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CYStech Electronics Corp.
Small Signal Schottky diode
Spec. No. : C302C2-A Issued Date : 2004.02.11 Revised Date : Page No. : 1/3
RB520S-30C2
Description
These devices are designed for high speed switching applications, circuit protection, and voltage clamping. Extremely low forward voltage reduces conduction loss. Miniature surface mount package is excellent for hand held and portable applications where space is limited.
Features
*Extremely small surface mounting type.(SC-79/SOD523) *Extremely fast switching speed *Low reverse current *Extremely low forward voltage.(VF=0.6V max. at 200mA)
Symbol
Outline
Absolute Maximum Ratings
* Maximum Temperatures Storage Temperature Tstg .................................................................................................... -55~+150C Junction Temperature Tj .............................................................................................................. +150C * Maximum Voltages and Currents (Ta=25C) DC Reverse Voltage VR ...................................................................................................................... 30 V Mean Rectifying Current IF ......................................................................................................... 200 mA * Thermal Characteristics Total Device Dissipation @ TA=25C (Note) Thermal Resistance, Junction to Ambient
Note: FR-5 board minimum pad.
PD.......................................................200mW RJA...................................................625C/W
RB520S-30C2
CYStek Product Specification
CYStech Electronics Corp.
Characteristics (Ta=25C)
Characteristic Forward Voltage Reverse Leakage Current Symbol VF IR VR=10V Condition IF=200mA
Spec. No. : C302C2-A Issued Date : 2004.02.11 Revised Date : Page No. : 2/3
Min. -
Max. 600 1
Unit mV A
Characteristic Curves
Forward Current Derating Curve
120 Percentage of Rated Forward Current---(%) 100 80 60 40 20 0 0 25 50 75 100 125 150 175 200 0.1 0 0.1 0.2 0.3 0.4 0.5 0.6 Ambient Temperature---TA() 1000
Forward Current vs Forward Voltage
Forward Current---I F(mA)
M ounting on glass epoxy PCBs
125 100
10
8 5 25
1 - 55
Forward Voltage---VF(V)
Reverse Leakage Current vs Reverse Voltage
Capacitance between terminals---C T(pF) 1000 Reverse Leakage Current---I R(A)
T a= 125
Capacitance vs Reverse Voltage
20 18 16 14 12 10 8 6 4 2 0 0 5 10 15 20 25 30
f=1MHz Ta=25
100 10
T a= 8 5
1 0.1
T a= 25
0.01 0.001 0 10 20 30 Reverse Voltage---VR(V)
Reverse Voltage---VR(V)
RB520S-30C2
CYStek Product Specification
CYStech Electronics Corp.
SOD-523 Dimension
Spec. No. : C302C2-A Issued Date : 2004.02.11 Revised Date : Page No. : 3/3
Marking Code :
1
5J
2
1
2
Style : Pin 1. Cathode 2. Anode 2-lead SOD-523 Plastic Package CYStek Package Code : C2
*: Typical
DIM A bp c D
Material:
Millimeters Min 0.5 0.25 0.1 1.1 .Max. 0.7 0.35 0.2 1.3
DIM E HE V
Millimeters Min. 0.7 1.5 0.15(typ) Max. 0.9 1.7
Notes: 1.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
2.If there is any question with packing specification or packing method, please contact your local CYStek sales office. * Lead: 42 Alloy; solder plating * Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
* All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. * CYStek reserves the right to make changes to its products without notice. * CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. * CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
RB520S-30C2
CYStek Product Specification

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