 |
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
| Datasheet File OCR Text: |
| PD- 93795B SI3443DV HEXFET(R) Power MOSFET l l l l l Ultra Low On-Resistance P-Channel MOSFET Surface Mount Available in Tape & Reel -2.5V Rated D 1 6 A D VDSS = -20V D 2 5 D G 3 4 S RDS(on) = 0.065 Top View Description These P-channel MOSFETs from International Rectifier utilize advanced processing techniques to achieve the extremely low on-resistance per silicon area. This benefit provides the designer with an extremely efficient device for use in battery and load management applications. The TSOP-6 package with its customized leadframe produces a HEXFET(R) power MOSFET with RDS(on) 60% less than a similar size SOT-23. This package is ideal for applications where printed circuit board space is at a premium. It's unique thermal design and RDS(on) reduction enables a current-handling increase of nearly 300% compared to the SOT-23. TSOP-6 Absolute Maximum Ratings Parameter VDS ID @ TA = 25C ID @ TA= 70C IDM PD @TA = 25C PD @TA = 70C EAS VGS TJ, TSTG Drain- Source Voltage Continuous Drain Current, VGS @ -4.5V Continuous Drain Current, VGS @ -4.5V Pulsed Drain Current Power Dissipation Power Dissipation Linear Derating Factor Single Pulse Avalanche Energy Gate-to-Source Voltage Junction and Storage Temperature Range Max. -20 -4.4 -3.5 -20 2.0 1.3 0.016 31 12 -55 to + 150 Units V A W W/C mJ V C Thermal Resistance Parameter RJA Maximum Junction-to-Ambient Max. 62.5 Units C/W www.irf.com 1 01/13/03 SI3443DV Electrical Characteristics @ TJ = 25C (unless otherwise specified) V(BR)DSS V(BR)DSS/TJ Parameter Drain-to-Source Breakdown Voltage Breakdown Voltage Temp. Coefficient Static Drain-to-Source On-Resistance Gate Threshold Voltage Forward Transconductance Drain-to-Source Leakage Current Gate-to-Source Forward Leakage Gate-to-Source Reverse Leakage Total Gate Charge Gate-to-Source Charge Gate-to-Drain ("Miller") Charge Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Input Capacitance Output Capacitance Reverse Transfer Capacitance RDS(on) VGS(th) gfs IDSS IGSS Qg Qgs Qgd td(on) tr td(off) tf Ciss Coss Crss Min. -20 --- --- --- --- -0.60 --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- Typ. Max. Units Conditions --- --- V VGS = 0V, ID = -250A -0.005 --- V/C Reference to 25C, ID = -1mA 0.034 0.065 VGS = -4.5V, I D = -4.4A 0.053 0.090 VGS = -2.7V, I D = -3.7A 0.060 0.100 VGS = -2.5V, I D = -3.5A --- -1.2 V VDS = VGS, ID = -250A 12 --- S VDS = -10V, ID = -4.4 A --- -1.0 VDS = -20V, VGS = 0V A --- -5.0 VDS = -20V, VGS = 0V, TJ = 70C --- -100 VGS = -12V nA --- 100 VGS = 12V 11 15 ID = -4.4A 2.2 --- nC VDS = -10V 2.9 --- VGS = -4.5V 12 50 VDD = -10V, VGS = -4.5V 33 60 ID = -1.0A ns 70 100 RG = 6.0 72 100 RD = 10 , 1079 --- VGS = 0V 220 --- pF VDS = -10V 152 --- = 1.0MHz Source-Drain Ratings and Characteristics IS ISM VSD trr Qrr Parameter Continuous Source Current (Body Diode) Pulsed Source Current (Body Diode) Diode Forward Voltage Reverse Recovery Time Reverse Recovery Charge Min. Typ. Max. Units --- --- --- --- 51 30 -2.0 A -20 -1.2 77 44 V ns nC Conditions MOSFET symbol showing the G integral reverse p-n junction diode. TJ = 25C, IS = -1.7A, VGS = 0V TJ = 25C, I F = -1.7A di/dt = -100A/s D S Notes: Repetitive rating; pulse width limited by max. junction temperature. Surface mounted on FR-4 board, t 5sec. Starting TJ = 25C, L = 6.8mH RG = 25, IAS = -3.0A. Pulse width 300s; duty cycle 2%. 2 www.irf.com SI3443DV 100 VGS -7.50V -5.00V -4.00V -3.50V -3.00V -2.50V -2.00V BOTTOM -1.50V TOP 100 -I D , Drain-to-Source Current (A) 10 -I D , Drain-to-Source Current (A) VGS -7.50V -5.00V -4.00V -3.50V -3.00V -2.50V -2.00V BOTTOM -1.50V TOP 10 1 1 -1.50V -1.50V 20s PULSE WIDTH TJ = 25 C 1 10 100 0.1 0.1 0.1 0.1 20s PULSE WIDTH TJ = 150 C 1 10 100 -VDS , Drain-to-Source Voltage (V) -VDS , Drain-to-Source Voltage (V) Fig 1. Typical Output Characteristics Fig 2. Typical Output Characteristics 100 2.0 TJ = 25 C 10 RDS(on) , Drain-to-Source On Resistance (Normalized) ID = -5.6A -I D , Drain-to-Source Current (A) 1.5 TJ = 150 C 1.0 1 0.5 0.1 1.5 V DS = -15V 20s PULSE WIDTH 2.0 2.5 3.0 3.5 0.0 -60 -40 -20 VGS = -4.5V 0 20 40 60 80 100 120 140 160 -VGS , Gate-to-Source Voltage (V) TJ , Junction Temperature ( C) Fig 3. Typical Transfer Characteristics Fig 4. Normalized On-Resistance Vs. Temperature www.irf.com 3 SI3443DV 1600 -VGS , Gate-to-Source Voltage (V) VGS = 0V, f = 1MHz Ciss = Cgs + Cgd , Cds SHORTED Crss = Cgd Coss = Cds + Cgd 15 ID = -4.5A 12 C, Capacitance (pF) 1200 Ciss VDS =-10V 9 800 6 400 Coss Crss 0 1 10 100 3 0 0 4 8 12 16 20 24 -VDS , Drain-to-Source Voltage (V) QG , Total Gate Charge (nC) Fig 5. Typical Capacitance Vs. Drain-to-Source Voltage Fig 6. Typical Gate Charge Vs. Gate-to-Source Voltage 100 1000 -ISD , Reverse Drain Current (A) OPERATION IN THIS AREA LIMITED BY RDS(on) 10 -ID , Drain Current (A) I 100 10us 10 100us 1ms 1 10ms TJ = 150 C TJ = 25 C 1 0.1 0.0 V GS = 0 V 0.4 0.8 1.2 1.6 2.0 2.4 0.1 0.1 TC = 25 C TJ = 150 C Single Pulse 1 10 100 -VSD ,Source-to-Drain Voltage (V) -VDS , Drain-to-Source Voltage (V) Fig 7. Typical Source-Drain Diode Forward Voltage Fig 8. Maximum Safe Operating Area 4 www.irf.com SI3443DV 5.0 EAS , Single Pulse Avalanche Energy (mJ) 80 4.0 ID -1.3A -2.4A BOTTOM -3.0A TOP -ID , Drain Current (A) 60 3.0 40 2.0 20 1.0 0.0 0 25 50 75 100 125 150 25 50 75 100 125 150 TC , Case Temperature ( C) Starting TJ , Junction Temperature ( C) Fig 9. Maximum Drain Current Vs. Case Temperature Fig 10. Maximum Avalanche Energy Vs. Drain Current 100 D = 0.50 Thermal Response (Z thJA ) 0.20 10 0.10 0.05 0.02 1 0.01 t1 SINGLE PULSE (THERMAL RESPONSE) Notes: 1. Duty factor D = t 1 / t 2 2. Peak T J = P DM x Z thJA + TA 0.0001 0.001 0.01 0.1 1 10 100 t2 PDM 0.1 0.00001 t1 , Rectangular Pulse Duration (sec) Fig 11. Maximum Effective Transient Thermal Impedance, Junction-to-Ambient www.irf.com 5 Package Outline TSOP-6 SI3443DV Part Marking Information TSOP-6 @Y6HQG@)AUCDTADTA6IATD"##"9W Q6SUAIVH7@S UPQ X6A@SAGPU IVH7@SA8P9@ 7PUUPH Q6SUAIVH7@SA8P9@AS@A@S@I8@) "6A2ATD"##"9W "7A2ADSA$' "8A2ADSA$'$ "9A2ADSA$'$ "@A2ADSA$'$! "DA2ADSA$'$ "EA2ADSA$'% 96U@A8P9@A@Y6HQG@T) XXA2A(%"A2A%8 XXA2A(%"!A2AAA 96U@ 8P9@ Ir)AUuvAhAhxvtAvshvAhyvrAAqrvprAqprqAirsrA!!%! XXA2A !%ADAAQS@8@9@9A7AG6TUA9DBDUAPAA86G@I96SA@6S XPSF @6S X@@F X ! 6 !! ! ! 7 !" " " 8 !# # # 9 !$ $ ((% % ((& & ((' ' ((( ( !# Y ! !$ !% a XXA2A!&$!ADAAQS@8@9@9A7A6AG@UU@S XPSF @6S X@@F X ! 6 !& 6 !! 7 !' 7 !" 8 !( 8 !# 9 " 9 !$ @ ((% A ((& B ((' C ((( E ! F $ Y $ Ir)AUuvAhAhxvtAvshvAhyvrAAqrvprAqprqAhsrA!!%! XA2A !%ADAAQS@8@9@9A7AG6TUA9DBDUAPAA86G@I96SA@6S @6S ! !! !" !# !$ ((% ((& ((' ((( ! ! " # $ % & ' ( XPSF X@@F ! " # X 6 7 8 9 A2A@6S XA2AX@@F Q6SUAIVH7@S UPQ GPU 8P9@ !# !$ !% Y a Q6SUAIVH7@SA8P9@AS@A@S@I8@) 6A2ATD"##"9W 7A2ADSA$' 8A2ADSA$'$ 9A2ADSA$'$ @A2ADSA$'$! DA2ADSA$'$ EA2ADSA$'% FA2ADSA$' GA2ADSA$'# HA2ADSA$'" IA2ADSA$'! XA2A!&$!ADAAQS@8@9@9A7A6AG@UU@S @6S ! !! !" !# !$ ((% ((& ((' ((( ! 6 7 8 9 @ A B C E F XPSF X@@F !& !' !( " X 6 7 8 9 $ $ Y 6 www.irf.com SI3443DV Tape & Reel Information TSOP-6 IR WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105 TAC Fax: (310) 252-7903 Visit us at www.irf.com for sales contact information. 01/03 www.irf.com 7 |
Price & Availability of SI3443DV
 |
|
|
|
|
All Rights Reserved © IC-ON-LINE 2003 - 2022 |
| [Add Bookmark] [Contact Us] [Link exchange] [Privacy policy] |
|
Mirror Sites : [www.datasheet.hk]
[www.maxim4u.com] [www.ic-on-line.cn]
[www.ic-on-line.com] [www.ic-on-line.net]
[www.alldatasheet.com.cn]
[www.gdcy.com]
[www.gdcy.net] |