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 Si3456BDV
Vishay Siliconix
N-Channel 30-V (D-S) MOSFET
PRODUCT SUMMARY
VDS (V)
30
FEATURES
ID (A)
6.0 4.9
rDS(on) (W)
0.035 @ VGS = 10 V 0.052 @ VGS = 4.5 V
D TrenchFETr Power MOSFET D 100% Rg Tested
TSOP-6 Top View
1 3 mm 6 5
(1, 2, 5, 6) D
2
(3) G
3
4
2.85 mm Ordering Information: Si3456BDV-T1--E3 Marking Code: 6Bxxx
(4) S N-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS (TA = 25_C UNLESS OTHERWISE NOTED)
Parameter
Drain-Source Voltage Gate-Source Voltage Continuous Drain Current (TJ = 150_C)a Pulsed Drain Current Continuous Source Current (Diode Conduction)a Maximum Power Dissipationa Operating Junction and Storage Temperature Range TA = 25_C TA = 70_C TA = 25_C TA = 70_C
Symbol
VDS VGS ID IDM IS PD TJ, Tstg
5 secs
30 "20 6.0 4.8 "30 1.7 2.0 1.3
Steady State
Unit
V
4.5 3.6 A
0.9 1.1 0.7 -55 to 150 W _C
THERMAL RESISTANCE RATINGS
Parameter
Maximum J Mi Junction-to-Ambienta ti t A bi t Maximum Junction-to-Foot (Drain) Notes a. Surface Mounted on 1" x 1" FR4 Board. Document Number: 72544 S-404024--Rev. C, 15-Mar-04 www.vishay.com t v 5 sec Steady State Steady State
Symbol
RthJA RthJF
Typical
55 92 28
Maximum
62.5 110 40
Unit
_C/W C/W
1
Si3456BDV
Vishay Siliconix
SPECIFICATIONS (TJ = 25_C UNLESS OTHERWISE NOTED)
Parameter Static
Gate Threshold Voltage Gate-Body Leakage Zero Gate Voltage Drain Current On-State Drain Currenta Drain-Source On-State Resistancea Forward Transconductancea Diode Forward Voltagea VGS(th) IGSS IDSS ID(on) rDS(on) gfs VSD VDS = VGS, ID = 250 mA VDS = 0 V, VGS = "20 V VDS = 30 V, VGS = 0 V VDS = 30 V, VGS = 0 V, TJ = 55_C VDS w 5 V, VGS = 10 V VGS = 10 V, ID = 6 A VGS = 4.5 V, ID = 4.9 A VDS = 15 V, ID = 6 A IS = 1.7 A, VGS = 0 V 30 0.028 0.041 12 0.8 1.2 0.035 0.052 1.0 3.0 "100 1 5 V nA mA A W S V
Symbol
Test Condition
Min
Typ
Max
Unit
Dynamicb
Total Gate Charge Gate-Source Charge Gate-Drain Charge Gate Resistance Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Source-Drain Reverse Recovery Time Qg Qgs Qgd Rg td(on) tr td(off) tf trr IF = 1.7 A, di/dt = 100 A/ms VDD = 15 V, RL = 15 W ID ^ 1 A, VGEN = 10 V, Rg = 6 W f = 1 MHz 1.4 VDS = 15 V, VGS = 10 V, ID = 6 A 8.6 1.8 1.5 2.8 10 15 25 10 20 4.8 15 25 40 15 40 ns W 13 nC
Notes a. Pulse test; pulse width v 300 ms, duty cycle v 2%. b. Guaranteed by design, not subject to production testing.
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Output Characteristics
40 35 30 I D - Drain Current (A) 25 20 15 10 5 0 0 1 2 3 4 5 VDS - Drain-to-Source Voltage (V) www.vishay.com 3V 4V I D - Drain Current (A) VGS = 10 thru 6 V 5V 40 35 30 25 20 15 10 5 0 0 1
Transfer Characteristics
TC = -55_C 25_C
125_C
2
3
4
5
6
VGS - Gate-to-Source Voltage (V) Document Number: 72544 S-404024--Rev. C, 15-Mar-04
2
Si3456BDV
Vishay Siliconix
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
On-Resistance vs. Drain Current
0.10 r DS(on) - On-Resistance ( W ) 800 700 C - Capacitance (pF) 0.08 600 500 400 300 200 100 0.00 0 5 10 15 20 25 30 35 40 0 0 5 10 15 20 25 30 Crss Coss Ciss
Capacitance
0.06 VGS = 4.5 V 0.04 VGS = 10 V
0.02
ID - Drain Current (A)
VDS - Drain-to-Source Voltage (V)
Gate Charge
10 V GS - Gate-to-Source Voltage (V) VDS = 15 V ID = 6 A 8 rDS(on) - On-Resiistance (Normalized) 1.4 1.6
On-Resistance vs. Junction Temperature
VGS = 10 V ID = 6 A
6
1.2
4
1.0
2
0.8
0 0 2 4 6 8 10 Qg - Total Gate Charge (nC)
0.6 -50
-25
0
25
50
75
100
125
150
TJ - Junction Temperature (_C)
Source-Drain Diode Forward Voltage
40 0.10
On-Resistance vs. Gate-to-Source Voltage
I S - Source Current (A)
TJ = 150_C 10
r DS(on) - On-Resistance ( W )
0.08
0.06 ID = 6 A 0.04
TJ = 25_C
0.02
1 0.0
0.00 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 0 2 4 6 8 10 VSD - Source-to-Drain Voltage (V) VGS - Gate-to-Source Voltage (V)
Document Number: 72544 S-404024--Rev. C, 15-Mar-04
www.vishay.com
3
Si3456BDV
Vishay Siliconix
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Threshold Voltage
0.4 0.2 V GS(th) Variance (V) ID = 250 mA -0.0 -0.2 -0.4 -0.6 -0.8 -50 10 Power (W) 30 50
Single Pulse Power
40
20
-25
0
25
50
75
100
125
150
0 10-3
10-2
10-1
1
10
100
600
TJ - Temperature (_C)
Time (sec)
100
Safe Operating Area
rDS(on) Limited IDM Limited
10 I D - Drain Current (A)
P(t) = 0.0001
1
ID(on) Limited TA = 25_C Single Pulse BVDSS Limited
P(t) = 0.001 P(t) = 0.01 P(t) = 0.1 P(t) = 1 P(t) = 10 dc
0.1
0.01 0.1 1 10 100 VDS - Drain-to-Source Voltage (V)
Normalized Thermal Transient Impedance, Junction-to-Ambient
2 1
Normalized Effective Transient Thermal Impedance
Duty Cycle = 0.5
0.2 0.1 0.1 0.05 0.02 Single Pulse 0.01 10-4 10-3 10-2 1 Square Wave Pulse Duration (sec) 10-1
Notes: PDM t1
t2 1. Duty Cycle, D =
2. Per Unit Base = RthJA = 92_C/W 3. TJM - TA = PDMZthJA(t) 4. Surface Mounted
t1 t2
10
100
600
www.vishay.com
4
Document Number: 72544 S-404024--Rev. C, 15-Mar-04
Si3456BDV
Vishay Siliconix
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Normalized Thermal Transient Impedance, Junction-to-Foot
2 1
Normalized Effective Transient Thermal Impedance
Duty Cycle = 0.5
0.2 0.1 0.1 0.05 0.02
Single Pulse 0.01 10-4 10-3 10-2 10-1 Square Wave Pulse Duration (sec) 1 10
Document Number: 72544 S-404024--Rev. C, 15-Mar-04
www.vishay.com
5


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