View RD02MUS2_1300954.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

MITSUBISHI RF POWER MOS FET
ELECTROSTATIC SENSITIVE DEVICE
OBSERVE HANDLING PRECAUTIONS
RD02MUS2
0.2+/-0.05
(0.22) (0.22) (0.25)
RoHS Compliance,Silicon MOSFET Power Transistor 175MHz,520MHz,2W
DESCRIPTION
RD02MUS2 is a MOS FET type transistor specifically designed for VHF/UHF RF po -wer amplifiers applications. This device have an interal monolithic zener diode from gate to source for ESD protection.
OUTLINE
DRAWING
4.6+/-0.05 3.3+/-0.05 0.8+/-0.05
6.0+/-0.15
1
4.9+/-0.15 1.0+/-0.05
2
FEATURES
*High power gain: Pout>2W, Gp>16dB @Vdd=7.2V,f=175MHz,520MHz *High Efficiency:65%typ.(175MHz) *High Efficiency:65%typ.(520MHz) *Integrated gate protection diode
3
(0.25)
INDEX MARK (Gate)
0.2+/-0.05
0.9+/-0.1
Terminal No. 1.Drain (output) 2.Source (GND) 3.Gate (input) Note ( ):center value UNIT:mm
APPLICATION
For output stage of high power amplifiers In VHF/UHF band mobile radio sets.
RoHS COMPLIANT
RD02MUS2-101,T112 is a RoHS compliant products. RoHS compliance is indicate by the letter "G" after the Lot Marking. This product include the lead in high melting temperature type solders. How ever,it applicable to the following exceptions of RoHS Directions. 1.Lead in high melting temperature type solders(i.e.tin-lead solder alloys containing more than85% lead.)
RD02MUS2
MITSUBISHI ELECTRIC 1/9
17 Jan. 2006
3.5+/-0.05
2.0+/-0.05
MITSUBISHI RF POWER MOS FET
ELECTROSTATIC SENSITIVE DEVICE
OBSERVE HANDLING PRECAUTIONS
RD02MUS2
UNIT V V W W A
C C C/W
RoHS Compliance,Silicon MOSFET Power Transistor 175MHz,520MHz,2W
ABSOLUTE MAXIMUM RATINGS (Tc=25C UNLESS OTHERWISE NOTED)
SYMBOL VDSS VGSS Pch Pin ID Tch Tstg Rth j-c PARAMETER Drain to source voltage Gate to source voltage Channel dissipation Input Power Drain Current Junction temperature Storage temperature Thermal resisitance CONDITIONS Vgs=0V Vds=0V Tc=25C Zg=Zl=50 Junction to case RATINGS 30 -5/+10 21.9 0.1 1.5 150 -40 to +125 5.7
SCHEMATIC
DRAWING
Note 1: Above parameters are guaranteed independently.
ELECTRICAL CHARACTERISTICS
SYMBOL IDSS IGSS Vth Pout1 D1 Pout2 D2 PARAMETER
(Tc=25C, UNLESS OTHERWISE NOTED)
CONDITIONS VDS=17V, VGS=0V VGS=10V, VDS=0V VDS=12V, IDS=1mA VDD=7.2V, Pin=50mW, f=175MHz Idq=200mA VDD=7.2V, Pin=50mW, f=520MHz Idq=200mA VDD=9.2V,Po=2W(Pin Control) f=175MHz,Idq=200mA,Zg=50 Load VSWR=20:1(All Phase) VDD=9.2V,Po=2W(Pin Control) f=520MHz,Idq=200mA,Zg=50 Load VSWR=20:1(All Phase) MIN 1 2 55 2 50 LIMITS TYP MAX. 100 1 1.8 3 3 65 3 65 No destroy No destroy UNIT uA uA V W % W % -
Zero gate Voltage drain current Gate to source leak current Gate threshold Voltage Output power Drain efficiency Output power Drain efficiency Load VSWR tolerance
Load VSWR tolerance
Note : Above parameters , ratings , limits and conditions are subject to change.
RD02MUS2
MITSUBISHI ELECTRIC 2/9
17 Jan. 2006
MITSUBISHI RF POWER MOS FET
ELECTROSTATIC SENSITIVE DEVICE
OBSERVE HANDLING PRECAUTIONS
RD02MUS2
RoHS Compliance,Silicon MOSFET Power Transistor 175MHz,520MHz,2W
TYPICAL CHARACTERISTICS
25 CHANNEL DISSIPATION Pch(W) 20 15 10 5 0
DRAIN DISSIPATION VS. AMBIENT TEMPERATURE
*1:The material of the PCB Glass epoxy (t=0.6 mm)
Vgs-Ids CHARACTERISTICS 6 5 4 Ids(A)
Ta=+25C Vds=7.2V
On PCB(*1) with Heat-sink
3 2
On PCB(*1)
1 0
0 40 80 120 160 200 AMBIENT TEMPERATURE Ta(C)
0
2
4 6 Vgs(V)
8
10
Vds-Ids CHARACTERISTICS 5.0 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0.0 0 2 4 6 Vds(V) 8 10
Ta=+25C Vgs=10V Vgs=9V Vgs=8V Vgs=7V Vgs=6V
Vds VS. Ciss CHARACTERISTICS 40
Ta=+25C f=1MHz
30 Ciss(pF) 20 10 0 0 5 10 Vds(V) 15 20
Ids(A)
Vgs=5V
Vgs=4V
Vgs=3V
Vds VS. Coss CHARACTERISTICS 40
Ta=+25C f=1MHz
Vds VS. Crss CHARACTERISTICS 6 5 Crss(pF) 4 3 2 1
Ta=+25C f=1MHz
30 Coss(pF)
20
10 0 0 5 10 Vds(V) 15 20 0 5 10 Vds(V) 15 20
0
RD02MUS2
MITSUBISHI ELECTRIC 3/9
17 Jan. 2006
MITSUBISHI RF POWER MOS FET
ELECTROSTATIC SENSITIVE DEVICE
OBSERVE HANDLING PRECAUTIONS
RD02MUS2
RoHS Compliance,Silicon MOSFET Power Transistor 175MHz,520MHz,2W
TYPICAL CHARACTERISTICS
Pin-Po CHARACTERISTICS @f=175MHz 40 35 Po(dBm) , Gp(dB) , Idd(A) 30 25 20 15 10 5 0 -10 -5 0 5 10 Pin(dBm)
Ta=+25C f=175MHz Vdd=7.2V Idq=200mA Gp Po
Pin-Po CHARACTERISTICS @f=175MHz 100 90 70 60 50 40 30 20 0.0 0 20 40 60 Pin(mW) 80 20 100 Pout(W) , Idd(A) 80 d(%) 3.0
d
4.0
Po
100 80 60 40 d(%) Idd(A)
17 Jan. 2006
2.0 1.0
Idd
Ta=25C f=175MHz Vdd=7.2V Idq=200mA
15
20
Pin-Po CHARACTERISTICS @f=520MHz 40 35 Po(dBm) , Gp(dB) , Idd(A) 30 25 20 15 10 5 0 -10 -5 0 5 10 Pin(dBm)
Ta=+25C f=520MHz Vdd=7.2V Idq=200mA Gp Po
Pin-Po CHARACTERISTICS @f=520MHz 100 90 70 60 50 40 30 20 0.0 0 20 40 60 Pin(mW) 80 20 100 Pout(W) , Idd(A) 80 d(%) 3.0 2.0 1.0
d Ta=25C f=520MHz Vdd=7.2V Idq=200mA
4.0
Po
100 80 60 40 d(%)
Idd
15
20
Vdd-Po CHARACTERISTICS @f=175MHz 7 6 5 Po(W) 4 3 2 1 0 2 4 6 8 Vdd(V) 10 12
Idd Ta=25C f=175MHz Pin=50mW Idq=200mA Zg=ZI=50 ohm Po
Vdd-Po CHARACTERISTICS @f=520MHz 1.4 1.2 1.0 Idd(A) Po(W) 0.8 0.6 0.4 0.2 0.0 7 6 5 4 3 2 1 0 2 4 6 8 Vdd(V) 10 12
Ta=25C f=520MHz Pin=50mW Idq=200mA Zg=ZI=50 ohm Po
1.4 1.2 1.0
Idd
0.8 0.6 0.4 0.2 0.0
RD02MUS2
MITSUBISHI ELECTRIC 4/9
MITSUBISHI RF POWER MOS FET
ELECTROSTATIC SENSITIVE DEVICE
OBSERVE HANDLING PRECAUTIONS
RD02MUS2
RoHS Compliance,Silicon MOSFET Power Transistor 175MHz,520MHz,2W
TYPICAL CHARACTERISTICS
Vgs-Ids CHARACTORISTICS 2 4
Vds=10V Tc=-25~+75C -25C +25C
3 Ids(A),GM(S)
2
+75C
1
0 2 3 4 Vgs(V) 5 6
RD02MUS2
MITSUBISHI ELECTRIC 5/9
17 Jan. 2006
MITSUBISHI RF POWER MOS FET
ELECTROSTATIC SENSITIVE DEVICE
OBSERVE HANDLING PRECAUTIONS
RD02MUS2
RoHS Compliance,Silicon MOSFET Power Transistor 175MHz,520MHz,2W
TEST CIRCUIT(f=175MHz)
Vgg Vdd
C1 19m m
C2 15m m
10uF,50V
4.7kO HM RF-IN 3m m 33m m 6.5m m 12m m L1 39pF 68O HM 240pF
RD02MUS2 R D 02MVS1 175MHz
3m m
10pF
L3 5m m 13.5m m 12m m 5m m RF-O UT L2 62pF 43pF
3m m 11.5m m 10pF
5m m 62pF
L1: Enam eled wire 5Turns,D:0.43m m ,2.46m m O .D L2: Enam eled wire 3Turns,D :0.43m m ,2.46m m O .D L3: Enam eled wire 9Turns,D:0.43m m ,2.46m m O .D C 1,C 2:1000pF,0.0022uF in parallel
Note:Board m aterial-Teflon substrate Micro strip line width=2.2m m /50O HM,er:2.7,t=0.8m m
TEST CIRCUIT(f=520MHz)
V gg Vdd
C1 19m m 19m m
RD02MUS2 R D 02MUS 1
C2
10uF,50V
4.7kO HM 26.5m m 20m m RF-IN 62pF 6pF 43pF 68O HM 2m m 10m m
520MHz 3m m 11m m
L1 4.5m m 40.5m m R F-OUT 62pF 18pF
240pF
L1: Enam eled wire 9Turns,D :0.43m m ,2.46m m O .D C1,C 2:1000pF,0.022uF in parallel
Note:Board m aterial-Teflon substrate Micro strip line width=2.2m m /50OHM,er:2.7,t=0.8m m
RD02MUS2
MITSUBISHI ELECTRIC 6/9
17 Jan. 2006
MITSUBISHI RF POWER MOS FET
ELECTROSTATIC SENSITIVE DEVICE
OBSERVE HANDLING PRECAUTIONS
RD02MUS2
RoHS Compliance,Silicon MOSFET Power Transistor 175MHz,520MHz,2W
INPUT/OUTPUT IMPEDANCE VS. FREQUENCY CHARACTERISTICS
175MHz Zin* Zout* Zo=50
Vdd=7.2V, Idq=200mA(Vgg adj.),Pin=0.05W
Zin*=11.61+j17.88 Zout*=6.83+j5.21
175MHz Zin*
Zin*: Complex conjugate of input impedance Zout*: Complex conjugate of input impedance
175MHz Zout*
520MHz Zin* Zout* Zo=50
Vdd=7.2V, Idq=200mA(Vgg adj.),Pin=0.05W
Zin*=1.20+j5.47 Zout*=5.56+j1.31
520MHz Zin* Zin*: Complex conjugate of input impedance Zout*: Complex conjugate of input impedance 520MHz Zout*
RD02MUS2
MITSUBISHI ELECTRIC 7/9
17 Jan. 2006
MITSUBISHI RF POWER MOS FET
ELECTROSTATIC SENSITIVE DEVICE
OBSERVE HANDLING PRECAUTIONS
RD02MUS2
S12 (mag) 0.038 0.039 0.039 0.040 0.037 0.036 0.036 0.034 0.033 0.032 0.032 0.031 0.028 0.028 0.026 0.024 0.023 0.022 0.019 0.019 0.017 0.016 0.015 (ang) 10.7 1.0 -3.4 -5.7 -12.7 -17.0 -22.1 -26.4 -29.9 -33.6 -34.5 -35.7 -39.1 -41.1 -43.6 -46.5 -49.7 -54.7 -52.1 -54.9 -55.3 -56.1 -54.1 (mag) 0.571 0.561 0.565 0.573 0.586 0.604 0.626 0.646 0.669 0.690 0.697 0.710 0.732 0.745 0.762 0.779 0.788 0.802 0.813 0.823 0.835 0.844 0.853 S22 (ang) -126.8 -139.9 -143.5 -146.3 -149.9 -152.6 -154.8 -156.6 -158.2 -159.6 -160.2 -161.1 -162.5 -163.7 -165.3 -166.5 -167.9 -168.9 -170.0 -171.3 -172.0 -173.1 -173.9
RoHS Compliance,Silicon MOSFET Power Transistor 175MHz,520MHz,2W
RD02MSU2 S-PARAMETER DATA (@Vdd=7.2V, Id=200mA)
Freq. [MHz] 100 150 175 200 250 300 350 400 450 500 520 550 600 650 700 750 800 850 900 950 1000 1050 1100 S11 (mag) 0.827 0.819 0.816 0.813 0.819 0.823 0.832 0.836 0.841 0.851 0.854 0.857 0.864 0.869 0.878 0.882 0.888 0.893 0.894 0.899 0.903 0.907 0.909 (ang) -137.1 -151.1 -155.3 -158.5 -163.4 -166.9 -169.4 -171.5 -173.2 -174.9 -175.5 -176.4 -177.7 -179.1 179.6 178.7 177.6 176.4 175.5 174.7 173.8 172.9 172.1 S21 (mag) (ang) 16.666 99.9 11.358 88.9 9.733 84.7 8.455 81.1 6.704 74.4 5.469 68.6 4.593 63.6 3.904 58.8 3.362 54.3 2.941 50.1 2.793 48.5 2.572 46.2 2.298 42.8 2.041 39.1 1.836 35.8 1.652 32.9 1.490 30.1 1.357 27.1 1.232 24.9 1.131 22.8 1.043 20.2 0.957 18.5 0.882 16.3
RD02MSU2 S-PARAMETER DATA (@Vdd=12.5V, Id=200mA)
Freq. [MHz] 100 150 175 200 250 300 350 400 450 500 520 550 600 650 700 750 800 850 900 950 1000 1050 1100 S11 (mag) 0.844 0.832 0.829 0.830 0.832 0.836 0.841 0.849 0.853 0.861 0.859 0.865 0.869 0.877 0.881 0.890 0.894 0.897 0.902 0.905 0.910 0.913 0.914 (ang) -132.5 -147.7 -152.5 -156.2 -161.5 -165.3 -168.3 -170.6 -172.8 -174.6 -175.3 -176.1 -177.5 -178.9 179.9 178.9 177.9 176.6 175.7 174.7 174.0 173.1 172.4 S21 (mag) (ang) 17.379 102.5 11.947 91.0 10.288 86.5 8.975 82.5 7.098 75.9 5.821 70.1 4.863 64.7 4.167 59.9 3.597 55.1 3.139 50.9 2.965 49.2 2.759 46.9 2.440 43.3 2.179 39.7 1.958 36.7 1.772 33.5 1.597 30.8 1.448 28.2 1.331 25.4 1.212 23.3 1.110 20.8 1.026 18.8 0.953 16.7 S12 (mag) 0.037 0.037 0.037 0.037 0.037 0.036 0.034 0.034 0.032 0.030 0.030 0.028 0.028 0.026 0.024 0.023 0.022 0.020 0.018 0.018 0.017 0.015 0.014 (ang) 12.8 2.1 -1.8 -4.7 -12.5 -17.0 -21.0 -25.3 -28.8 -31.6 -34.7 -35.4 -39.0 -41.6 -43.3 -46.6 -47.9 -48.2 -48.2 -50.7 -52.3 -55.2 -56.5 (mag) 0.541 0.533 0.538 0.541 0.559 0.578 0.601 0.624 0.648 0.669 0.677 0.691 0.710 0.729 0.745 0.765 0.777 0.790 0.800 0.814 0.825 0.834 0.843 S22 (ang) -122.6 -136.2 -140.2 -143.1 -147.2 -149.8 -151.9 -153.9 -155.3 -156.9 -157.6 -158.3 -159.9 -161.4 -162.9 -164.2 -165.4 -166.8 -167.9 -169.2 -170.3 -171.4 -172.1
RD02MUS2
MITSUBISHI ELECTRIC 8/9
17 Jan. 2006
MITSUBISHI RF POWER MOS FET
ELECTROSTATIC SENSITIVE DEVICE
OBSERVE HANDLING PRECAUTIONS
RD02MUS2
RoHS Compliance,Silicon MOSFET Power Transistor 175MHz,520MHz,2W
Keep safety first in your circuit designs! Mitsubishi Electric Corporation puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage. Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of non-flammable material or (iii) prevention against any malfunction or mishap.
warning ! Do not use the device at the exceeded the maximum rating condition. In case of plastic molded devices, the exceeded maximum rating condition may cause blowout, smoldering or catch fire of the molding resin due to extreme short current flow between the drain and the source of the device. These results causes in fire or injury.
RD02MUS2
MITSUBISHI ELECTRIC 9/9
17 Jan. 2006

▲Up To Search▲

Price & Availability of RD02MUS2

	To Download RD02MUS2 Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .