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| PDF: 2003 Feb 18 Philips Semiconductors Package outline DIP28: plastic dual in-line package; 28 leads (600 mil) SOT117-1 seating plane D ME A2 A L A1 c Z e b1 b 28 15 MH wM (e 1) pin 1 index E 1 14 0 5 scale 10 mm DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches Note 1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included. OUTLINE VERSION SOT117-1 REFERENCES IEC 051G05 JEDEC MO-015 JEITA SC-510-28 EUROPEAN PROJECTION A max. 5.1 0.2 A1 min. 0.51 0.02 A2 max. 4 0.16 b 1.7 1.3 0.066 0.051 b1 0.53 0.38 0.020 0.014 c 0.32 0.23 0.013 0.009 D (1) 36 35 1.41 1.34 E (1) 14.1 13.7 0.56 0.54 e 2.54 0.1 e1 15.24 0.6 L 3.9 3.4 0.15 0.13 ME 15.80 15.24 0.62 0.60 MH 17.15 15.90 0.68 0.63 w 0.25 0.01 Z (1) max. 1.7 0.067 ISSUE DATE 99-12-27 03-02-13 |
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