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QSB34GR, QSB34ZR, QSB34CGR, QSB34CZR Surface Mount Silicon Pin Photodiode
January 2007
QSB34GR, QSB34ZR, QSB34CGR, QSB34CZR Surface Mount Silicon Pin Photodiode
Features
Daylight Filter (QSB34GR and QSB34ZR only) Surface Mount Packages: Large Chip Size = .014 in2 (9 mm2) High Sensitivity Low Capacitance Available in 0.470" (12mm) width tape on 7" (178mm)
- QSB34GR/QSB34CGR for overmount board - QSB34ZR/QSB34CZR for undermount board Fast PIN Photodiode Wide Reception Angle, 120
diameter reel; 1,000 units per reel
Package Dimensions, QSB34GR
Anode
0.177 (4.50) 0.169 (4.30) 0.067 (1.70) 0.059 (1.50) 0.157 (4.00) 0.150 (3.80) 0.035 (0.90) 0.028 (0.70) .059 (1.50) .059 (1.50) .087 (2.20)
Schematic
ANODE CATHODE
Photosensitive surface
0.007 (0.17) 0.005 (0.13)
0.016 (0.40) 0.008 (0.20)
0.157 (4.00) 0.149 (3.80)
0.047 (1.20)
0.004 (0.10) 0-5 Min
0.264 (6.70) 0.240 (6.10)
Note: 1.Dimensions for all drawings are in inches (mm). 2.Tolerance of .005 (.13) on all non-nominal dimensions unless otherwise specified.
(c)2004 Fairchild Semiconductor Corporation
1
www.fairchildsemi.com
QSB34XR Rev. 1.0.1
QSB34GR, QSB34ZR, QSB34CGR, QSB34CZR Surface Mount Silicon Pin Photodiode
Absolute Maximum Ratings (TA = 25C unless otherwise specified)
Symbol
TOPR TSTG TSOL VR PC
Parameter
Operating Temperature Storage Temperature Soldering Temperature Reverse Voltage Power Dissipation at (or below) 25C Free Air Temperature
Rating
-25 to +85 -40 to +85 260 32 150
Unit
C C C V mW
Note: 1. Soldering time 5 seconds
Electrical/Optical Characteristics (TA =25C unless otherwise specified)
Symbol Parameter
VR IR(D) PK IPH C tr tf 0.5 Reverse Voltage Dark Reverse Current Peak Sensitivity Reception Angle @ 1/2 Power Photo Current Capacitance Rise Time Fall Time Spectral Sensitivity QSB34GR, QSB34ZR QSB34CGR, QSB34CZR Ee = 1.0mW/cm2, VCE = 5V(4) VR = 3V VR = 10V, RL = 50 VR = 10V, RL = 50 730 400 25
Test Conditions
IR = 0.1mA VR = 10V VR = 5V
Min.
32
Typ.
Max.
30
Units
V nA nm A pF ns ns
940 60 37 25 50 50 1100 1100
nm
2 QSB34XR Rev. 1.0.1
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QSB34GR, QSB34ZR, QSB34CGR, QSB34CZR Surface Mount Silicon Pin Photodiode
Typical Performance Curves
Fig. 1 Relative Spectral Sensitivity vs. Wavelength
1.0
RELATIVE SPECTRAL SENSITIVITY
Fig. 2 Short Circuit Current vs. Irradiance
80 ISC - SHORT CIRCUIR CURRENT (A)
QSB34CGR, QSB34CZR
0.8
60
0.6
40
0.4
20
0.2 QSB34GR, QSB34ZR 100 300 500 700
Ta = 25C 900 1100 1300
VR = 5V = 940nm 0 0 0.5 1.0 1.5 Ee - IRRADIANCE (mW/cm2)
0
- WAVELENGTH (nm)
Fig. 3 Capacitance vs. Reverse Voltage
80 f = 1 MHz H = 0mW/cm2 60
IR - DARK CURRENT (nA) CAPACITANCE (pF)
Fig. 4 Dark Current vs. Temperature
1000
100
40
10
20
VR = 10 V Ee = 0mV/cm2 0 0.1 1 10 100 VR - REVERSE VOLTAGE (V) 1 20 40 60 80 TA -TEMPERATURE (C) 100
Fig. 5 Dark Current vs. Reverse Voltage
1200 Ee = 0mV/cm2 1000
IR -DARK CURRENT (pA)
Fig. 6 Response Time vs. Load Resistance
101 VR = 10V TA = 25C 100
800 600 400 200 0 0 2 4 6 8 10 12 14 16 18 20
RESPONSE TIME tr, ff (s)
10-1
10-2
10-3 101
102
103
104
105
VR - REVERSE VOLTAGE (V)
LOAD RESISTANCE RL ()
3 QSB34XR Rev. 1.0.1
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QSB34GR, QSB34ZR, QSB34CGR, QSB34CZR Surface Mount Silicon Pin Photodiode
Package Dimensions, QSB34ZR Package Dimensions
Anode
0.177 (4.50) 0.169 (4.30) 0.067 (1.70) 0.059 (1.50) 0.157 (4.00) 0.150 (3.80) 0.035 (0.90) 0.028 (0.70) .059 (1.50) .059 (1.50) .087 (2.20)
Recommended Solder Screen Pattern (For Reference Only)
7.4 4.3
1.8
0.008 (0.20) 0.004 (0.10)
0.264 (6.70) 0.240 (6.10) 0.043 (1.10) 0.035 (0.90) Photosensitive
1.55 Note: 1. All dimensions in mm 2. Pattern applies to both QSB34GR and QSB34Z
0.004 (0.10)
surface
0-5
0.012 (0.30) 0.047 (1.20)
Note: 1.Dimensions for all drawings are in inches (mm). 2.Tolerance of .005 (.13) on all non-nominal dimensions unless otherwise specified.
Recommend IR Reflow Soldering Profile
1 ~ 5C/sec. 260C Max. 10sec. Max. 1 ~ 5C/sec. Pre-heating 180 ~ 200C 60sec. Max. Above 220C
120sec. Max.
4 QSB34XR Rev. 1.0.1
www.fairchildsemi.com
QSB34GR, QSB34ZR, QSB34CGR, QSB34CZR Surface Mount Silicon Pin Photodiode
Ordering Information
Option
QSB34GR QSB34ZR QSB34CGR QSB34CZR
Description
Gullwing, 1000 units per reel Z-Bend reversed, 1000 units per reel Gullwing, 1000 units per reel Z-Bend reversed, 1000 units per reel
Tape & Reel Dimensions
O130.5
2.5
0 0
.5
13.21.5 16.00.2
O60.20.5
O1781.0
CATHODE
O1.50.1
2.00.05
4.00.10
1.750.10
5.50.05
12 +0.3 -0.1
9
COVER TAPE
4.200.10
O1.500.25
8.00.10
1.450.10
Unit: mm
5 QSB34XR Rev. 1.0.1
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6.900.10
2.5 0.5 0
QSB34GR, QSB34ZR, QSB34CGR, QSB34CZR Surface Mount Silicon Pin Photodiode
FAIRCHILD SEMICONDUCTOR TRADEMARKS
The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks. ACExTM ActiveArrayTM BottomlessTM Build it NowTM CoolFETTM CROSSVOLTTM DOMETM EcoSPARKTM E2CMOSTM EnSignaTM FACT(R) FAST(R) FASTrTM FPSTM FRFETTM FACT Quiet SeriesTM GlobalOptoisolatorTM GTOTM HiSeCTM I2CTM i-LoTM ImpliedDisconnectTM IntelliMAXTM ISOPLANARTM LittleFETTM MICROCOUPLERTM MicroFETTM MicroPakTM MICROWIRETM MSXTM MSXProTM Across the board. Around the world.TM The Power Franchise(R) Programmable Active DroopTM OCXTM OCXProTM OPTOLOGIC(R) OPTOPLANARTM PACMANTM POPTM Power247TM PowerEdgeTM PowerSaverTM PowerTrench(R) QFET(R) QSTM QT OptoelectronicsTM Quiet SeriesTM RapidConfigureTM RapidConnectTM SerDesTM ScalarPumpTM SILENT SWITCHER(R) SMART STARTTM SPMTM StealthTM SuperFETTM SuperSOTTM-3 SuperSOTTM-6 SuperSOTTM-8 SyncFETTM TCMTM TinyBoostTM TinyBuckTM TinyPWMTM TinyPowerTM TinyLogic(R) TINYOPTOTM TruTranslationTM UHC(R) UniFETTM UltraFET(R) VCXTM WireTM
DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION, OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD'S WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY THEREIN, WHICH COVERS THESE PRODUCTS.
LIFE SUPPORT POLICY
FAIRCHILD'S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, or (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. 2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness.
PRODUCT STATUS DEFINITIONS Definition of Terms
Datasheet Identification Advance Information Product Status Formative or In Design Definition This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. This datasheet contains preliminary data, and supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve design. This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve design. This datasheet contains specifications on a product that has been discontinued by Fairchild semiconductor. The datasheet is printed for reference information only.
Rev. I21
Preliminary
First Production
No Identification Needed
Full Production
Obsolete
Not In Production
6 QSB34XR Rev. 1.0.1
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