 8 sectors such that each sector has a lower and upper 32-KByte block, and the two blocks can reside in different pages but in the same address range. If your design works with 64KB sectors, you don't need to configure this logic. If the design requires 32KB blocks in each sector, you need to define a "FA15" PLD equation in PSDsoft as the A15 address input to the main Flash module. FA15 consists of 3 product terms and will control whether the MCU is accessing the lower or upper 32KB in the selected sector. Figure 4 shows an example for Flash sector chip select FS0. A typical equation is FA15 = pgr4 of the Page Register. When pgr4 is 0 (page 00), the lower 32KB is selected. When pgr4 is switched to 1 by the user, the upper 32KB is selected. PSDsoft will automatically generate the PLD equations shown, based on your point and click selections. If no FA15 equation is defined in PSDsoft, the A15 that comes from the MCU address bus will be routed as input to the primary Flash memory instead of FA15. The FA15 equation has no impact on the Sector Erase operation.
Note:
FA15 affects all eight sectors of the primary Flash memory simultaneously. You cannot direct FA15 to a particular Flash sector only.
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PSD835G2V Figure 4. Example for Flash Sector Chip Select FS0
Detailed operation
page = [pgr7... pgr0]; "Page Register output "Sector Chip Select Equation FS0 = ((0000h <= address <= 7FFFh) & page = 00h) # "select first 32KB block ((0000h <= address <= 7FFFh) & page = 10h); "select second 32KB block FA15 = pgr4; "as address A15 input to the primary Flash memory
ai07652
Figure 5.
Selecting the upper or lower block in a Primary Flash memory sector
FLASH MEMORY CHIP SELECT PINS FS0-FS7
DPLD ARRAY FA15 MUX A15 ADDR A15
PRIMARY FLASH MEMORY SECTOR
NVM CONTROL BIT(1)
A14-A0 ai07653
6.5
Ready/Busy (PE4)
This signal can be used to output the Ready/Busy status of the PSD. The output on Ready/Busy (PE4) is a 0 (Busy) when Flash memory blocks are being written to, or when the Flash memory block is being erased. The output is a 1 (Ready) when no Write or Erase cycle is in progress.
6.6
Memory operation
The primary Flash memory and secondary Flash memory are addressed through the MCU Bus Interface. The MCU can access these memories in one of two ways:

The MCU can execute a typical bus Write or Read operation just as it would if accessing a RAM or ROM device using standard bus cycles. The MCU can execute a specific instruction that consists of several Write and Read operations. This involves writing specific data patterns to special addresses within the Flash memory to invoke an embedded algorithm. These instructions are summarized in Table 28. on page 32.
Typically, the MCU can read Flash memory using Read operations, just as it would read a ROM device. However, Flash memory can only be altered using specific Erase and Program instructions. For example, the MCU cannot write a single byte directly to Flash memory as it would write a byte to RAM. To program a byte into Flash memory, the MCU must execute a Program instruction, then test the status of the Program cycle. This status test is achieved by a Read operation or polling Ready/Busy (PE4). Flash memory can also be read by using special instructions to retrieve particular Flash device information (sector protect status and ID).
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Detailed operation Table 28. Instructions(1) (2) (3)
FS0-FS7 or CSBOOT0CSBOOT3(4) 1 1 Cycle 1 "Read" RA @ RD AAh@ 555h 55h@ AAAh 90h@ 555h Read identifier @X01h Cycle 2 Cycle 3 Cycle 4 Cycle 5
PSD835G2V
Instruction
Cycle 6 Cycle 7
Read(5) Read Primary Flash ID(6)(7) Read Sector Protection(6)(8)(7) Program a Flash Byte(7) Flash Sector Erase(9) Flash Bulk Erase Suspend Sector Erase(10) Resume Sector Erase(11) Reset(6) Unlock Bypass Unlock Bypass Program(12) Unlock Bypass Reset(13)
1
Read identifier AAh@ 555h 55h@ AAAh 90h@ 555h 00h or 01h @X02h AAh@ 555h 55h@ AAAh A0h@ 555h PD@ PA 55h@ AAAh 55h@ AAAh 30h@ SA 10h@ 555h 30h(9)@ next SA
1 1 1 1 1 1 1 1 1
AAh@ 555h 55h@ AAAh 80h@ 555h AAh@ 555h AAh@ 555h 55h@ AAAh 80h@ 555h AAh@ 555h B0h@ XXXh 30h@ XXXh F0h@ any address AAh@ 555h 55h@ AAAh 20h@ 555h A0h@ XXXh 90h@ XXXh PD@ PA 00h@ XXXh
1. All bus cycles are write bus cycles, except the ones with the "Read" label. 2. All values are in hexadecimal: X = Don't Care. RA = Address of the memory location to be read, RD = Data read from location RA during the Read cycle, PA = Address of the memory location to be programmed. Addresses are latched on the falling edge of Write Strobe (WR, CNTL0). PA is an even address for PSD in word programming mode. PD = Data to be programmed at location PA. Data is latched on the rising edge of Write Strobe (WR, CNTL0) SA = Address of the sector to be erased or verified. The Sector Select pins (FS0-FS7 or CSBOOT0-CSBOOT3) of the sector or whole memory to be erased, or verified, must be Active (High). 3. Only address bits A11-A0 are used in instruction decoding. A15-A12 (or A16-A12) are don't care. 4. Sector Select (FS0-FS7 or CSBOOT0-CSBOOT3) signals are active High, and are defined in PSDsoft. 5. No Unlock or instruction cycles are required when the device is in the Read mode 6. The Reset instruction is required to return to the Read mode after reading the Flash ID, or after reading the Sector Protection Status, or if the Error Flag (DQ5/DQ13) bit goes High. 7. The MCU cannot invoke these instructions while executing code from the same Flash memory as that for which the instruction is intended. The MCU must fetch, for example, the code from the secondary Flash memory when reading the Sector Protection Status of the primary Flash memory. 8. The data is 00h for an unprotected sector, and 01h for a protected sector. In the fourth cycle, the Sector Select is active, and (A1,A0)=(1,0) 9. Additional sectors to be erased must be written at the end of the Sector Erase instruction within 80 s. 10. The system may perform Read and Program cycles in non-erasing sectors, read the Flash ID or read the Sector Protection Status when in the Suspend Sector Erase mode. The Suspend Sector Erase instruction is valid only during a Sector Erase cycle. 11. The Resume Sector Erase instruction is valid only during the Suspend Sector Erase mode. 12. The Unlock Bypass instruction is required prior to the Unlock Bypass Program instruction. 13. The Unlock Bypass Reset Flash instruction is required to return to reading memory data when the device is in the Unlock Bypass mode.
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Instructions
7
Instructions
An instruction consists of a sequence of specific operations. Each received Byte is sequentially decoded by the PSD and not executed as a standard Write operation. The instruction is executed when the correct number of Bytes is properly received and the time between two consecutive Bytes is shorter than the time-out period. Some instructions are structured to include Read operations after the initial Write operations. The instruction must be followed exactly. Any invalid combination of instruction Bytes or time-out between two consecutive bytes while addressing Flash memory resets the device logic into Read mode (Flash memory is read like a ROM device). The PSD supports the instructions summarized in Table 28. on page 32: Flash memory:

Erase memory by chip or sector Suspend or resume sector erase Program a Byte Reset to Read mode Read primary Flash Identifier value Read Sector Protection Status Bypass
These instructions are detailed in Table 28. For efficient decoding of the instructions, the first two Bytes of an instruction are the coded cycles and are followed by an instruction Byte or a confirmation Byte. The coded cycles consist in writing the data AAh to address X555h during the first cycle and data 55h to address XAAAh during the second cycle unless the Bypass Instruction feature is used). Address signals A15-A12 are Don't Care during the instruction Write cycles. However, the appropriate Sector Select (FS0-FS7 or CSBOOT0CSBOOT3) must be selected. The primary and secondary Flash memories have the same instruction set (except for Read Primary Flash Identifier). The Sector Select signals determine which Flash memory is to receive and execute the instruction. The primary Flash memory is selected if any one of Sector Select (FS0-FS7) is High, and the secondary Flash memory is selected if any one of Sector Select (CSBOOT0-CSBOOT3) is High.
7.1
Power-up mode
The PSD internal logic is reset upon Power-up to the Read mode. Sector Select (FS0-FS7 and CSBOOT0-CSBOOT3) must be held Low, and Write Strobe (WR, CNTL0) High, during Power-up for maximum security of the data contents and to remove the possibility of a byte being written on the first edge of Write Strobe (WR, CNTL0). Any Write cycle initiation is locked when VCC is below VLKO.
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Instructions
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7.2
READ
Under typical conditions, the MCU may read the primary Flash memory or the secondary Flash memory using Read operations just as it would a ROM or RAM device. Alternately, the MCU may use Read operations to obtain status information about a Program or Erase cycle that is currently in progress. Lastly, the MCU may use instructions to read special data from these memory blocks. The following sections describe these Read functions.
7.3
Read Memory Contents
Primary Flash memory and secondary Flash memory are placed in the Read mode after Power-up, chip reset, or a Reset Flash instruction (see Table 28). The MCU can read the memory contents of the primary Flash memory or the secondary Flash memory by using Read operations any time the Read operation is not part of an instruction.
7.4
Read Primary Flash Identifier
The primary Flash memory identifier is read with an instruction composed of 4 operations: 3 specific Write operations and a Read operation (see Table 28). The identifier for the device is E8h.
7.5
Read Memory Sector Protection Status
The primary Flash memory Sector Protection Status is read with an instruction composed of 4 operations: 3 specific Write operations and a Read operation (see Table 28). The Read operation produces 01h if the Flash memory sector is protected, or 00h if the sector is not protected. The sector protection status for all NVM blocks (primary Flash memory or secondary Flash memory) can also be read by the MCU accessing the Flash Protection and Flash Boot Protection registers in PSD I/O space. See Flash memory sector protect on page 43, for register definitions.
7.6
Read the Erase/Program Status Bits
The PSD provides several status bits to be used by the MCU to confirm the completion of an Erase or Program cycle of Flash memory. These status bits minimize the time that the MCU spends performing these tasks and are defined in Table 29. The status bits can be read as many times as needed. For Flash memory, the MCU can perform a Read operation to obtain these status bits while an Erase or Program instruction is being executed by the embedded algorithm. See Programming Flash memory on page 37, for details.
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PSD835G2V Table 29.
Functional Block Flash memory
Instructions Status bit(1) (2)
FS0-FS7/CSBOOT0CSBOOT3(3) VIH DQ7 DQ6 DQ5 DQ4 X DQ3 DQ2 DQ1 DQ0 X X
Data Toggle Error Polling Flag Flag
Erase X Time-out
1. X = Not guaranteed value, can be read either 1 or 0. 2. DQ7-DQ0 represent the Data Bus bits, D7-D0. 3. FS0-FS7 and CSBOOT0-CSBOOT3 are active High.
7.7
Data polling flag (DQ7)
When erasing or programming in Flash memory, the Data Polling Flag (DQ7) bit outputs the complement of the bit being entered for programming/writing on the DQ7 bit. Once the Program instruction or the Write operation is completed, the true logic value is read on the Data Polling Flag (DQ7) bit (in a Read operation).
Data Polling is effective after the fourth Write pulse (for a Program instruction) or after the sixth Write pulse (for an Erase instruction). It must be performed at the address being programmed or at an address within the Flash memory sector being erased. During an Erase cycle, the Data Polling Flag (DQ7) bit outputs a 0. After completion of the cycle, the Data Polling Flag (DQ7) bit outputs the last bit programmed (it is a 1 after erasing). If the Byte to be programmed is in a protected Flash memory sector, the instruction is ignored. If all the Flash memory sectors to be erased are protected, the Data Polling Flag (DQ7) bit is reset to 0 for about 100 s, and then returns to the previous addressed byte. No erasure is performed.

7.8
Toggle flag (DQ6)
The PSD offers another way for determining when the Flash memory Program cycle is completed. During the internal Write operation and when either the FS0-FS7 or CSBOOT0CSBOOT3 is true, the Toggle Flag (DQ6) bit toggles from 0 to 1 and 1 to 0 on subsequent attempts to read any Byte of the memory. When the internal cycle is complete, the toggling stops and the data read on the Data Bus D0-D7 is the addressed memory Byte. The device is now accessible for a new Read or Write operation. The cycle is finished when two successive Reads yield the same output data.

The Toggle Flag (DQ6) bit is effective after the fourth Write pulse (for a Program instruction) or after the sixth Write pulse (for an Erase instruction). If the Byte to be programmed belongs to a protected Flash memory sector, the instruction is ignored. If all the Flash memory sectors selected for erasure are protected, the Toggle Flag (DQ6) bit toggles to 0 for about 100 s and then returns to the previous addressed Byte.
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Instructions
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7.9
Error flag (DQ5)
During a normal Program or Erase cycle, the Error Flag (DQ5) bit is set to 0. This bit is set to 1 when there is a failure during Flash memory Byte Program, Sector Erase, or Bulk Erase cycle. In the case of Flash memory programming, the Error Flag (DQ5) bit indicates the attempt to program a Flash memory bit from the programmed state, 0, to the erased state, 1, which is not valid. The Error Flag (DQ5) bit may also indicate a Time-out condition while attempting to program a Byte. In case of an error in a Flash memory Sector Erase or Byte Program cycle, the Flash memory sector in which the error occurred or to which the programmed Byte belongs must no longer be used. Other Flash memory sectors may still be used. The Error Flag (DQ5) bit is reset after a Reset Flash instruction.
7.10
Erase time-out flag (DQ3)
The Erase Time-out Flag (DQ3) bit reflects the time-out period allowed between two consecutive Sector Erase instructions. The Erase Time-out Flag (DQ3) bit is reset to 0 after a Sector Erase cycle for a time period of 100 s + 20% unless an additional Sector Erase instruction is decoded. After this time period, or when the additional Sector Erase instruction is decoded, the Erase Time-out Flag (DQ3) bit is set to 1.
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PSD835G2V
Programming Flash memory
8
Programming Flash memory
Flash memory must be erased prior to being programmed. The MCU may erase Flash memory all at once or by-sector. A Flash memory sector is erased to all 1s (FFh), and is programmed by setting selected bits to 0. Although Flash memory is erased by-sector, it is programmed Word-by-Word. The primary and secondary Flash memories require the MCU to send an instruction to program a Word or to erase sectors (see Table 28. on page 32). Once the MCU issues a Flash memory Program or Erase instruction, it must check the status bits for completion. The embedded algorithms that are invoked inside the PSD support several means to provide status to the MCU. Status may be checked using any of three methods: Data Polling, Data Toggle, or the Ready/Busy (PE4) output pin.
8.1
Data polling
Polling on the Data Polling Flag (DQ7) bit is a method of checking whether a Program or Erase cycle is in progress or has completed. Figure 6 shows the Data Polling algorithm. When the MCU issues a Program instruction, the embedded algorithm within the PSD begins. The MCU then reads the location of the Word to be programmed in Flash memory to check status. The Data Polling Flag (DQ7) bit of this location becomes the complement of b7 of the original data byte to be programmed. The MCU continues to poll this location, comparing the Data Polling Flag (DQ7) bit and monitoring the Error Flag (DQ5) bit. When the Data Polling Flag (DQ7) bit matches b7 of the original data, and the Error Flag (DQ5) bit remains 0, the embedded algorithm is complete. If the Error Flag (DQ5) bit is 1, the MCU should test the Data Polling Flag (DQ7) bit again since the Data Polling Flag (DQ7) bit may have changed simultaneously with the Error Flag (DQ5) bit (see Figure 6). The Error Flag (DQ5) bit is set if either an internal time-out occurred while the embedded algorithm attempted to program the Byte or if the MCU attempted to program a 1 to a bit that was not erased (not erased is logic 0). It is suggested (as with all Flash memories) to read the location again after the embedded programming algorithm has completed, to compare the Byte that was written to the Flash memory with the Byte that was intended to be written. When using the Data Polling method after an Erase cycle, Figure 6 still applies. However, the Data Polling Flag (DQ7) bit is 0 until the Erase cycle is complete. A 1 on the Error Flag (DQ5) bit indicates a time-out condition on the Erase cycle; a 0 indicates no error. The MCU can read any location within the sector being erased to get the Data Polling Flag (DQ7) bit and the Error Flag (DQ5) bit. PSDsoft generates ANSI C code functions which implement these Data Polling algorithms.
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Programming Flash memory Figure 6. Data polling flowchart
START
PSD835G2V
READ DQ5 & DQ7 at VALID ADDRESS
DQ7 = DATA NO NO
YES
DQ5 =1 YES READ DQ7
DQ7 = DATA NO FAIL
YES
PASS
AI01369B
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Programming Flash memory
8.2
Data toggle
Checking the Toggle Flag (DQ6) bit is a method of determining whether a Program or Erase cycle is in progress or has completed. Figure 7 shows the Data Toggle algorithm. When the MCU issues a Program instruction, the embedded algorithm within the PSD begins. The MCU then reads the location of the byte to be programmed in Flash memory to check status. The Toggle Flag (DQ6) bit of this location toggles each time the MCU reads this location until the embedded algorithm is complete. The MCU continues to read this location, checking the Toggle Flag (DQ6) bit and monitoring the Error Flag (DQ5) bit. When the Toggle Flag (DQ6) bit stops toggling (two consecutive reads yield the same value), and the Error Flag (DQ5) bit remains 0, the embedded algorithm is complete. If the Error Flag (DQ5) bit is 1, the MCU should test the Toggle Flag (DQ6) bit again, since the Toggle Flag (DQ6) bit may have changed simultaneously with the Error Flag (DQ5) bit (see Figure 7). The Error Flag (DQ5) bit is set if either an internal time-out occurred while the embedded algorithm attempted to program the byte, or if the MCU attempted to program a 1 to a bit that was not erased (not erased is logic 0). It is suggested (as with all Flash memories) to read the location again after the embedded programming algorithm has completed, to compare the Byte that was written to Flash memory with the Byte that was intended to be written. When using the Data Toggle method after an Erase cycle, Figure 7 still applies. the Toggle Flag (DQ6) bit toggles until the Erase cycle is complete. A 1 on the Error Flag (DQ5) bit indicates a time-out condition on the Erase cycle; a 0 indicates no error. The MCU can read any location within the sector being erased to get the Toggle Flag (DQ6) bit and the Error Flag (DQ5) bit. PSDsoft generates ANSI C code functions which implement these Data Toggling algorithms.
8.2.1
Unlock bypass
The Unlock Bypass instructions allow the system to program bytes to the Flash memories faster than using the standard Program instruction. The Unlock Bypass mode is entered by first initiating two Unlock cycles. This is followed by a third Write cycle containing the Unlock Bypass code, 20h (as shown in Table 28. on page 32). The Flash memory then enters the Unlock Bypass mode. A two-cycle Unlock Bypass Program instruction is all that is required to program in this mode. The first cycle in this instruction contains the Unlock Bypass Program code, A0h. The second cycle contains the program address and data. Additional data is programmed in the same manner. These instructions dispense with the initial two Unlock cycles required in the standard Program instruction, resulting in faster total Flash memory programming. During the Unlock Bypass mode, only the Unlock Bypass Program and Unlock Bypass Reset Flash instructions are valid. To exit the Unlock Bypass mode, the system must issue the two-cycle Unlock Bypass Reset Flash instruction. The first cycle must contain the data 90h; the second cycle, the data 00h. Addresses are Don't Care for both cycles. The Flash memory then returns to Read mode.
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Programming Flash memory Figure 7. Data toggle flowchart
START
PSD835G2V
READ DQ5 & DQ6
DQ6 = TOGGLE YES NO
NO
DQ5 =1 YES READ DQ6
DQ6 = TOGGLE YES FAIL
NO
PASS
AI01370B
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Erasing Flash memory
9
9.1
Erasing Flash memory
Flash Bulk Erase
The Flash Bulk Erase instruction uses six Write operations followed by a Read operation of the status register, as described in Table 28. on page 32. If any byte of the Bulk Erase instruction is wrong, the Bulk Erase instruction aborts and the device is reset to the Read Flash memory status. During a Bulk Erase, the memory status may be checked by reading the Error Flag (DQ5) bit, the Toggle Flag (DQ6) bit, and the Data Polling Flag (DQ7) bit, as detailed in Programming Flash memory on page 37. The Error Flag (DQ5) bit returns a 1 if there has been an Erase Failure (maximum number of Erase cycles has been executed). It is not necessary to program the memory with 00h because the PSD automatically does this before erasing to 0FFh. During execution of the Bulk Erase instruction, the Flash memory does not accept any instructions.
9.2
Flash Sector Erase
The Sector Erase instruction uses six Write operations, as described in Table 28. on page 32. Additional Flash Sector Erase codes and Flash memory sector addresses can be written subsequently to erase other Flash memory sectors in parallel, without further coded cycles, if the additional bytes are transmitted in a shorter time than the time-out period of about 100 s. The input of a new Sector Erase code restarts the time-out period. The status of the internal timer can be monitored through the level of the Erase Time-out Flag (DQ3) bit. If the Erase Time-out Flag (DQ3) bit is 0, the Sector Erase instruction has been received and the time-out period is counting. If the Erase Time-out Flag (DQ3) bit is 1, the time-out period has expired and the PSD is busy erasing the Flash memory sector(s). Before and during Erase time-out, any instruction other than Suspend Sector Erase and Resume Sector Erase instructions abort the cycle that is currently in progress, and reset the device to Read mode. It is not necessary to program the Flash memory sector with 00h as the PSD does this automatically before erasing (Byte=FFh). During a Sector Erase, the memory status may be checked by reading the Error Flag (DQ5) bit, the Toggle Flag (DQ6) bit, and the Data Polling Flag (DQ7) bit, as detailed in Programming Flash memory on page 37. During execution of the Erase cycle, the Flash memory accepts only Reset and Suspend Sector Erase instructions. Erasure of one Flash memory sector may be suspended, in order to read data from another Flash memory sector, and then resumed.
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Erasing Flash memory
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9.3
Suspend Sector Erase
When a Sector Erase cycle is in progress, the Suspend Sector Erase instruction can be used to suspend the cycle by writing 0B0h to any even address when an appropriate Sector Select (FS0-FS7 or CSBOOT0-CSBOOT3) is High. (See Table 28. on page 32). This allows reading of data from another Flash memory sector after the Erase cycle has been suspended. Suspend Sector Erase is accepted only during an Erase cycle and defaults to Read mode. A Suspend Sector Erase instruction executed during an Erase time-out period, in addition to suspending the Erase cycle, terminates the time out period. The Toggle Flag (DQ6) bit stops toggling when the PSD internal logic is suspended. The status of this bit must be monitored at an address within the Flash memory sector being erased. The Toggle Flag (DQ6) bit stops toggling between 0.1 s and 15 s after the Suspend Sector Erase instruction has been executed. The PSD is then automatically set to Read mode. If an Suspend Sector Erase instruction was executed, the following rules apply:

Attempting to read from a Flash memory sector that was being erased outputs invalid data. Reading from a Flash sector that was not being erased is valid. The Flash memory cannot be programmed, and only responds to Resume Sector Erase and Reset Flash instructions (Read is an operation and is allowed). If a Reset Flash instruction is received, data in the Flash memory sector that was being erased is invalid.
9.4
Resume Sector Erase
If a Suspend Sector Erase instruction was previously executed, the erase cycle may be resumed with this instruction. The Resume Sector Erase instruction consists in writing 030h to any even address while an appropriate Sector Select (FS0-FS7 or CSBOOT0-CSBOOT3) is High. (See Table 28. on page 32.)
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PSD835G2V
Specific features
10
10.1
Specific features
Flash memory sector protect
Each primary and secondary Flash memory sector can be separately protected against Program and Erase cycles. Sector Protection provides additional data security because it disables all Program or Erase cycles. This mode can be activated through the JTAG/ISP Port or a Device Programmer. Sector protection can be selected for each sector using the PSDsoft program. This automatically protects selected sectors when the device is programmed through the JTAG Port or a Device Programmer. Flash memory sectors can be unprotected to allow updating of their contents using the JTAG Port or a Device Programmer. The MCU can read (but cannot change) the sector protection bits. Any attempt to program or erase a protected Flash memory sector is ignored by the device. The Verify operation results in a read of the protected data. The retention of the Protection status is thus ensured. The sector protection status can be read by the MCU through the primary and secondary Flash memory protection registers (in the CSIOP block). See Table 18. on page 26 and Table 19. on page 27.
10.2
Reset Flash
The Reset Flash instruction consists of one Write cycle (see Table 28. on page 32). It can also be optionally preceded by the standard two write decoding cycles (writing AAh to AAAh and 55h to 554h). It must be executed after:

Reading the Flash Protection Status or Flash ID using the Flash instruction. An Error condition has occurred (and the device has set the Error Flag (DQ5) bit to 1) during a Flash memory Program or Erase cycle.
The Reset Flash instruction puts the Flash memory back into normal Read mode immediately. If an Error condition has occurred (and the device has set the Error Flag (DQ5) bit to 1) the Flash memory is put back into normal Read mode within 25 s of the Reset Flash instruction having been issued. The Reset Flash instruction is ignored when it is issued during a Program or Bulk Erase cycle of the Flash memory. The Reset Flash instruction aborts any on-going Sector Erase cycle, and returns the Flash memory to the normal Read mode within 25s.
10.3
Reset (RESET) signal
A pulse on Reset (RESET) aborts any cycle that is in progress, and resets the Flash memory to the Read mode. When the reset occurs during a Program or Erase cycle, the Flash memory takes up to 25s to return to the Read mode. It is recommended that the Reset (RESET) pulse (except for Power-Up Reset, described in Power-up reset on page 89) be at least 25s so that the Flash memory is always ready for the MCU to fetch the bootstrap instructions after the Reset cycle is complete.
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SRAM
PSD835G2V
11
SRAM
The SRAM is enabled when SRAM Select (RS0) from the DPLD is High. SRAM Select (RS0) can contain up to three product terms, allowing flexible memory mapping. The SRAM can be backed up using an external battery. The external battery should be connected to Voltage Stand-by (VSTBY, PE6). If you have an external battery connected to the PSD, the contents of the SRAM are retained in the event of a power loss. The contents of the SRAM are retained so long as the battery voltage remains at 2 V or greater. If the supply voltage falls below the battery voltage, an internal power switch-over to the battery occurs. PE7 can be configured as an output that indicates when power is being drawn from the external battery. Battery-on Indicator (VBATON, PE7) is High when the supply voltage falls below the battery voltage and the battery on Voltage Stand-by (VSTBY, PE6) is supplying power to the internal SRAM. SRAM Select (RS0), Voltage Stand-by (VSTBY, PC2) and Battery-on Indicator (VBATON, PC4) are all configured using PSDsoft Express Configuration. The SRAM Select (RS0), VBATON and VSTBY are all configured using PSDsoft.
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PSD835G2V
Sector Select and SRAM Select
12
Sector Select and SRAM Select
Sector Select (FS0-FS7 for primary Flash memory, CSBOOT0-CSBOOT3 for secondary Flash memory) and SRAM Select (RS0) are all outputs of the DPLD. They are setup using PSDsoft. The following rules apply to the equations for these signals: 1. 2. 3. 4. 5. 6. Primary Flash memory and secondary Flash memory Sector Select signals must not be larger than the physical sector size. Any primary Flash memory sector must not be mapped in the same memory space as another primary Flash memory sector. A secondary Flash memory sector must not be mapped in the same memory space as another secondary Flash memory sector. SRAM and I/O spaces must not overlap. A secondary Flash memory sector may overlap a primary Flash memory sector. In case of overlap, priority is given to the secondary Flash memory sector. SRAM and I/O spaces may overlap any other memory sector. Priority is given to the SRAM and I/O.
12.1
Example
FS0 is valid when the address is in the range of 8000h to BFFFh, CSBOOT0 is valid from 8000h to 9FFFh, and RS0 is valid from 8000h to 87FFh. Any address in the range of RS0 always accesses the SRAM. Any address in the range of CSBOOT0 greater than 87FFh (and less than 9FFFh) automatically addresses secondary Flash memory segment 0. Any address greater than 9FFFh accesses the primary Flash memory segment 0. You can see that half of the primary Flash memory segment 0 and one-fourth of secondary Flash memory segment 0 cannot be accessed in this example. Also note that an equation that defined FS1 to anywhere in the range of 8000h to BFFFh would not be valid. Figure 8 shows the priority levels for all memory components. Any component on a higher level can overlap and has priority over any component on a lower level. Components on the same level must not overlap. Level one has the highest priority and level 3 has the lowest.
12.2
Memory select configuration for MCUs with separate program and data spaces
The 80C51 and compatible family of MCUs have separate address spaces for Program memory (selected using Program Select Enable (PSEN, CNTL2)) and Data memory (selected using Read Strobe (RD, CNTL1)). Any of the memories within the PSD can reside in either space or both spaces. This is controlled through manipulation of the VM register that resides in the CSIOP space. The VM register is set using PSDsoft to have an initial value. It can subsequently be changed by the MCU so that memory mapping can be changed on-the-fly. For example, you may wish to have SRAM and primary Flash memory in the Data space at Boot-up, and secondary Flash memory in the Program space at Boot-up, and later swap the primary and secondary Flash memories. This is easily done with the VM register by using PSDsoft to configure it for Boot-up and having the MCU change it when desired. Table 24. on page 28 describes the VM Register.
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Sector Select and SRAM Select Figure 8. Priority level of memory and I/O components
Highest Priority
PSD835G2V
Level 1 SRAM, I /O, or Peripheral I /O Level 2 Secondary Non-Volatile Memory Level 3 Primary Flash Memory Lowest Priority
AI02867D
12.3
12.3.1
Configuration modes for MCUs with separate program and data spaces
Separate space modes
Program space is separated from Data space. For example, Program Select Enable (PSEN, CNTL2) is used to access the program code from the primary Flash memory, while Read Strobe (RD, CNTL1) is used to access data from the secondary Flash memory, SRAM and I/O Port blocks. This configuration requires the VM register to be set to 0Ch (see Figure 9).
12.3.2
Combined Space Modes
The Program and Data spaces are combined into one memory space that allows the primary Flash memory, secondary Flash memory, and SRAM to be accessed by either Program Select Enable (PSEN, CNTL2) or Read Strobe (RD, CNTL1). For example, to configure the primary Flash memory in Combined space, bits b2 and b4 of the VM register are set to 1 (see Figure 10). Figure 9. 8031 memory modules - separate space
DPLD
RS0 CSBOOT0-3 FS0-FS7
Primary Flash Memory
Secondary Flash Memory
SRAM
CS OE
CS OE
CS OE
PSEN RD
AI02869C
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PSD835G2V Figure 10. 8031 memory modules - combined space
Sector Select and SRAM Select
DPLD
RS0 CSBOOT0-3 FS0-FS7
Primary Flash Memory
Secondary Flash Memory
SRAM
RD
CS OE
CS OE
CS OE
VM REG BIT 3
VM REG BIT 4
PSEN
VM REG BIT 1
VM REG BIT 2
RD
VM REG BIT 0
AI02870C
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Page Register
PSD835G2V
13
Page Register
The 8-bit Page Register increases the addressing capability of the MCU by a factor of up to 256. The contents of the register can also be read by the MCU. The outputs of the Page Register (PGR0-PGR7) are inputs to the DPLD decoder and can be included in the Sector Select (FS0-FS7, CSBOOT0-CSBOOT3), and SRAM Select (RS0) equations. If memory paging is not needed, or if not all 8 page register bits are needed for memory paging, then these bits may be used in the CPLD for general logic. See Application Note AN1154. Figure 11 shows the Page Register. The eight flip-flops in the register are connected to the internal data bus D0-D7. The MCU can write to or read from the Page Register. The Page Register can be accessed at address location CSIOP + E0h. Figure 11. Page Register
RESET
D0 D1 D0 - D7 D2 D3 D4 D5 D6 R/W D7
Q0 Q1 Q2 Q3 Q4 Q5
PGR0 PGR1 PGR2 PGR3 PGR4 PGR5 PGR6 DPLD AND CPLD
INTERNAL SELECTS AND LOGIC
Q6 PGR7 Q7
PAGE REGISTER
PLD
AI02871B
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PSD835G2V
Memory ID registers
14
Memory ID registers
The 8-bit Read-Only Memory Status Registers are included in the CSIOP space. The user can determine the memory configuration of the PSD device by reading the Memory ID0 and ID1 Registers. The contents of the registers are defined in Table 25 and Table 26. on page 28.
15
PLDs
The PLDs bring programmable logic functionality to the PSD. After specifying the logic for the PLDs in PSDsoft, the logic is programmed into the device and available upon Power-up. The PSD contains two PLDs: the Decode PLD (DPLD), and the Complex PLD (CPLD). The PLDs are briefly discussed in the next few paragraphs, and in more detail in Decode PLD (DPLD) on page 52, and in Complex PLD (CPLD) on page 53. Figure 12. on page 51 shows the configuration of the PLDs. The DPLD performs address decoding for Select signals for internal components, such as memory, registers, and I/O ports. The CPLD can be used for logic functions, such as loadable counters and shift registers, state machines, and encoding and decoding logic. These logic functions can be constructed using the 16 Output Macrocells (OMC), 24 Input Macrocells (IMC), and the AND Array. The CPLD can also be used to generate External Chip Select (ECS0-ECS2) signals. The AND Array is used to form product terms. These product terms are specified using PSDsoft. An Input Bus consisting of 82 signals is connected to the PLDs. The signals are shown in Table 30.
15.1
The Turbo Bit in PSD
The PLDs in the PSD can minimize power consumption by switching to standby when inputs remain unchanged for an extended time of about 70ns. Resetting the Turbo bit to 0 (Bit 3 of PMMR0) automatically places the PLDs into standby if no inputs are changing. Turning the Turbo mode off increases propagation delays while reducing power consumption. See Power management on page 84, on how to set the Turbo bit. Additionally, five bits are available in PMMR2 to block MCU control signals from entering the PLDs. This reduces power consumption and can be used only when these MCU control signals are not used in PLD logic equations. Each of the two PLDs has unique characteristics suited for its applications. They are described in the following sections.
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PLDs Table 30. DPLD and CPLD Inputs
Input Source MCU Address Bus(1) MCU Control Signals Reset Power-down Port A Input Macrocells Port B Input Macrocells Port C Input Macrocells Port D Inputs Port F Inputs Page Register Macrocell A Feedback Macrocell B Feedback Secondary Flash memory Program Status Bit
1. The address inputs are A19-A4 in 80C51XA mode.
PSD835G2V
Input Name A15-A0 CNTL2-CNTL0 RST PDN PA7-PA0 PB7-PB0 PC7-PC0 PD3-PD0 PF7-PF0 PGR7-PGR0 MCELLA.FB7-FB0 MCELLB.FB7-FB0 Ready/Busy
Number of Signals 16 3 1 1 8 8 8 4 8 8 8 8 1
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PSD835G2V
8 DATA BUS
PAGE REGISTER
DECODE PLD
PRIMARY FLASH MEMORY SELECTS 73 4 1 SRAM SELECT CSIOP SELECT PERIPHERAL SELECTS JTAG SELECT 1 2 1
8
Figure 12. PLD diagram
SECONDARY NON-VOLATILE MEMORY SELECTS
PLD INPUT BUS
16
OUTPUT MACROCELL FEEDBACK
DIRECT MACROCELL ACCESS FROM MCU DATA BUS
CPLD
82 PT ALLOC.
16 OUTPUT MACROCELL
MCELLA TO PORT A MCELLB TO PORT B I/O PORTS
8
24 INPUT MACROCELL (PORT A,B,C)
8 3 EXTERNAL CHIP SELECTS TO PORT C OR F
DIRECT MACROCELL INPUT TO MCU DATA BUS 24 INPUT MACROCELL & INPUT PORTS
12
PORT D AND F INPUTS
PLDs
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AI02872D
PLDs
PSD835G2V
15.2
Decode PLD (DPLD)
The DPLD, shown in Figure 13, is used for decoding the address for internal and external components. The DPLD can be used to generate the following decode signals:

8 Sector Select (FS0-FS7) signals for the primary Flash memory (three product terms each) 4 Sector Select (CSBOOT0-CSBOOT3) signals for the secondary Flash memory (three product terms each) 1 internal SRAM Select (RS0) signal (three product terms) 1 internal CSIOP Select (PSD Configuration Register) signal 1 JTAG Select signal (enables JTAG/ISP on Port E) 2 internal Peripheral Select signals (Peripheral I/O mode).
Figure 13. DPLD logic array
3 3 3 3 (INPUTS) I /O PORTS (PORT A,B,C,F) MCELLA.FB7-FB0 (FEEDBACKS) MCELLB.FB7-FB0 (FEEDBACKS) PGR0 - PGR7 A15-A0(1,2) PD3-PD0 (ALE,CLKIN,CSI) PDN (APD OUTPUT) (32) 3 (8) 3 (8) 3 (8) 3 (16) 3 (4) 3 (1) 3 CNTRL2-CNTRL0 (READ/WRITE CONTROL SIGNALS) (3) RESET RD_BSY (1) 3 (1) CSIOP PSEL0 PSEL1 JTAGSEL
AI02873E
CSBOOT 0 CSBOOT 1 CSBOOT 2 CSBOOT 3
3
FS0 FS1 FS2 FS3 FS4 FS5 FS6 FS7 8 PRIMARY FLASH MEMORY SECTOR SELECTS
RS0
SRAM SELECT I/O DECODER SELECT PERIPHERAL I/O MODE SELECT
1. The address inputs are A19-A4 in 80C51XA mode. 2. Additional address lines can be brought into PSD via Port A, B, C, D or F.
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PSD835G2V
PLDs
15.3
Complex PLD (CPLD)
The CPLD can be used to implement system logic functions, such as loadable counters and shift registers, system mailboxes, handshaking protocols, state machines, and random logic. The CPLD can also be used to generate three External Chip Select (ECS0-ECS2), routed to Port D. Although External Chip Select (ECS0-ECS2) can be produced by any Output Macrocell (OMC), these three External Chip Select (ECS0-ECS2) on Port D do not consume any Output Macrocells (OMC). As shown in Figure 12. on page 51, the CPLD has the following blocks:

24 Input Macrocells (IMC) 16 Output Macrocells (OMC) Macrocell Allocator Product Term Allocator AND Array capable of generating up to 137 product terms Four I/O Ports.
Each of the blocks are described in the sections that follow. The Input Macrocells (IMC) and Output Macrocells (OMC) are connected to the PSD internal data bus and can be directly accessed by the MCU. This enables the MCU software to load data into the Output Macrocells (OMC) or read data from both the Input and Output Macrocells (IMC and OMC). This feature allows efficient implementation of system logic and eliminates the need to connect the data bus to the AND Array as required in most standard PLD macrocell architectures.
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PLDs
PLD INPUT BUS
AND ARRAY
PR DI LD D/T Q COMB. /REG SELECT PDR INPUT MUX D/T/JK FF SELECT CK CL WR PT CLEAR D Q DIR REG. PT CLOCK GLOBAL CLOCK CLOCK SELECT SELECT
PLD INPUT BUS
PT OUTPUT ENABLE (OE) MACROCELL FEEDBACK I/O PORT INPUT
MUX
PT INPUT LATCH GATE/CLOCK MUX ALE/AS
MUX
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PRODUCT TERMS FROM OTHER MACROCELLS MCU ADDRESS / DATA BUS
CPLD MACROCELLS I/O PORTS
MCU DATA IN MCU LOAD D WR UP TO 10 PRODUCT TERMS MACROCELL OUT TO MCU CPLD OUTPUT DATA Q DATA LOAD CONTROL LATCHED ADDRESS OUT PT PRESET PRODUCT TERM ALLOCATOR
I/O PIN
MUX
Figure 14. Macrocell and I/O Port
POLARITY SELECT
INPUT MACROCELLS
QD
QD G
AI02874b
PSD835G2V
PSD835G2V
PLDs
15.4
Output macrocell (OMC)
Eight of the Output Macrocells (OMC) are connected to Port A pins and are named as McellA0-McellA7. The other eight macrocells are connected to Port B pins and are named as McellB0-McellB7. The Output Macrocell (OMC) architecture is shown in Figure 15. on page 57. As shown in the figure, there are native product terms available from the AND Array, and borrowed product terms available (if unused) from other Output Macrocells (OMC). The polarity of the product term is controlled by the XOR gate. The Output Macrocell (OMC) can implement either sequential logic, using the flip-flop element, or combinatorial logic. The multiplexer selects between the sequential or combinatorial logic outputs. The multiplexer output can drive a port pin and has a feedback path to the AND Array inputs. The flip-flop in the Output Macrocell (OMC) block can be configured as a D, T, JK, or SR type in the PSDsoft program. The flip-flop's clock, preset, and clear inputs may be driven from a product term of the AND Array. Alternatively, CLKIN (PD1) can be used for the clock input to the flip-flop. The flip-flop is clocked to the rising edge of CLKIN (PD1). The preset and clear are active High inputs. Each clear input can use up to two product terms. Table 31.
Output macrocell McellA0 McellA1 McellA2 McellA3 McellA4 McellA5 McellA6 McellA7 McellB0 McellB1 McellB2 McellB3 McellB4 McellB5 McellB6 McellB7
Output macrocell port and data bit assignments
Port assignment Port A0 Port A1 Port A2 Port A3 Port A4 Port A5 Port A6 Port A7 Port B0 Port B1 Port B2 Port B3 Port B4 Port B5 Port B6 Port B7 Native product terms 3 3 3 3 3 3 3 3 4 4 4 4 4 4 4 4 Maximum borrowed product terms 6 6 6 6 6 6 6 6 5 5 5 5 6 6 6 6 Data bit for loading or reading D0 D1 D2 D3 D4 D5 D6 D7 D0 D1 D2 D3 D4 D5 D6 D7
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PLDs
PSD835G2V
15.5
Product term allocator
The CPLD has a Product Term Allocator. The PSDsoft uses the Product Term Allocator to borrow and place product terms from one macrocell to another. The following list summarizes how product terms are allocated:

McellA0-McellA7 all have three native product terms and may borrow up to six more McellB0-McellB3 all have four native product terms and may borrow up to five more McellB4-McellB7 all have four native product terms and may borrow up to six more.
Each macrocell may only borrow product terms from certain other macrocells. Product terms already in use by one macrocell are not available for another macrocell. If an equation requires more product terms than are available to it, then "external" product terms are required that consume other Output Macrocells (OMC). If external product terms are used, extra delay is added for the equation that required the extra product terms. This is called product term expansion. PSDsoft performs this expansion as needed.
15.5.1
Loading and reading the output macrocells (OMC)
The Output Macrocells (OMC) block occupies a memory location in the MCU address space, as defined by the CSIOP block (see I/O ports on page 71). The flip-flops in each of the 16 Output Macrocells (OMC) can be loaded from the data bus by a MCU. Loading the Output Macrocells (OMC) with data from the MCU takes priority over internal functions. As such, the preset, clear, and clock inputs to the flip-flop can be overridden by the MCU. The ability to load the flip-flops and read them back is useful in such applications as loadable counters and shift registers, mailboxes, and handshaking protocols. Data can be loaded to the Output Macrocells (OMC) on the trailing edge of the Write Strobe (WR, CNTL0) signal.
15.6
The OMC mask register
There is one Mask Register for each of the two groups of eight Output Macrocells (OMC). The Mask Registers can be used to block the loading of data to individual Output Macrocells (OMC). The default value for the Mask Registers is 00h, which allows loading of the Output Macrocells (OMC). When a given bit in a Mask Register is set to a 1, the MCU is blocked from writing to the associated Output Macrocells (OMC). For example, suppose McellA0McellA3 are being used for a state machine. You would not want a MCU write to McellA to overwrite the state machine registers. Therefore, you would want to load the Mask Register for McellA (Mask Macrocell AB) with the value 0Fh.
15.7
The Output Enable of the OMC
The Output Macrocells (OMC) block can be connected to an I/O port pin as a PLD output. The output enable of each port pin driver is controlled by a single product term from the AND Array, OR'ed with the Direction Register output. The pin is enabled upon Power-up if no output enable equation is defined and if the pin is declared as a PLD output in PSDsoft. If the Output Macrocell (OMC) output is declared as an internal node and not as a port pin output in the PSDabel file, the port pin can be used for other I/O functions. The internal node feedback can be routed as an input to the AND Array.
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PSD835G2V
MASK REG.
MACROCELL CS INTERNAL DATA BUS RD
PT ALLOCATOR ENABLE (.OE) PRESET(.PR) PT PT DIN PR MUX PT POLARITY SELECT IN CLR PROGRAMMABLE FF (D / T/JK /SR) MUX CLEAR (.RE) PT CLK CLKIN LD Q AND ARRAY COMB/REG SELECT
WR DIRECTION REGISTER
Figure 15. CPLD output macrocell
I/O PIN
PLD INPUT BUS
PORT DRIVER
FEEDBACK (.FB) PORT INPUT INPUT MACROCELL
AI02875C
PLDs
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PLDs
PSD835G2V
15.8
Input macrocells (IMC)
The CPLD has 24 Input Macrocells (IMC), one for each pin on Ports A, B, and C. The architecture of the Input Macrocells (IMC) is shown in Figure 16. on page 59. The Input Macrocells (IMC) are individually configurable, and can be used as a latch, register, or to pass incoming Port signals prior to driving them onto the PLD input bus. The outputs of the Input Macrocells (IMC) can be read by the MCU through the internal data bus. The enable for the latch and clock for the register are driven by a multiplexer whose inputs are a product term from the CPLD AND Array or the MCU Address Strobe (ALE/AS). Each product term output is used to latch or clock four Input Macrocells (IMC). Port inputs 3-0 can be controlled by one product term and 7-4 by another. Configurations for the Input Macrocells (IMC) are specified by PSDsoft. Outputs of the Input Macrocells (IMC) can be read by the MCU via the IMC buffer. See I/O ports on page 71. Input Macrocells (IMC) can use Address Strobe (ALE/AS, PD0) to latch address bits higher than A15. Any latched addresses are routed to the PLDs as inputs. Input Macrocells (IMC) are particularly useful with handshaking communication applications where two processors pass data back and forth through a common mailbox. Figure 17. on page 60 shows a typical configuration where the Master MCU writes to the Port A Data Out Register. This, in turn, can be read by the Slave MCU via the activation of the "Slave-Read" output enable product term. The Slave can also write to the Port A Input Macrocells (IMC) and the Master can then read the Input Macrocells (IMC) directly. Note that the "Slave-Read" and "Slave-Wr" signals are product terms that are derived from the Slave MCU inputs Read Strobe (RD, CNTL1), Write Strobe (WR, CNTL0), and Slave_CS.
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PSD835G2V
INTERNAL DATA BUS
INPUT MACROCELL _ RD DIRECTION REGISTER ENABLE ( .OE )
Figure 16. Input macrocell
PT
OUTPUT MACROCELLS A AND MACROCELLS B I/O PIN
AND ARRAY
PLD INPUT BUS
PT
PORT DRIVER
MUX
Q
D MUX D FF
PT ALE/AS
FEEDBACK
Q
D G LATCH INPUT MACROCELL
AI02876C
PLDs
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PLDs Figure 17. Handshaking communication using input macrocells
AI02877C
PSD835G2V
SLAVE MCU PORT A D [ 7:0]
SLAVE - READ
PORT A INPUT MACROCELL
PORT A DATA OUT REGISTER
Q
SLAVE - WR
SLAVE - CS
WR
MCU -WR
RD
Q MCU -RD
PSD
CPLD
D
MCU - RD
MCU - WR
15.9
External chip
The CPLD also provides eight Chip Select outputs that can be used to select external devices. The Chip Selects can be routed to either Port C or Port F, depending on the pin declaration in the PSDsoft. Each Chip Select (ECS0-ECS7) consists of one product term that can be configured active High or Low. The Output Enable of the pin is controlled by either the Output Enable product term or the Direction Register (see Figure 18).
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MASTER MCU
D [ 7:0]
D
PSD835G2V Figure 18. External Chip Select
PLDs
ENABLE (.OE) PT
DIRECTION REGISTER
CPLD AND ARRAY
PLD INPUT BUS
ECS PT
ECS TO PORT C OR F
PD0 PIN
POLARITY BIT PORT C OR PORT F
AI07654
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MCU bus interface
PSD835G2V
16
MCU bus interface
The "no-glue logic" MCU Bus Interface block can be directly connected to most popular MCUs and their control signals. Key 8-bit MCUs, with their bus types and control signals, are shown in Table 32. The interface type is specified using the PSDsoft. Table 32.
MCU 8031/8051 80C51XA 80C251 80C251 80198 68HC11 68HC05C0 68HC912 Z80 Z8 68330 M37702M2
MCUs and their control signals
Data Bus CNTL0 CNTL1 CNTL2 Width 8 8 8 8 8 8 8 8 8 8 8 8 WR WR WR WR WR R/W WR R/W WR R/W R/W R/W RD RD PSEN RD RD E RD E RD DS DS E PSEN PSEN PC7 PD0(1) ADIO0 PA3-PA0 PA7-PA4 A0 A4 A0 A0 A0 A0 A0 A0 A0 A0 A0 A0 Note (2) A3-A0 Note (2) Note (2) Note (2) Note (2) Note (2) Note (2) D3-D0 Note (2) Note (2) D3-D0 Note (2) Note (2) Note (2) Note (2) Note (2) Note (2) Note (2) Note (2) D7-D4 Note (2) Note (2) D7-D4
Note (2) ALE Note (2) ALE
Note (2) Note (2) ALE PSEN Note (2) ALE
Note (2) Note (2) ALE Note (2) Note (2) AS Note (2) Note (2) AS Note (2) DBE AS
(Note Note (2) Note (2) 1 ) Note (2) Note (2) AS Note (2) Note (2) AS Note (2) Note (2) ALE
1. ALE/AS input is optional for MCUs with a non-multiplexed bus 2. Unused CNTL2 pin can be configured as PLD input. Other unused pins (PD3-PD0, PA3-PA0) can be configured for other I/O functions.
16.1
PSD interface to a multiplexed 8-bit bus
Figure 19 shows an example of a system using a MCU with an 8-bit multiplexed bus and a PSD. The ADIO port on the PSD is connected directly to the MCU address/data bus. Address Strobe (ALE/AS, PD0) latches the address signals internally. Latched addresses can be brought out to Port E, For G. The PSD drives the ADIO data bus only when one of its internal resources is accessed and Read Strobe (RD, CNTL1) is active. Should the system address bus exceed sixteen bits, Ports A, B, C, or F may be used as additional address inputs.
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PSD835G2V Figure 19. An example of a typical 8-bit multiplexed bus interface
MCU bus interface
MCU
AD7-AD0
PSD
PORT F A7-A0 (OPTIONAL)
A15-A8
ADIO PORT
PORT G WR RD BHE WR (CNTRL0) RD (CNTRL1) BHE (CNTRL2) RST ALE ALE (PD0) PORT D RESET PORT A, B or C
A15-A8 (OPTIONAL)
A23-A16 (OPTIONAL)
AI02878D
16.2
PSD interface to a non-multiplexed 8-bit bus
Figure 20 shows an example of a system using a MCU with an 8-bit non-multiplexed bus and a PSD. The address bus is connected to the ADIO Port, and the data bus is connected to Port F. Port F is in tri-state mode when the PSD is not accessed by the MCU. Should the system address bus exceed sixteen bits, Ports A, B or C may be used for additional address inputs.
16.3
MCU bus interface examples
Figures 21 through Figure 24. on page 70 show examples of the basic connections between the PSD and some popular MCUs. The PSD Control input pins are labeled as to the MCU function for which they are configured. The MCU bus interface is specified using the PSDsoft.
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MCU bus interface Figure 20. An example of a typical 8-bit non-multiplexed bus interface
PSD835G2V
MCU
D7-D0
PSD
PORT F D7-D0
ADIO PORT A15-A0
PORT G WR RD BHE WR (CNTRL0) RD (CNTRL1) BHE (CNTRL2) RST PORT A, B or C A23-A16 (OPTIONAL)
ALE
ALE (PD0) PORT D
RESET
AI02879D
16.4
80C31
Figure 21 shows the bus interface for the 80C31, which has an 8-bit multiplexed address/data bus. The lower address byte is multiplexed with the data bus. The MCU control signals Program Select Enable (PSEN, CNTL2), Read Strobe (RD, CNTL1), and Write Strobe (WR, CNTL0) may be used for accessing the internal memory and I/O Ports blocks. Address Strobe (ALE/AS, PD0) latches the address.
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PSD835G2V Figure 21. Interfacing the PSD with an 80C31
A15-A8 AD7-AD0
MCU bus interface
AD[15:8] AD[ 7:0 ] VCC
80C31
19 X1 X2 RESET INT0 INT1 T0 T1 1 2 3 4 5 6 7 8 10 11 31 EA/VP 39 71 72 73 74 75 76 77 78 P1.0 P1.1 P1.2 P1.3 P1.4 P1.5 P1.6 P1.7 RXD TXD P0.0 P0.1 P0.2 P0.3 P0.4 P0.5 P0.6 P0.7 P2.0 P2.1 P2.2 P2.3 P2.4 P2.5 P2.6 P2.7 WR RD PSEN ALE/P 39 38 37 36 35 34 33 32 21 22 23 24 25 26 27 28 16 17 29 30 WR RD PSEN ALE AD0 AD1 AD2 AD3 AD4 AD5 AD6 AD7 A8 A9 A10 A11 A12 A13 A14 A15 3 4 5 6 7 10 11 12 13 14 15 16 17 18 19 20 59 60 40 79 80 1 2
PSD
VCC VCC VCC ADIO0 ADIO1 ADIO2 ADIO3 ADIO4 ADIO5 ADIO6 ADIO7 ADIO8 ADIO9 ADIO10 ADIO11 ADIO12 ADIO13 ADIO14 ADIO15 CNTL0 (WR) CNTL1(RD) CNTL2 (PSEN) PD0 (ALE) PD1 (CLKIN) PD2 (CS) PD3 RESET PE0 (TMS) PE1 (TCK/ST) PE2 (TDI) PE3 (TDO) PE4 (TSTAT/RDY) PE5 (TERR) PE6 (VSTBY) PE7 (VBATON) PF0 PF1 PF2 PF3 PF4 PF5 PF6 PF7 PG0 PG1 PG2 PG3 PG4 PG5 PG6 PG7 PA0 PA1 PA2 PA3 PA4 PA5 PA6 PA7 PB0 PB1 PB2 PB3 PB4 PB5 PB6 PB7 PC0 PC1 PC2 PC3 PC4 PC5 PC6 PC7 31 32 33 34 35 36 37 38 21 22 23 24 25 26 27 28 51 52 53 54 55 56 57 58 61 62 63 64 65 66 67 68 41 42 43 44 45 46 47 48
CRYSTAL
18 9 12 13 14 15
RESET
RESET RESET
GND GND GND GND GND 8 30 49 50 70
AI02880D
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MCU bus interface
PSD835G2V
16.5
80C251
The Intel 80C251 MCU features a user-configurable bus interface with four possible bus configurations, as shown in Table 33. The first configuration is 80C31 compatible, and the bus interface to the PSD is identical to that shown in Figure 21. on page 65. The second and third configurations have the same bus connection as shown in Table 34. on page 67. There is only one Read Strobe (PSEN) connected to CNTL1 on the PSD. The A16 connection to PA0 allows for a larger address input to the PSD. The fourth configuration is shown in Figure 22. on page 68. Read Strobe (RD) is connected to CNTL1 and Program Select Enable (PSEN) is connected to CNTL2. The 80C251 has two major operating modes: Page mode and Non-page mode. In Nonpage mode, the data is multiplexed with the lower address byte, and Address Strobe (ALE/AS, PD0) is active in every bus cycle. In Page mode, data (D7-D0) is multiplexed with address (A15-A8). In a bus cycle where there is a Page hit, Address Strobe (ALE/AS, PD0) is not active and only addresses (A7-A0) are changing. The PSD supports both modes. In Page Mode, the PSD bus timing is identical to Non-Page Mode except the address hold time and setup time with respect to Address Strobe (ALE/AS, PD0) is not required. The PSD access time is measured from address (A7-A0) valid to data in valid. Table 33. 80C251 configurations
Page mode Non-Page Mode, 80C31 compatible A7-A0 multiplex with D7-D0 Non-Page Mode A7-A0 multiplex with D7-D0 Page Mode A15-A8 multiplex with D7D0 Page Mode A15-A8 multiplex with D7D0
Configuration 80C251 Read/Write pins Connecting to PSD pins WR RD PSEN WR PSEN only WR PSEN only WR RD PSEN CNTL0 CNTL1 CNTL2 CNTL0 CNTL1 CNTL0 CNTL1 CNTL0 CNTL1 CNTL2
1
2
3
4
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PSD835G2V Table 34. Interfacing the PSD with the 80C251, with one read input
A17-A8 A17 AD7-AD0 VCC U1 2 3 4 5 6 7 8 9 21 P1.0 P1.1 P1.2 P1.3 P1.4 P1.5 P1.6 P1.7 X1 X2
MCU bus interface
AD[15:8] AD[ 7:0 ]
80C31
P0.0 P0.1 P0.2 P0.3 P0.4 P0.5 P0.6 P0.7 P2.0 P2.1 P2.2 P2.3 P2.4 P2.5 P2.6 P2.7 WR RD/A16 PSEN 43 42 41 40 39 38 37 36 24 25 26 27 28 29 30 31 18 19 32 33 RD ALE A16 AD0 AD1 AD2 AD3 AD4 AD5 AD6 AD7 A8 A9 A10 A11 A12 A13 A14 A15 WR 3 4 5 6 7 10 11 12 13 14 15 16 17 18 19 20 59 60 40 79 80 1 2 39 71 72 73 74 75 76 77 78
PSD
VCC VCC VCC ADIO0(2) PF0 ADIO1 PF1 ADIO2 PF2 ADIO3 PF3 PF4 ADIO4 PF5 ADIO5 PF6 ADIO6 PF7 ADIO7 ADIO8 ADIO9 ADIO10 ADIO11 ADIO12 ADIO13 ADIO14 ADIO15 CNTL0 (WR) CNTL1(RD) CNTL2 (PSEN) PD0 (ALE) PD1 (CLKIN) PD2 (CS) PD3 RESET PE0 (TMS) PE1 (TCK/ST) PE2 (TDI) PE3 (TDO) PE4 (TSTAT/RDY) PE5 (TERR) PE6 (VSTBY) PE7 (VBATON) PG0 PG1 PG2 PG3 PG4 PG5 PG6 PG7 PA0 PA1 PA2 PA3 PA4 PA5 PA6 PA7 PB0 PB1 PB2 PB3 PB4 PB5 PB6 PB7 PC0 PC1 PC2 PC3 PC4 PC5 PC6 PC7 31 32 33 34 35 36 37 38 21 22 23 24 25 26 27 28 51 52 53 54 55 56 57 58 61 62 63 64 65 66 67 68 41 42 43 44 45 46 47 48 A16(1) A17
CRYSTAL
20
RESET
10
RESET ALE
35 EA
RESET RESET
GND GND GND GND GND 8 30 49 50 70
AI02881D
1. The A16 and A17 connections are optional. 2. In non-Page-Mode, AD7-AD0 connects to ADIO7-ADIO0.
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MCU bus interface Figure 22. Interfacing the PSD with the 80C251, with RD and PSEN Inputs
A15-A8 AD7-AD0 VCC
PSD835G2V
AD[15:8] AD[ 7:0 ]
80C31
2 3 4 5 6 7 8 9 21 P1.0 P1.1 P1.2 P1.3 P1.4 P1.5 P1.6 P1.7 X1 X2 P0.0 P0.1 P0.2 P0.3 P0.4 P0.5 P0.6 P0.7 P2.0 P2.1 P2.2 P2.3 P2.4 P2.5 P2.6 P2.7 WR RD/A16 RESET 10 PSEN RESET ALE 35 43 42 41 40 39 38 37 36 24 25 26 27 28 29 30 31 18 19 32 33 AD0 AD1 AD2 AD3 AD4 AD5 AD6 AD7 A8 A9 A10 A11 A12 A13 A14 A15 WR RD PSEN ALE 3 4 5 6 7 10 11 12 13 14 15 16 17 18 19 20 59 60 40 79 80 1 2 39 71 72 73 74 75 76 77 78
PSD
VCC VCC VCC ADIO0(2) ADIO1 ADIO2 ADIO3 ADIO4 ADIO5 ADIO6 ADIO7 ADIO8 ADIO9 ADIO10 ADIO11 ADIO12 ADIO13 ADIO14 ADIO15 CNTL0 (WR) CNTL1(RD) CNTL2 (PSEN) PD0 (ALE) PD1 (CLKIN) PD2 (CS) PD3 RESET PE0 (TMS) PE1 (TCK/ST) PE2 (TDI) PE3 (TDO) PE4 (TSTAT/RDY) PE5 (TERR) PE6 (VSTBY) PE7 (VBATON) PF0 PF1 PF2 PF3 PF4 PF5 PF6 PF7 PG0 PG1 PG2 PG3 PG4 PG5 PG6 PG7 PA0 PA1 PA2 PA3 PA4 PA5 PA6 PA7 PB0 PB1 PB2 PB3 PB4 PB5 PB6 PB7 PC0 PC1 PC2 PC3 PC4 PC5 PC6 PC7 31 32 33 34 35 36 37 38 21 22 23 24 25 26 27 28 51 52 53 54 55 56 57 58 61 62 63 64 65 66 67 68 41 42 43 44 45 46 47 48
CRYSTAL
20
EA
RESET RESET
GND GND GND GND GND 8 30 49 50 70
AI02882D
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MCU bus interface
16.6
80C51XA
The Philips 80C51XA MCU family supports an 8- or 16-bit multiplexed bus that can have burst cycles. Address bits (A3-A0) are not multiplexed, while (A19-A4) are multiplexed with data bits (D15-D0) in 16-bit mode. In 8-bit mode, (A11-A4) are multiplexed with data bits (D7-D0). The 80C51XA can be configured to operate in eight-bit data mode (as shown in Figure 23). The 80C51XA improves bus throughput and performance by executing burst cycles for code fetches. In Burst Mode, address A19-A4 are latched internally by the PSD, while the 80C51XA changes the A3-A0 signals to fetch up to 16 bytes of code. The PSD access time is then measured from address A3-A0 valid to data in valid. The PSD bus timing requirement in Burst Mode is identical to the normal bus cycle, except the address setup and hold time with respect to Address Strobe (ALE/AS, PD0) does not apply.
Figure 23. Interfacing the PSD with the 80C51X, 8-bit data bus
A[19:12] D[7:0] A[3:0 ] VCC
80C31
21 XTAL1 XTAL2 A4D0 A5D1 A6D2 A7D3 A8D4 A9D5 A10D6 A11D7 A12D8 A13D9 A14D10 A15D11 A16D12 A17D13 A18D14 A19D15 A3 A2 A1 A0/WRH WRL RD 32 33 PSEN ALE 79 80 1 2 39 71 72 73 74 75 76 77 78 43 42 41 40 39 38 37 36 24 25 26 27 28 29 30 31 5 4 3 2 18 19 A3 A2 A1 A0 AD0 AD1 AD2 AD3 AD4 AD5 AD6 AD7 A8 A9 A10 A11 A12 A13 A14 A15 3 4 5 6 7 10 11 12 13 14 15 16 17 18 19 20
PSD
CRYSTAL
20
11 13 6 7 9 8 16
RXD0 TXD0 RXD1 TXD1 T2EX T2 T0
9 29 69 VCC VCC VCC ADIO0(2) PF0 ADIO1 PF1 ADIO2 PF2 ADIO3 PF3 PF4 ADIO4 PF5 ADIO5 PF6 ADIO6 PF7 ADIO7 ADIO8 ADIO9 ADIO10 ADIO11 ADIO12 ADIO13 ADIO14 ADIO15 PG0 PG1 PG2 PG3 PG4 PG5 PG6 PG7 PA0 PA1 PA2 PA3 PA4 PA5 PA6 PA7 PB0 PB1 PB2 PB3 PB4 PB5 PB6 PB7 PC0 PC1 PC2 PC3 PC4 PC5 PC6 PC7
31 32 33 34 35 36 37 38 21 22 23 24 25 26 27 28 51 52 53 54 55 56 57 58 61 62 63 64 65 66 67 68 41 42 43 44 45 46 47 48
WR RD
59 60 40
RESET
CNTL0 (WR) CNTL1(RD) CNTL2 (PSEN)
10 14 15 35
RESET INT0 INT1 EA/WAIT
VCC
PSEN ALE
PD0 (ALE) PD1 (CLKIN) PD2 (CS) PD3 RESET PE0 (TMS) PE1 (TCK/ST) PE2 (TDI) PE3 (TDO) PE4 (TSTAT/RDY) PE5 (TERR) PE6 (VSTBY) PE7 (VBATON)
RESET RESET
GND GND GND GND GND 8 30 49 50 70
AI02883D
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MCU bus interface
PSD835G2V
16.7
68HC11
Figure 24 shows a bus interface to a 68HC11 where the PSD is configured in 8-bit multiplexed mode with E and R/W settings. The DPLD can be used to generate the READ and WR signals for external devices.
Figure 24. Interfacing the PSD with a 68HC11
A15-A8 AD7-AD0 VCC A[15:8] A[3:0 ]
80C31
34 33 32 31 30 29 28 27 8 PA0 PA1 PA2 PA3 PA4 PA5 PA6 PA7 XT EX IRQ XIRQ PD0 PD1 PD2 PD3 PD4 PD5 PE0 PE1 PE2 PE3 PE4 PE5 PE6 PE7 VRH VRL MODB MODA RESET RESET PC0 PC1 PC2 PC3 PC4 PC5 PC6 PC7 PB0 PB1 PB2 PB3 PB4 PB5 PB6 PB7 9 10 11 12 13 14 15 16 42 41 40 39 38 37 36 35 6 5 4 AS RESET AD0 AD1 AD2 AD3 AD4 AD5 AD6 AD7 A8 A9 A10 A11 A12 A13 A14 A15 3 4 5 6 7 10 11 12 13 14 15 16 17 18 19 20
PSD
9 29 69 VCC VCC VCC ADIO0(2) PF0 ADIO1 PF1 ADIO2 PF2 ADIO3 PF3 PF4 ADIO4 PF5 ADIO5 PF6 ADIO6 PF7 ADIO7 ADIO8 ADIO9 ADIO10 ADIO11 ADIO12 ADIO13 ADIO14 ADIO15 PG0 PG1 PG2 PG3 PG4 PG5 PG6 PG7 PA0 PA1 PA2 PA3 PA4 PA5 PA6 PA7 PB0 PB1 PB2 PB3 PB4 PB5 PB6 PB7 PC0 PC1 PC2 PC3 PC4 PC5 PC6 PC7
31 32 33 34 35 36 37 38 21 22 23 24 25 26 27 28 51 52 53 54 55 56 57 58 61 62 63 64 65 66 67 68 41 42 43 44 45 46 47 48
CRYSTAL
7 19 18 20 21 22 23 24 25 43 44 45 46 47 48 49 50 52 51 2 3
R/W E AS
R/W E
59 60 40 79 80 1 2 39 71 72 73 74 75 76 77 78
CNTL0 (R/W) CNTL1(RD) CNTL2 (E) PD0 (AS) PD1 (CLKIN) PD2 (CS) PD3 RESET PE0 (TMS) PE1 (TCK/ST) PE2 (TDI) PE3 (TDO) PE4 (TSTAT/RDY) PE5 (TERR) PE6 (VSTBY) PE7 (VBATON)
RESET
GND GND GND GND GND 8 30 49 50 70
AI02884D
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I/O ports
17
I/O ports
There are seven programmable I/O ports: Ports A, B, C, D, E and F. Each of the ports is eight bits except for Port D, which is 4 bits. Each port pin is individually user-configurable, thus allowing multiple functions per port. The ports are configured using PSDsoft or by the MCU writing to on-chip registers in the CSIOP space. The topics discussed in this section are:

General Port architecture Port operating modes Port Configuration Registers (PCR) Port Data Registers Individual Port functionality.
17.1
General port architecture
The general architecture of the I/O Port block is shown in Figure 25. on page 72. Individual Port architectures are shown in Figure 27. on page 80 to Figure 29. on page 83. In general, once the purpose for a port pin has been defined, that pin is no longer available for other purposes. Exceptions are noted. As shown in Figure 25. on page 72, the ports contain an output multiplexer whose select signals are driven by the configuration bits in the Control Registers (Ports E, F and G only) and PSDsoft Configuration. Inputs to the multiplexer include the following:

Output data from the Data Out register Latched address outputs CPLD macrocell output External Chip Select (ECS0-ECS2) from the CPLD.
The Port Data Buffer (PDB) is a tri-state buffer that allows only one source at a time to be read. The Port Data Buffer (PDB) is connected to the Internal Data Bus for feedback and can be read by the MCU. The Data Out and macrocell outputs, Direction and Control Registers, and port pin input are all connected to the Port Data Buffer (PDB). The Port pin's tri-state output driver enable is controlled by a two input OR gate whose inputs come from the CPLD AND Array enable product term and the Direction Register. If the enable product term of any of the Array outputs is not defined and that port pin is not defined as a CPLD output in the PSDabel file, then the Direction Register has sole control of the buffer that drives the port pin. The contents of these registers can be altered by the MCU. The Port Data Buffer (PDB) feedback path allows the MCU to check the contents of the registers. Ports A, B, and C have embedded Input Macrocells (IMC). The Input Macrocells (IMC) can be configured as latches, registers, or direct inputs to the PLDs. The latches and registers are clocked by Address Strobe (ALE/AS, PD0) or a product term from the PLD AND Array. The outputs from the Input Macrocells (IMC) drive the PLD input bus and can be read by the MCU. See Input macrocell on page 59.
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I/O ports
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17.2
Port operating modes
The I/O Ports have several modes of operation. Some modes can be defined using PSDabel, some by the MCU writing to the Registers in CSIOP space, and some by both. The modes that can only be defined using PSDsoft must be programmed into the device and cannot be changed unless the device is reprogrammed. The modes that can be changed by the MCU can be done so dynamically at run-time. The PLD I/O, Data Port, Address Input, Peripheral I/O and MCU Reset modes are the only modes that must be defined before programming the device. All other modes can be changed by the MCU at run-time. Table 35. on page 74 summarizes which modes are available on each port. Table 38. on page 77 shows how and where the different modes are configured. Each of the port operating modes are described in the following sections.
Figure 25. General I/O port architecture
DATA OUT REG. D WR ADDRESS ALE D G Q ADDRESS OUTPUT MUX PORT PIN Q
DATA OUT
MACROCELL OUTPUTS EXT CS INTERNAL DATA BUS READ MUX P D B DATA IN OUTPUT SELECT
CONTROL REG. D WR DIR REG. D WR ENABLE PRODUCT TERM (.OE) INPUT MACROCELL CPLD-INPUT
AI02885
Q
ENABLE OUT
Q
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I/O ports
17.3
MCU I/O mode
In the MCU I/O mode, the MCU uses the I/O Ports block to expand its own I/O ports. By setting up the CSIOP space, the ports on the PSD are mapped into the MCU address space. The addresses of the ports are listed in Table 5. on page 23. A port pin can be put into MCU I/O mode by writing a 0 to the corresponding bit in the Control Register (Ports E, F and G). The MCU I/O direction may be changed by writing to the corresponding bit in the Direction Register, or by the output enable product term. See Direction Register on page 77. When the pin is configured as an output, the content of the Data Out Register drives the pin. When configured as an input, the MCU can read the port input through the Data In buffer. See Figure 25. on page 72. Ports A, B and C do not have Control Registers, and are in MCU I/O mode by default. They can be used for PLD I/O if they are specified in PSDsoft.
17.4
PLD I/O mode
The PLD I/O Mode uses a port as an input to the CPLD's Input Macrocells (IMC), and/or as an output from the CPLD's Output Macrocells (OMC). The output can be tri-stated with a control signal. This output enable control signal can be defined by a product term from the PLD, or by resetting the corresponding bit in the Direction Register to 0. The corresponding bit in the Direction Register must not be set to 1 if the pin is defined as a PLD input pin in PSDsoft. The PLD I/O mode is specified in PSDsoft by declaring the port pins, and then specifying an equation in PSDsoft.
17.5
Address out mode
For MCUs with a multiplexed address/data bus, Address Out Mode can be used to drive latched addresses on to the port pins. These port pins can, in turn, drive external devices. Either the output enable or the corresponding bits of both the Direction Register and Control Register must be set to a 1 for pins to use Address Out Mode. This must be done by the MCU at run-time. See Table 37. on page 75 for the address output pin assignments on Ports E, F and G for various MCUs. Note: Do not drive address signals with Address Out Mode to an external memory device if it is intended for the MCU to Boot from the external device. The MCU must first Boot from PSD memory so the Direction and Control register bits can be set.
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I/O ports Table 35. Port operating modes
Port A Yes Port B Yes Port C Yes Port D Yes Port E Yes Port F Yes
PSD835G2V
Port Mode MCU I/O PLD I/O McellA Outputs McellB Outputs Additional Ext. CS Outputs PLD Inputs Address Out Address In Data Port Peripheral I/O JTAG ISP
Port G Yes
Yes No No Yes No Yes No No No
No Yes No Yes No Yes No No No
No No Yes Yes No Yes No No No
No No No Yes No Yes No No No
No No No No
No No Yes Yes
No No No No Yes (A7-A0) or (A15-A8) No No No No
Yes (A7-A0) Yes (A7-A0) No No No Yes
1
Yes Yes Yes No
1. Can be multiplexed with other I/O functions.
Table 36.
Mode
Port operating mode settings
Defined in PSDsoft Control Register Setting Direction Register Setting VM Register Setting JTAG Enable
MCU I/O
Declare pins only
1 = output, 0 (Note 4) 0 = input (Note 2) (Note 2) N/A 1 (Note 2)
N/A
N/A
PLD I/O Data Port (Port F) Address Out (Port E, F, G) Address In (Port A,B,C,D, F) Peripheral I/O (Port F)
Declare pins and logic N/A equations Selected for MCU with N/A non-mux bus Declare pins only Declare pins or logic equations for Input Macrocells Logic equations (PSEL0 & 1) 1
N/A N/A N/A
N/A N/A N/A
N/A
N/A
N/A
N/A
N/A N/A
N/A N/A
PIO bit = 1 N/A N/A JTAG_Enable
JTAG ISP (Note 3) Declare pins only
1. N/A = Not Applicable
2. The direction of the Port A,B,C, and F pins are controlled by the Direction Register OR'ed with the individual output enable product term (.oe) from the CPLD AND Array. 3. Any of these three methods enables the JTAG pins on Port E. 4. Control Register setting is not applicable to Ports A, B and C.
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PSD835G2V Table 37.
MCU
I/O ports I/O port latched address output assignments(1)
Port E Port E Port F Port F Port G (PG3-PG0) Address (A11-A8) Address (A11-A8) Address (A3-A0) Address (A3-A0) Port G (PG7-PG4) Address (A15-A12) Address (A7-A4) Address (A7-A4) Address (A7-A4) (PE3-PE0) (PE7-PE4) (PF3-PF0) (PF7-PF4) N/A N/A Address (A3-A0) N/A Address (A7-A4) N/A Address (A7-A4) N/A N/A N/A Address (A3-A0) N/A Address (A7-A4) N/A Address (A7-A4) N/A
8051XA 80C251 (Page Mode) All Other 8-Bit Multiplexed 8-Bit Non-Multiplexed Bus
1. N/A = Not Applicable.
17.6
Address In mode
For MCUs that have more than 16 address signals, the higher addresses can be connected to Port A, B, C, D or F and are routed as inputs to the PLDs. The address input can be latched in the Input Macrocell (IMC) by Address Strobe (ALE/AS, PD0). Any input that is included in the DPLD equations for the SRAM, or primary or secondary Flash memory is considered to be an address input.
17.7
Data Port mode
Port F can be used as a data bus port for an MCU with a non-multiplexed address/data bus. The Data Port is connected to the data bus of the MCU. The general I/O functions are disabled in Port F if the port is configured as a Data Port. Data Port Mode is automatically configured in PSDsoft when a non-multiplexed bus MCU is selected.
17.8
Peripheral I/O mode
Peripheral I/O mode can be used to interface with external 8-bit peripherals. In this mode, all of Port F serves as a tri-state, bidirectional data buffer for the MCU. Peripheral I/O Mode is enabled by setting Bit 7 of the VM Register to a 1. Figure 26 shows how Port A acts as a bidirectional buffer for the MCU data bus if Peripheral I/O Mode is enabled. An equation for PSEL0 and/or PSEL1 must be written in PSDsoft. The buffer is tri-stated when PSEL0 or PSEL1 is not active.
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I/O ports Figure 26. Peripheral I/O mode
RD PSEL0 PSEL PSEL1 D0 - D7 DATA BUS
PSD835G2V
VM REGISTER BIT 7
PF0 - PF7
WR
AI02886b
17.9
JTAG in-system programming (ISP)
Port E is JTAG compliant, and can be used for In-System Programming (ISP). You can multiplex JTAG operations with other functions on Port E because In-System Programming (ISP) is not performed in normal Operating mode. For more information on the JTAG Port, see Programming in-circuit using the JTAG/ISP interface on page 91.
17.10
Port Configuration Registers (PCR)
Each Port has a set of Port Configuration Registers (PCR) used for configuration. The contents of the registers can be accessed by the MCU through normal read/write bus cycles at the addresses given in Table 5. on page 23. The addresses in Table 5 are the offsets in hexadecimal from the base of the CSIOP register. The pins of a port are individually configurable and each bit in the register controls its respective pin. For example, Bit 0 in a register refers to Bit 0 of its port. The three Port Configuration Registers (PCR), shown in Table 38, are used for setting the Port configurations. The default Power-up state for each register in Table 38 is 00h.
17.11
Control Register
Any bit reset to 0 in the Control Register sets the corresponding port pin to MCU I/O Mode, and a 1 sets it to Address Out Mode. The default mode is MCU I/O. Only Ports E, F and G have an associated Control Register.
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I/O ports
17.12
Direction Register
The Direction Register, in conjunction with the output enable (except for Port D), controls the direction of data flow in the I/O Ports. Any bit set to 1 in the Direction Register causes the corresponding pin to be an output, and any bit set to 0 causes it to be an input. The default mode for all port pins is input. Figure 27. on page 80 and Figure 28. on page 81 show the Port Architecture diagrams for Ports A/B/C and E/F/G, respectively. The direction of data flow for Ports A, B, C and F are controlled not only by the direction register, but also by the output enable product term from the PLD AND Array. If the output enable product term is not active, the Direction Register has sole control of a given pin's direction. An example of a configuration for a Port with the three least significant bits set to output and the remainder set to input is shown in Table 41. Since Port D only contains four pins (shown in Figure 28. on page 81), the Direction Register for Port D has only the four least significant bits active.
17.13
Drive Select Register
The Drive Select Register configures the pin driver as Open Drain or CMOS for some port pins, and controls the slew rate for the other port pins. An external pull-up resistor should be used for pins configured as Open Drain. A pin can be configured as Open Drain if its corresponding bit in the Drive Select Register is set to a 1. The default pin drive is CMOS. Note that the slew rate is a measurement of the rise and fall times of an output. A higher slew rate means a faster output response and may create more electrical noise. A pin operates at a high slew rate when the corresponding bit in the Drive Register is set to 1. The default rate is slow slew. Table 42. on page 78 shows the Drive Register for Ports A, B, C, D, E and F. It summarizes which pins can be configured as Open Drain outputs and which pins the slew rate can be set for. Table 38. Port Configuration Registers (PCR)
Port E, F, G A,B,C,D, E, F, G
1
Register name Control Direction Drive Select
MCU access Write/Read Write/Read Write/Read
A,B,C,D, E, F, G
1. See Table 42. on page 78 for Drive Register bit definition.
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I/O ports Table 39. Port pin direction control, Output Enable P.T. not defined
Direction Register bit 0 1 Port Pin mode Input Output
PSD835G2V
Table 40.
Port pin direction control, Output Enable P.T. defined
Output Enable P.T. 0 1 0 1 Port Pin Mode Input Output Output Output
Direction Register Bit 0 0 1 1
Table 41.
Bit 7 0
Port direction assignment example
Bit 6 0 Bit 5 0 Bit 4 0 Bit 3 0 Bit 2 1 Bit 1 1 Bit 0 1
Table 42.
Drive Register Port A Port B Port C Port D Port E Port F Port G
Drive Register pin assignment(1)
Bit 7 Open Drain Open Drain Slew Rate NA Open Drain Slew Rate Open Drain Bit 6 Open Drain Open Drain Slew Rate NA Open Drain Slew Rate Open Drain Bit 5 Open Drain Open Drain Slew Rate NA Open Drain Slew Rate Open Drain Bit 4 Open Drain Open Drain Slew Rate NA Open Drain Slew Rate Open Drain Bit 3 Open Drain Open Drain Slew Rate Open Drain Open Drain Slew Rate Open Drain Bit 2 Open Drain Open Drain Slew Rate Open Drain Open Drain Slew Rate Open Drain Bit 1 Open Drain Open Drain Slew Rate Open Drain Open Drain Slew Rate Open Drain Bit 0 Open Drain Open Drain Slew Rate Open Drain Open Drain Slew Rate Open Drain
1. NA = Not Applicable.
17.14
Port Data Registers
The Port Data Registers, shown in Table 43, are used by the MCU to write data to or read data from the ports. Table 43 shows the register name, the ports having each register type, and MCU access for each register type. The registers are described below.
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I/O ports
17.15
Data In
Port pins are connected directly to the Data In buffer. In MCU I/O input mode, the pin input is read through the Data In buffer.
17.16
Data Out Register
Stores output data written by the MCU in the MCU I/O output mode. The contents of the Register are driven out to the pins if the Direction Register or the output enable product term is set to 1. The contents of the register can also be read back by the MCU.
17.17
Output macrocells (OMC)
The CPLD Output Macrocells (OMC) occupy a location in the MCU's address space. The MCU can read the output of the Output Macrocells (OMC). If the OMC Mask Register bits are not set, writing to the macrocell loads data to the macrocell flip-flops. See PLDs on page 49 for more information.
17.18
OMC Mask Register
Each OMC Mask Register bit corresponds to an Output Macrocell (OMC) flip-flop. When the OMC Mask Register bit is set to a 1, loading data into the Output Macrocell (OMC) flip-flop is blocked. The default value is 0 or unblocked. Table 43. Port Data Registers
Port A, B, C, D, E, F, G Read - input on pin A, B, C, D, E, F, G Write/Read A, B A, B A, B, C A, B, C, F Read - outputs of macrocells Write - loading macrocell flip-flops Write/Read - prevents loading into a given macrocell Read - outputs of the Input Macrocells Read - the output enable control of the port driver MCU access
Register name Data In Data Out Output Macrocell Mask Macrocell Input Macrocell Enable Out
17.19
Input macrocells (IMC)
The Input Macrocells (IMC) can be used to latch or store external inputs. The outputs of the Input Macrocells (IMC) are routed to the PLD input bus, and can be read by the MCU. See PLDs on page 49.
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I/O ports
PSD835G2V
17.20
Enable Out
The Enable Out register can be read by the MCU. It contains the output enable values for a given port. A `1' indicates the driver is in output mode. A `0' indicates the driver is in tri-state and the pin is in input mode.
17.21
Ports A,B and C - Functionality and Structure
Ports A and B have similar functionality and structure, as shown in Figure 27. The two ports can be configured to perform one or more of the following functions:

MCU I/O Mode CPLD Output - Macrocells McellA7-McellA0 can be connected to Port A, McellB7McellB0 can be connected to Port B, External Chip Select ECS7-ECS0 can be connected to Port C. CPLD Input - Via the Input Macrocells (IMC). Address In - Additional high address inputs using the Input Macrocells (IMC). Open Drain/Slew Rate - pins PC7-PC0 can be configured to fast slew rate, pins PA7PA0 and PB7-PB0 can be configured to Open Drain Mode.

Figure 27. Port A, B and C structure
DATA OUT REG. D WR PORT PIN OUTPUT MUX MCELLA7-MCELLA0 (PORT A) MCELLB7-MCELLB0 (PORT B) EXT.CS (PORT C) INTERNAL DATA BUS READ MUX P D B ENABLE OUT DATA IN OUTPUT SELECT Q
DATA OUT
DIR REG. D WR ENABLE PRODUCT TERM (.OE) INPUT MACROCELL Q
CPLD-INPUT
AI02887b
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PSD835G2V
I/O ports
17.22
Port D - functionality and structure
Port D has four I/O pins. It can be configured to program one or more of the following functions (see Figure 28):

MCU I/O Mode CPLD Input - direct input to CPLD, no Input Macrocell (IMC). PD0 - ALE, as Address Strobe input. PD1 - CLKIN, as Clock input to the Macrocell flip-flops and APD counter. PD2 - CSI, as active Low Chip Select input. A High input will disable the Flash/SRAM memories and the CSIOP. PD3 - as DBE input from 68HC912.
Port D pins can be configured in PSDsoft as input pins for other dedicated functions:

Figure 28. Port D structure
DATA OUT REG. D WR PORT D PIN OUTPUT MUX Q DATA OUT
READ MUX INTERNAL DATA BUS
P D B DATA IN OUTPUT SELECT
DIR REG. D WR Q CPLD - INPUT
AI02888C
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I/O ports
PSD835G2V
17.23
Port E - functionality and structure
Port E can be configured to perform one or more of the following functions:

MCU I/O Mode In-System Programming - JTAG port can be enabled for programming/erase of the PSD device. Refer to Programming in-circuit using the JTAG/ISP interface on page 91 for more information. Open Drain - Port E pins can be configured in Open Drain Mode. Battery Backup features - PE6 can be configured as a Battery Input (VSTBY) pin. PE7 can be configured as a Battery On Indicator output pin, indicating when VCC is less than VBAT. Latched Address Output - Provided latched address (A7-A0) output.

17.24
Port F - functionality and structure
Port F can be configured to perform one or more of the following functions:

MCU I/O Mode CPLD Output - External Chip Select ECS7-ECS0 can be connected to Port F (or Port C). CPLD Input - as direct input of the CPLD array. Address In - addition high address inputs. Direct input to the CPLD array, no Input Macrocell (IMC) latching is available. Latched Address Out - Provide latched address out per Table 47. on page 90. Slew Rate - pins can be set up for fast slew rate. Data Port - connected to D7-D0 when Port F is configured as Data Port for a nonmultiplexed bus. Peripheral I/O Mode.
17.25
Port G - functionality and structure
Port G can be configured to perform one or more of the following functions:

MCU I/O Mode Latched Address Out - Provide latched address out per Table 47. on page 90. Open Drain - pins can be configured in Open Drain Mode.
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PSD835G2V Figure 29. Port E, F, G structure
DATA OUT REG. D WR ADDRESS ALE D G Q ADDRESS A7-A0 OR A15-A8 OUTPUT MUX Q
I/O ports
DATA OUT
PORT E, F OR G PIN
EXT.CS (PORT F) READ MUX P D B CONTROL REG. D WR DIR REG. D WR ENABLE PRODUCT TERM (.OE) CPLD - INPUT ISP OR BATTERY BACK-UP (PORT E) CONFIGURATION BIT
AI02889b
INTERNAL DATA BUS
OUTPUT SELECT DATA IN
Q
ENABLE OUT
Q
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Power management
PSD835G2V
18
Power management
The PSD835G2 offers configurable power saving options. These options may be used individually or in combinations, as follows:
All memory blocks in a PSD (primary and secondary Flash memory, and SRAM) are built with Power Management technology. In addition to using special silicon design methodology, power management technology puts the memories into standby mode when address/data inputs are not changing (zero DC current). As soon as a transition occurs on an input, the affected memory "wakes up", changes and latches its outputs, then goes back to standby. The designer does not have to do anything special to achieve memory standby mode when no inputs are changing--it happens automatically. The PLD sections can also achieve Stand-by mode when its inputs are not changing, as described in the sections on the Power Management Mode Registers (PMMR).
As with the Power Management mode, the Automatic Power Down (APD) unit allows the PSD to reduce to standby current automatically. The APD Unit can also block MCU address/data signals from reaching the memories and PLDs. This feature is available on all the devices of the PSD family. The APD Unit is described in more detail in Automatic Power-down (APD) unit and Power-down mode on page 85. Built-in logic monitors the Address Strobe of the MCU for activity. If there is no activity for a certain time period (MCU is asleep), the APD Unit initiates Power-down mode (if enabled). Once in Power-down mode, all address/data signals are blocked from reaching PSD memory and PLDs, and the memories are deselected internally. This allows the memory and PLDs to remain in standby mode even if the address/data signals are changing state externally (noise, other devices on the MCU bus, etc.). Keep in mind that any unblocked PLD input signals that are changing states keep the PLD out of Stand-by mode, but not the memories.
PSD Chip Select Input (CSI, PD2) can be used to disable the internal memories, placing them in standby mode even if inputs are changing. This feature does not block any internal signals or disable the PLDs. This is a good alternative to using the APD Unit. There is a slight penalty in memory access time when PSD Chip Select Input (CSI, PD2) makes its initial transition from deselected to selected. The PMMRs can be written by the MCU at run-time to manage power. All PSD devices support "blocking bits" in these registers that are set to block designated signals from reaching both PLDs. Current consumption of the PLDs is directly related to the composite frequency of the changes on their inputs (see Figure 33. on page 93). Significant power savings can be achieved by blocking signals that are not used in PLD logic equations at run-time. PSDsoft creates a fuse map that automatically blocks the low address Byte (A7-A0) or the Control signals (CNTL0-CNTL2, ALE and WRH/DBE) if none of these signals are used in PLD logic equations. PSD devices have a Turbo bit in PMMR0. This bit can be set to turn the Turbo mode off (the default is with Turbo mode turned on). While Turbo mode is off, the PLDs can achieve standby current when no PLD inputs are changing (zero DC current). Even when inputs do change, significant power can be saved at lower frequencies (AC current), compared to when Turbo mode is on. When the Turbo mode is on, there is a significant DC current component and the AC component is higher.
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PSD835G2V
Power management
18.1
Automatic Power-down (APD) unit and Power-down mode
The APD Unit, shown in Figure 30, puts the PSD into Power-down mode by monitoring the activity of Address Strobe (ALE/AS, PD0). If the APD Unit is enabled, as soon as activity on Address Strobe (ALE/AS, PD0) stops, a four bit counter starts counting. If Address Strobe (ALE/AS, PD0) remains inactive for fifteen clock periods of CLKIN (PD1), Power-down (PDN) goes High, and the PSD enters Power-down mode, as discussed next.
18.1.1
Power-down mode
By default, if you enable the APD Unit, Power-down mode is automatically enabled. The device enters Power-down mode if Address Strobe (ALE/AS, PD0) remains inactive for fifteen periods of CLKIN (PD1). The following should be kept in mind when the PSD is in Power-down mode:
If Address Strobe (ALE/AS, PD0) starts pulsing again, the PSD returns to normal Operating mode. The PSD also returns to normal Operating mode if either PSD Chip Select Input (CSI, PD2) is Low or the Reset (RESET) input is High. The MCU address/data bus is blocked from all memories and PLDs. Various signals can be blocked (prior to Power-down mode) from entering the PLDs by setting the appropriate bits in the PMMR registers. The blocked signals include MCU control signals and the common CLKIN (PD1). Note that blocking CLKIN (PD1) from the PLDs does not block CLKIN (PD1) from the APD Unit. All PSD memories enter Standby mode and are drawing standby current. However, the PLD and I/O ports blocks do not go into Standby Mode because you don't want to have to wait for the logic and I/O to "wake-up" before their outputs can change. See Table 44 for Power-down mode effects on PSD ports. Typical standby current is of the order of microamperes. These standby current values assume that there are no transitions on any PLD input. Power-down mode's effect on ports
Port function MCU I/O PLD Out Address Out Data Port Peripheral I/O Pin level No Change No Change Undefined Tri-State Tri-State

Table 44.
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Power management Figure 30. APD unit
APD EN PMMR0 BIT 1=1 TRANSITION DETECTION ALE CLR PD DISABLE BUS INTERFACE
PSD835G2V
RESET CSI CLKIN EDGE DETECT
APD COUNTER PD PLD
SECONDARY FLASH SELECT PRIMARY FLASH SELECT SRAM SELECT POWER DOWN (PDN) SELECT
DISABLE PRIMARY AND SECONDARY FLASH/SRAM MEMORIES
AI02891b
Table 45.
Mode
PSD timing and Standby current during Power-down mode
PLD propagation delay Memory access time No Access Access recovery time to normal access tLVDV 3 V VCC Typical Standby current 25 A(2)
Power-down Normal tPD (1)
1. Power-down does not affect the operation of the PLD. The PLD operation in this mode is based only on the Turbo bit. 2. Typical current consumption assuming no PLD inputs are changing state and the PLD Turbo bit is 0.
18.2
Other power saving options
The PSD offers other reduced power saving options that are independent of the Powerdown mode. Except for the SRAM Standby and Chip Select Input (CSI, PD2) features, they are enabled by setting bits in the PMMR0 and PMMR2 registers (see Table 22 and Table 23. on page 27 for a bit definition of the two registers).
18.3
PLD power management
The power and speed of the PLDs are controlled by the Turbo bit (bit 3) in PMMR0. By setting the bit to 1, the Turbo mode is off and the PLDs consume the specified standby current when the inputs are not switching for an extended time of 70ns. The propagation delay time is increased after the Turbo bit is set to 1 (turned off) when the inputs change at a composite frequency of less than 15MHz. When the Turbo bit is reset to 0 (turned on), the PLDs run at full power and speed. The Turbo bit affects the PLD's DC power, AC power, and propagation delay. Refer to Maximum rating on page 96 for PLD timings. Blocking MCU control signals with the bits of PMMR2 can further reduce PLD AC power consumption.
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PSD835G2V
Power management
18.3.1
SRAM Standby mode (battery backup)
The PSD supports a battery backup mode in which the contents of the SRAM are retained in the event of a power loss. The SRAM has a Voltage Standby pin (VSTBY, PC2) that can be connected to an external battery. When VCC becomes lower than VSTBY then the PSD automatically connects to Voltage Stand-by (VSTBY, PC2) as a power source to the SRAM. The SRAM Standby Current (ISTBY) is typically 0.5A. The SRAM data retention voltage is 2 V minimum. The Battery-on Indicator (VBATON) can be routed to PE7. This signal indicates when the VCC has dropped below VSTBY and the SRAM is running on battery power.
18.4
PSD Chip Select input (CSI, PD2)
PD2 of Port D can be configured in PSDsoft as the PSD Chip Select Input (CSI). When Low, the signal selects and enables the internal (primary) Flash memory, secondary Flash memory, SRAM, and I/O blocks for Read or Write operations involving the PSD. A High on PSD Chip Select Input (CSI, PD2) disables the primary Flash memory, secondary Flash memory, and SRAM, and reduces the PSD power consumption. However, the PLD and I/O signals remain operational when PSD Chip Select Input (CSI, PD2) is High. There may be a timing penalty when using PSD Chip Select Input (CSI, PD2) depending on the speed grade of the PSD that you are using. See the timing parameter tSLQV in Table 64. on page 109.
18.5
Input Clock
The PSD provides the option to turn off CLKIN (PD1) to the PLD to save AC power consumption. CLKIN (PD1) is an input to the PLD AND Array and the Output Macrocells (OMC). During Power-down mode, or, if CLKIN (PD1) is not being used as part of the PLD logic equation, the clock should be disabled to save AC power. CLKIN (PD1) is disconnected from the PLD AND Array or the Macrocells block by setting bits 4 or 5 to a 1 in PMMR0.
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Power management Figure 31. Enable power-down flow chart
RESET
PSD835G2V
Enable APD Set PMMR0 Bit 1 = 1
OPTIONAL
Disable desired inputs to PLD by setting PMMR0 bits 4 and 5 and PMMR2 bit 0.
No
ALE/AS idle for 15 CLKIN clocks? Yes PSD in Power Down Mode
AI02892B
18.6
Input control signals
The PSD provides the option to turn off the address input (A7-A0) and input control signals (CNTL0, CNTL1, CNTL2, Address Strobe (ALE/AS, PD0) and DBE) to the PLD to save AC power consumption. These signals are inputs to the PLD AND Array. During Power-down mode, or, if any of them are not being used as part of the PLD logic equation, these signals should be disabled to save AC power. They are disconnected from the PLD AND Array by setting bits 0, 2, 3, 4, 5, and 6 to a `1' in PMMR2. Table 46. APD counter operation
ALE PD polarity X X 1 0 ALE level X Pulsing 1 0 Not Counting Not Counting Counting (Generates PDN after 15 Clocks) Counting (Generates PDN after 15 Clocks) APD counter
APD Enable bit 0 1 1 1
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PSD835G2V
Reset timing and device status at reset
19
19.1
Reset timing and device status at reset
Power-up reset
Upon Power-up, the PSD requires a Reset (RESET) pulse of duration tNLNH-PO (1ms minimum) after VCC is steady. During this period, the device loads internal configurations, clears some of the registers and sets the Flash memory into Operating mode. After the rising edge of Reset (RESET), the PSD remains in the Reset mode for an additional period, tOPR (120ns maximum), before the first memory access is allowed. The Flash memory is reset to the Read mode upon Power-up. Sector Select (FS0-FS7 and CSBOOT0-CSBOOT3) must all be Low, Write Strobe (WR, CNTL0) High, during Power-Up Reset for maximum security of the data contents and to remove the possibility of a byte being written on the first edge of Write Strobe (WR, CNTL0). Any Flash memory Write cycle initiation is prevented automatically when VCC is below VLKO.
19.2
Warm reset
Once the device is up and running, the device can be reset with a pulse of a much shorter duration, tNLNH (150ns minimum). The same tOPR period is needed before the device is operational after warm reset. Figure 32 shows the timing of the Power-up and warm reset.
19.3
I/O pin, Register and PLD status at reset
Table 47. on page 90 shows the I/O pin, register and PLD status during Power-Up Reset, warm reset and Power-down mode. PLD outputs are always valid during warm reset, and they are valid in Power-Up Reset once the internal PSD Configuration bits are loaded. This loading of PSD is completed typically long before VCC ramps up to operating level. Once the PLD is active, the state of the outputs are determined by the equations specified in PSDsoft.
19.4
Reset of Flash memory Erase and Program cycles
A Reset (RESET) also resets the internal Flash memory state machine. During a Flash memory Program or Erase cycle, Reset (RESET) terminates the cycle and returns the Flash memory to the Read mode within a period of tNLNH-A (25s minimum).
Figure 32. Power-up and warm reset (RESET) timing
VCC
VCC(min) tNLNH tNLNH-A Warm Reset
tNLNH-PO Power-On Reset
tOPR
tOPR
RESET
AI02866b
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Reset timing and device status at reset Table 47.
PSD835G2V
Status during power-up reset, warm reset and power-down mode
Power-up reset Input mode Valid after internal PSD configuration bits are loaded Tri-stated Tri-stated Tri-stated Warm reset Input mode Valid Tri-stated Tri-stated Tri-stated Power-down mode Unchanged Depends on inputs to PLD (addresses are blocked in PD mode) Not defined Tri-stated Tri-stated
Port configuration MCU I/O PLD Output Address Out Data Port Peripheral I/O
Register
Power-Un Reset
Warm Reset Unchanged Depends on .re and .pr equations Initialized, based on the selection in PSDsoft Configuration menu Cleared to 0
Power-down Mode Unchanged Depends on .re and .pr equations
PMMR0 and PMMR2 Cleared to 0 Macrocells flip-flop status Cleared to 0 by internal Power-Up Reset Initialized, based on the selection in PSDsoft Configuration menu Cleared to 0
VM Register(1)
Unchanged
All other registers
Unchanged
1. The SR_cod and PeriphMode bits in the VM Register are always cleared to 0 on Power-Up Reset or Warm Reset.
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PSD835G2V
Programming in-circuit using the JTAG/ISP interface
20
Programming in-circuit using the JTAG/ISP interface
The JTAG/ISP Interface block can be enabled on Port E (see Table 48. on page 92). All memory blocks (primary and secondary Flash memory), PLD logic, and PSD Configuration Register bits may be programmed through the JTAG/ISP Interface block. A blank device can be mounted on a printed circuit board and programmed using JTAG/ISP. The standard JTAG signals (IEEE 1149.1) are TMS, TCK, TDI, and TDO. Two additional signals, TSTAT and TERR, are optional JTAG extensions used to speed up Program and Erase cycles. By default, on a blank PSD (as shipped from the factory or after erasure), four pins on Port E are enabled for the basic JTAG signals TMS, TCK, TDI, and TDO. See Application Note AN1153 for more details on JTAG In-System Programming (ISP).
20.1
Standard JTAG signals
The standard JTAG signals (TMS, TCK, TDI, and TDO) can be enabled by any of three different conditions that are logically OR'ed. When enabled, TDI, TDO, TCK, and TMS are inputs, waiting for a JTAG serial command from an external JTAG controller device (such as FlashLINK or Automated Test Equipment). When the enabling command is received, TDO becomes an output and the JTAG channel is fully functional inside the PSD. The same command that enables the JTAG channel may optionally enable the two additional JTAG signals, TSTAT and TERR. The following symbolic logic equation specifies the conditions enabling the four basic JTAG signals (TMS, TCK, TDI, and TDO) on their respective Port E pins. For purposes of discussion, the logic label JTAG_ON is used. When JTAG_ON is true, the four pins are enabled for JTAG. When JTAG_ON is false, the four pins can be used for general PSD I/O. JTAG_ON = PSDsoft_enabled + /* An NVM configuration bit inside the PSD is set by the designer in the PSDsoft Configuration utility. This dedicates the pins for JTAG at all times (compliant with IEEE 1149.1 */ Microcontroller_enabled + /* The microcontroller can set a bit at run-time by writing to the PSD register, JTAG Enable. This register is located at address CSIOP + offset C7h. Setting the JTAG_ENABLE bit in this register will enable the pins for JTAG use. This bit is cleared by a PSD reset or the microcontroller. See Table 20. on page 27 for bit definition. */ PSD_product_term_enabled; /* A dedicated product term (PT) inside the PSD can be used to enable the JTAG pins. This PT has the reserved name JTAGSEL. Once defined as a node in PSDabel, the designer can write an equation for JTAGSEL. This method is used when the Port E JTAG pins are multiplexed with other I/O signals. It is recommended to logically tie the node JTAGSEL to the JEN\ signal on the Flashlink cable when multiplexing JTAG signals. See Application Note 1153 for details. */ The PSD supports JTAG/ISP commands, but not Boundary Scan. The PSDsoft software tool and FlashLINK JTAG programming cable implement the JTAG/ISP commands.
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Programming in-circuit using the JTAG/ISP interface
PSD835G2V
20.2
JTAG extensions
TSTAT and TERR are two JTAG extension signals enabled by an JTAG command received over the four standard JTAG signals (TMS, TCK, TDI, and TDO). They are used to speed Program and Erase cycles by indicating status on PSD signals instead of having to scan the status out serially using the standard JTAG channel. See Application Note AN1153. TERR indicates if an error has occurred when erasing a sector or programming a Byte in Flash memory. This signal goes Low (active) when an Error condition occurs, and stays Low until a special JTAG command is executed or a chip Reset (RESET) pulse is received after an "ISC_DISABLE" command. TSTAT behaves the same as Ready/Busy described in Ready/Busy (PE4) on page 31. TSTAT is High when the PSD device is in Read mode (primary and secondary Flash memory contents can be read). TSTAT is Low when Flash memory Program or Erase cycles are in progress, and also when data is being written to the secondary Flash memory. TSTAT and TERR can be configured as open-drain type signals during a JTAG command.
20.3
Security and Flash memory protection
When the security bit is set, the device cannot be read on a Device Programmer or through the JTAG Port. When using the JTAG Port, only a Full Chip Erase command is allowed. All other Program, Erase and Verify commands are blocked. Full Chip Erase returns the part to a non-secured blank state. The Security Bit can be set in PSDsoft. All primary and secondary Flash memory sectors can individually be sector protected against erasures. The sector protect bits can be set in PSDsoft. Table 48. JTAG port signals
JTAG Signals TMS TCK TDI TDO TSTAT TERR Mode Select Clock Serial Data In Serial Data Out Status Error Flag Description
Port E Pin PE0 PE1 PE2 PE3 PE4 PE5
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PSD835G2V
AC/DC parameters
21
AC/DC parameters
The tables provided below describe the AD and DC parameters of the PSD: DC Electrical Specification AC Timing Specification
PLD Timing - - - - Combinatorial Timing Synchronous Clock Mode Asynchronous Clock Mode Input Macrocell Timing Read Timing Write Timing Peripheral Mode Timing Power-down and Reset Timing
MCU Timing - - - -
The following are issues concerning the parameters presented:
In the DC specification the supply current is given for different modes of operation. Before calculating the total power consumption, determine the percentage of time that the PSD is in each mode. Also, the supply power is considerably different if the Turbo bit is 0. The AC power component gives the PLD, Flash memory, and SRAM mA/MHz specification. Figure 33 show the PLD mA/MHz as a function of the number of Product Terms (PT) used. In the PLD timing parameters, add the required delay when Turbo bit is 0.
Figure 33. PLD ICC /frequency consumption
60 VCC = 3V 50
TU ON RBO (100 %)
40 ICC - (mA)
O
30
TU
OF
F
RB
20
TUR
BO
ON (
25%
)
10
TU
0 0
RB
5
O
OF
F
PT 100% PT 25%
10
15
20
25
HIGHEST COMPOSITE FREQUENCY AT PLD INPUTS (MHz)
AI07656
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AC/DC parameters Table 49.
PSD835G2V Example of PSD typical power calculation at VCC = 3.0 V (with Turbo mode on)
Conditions
Highest Composite PLD input frequency (Freq PLD) MCU ALE frequency (Freq ALE) % Flash memory Access % SRAM access % I/O access Operational Modes % Normal % Power-down Mode Number of product terms used (from fitter report) % of total product terms Turbo Mode = 54 PT = 54/217 = 25% = ON Calculation (using typical values) ICC total = Ipwrdown x %pwrdown + %normal x (ICC (ac) + ICC (dc)) = Ipwrdown x %pwrdown + % normal x (%flash x 1.2mA/MHz x Freq ALE + %SRAM x 0.8mA/MHz x Freq ALE + % PLD x 1.1mA/MHz x Freq PLD + #PT x 200A/PT) = 50A x 0.90 + 0.1 x (0.8 x 1.2mA/MHz x 4MHz + 0.15 x 0.8mA/MHz x 4MHz + 1.1mA/MHz x 8MHz + 54 x 0.2mA/PT) = 45A + 0.1 x (3.84 + 0.48 + 8.8 + 10.8) = 45A + 0.1 x 23.92 = 45A + 2.39mA = 2.43mA This is the operating power with no Flash memory Program or Erase cycles in progress. Calculation is based on IOUT = 0mA. = 10% = 90% = 8MHz = 4MHz = 80% = 15% = 5% (no additional power above base)
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PSD835G2V Table 50.
AC/DC parameters Example of PSD typical power calculation at VCC = 3.0 V (with Turbo mode Off)
Conditions Highest Composite PLD input frequency (Freq PLD) MCU ALE frequency (Freq ALE) % Flash memory Access % SRAM access % I/O access Operational Modes % Normal % Power-down Mode Number of product terms used (from fitter report) % of total product terms Turbo Mode = 54 PT = 54/217 = 25% = Off Calculation (using typical values) ICC total = Ipwrdown x %pwrdown + %normal x (ICC (ac) + ICC (dc)) = Ipwrdown x %pwrdown + % normal x (%flash x 1.2mA/MHz x Freq ALE + %SRAM x 0.8mA/MHz x Freq ALE + % PLD x (from graph using Freq PLD)) = 50A x 0.90 + 0.1 x (0.8 x 1.2mA/MHz x 4MHz + 0.15 x 0.8mA/MHz x 4MHz + 15mA) = 45A + 0.1 x (3.84 + 0.48 + 15) = 45A + 0.1 x 18.84 = 45A + 1.94mA = 1.98mA This is the operating power with no Flash memory Program or Erase cycles in progress. Calculation is based on IOUT = 0mA. = 10% = 90% = 8MHz = 4MHz = 80% = 15% = 5% (no additional power above base)
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Maximum rating
PSD835G2V
22
Maximum rating
Stressing the device above the rating listed in the Absolute Maximum Ratings" table may cause permanent damage to the device. These are stress ratings only and operation of the device at these or any other conditions above those indicated in the Operating sections of this specification is not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability. Refer also to the STMicroelectronics SURE Program and other relevant quality documents. Table 51.
Symbol TSTG TLEAD VIO VCC VPP VESD Storage temperature Lead temperature during soldering Input and output voltage (Q = VOH or Hi-Z) Supply voltage Device programmer supply voltage Electrostatic discharge voltage (human body model) (2) -0.6 -0.6 -0.6 -2000
Absolute maximum ratings
Parameter Min. -65 Max. 125 See (1) 4.0 4.0 14.0 2000 Unit C C V V V V
1. Compliant with JEDEC Std J-STD-020C (for small body, Sn-Pb or Pb assembly), the ST ECOPACK(R) 7191395 specification, and the European directive on Restrictions on Hazardous Substances (RoHS) 2002/95/EU 2. JEDEC Std JESD22-A114A (C1=100pF, R1=1500 , R2=500 )
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PSD835G2V
AC and DC parameters
23
AC and DC parameters
This section summarizes the operating and measurement conditions, and the DC and AC characteristics of the device. The parameters in the DC and AC Characteristic tables that follow are derived from tests performed under the Measurement Conditions summarized in the relevant tables. Designers should check that the operating conditions in their circuit match the measurement conditions when relying on the quoted parameters. Table 52.
Symbol VCC TA Supply voltage Ambient operating temperature (industrial) Ambient operating temperature (commercial)
Operating conditions
Parameter Min. 3.0 -40 0 Max. 3.6 85 70 Unit V C C
Table 53.
A C D E G I L N P Q R S T W B M
AC signal letters for PLD timing(1)
Address Input CEout Output Input Data E Input Internal WDOG_ON signal Interrupt Input ALE Input RESET Input or Output Port Signal Output Output Data WR, UDS, LDS, DS, IORD, PSEN Inputs Chip Select Input R/W Input Internal PDN Signal VSTBY Output Output Macrocell
1. Example: tAVLX = Time from Address Valid to ALE Invalid.
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AC and DC parameters Table 54.
t L H V X Z PW
PSD835G2V AC signal behavior symbols for PLD timing(1)
Time Logic Level Low or ALE Logic Level High Valid No Longer a Valid Logic Level Float Pulse Width
1. Example: tAVLX = Time from Address Valid to ALE Invalid.
Table 55.
Symbol CL
AC measurement conditions(1)
Parameter Load capacitance Min. 30 Max. Unit pF
1. Output Hi-Z is defined as the point where data out is no longer driven.
Table 56.
Symbol CIN COUT CVPP
Capacitance(1)
Parameter Input capacitance (for input pins) Output capacitance (for input/output pins) Capacitance (for CNTL2/VPP) Test condition VIN = 0 V VOUT = 0 V VPP = 0 V Typ.(2) 4 8 18 Max. 6 12 25 Unit
pF pF
pF
1. Sampled only, not 100% tested. 2. Typical values are for TA = 25C and nominal supply voltages.
Figure 34. AC measurement I/O waveform
3.0V Test Point 0V
AI03103b
1.5V
Figure 35. AC measurement load circuit
2.01 V
195 Device Under Test
CL = 30 pF (Including Scope and Jig Capacitance)
AI03104b
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PSD835G2V Figure 36. Switching waveforms - key
WAVEFORMS INPUTS
AC and DC parameters
OUTPUTS
STEADY INPUT
STEADY OUTPUT
MAY CHANGE FROM HI TO LO MAY CHANGE FROM LO TO HI
WILL BE CHANGING FROM HI TO LO WILL BE CHANGING LO TO HI
DON'T CARE
CHANGING, STATE UNKNOWN
OUTPUTS ONLY
CENTER LINE IS TRI-STATE
AI03102
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AC and DC parameters Table 57.
Symbol VIH VIL VIH1 VIL1 VHYS VLKO VOL
PSD835G2V
DC characteristics
Parameter Input high voltage Input low voltage Test condition (in addition to those in Table 52. on page 97) 3.0 V < VCC < 3.6 V 3.0 V < VCC < 3.6 V
(1) (1)
Min. 0.7VCC -0.5 0.8VCC -0.5 0.3 1.5
Typ.
Max. VCC +0.5 0.8 VCC +0.5 0.2VCC -0.1
Unit V V V V V
Reset high level input voltage Reset low level input voltage Reset pin hysteresis VCC (min) for Flash Erase and Program Output low voltage Output high voltage except VSTBY on Output high voltage VSTBY on SRAM Standby voltage SRAM Standby current (VSTBY pin) Idle current (VSTBY input) SRAM data retention voltage Standby Supply current for Power-down mode Input leakage current Output leakage current
2.3 0.01 0.15 0.1 0.45
V V V V V V
IOL = 20 A, VCC = 3.0 V IOL = 4, VCC = 3.0 V IOH = -20 A, VCC = 3.0 V IOH = -1, VCC = 3.0 V IOH1 = -1 A 2.9 2.7 VSTBY - 0.8 2.0 VCC = 0 V VCC > VSTBY Only on VSTBY CSI >VCC -0.3 V(2),(3) VSS < VIN < VCC 0.45 < VIN < VCC ZPLD_TURBO = Off, f = 0 MHz(3) -1 -10 -0.1 2
2.99 2.8
VOH VOH1 VSTBY ISTBY IIDLE VDF ISB ILI ILO
VCC 0.5 1 0.1
V A A V
50 0.1 5 0 400 10 0 0
(5)
100 1 10
A A A mA
PLD Only ICC (DC)(4) Operating supply current Flash memory ZPLD_TURBO = On, f = 0MHz During Flash memory Write/Erase Only Read Only, f = 0 MHz SRAM PLD AC base ICC (AC)(4) Flash memory AC adder SRAM AC adder f = 0 MHz 700 25 0 0 A/PT mA mA mA Figure 33 1.5 0.8 2.0 1.5 mA/MHz mA/MHz
1. Reset (Reset) has hysteresis. VIL1 is valid at or below 0.2VCC -0.1. VIH1 is valid at or above 0.8VCC. 2. CSI deselected or internal Power-down mode is active. 3. PLD is in non-Turbo mode, and none of the inputs are switching. 4. IOUT = 0 5. Please see Figure 33. on page 93 for the PLD current calculation.
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PSD835G2V Figure 37. Input to Output Disable / Enable
INPUT
AC and DC parameters
tER INPUT TO OUTPUT ENABLE/DISABLE
tEA
AI02863
Figure 38. Combinatorial Timing - PLD
CPLD INPUT
tPD CPLD OUTPUT
AI07655
Table 58.
Symbol
CPLD combinatorial timing
-90 Parameter CPLD Input Pin/Feedback to CPLD Combinatorial Output CPLD Input to CPLD Output Enable CPLD Input to CPLD Output Disable CPLD Register Clear or Preset Delay CPLD Register Clear or Preset Pulse Width CPLD Array Delay Any macrocell 28 23 Conditions Min Max Min Max -12 PT Turbo Slew Unit Aloc Off rate(1)
tPD
38
43
+4
+ 20
-6
ns
tEA tER tARP tARPW tARD
43 43 38 30
45 45 43
+ 20 + 20 + 20 + 20
-6 -6 -6
ns ns ns ns ns
27
+4
1. Fast Slew Rate output available on Ports C and F.
101/118
AC and DC parameters Table 59.
Symbol
PSD835G2V
CPLD Macrocell Synchronous clock mode timing
-90 Parameter Maximum Frequency External Feedback Conditions Min 1/(tS+tCO) 1/(tS+tCO-10) 1/(tCH+tCL) 18 0 Clock Input Clock Input Clock Input Any macrocell tCH+tCL 22 11 11 23 23 28 Max 24.3 32.2 45.0 23 0 14 14 26 27 +4 -6 Min Max 20.4 25.6 35.7 +4 + 20 -12 PT Aloc Turbo Off Slew rate(1) Unit
MHz MHz MHz ns ns ns ns ns ns ns
fMAX
Maximum Frequency Internal Feedback (fCNT) Maximum Frequency Pipelined Data
tS tH tCH tCL tCO tARD tMIN
Input Setup Time Input Hold Time Clock High Time Clock Low Time Clock to Output Delay CPLD Array Delay Minimum Clock Period (2)
1. Fast Slew Rate output available on Ports C and F. 2. CLKIN (PD1) tCLCL = tCH + tCL.
Table 60.
Symbol
CPLD Macrocell Asynchronous clock mode timing
-90 Parameter Maximum frequency external feedback Conditions Min 1/(tSA+tCOA) Max 23.8 Min Max 20.8 -12 PT Aloc Turbo Off Slew Rate Unit
MHz
fMAXA
Maximum frequency internal feedback (fCNTA) Maximum frequency pipelined data
1/(tSA+tCOA-10)
31.25
26.3
MHz
1/(tCHA+tCLA) 8 10 15 12
38.4 10 12 18 15 34
30.3 +4 + 20
MHz ns ns + 20 + 20 ns ns -6 ns ns ns
tSA tHA tCHA tCLA tCOA tARDA tMINA
Input setup time Input hold time Clock input high time Clock input low time Clock to output delay CPLD array delay Minimum Clock period Any macrocell 1/fCNTA
38 27 38 +4
+ 20
23 32
102/118
PSD835G2V Figure 39. Synchronous Clock mode timing - PLD
tCH tCL
AC and DC parameters
CLKIN
tS INPUT
tH
tCO REGISTERED OUTPUT
AI02860
Figure 40. Asynchronous Reset / Preset
tARPW
RESET/PRESET INPUT tARP REGISTER OUTPUT
AI02864
Figure 41. Asynchronous Clock mode timing (product term clock)
tCHA tCLA
CLOCK
tSA
tHA
INPUT tCOA REGISTERED OUTPUT
AI02859
103/118
AC and DC parameters Figure 42. Input macrocell timing (product term clock)
t INH
PT CLOCK
PSD835G2V
t INL
t IS
INPUT
t IH
OUTPUT
t INO
AI03101
Table 61.
Symbol tIS tIH tINH tINL tINO
Input macrocell timing
-90 Parameter Input setup time Input hold time NIB input high time NIB input low time NIB input to combinatorial delay Conditions Min Max Min Max
(1) (1) (1) (1) (1)
-12
PT Aloc
Turbo Unit Off ns + 20 ns ns ns
0 20 13 12 46
0 23 13 13 62 +4 + 20
ns
1. Inputs from Port A, B, and C relative to register/ latch clock from the PLD. ALE/AS latch timings refer to tAVLX and tLXAX.
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PSD835G2V Figure 43. Read timing
tAVLX ALE /AS tLVLX A /D MULTIPLEXED BUS ADDRESS NON-MULTIPLEXED BUS DATA NON-MULTIPLEXED BUS tSLQV CSI tRLQV tRLRH RD (PSEN, DS) ADDRESS VALID tAVQV ADDRESS VALID tLXAX
AC and DC parameters
1
DATA VALID
DATA VALID
tRHQX
tRHQZ
tEHEL E tTHEH tELTL
R/W
tAVPV ADDRESS OUT
AI02895
1. tAVLX and tLXAX are not required for 80C51XA in Burst Mode.
105/118
AC and DC parameters Table 62.
Symbol tLVLX tAVLX tLXAX tAVQV tSLQV tRLQV tRHQX tRLRH tRHQZ tEHEL tTHEH tELTL tAVPV
PSD835G2V Read timing
-90 Parameter Conditions Min Max Min 24 9 10 90 90
(2) (3) (4) (4) (4)
-12 Max
Turbo Off
Unit ns ns ns
ALE or AS pulse width Address Setup time Address Hold time Address Valid to Data Valid CS Valid to Data Valid RD to Data Valid 8-Bit Bus RD or PSEN to Data Valid 8-Bit Bus, 8031, 80251 RD Data Hold time RD pulse width RD to Data High-Z E pulse width R/W setup time to Enable R/W Hold time after Enable Address input valid to address output delay
(5) (1) (1) (1)
22 7 8
120 120 35 48 0 40
+ 20
ns ns ns ns ns ns
35 45 0 36 38 38 10 0 30 42 16 0
40
ns ns ns ns
35
ns
1. Any input used to select an internal PSD function. 2. RD timing has the same timing as DS signal. 3. RD and PSEN have the same timing for 80C51. 4. RD timing has the same timing as DS and PSEN signals. 5. In multiplexed mode, latched addresses generated from ADIO delay to address output on any Port.
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PSD835G2V Figure 44. Write timing
tAVLX ALE/AS t LVLX A/D MULTIPLEXED BUS ADDRESS VALID tAVWL ADDRESS NON-MULTIPLEXED BUS DATA NON-MULTIPLEXED BUS tSLWL CSI tDVWH WR (DS) t WLWH ADDRESS VALID t LXAX
AC and DC parameters
DATA VALID
DATA VALID
t WHDX t WHAX
t EHEL E t THEH R/ W t WLMV tAVPV ADDRESS OUT t WHPV STANDARD MCU I/O OUT t ELTL
AI02896
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AC and DC parameters Table 63.
Symbol tLVLX tAVLX tLXAX tAVWL tSLWL tDVWH tWHDX tWLWH tWHAX1 tWHAX2 tWHPV tDVMV tAVPV tWLMV
PSD835G2V Write timing
-90 Parameter Conditions Min Max Min 24 9 10 18 18 45 8 45 10 0 33 65 65 30 33 70 68 35 Max ns ns ns ns ns ns ns ns ns ns ns ns ns ns 22
(1) (1) (1),(2) (2) (2) (2),(3) (2) (2)
-12 Unit
ALE or AS pulse width Address Setup time Address Hold time Address Valid to leading edge of WR CS Valid to leading edge of WR WR Data Setup time WR Data Hold time WR pulse width Trailing edge of WR to Address invalid Trailing edge of WR to DPLD Address invalid Trailing edge of WR to port output valid using I/O Port Data Register Data valid to port output valid using Macrocell Register Preset/Clear Address input valid to Address output delay WR valid to port output valid using Macrocell Register Preset/Clear
7 8 15 15 40 5 40 8 0
(2),(4)
(2)
(2),(5)
(6)
(2),(7)
1. Any input used to select an internal PSD function. 2. WR has the same timing as E and DS signals. 3. tWHDX is 11ns when writing to Output Macrocell Registers AB and BC. 4. tWHAX2 is the address hold time for DPLD inputs that are used to generate Sector Select signals for internal PSD memory. 5. Assuming write is active before data becomes valid. 6. In multiplexed mode, latched address generated from ADIO delay to address output on any port. 7. Assuming data is stable before active write signal.
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PSD835G2V Figure 45. Peripheral I/O Read timing
ALE /AS
AC and DC parameters
A /D BUS
ADDRESS
DATA VALID
tAVQV ( PF) tSLQV ( PF) CSI tRLQV ( PF) RD tRLRH ( PF) tQXRH ( PF) tRHQZ ( PF)
tDVQV ( PF) DATA ON PORT F
AI02897b
Table 64.
Symbol tAVQV-PF tSLQV-PF tRLQV-PF tDVQV-PF tQXRH-PF tRLRH-PF tRHQZ-PF
Port F peripheral data mode read timing
-90 Parameter Address Valid to Data Valid CSI Valid to Data Valid RD to Data Valid RD to Data Valid 8031 Mode Data In to Data Out Valid RD Data Hold Time RD Pulse Width RD to Data High-Z
(2) (2) (2),(3)
-12
Conditions Min Max Min Max
(1)
Turbo Off + 20 + 20
Unit ns ns ns ns ns ns ns
50 35 35 45 34 0 35 38 0 36
50 40 40 45 38
40
ns
1. Any input used to select Port F Data Peripheral mode. 2. RD has the same timing as DS and PSEN. 3. Data is already stable on Port F.
109/118
AC and DC parameters Figure 46. Peripheral I/O Write timing
ALE /AS
PSD835G2V
A / D BUS
ADDRESS
DATA OUT
tWLQV WR
(PF)
tWHQZ (PF)
tDVQV (PF) PORT F DATA OUT
AI02898B
Table 65.
Symbol tWLQV-PF tDVQV-PF tWHQZ-PF
Port F peripheral data mode write timing
-90 Parameter WR to data propagation delay Data to Port A data propagation delay WR Invalid to Port A tri-state Conditions Min
(1) (2) (1)
-12 Unit Min Max 43 38 33 ns ns ns
Max 40 35 33
1. WR has the same timing as the E and DS signals. 2. Data stable on ADIO pins to data on Port F.
Table 66.
Symbol
Program, Write and Erase times
Parameter Flash Program Flash Bulk Erase(1) (pre-programmed to 00) Min. Typ. 8.5 3 10 1 2.2 14 100,000 100 30 1200 30 30 Max. Unit s s s s s s cycles s ns
Flash Bulk Erase (not pre-programmed) tWHQV3 tWHQV2 tWHQV1 Sector Erase (pre-programmed) Sector Erase (not pre-programmed to 00) Byte Program Program / Erase Cycles (per Sector) tWHWLO tQ7VQV Sector Erase Time-Out DQ7 Valid to Output (DQ7-DQ0) Valid (Data Polling)(2)
1. Programmed to all zero before erase. 2. The polling status, DQ7, is valid tQ7VQV time units before the data byte, DQ0-DQ7, is valid for reading.
110/118
PSD835G2V Table 67.
Symbol tLVDV tCLWH
AC and DC parameters
Power-down timing
-90 Parameter ALE access time from Power-down Maximum delay from APD Enable to Internal PDN valid signal Using CLKIN (PD1) Conditions Min Max 128 15 * tCLCL(1) Min Max 135 ns s -12 Unit
1. tCLCL is the period of CLKIN (PD1).
Figure 47. Reset (RESET) timing
VCC
VCC(min) tNLNH tNLNH-A Warm Reset
tNLNH-PO Power-On Reset
tOPR
tOPR
RESET
AI02866b
Table 68.
Symbol tNLNH tNLNH-PO tNLNH-A tOPR
Reset (RESET) Timing
Parameter RESET Active low time(1) Power Up Reset Active low time Warm Reset
(2)
Conditions
Min 300 1 25
Max
Unit ns ms s
RESET High to operational device
300
ns
1. Reset (RESET) does not reset Flash memory Program or Erase cycles. 2. Warm reset aborts Flash memory Program or Erase cycles.
Table 69.
Symbol tBVBH tBXBL
VSTBYON timing
Parameter VSTBY detection to VSTBYON output high VSTBY Off detection to VSTBYON output low Conditions
(1) (1)
Min
Typ 20 20
Max
Unit s s
1. VSTBYON timing is measured at VCC ramp rate of 2 ms.
111/118
AC and DC parameters Figure 48. ISC timing
t ISCCH
TCK
PSD835G2V
t ISCCL t ISCPSU t ISCPH
TDI/TMS
t ISCPZV t ISCPCO
ISC OUTPUTS/TDO
t ISCPVZ
ISC OUTPUTS/TDO
AI02865
Table 70.
Symbol
ISC timing
-90 Parameter Clock (TCK, PC1) frequency (except for PLD) Clock (TCK, PC1) high time (except for PLD) Clock (TCK, PC1) low time (except for PLD) Clock (TCK, PC1) frequency (PLD only) Clock (TCK, PC1) high time (PLD only) Clock (TCK, PC1) low time (PLD only) ISC Port Set Up time ISC Port Hold Up time ISC Port Clock to Output ISC Port high-impedance to Valid Output ISC Port Valid Output to High-Impedance Conditions Min Max Min Max 12 40 40 2 240 240 11 5 26 26 26 240 240 12 5 32 32 32 2 MHz ns ns MHz ns ns ns ns ns ns ns -12 Unit
tISCCF tISCCH tISCCL tISCCFP tISCCHP tISCCLP tISCPSU tISCPH tISCPCO tISCPZV tISCPVZ
(1)
15 30 30
(1)
(1) (2) (2) (2)
1. For non-PLD Programming, Erase or in ISC by-pass mode. 2. For Program or Erase PLD only.
112/118
PSD835G2V
Package mechanical
24
Package mechanical
In order to meet environmental requirements, ST offers these devices in ECOPACK(R) packages. These packages have a Lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: http://www.st.com with specific Application Notes covering the main technical aspects related to lead-free conversion (AN2033, AN2034, AN2035 and AN2036). Figure 49. TQFP80 - 80 lead Plastic Quad Flatpack, package outline
D D1 D2 A2
e Ne E2 E1 E b
N 1
Nd L1
A CP
c
QFP-A
A1
L
1. Drawing is not to scale.
113/118
Package mechanical Table 71.
Symbol Typ A A1 A2 b c D D1 D2 E E1 E2 e L L1 CP N Nd Ne 14.000 12.000 9.500 14.000 12.000 9.500 0.500 0.600 1.000 0.080 3.5 0.0 80 20 20 7.0 - - 0.450 - - 0.750 - - 0.220 0.050 0.950 0.170 0.090 Min Max 1.200 0.150 1.050 0.270 0.200 0.5512 0.4724 0.3740 0.5512 0.4724 0.3740 0.0197 0.0236 0.0394 0.0031 3.5 0.0 80 20 20 - - 0.0177 - 0.0087 0.0020 0.0374 0.0067 0.0035 Typ Min
PSD835G2V TQFP80 - 80 lead Plastic Quad Flatpack, package mechanical data
millimeters inches Max 0.0472 0.0059 0.0413 0.0106 0.0079
-
- - 0.0295
7.0
114/118
PSD835G2V
Part numbering
25
Part numbering
Table 72.
Example:
Ordering information scheme
PSD8 3 5 G 2 V - 90 U I T
Device type PSD8 = 8-bit PSD with Register Logic
SRAM size 3 = 64 Kbit
Flash memory size 5 = 4 Mbit (512 Kb x8)
I/O count G = 52 I/O
2nd Flash memory 2 = 256 Kbit (32 Kb x8) Flash memory
Operating voltage V = VCC = 3.0 to 3.6 V Speed 90 = 90 ns 12 = 120 ns
Package U = ECOPACK TQFP80
Temperature range blank = 0 to 70 C (Commercial) I = -40 to 85 C (Industrial)
Shipping option T = Tape & Reel Packing Blank =
For other options, or for more information on any aspect of this device, please contact the ST Sales Office nearest you.
115/118
Pin assignments
PSD835G2V
Appendix A
Table 73.
Pin No. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20
Pin assignments
PSD835G2V TQFP80
Pin No. 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 Pin assignments PG0 PG1 PG2 PG3 PG4 PG5 PG6 PG7 VCC GND PF0 PF1 PF2 PF3 PF4 PF5 PF6 PF7 RESET CNTL2 Pin No. 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 Pin assignments PC0 PC1 PC2 PC3 PC4 PC5 PC6 PC7 GND GND PA0 PA1 PA2 PA3 PA4 PA5 PA6 PA7 CNTL0 CNTL1 Pin No. 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 Pin assignments PB0 PB1 PB2 PB3 PB4 PB5 PB6 PB7 VCC GND PE0 PE1 PE2 PE3 PE4 PE5 PE6 PE7 PD0 PD1
Pin assignments PD2 PD3 AD0 AD1 AD2 AD3 AD4 GND VCC AD5 AD6 AD7 AD8 AD9 AD10 AD11 AD12 AD13 AD14 AD15
116/118
PSD835G2V
Revision history
Revision history
Document revision history
Date 31-May-04 Version 1.0 Changes Document reformatted; split from original with both voltage options Document maturity promoted from Preliminary Data to full Datasheet. TLEAD removed from Table 51: Absolute maximum ratings, Note 1. Added ECOPACK text in Package mechanical on page 113. Document reformatted. Notes modified below Table 24: VM Register.
24-Apr-2007
2
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PSD835G2V
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