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TB2905HQ
TOSHIBA Bi-CMOS Digital Integrated Circuit Silicon Monolithic
TB2905HQ
Class KB High-Efficiency, Low-Frequency Power Amplifier IC Maximum Power: 47 W x 4 Channels
The TB2905HQ is a high-efficiency class KB power amplifier IC developed for car audio applications that incorporates four BTL amplifier channels. It employs a pure complementary DMOS output stage consisting of P-ch upper and N-ch lower sections, offering a maximum output power (POUT) of 47 W. Class KB (keyed BTL) amplifiers exhibit less than half the heat generation of comparable class AB solutions under normal operating conditions. Therefore, it is possible to design a smaller Weight: 7.7 g (typ.) heatsink and maintain lower internal temperature in the car audio sets. Additionally, the TB2905HQ has many built-in functions for car audio, such as standby switching, muting, protective circuits, and self diagnosis.
Features
* High output power : POUT MAX (1) = 47 W (typ.) (VCC = 14.4 V, f = 1 kHz, JEITA max, RL = 4 ) : POUT MAX (2) = 43 W (typ.) (VCC = 13.7 V, f = 1 kHz, JEITA max, RL = 4 ) : POUT Pout MAX (3) = 80 W (typ.) (VCC = 14.4V, f = 1 kHz, JEITA max, RL = 2 ) : POUT (1) = 29 W (typ.) (VCC = 14.4 V, f = 1 kHz, THD = 10%, RL = 4 ) : POUT (2) = 25 W (typ.) (VCC = 13.2 V, f = 1 kHz, THD = 10%, RL = 4 ) : POUT (3) = 55 W (typ.) (VCC = 14.4 V, f = 1 kHz, THD = 10%,RL = 2 ) Low distortion ratio : THD = 0.03% (typ.) (VCC = 13.2 V, f = 1 kHz, GV = 26dB, POUT = 2 W, RL = 4 ) Low noise : VNO = 120 Vrms (typ.) (VCC = 13.2 V, GV = 26dB, Rg = 0 , BW = 20 Hz~20 kHz, RL = 4 ) Built-in standby (pin 4) and muting (pin22) functions Built-in offset/clipping detection (pin 25) Protective circuits: Thermal shutdown, overvoltage, out to GND, out to VCC, out to out short Operating supply voltage: VCC (opr) = 9 to 18 V (RL = 4 ) Note 1: Some pins of this product are sensitive to electrostatic discharge. When handling this product, ensure that the environment is protected against electrostatic discharge. Note 2: Install the product correctly. Otherwise, the product or connected equipment may get damaged or degrade. Note 3: These protective features are intended to temporarily prevent an output short circuit or other abnormal conditions from occurring. Toshiba does not guarantee that they prevent the IC from being damaged. If the product is operating outside any of the guaranteed operating ranges, these protective features may not operate and an output short circuit may result in the IC being damaged.
*
*
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Block Diagram
+B C2 C5 10 Ripple 1 TAB 6 VCC2 20 VCC1 OUT1 (+) C1 11 IN1 PW-GND1 8 OUT1 (-) 7 RL = 4 ohm 9 C3 RL = 4 ohm RL = 4 ohm RL = 4 ohm R1 LPF
OUT2 (+) C1 12 IN2
5
PW-GND2 2 OUT2 (-) 3
STBY 4
OUT3 (+) C1 15 IN3
17
PW-GND3 18 OUT3 (-) 19
13 OUT4 (+) C1 14 IN4 PW-GND4 24 OUT4 (-) MUTE 16 AC-GND Offset/Clip Det 25 23 22 21
Some of the functional blocks, circuits, or constants in the block diagram may be omitted or simplified for explanatory purpose.
C6
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Operational Description (Each description applies to a single channel)
1. Voltage Gain
The TB2905HQ has no NF (negative feedback) pins. Therefore, the voltage gain (GV) is determined within the IC.
Amplifier 2A Amplifier 1 Input
Amplifier 2B
Figure 1
Amplifier Configuration
Voltage gain of amplifier 1: GV1 = 0 dB Voltage gain of amplifiers 2A and 2B: GV2 = 20 dB Voltage gain obtained by BTL connection: GV (BTL) = 6 dB Therefore, the total voltage gain is determined by the following expression: GV = GV1 + GV2 + GV (BTL) = 0 + 20 + 6 = 26dB Although this configuration without an NF pin does not allow the user to adjust voltage gain, it eliminates the need for an NF capacitor, resulting in lower total application cost and smaller mounting space.
2. Standby Switching Function (Pin 4)
The TB2905HQ can be powered up or down by controlling the state of pin 4 (standby pin). The threshold voltage for pin 4 is approximately 3 VBE (typ.). The supply current in standby state is approximately 2 A (typ.).
VCC ON OFF Power 4 10 k 2 VBE To bias cutoff circuit
Pin 4 control voltage: VSB
Stand-by ON OFF Power OFF ON VSB (V) 0~0.5 2.5~6 V
Figure 2 Driving pin 4 high powers up the TB2905HQ
When changing the time constant for pin 4, check the pop noise produced.
< Advantages of standby switching >
(1) (2) The microcontroller can directly turn VCC on or off without using a switching relay. Since the control current is microscopic, a switching relay with small current capacity is satisfactory for switching.
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Large-current capacity switch Battery Relay Battery
VCC
VCC - Conventional method -
From microcontroller
Small-current capacity switch Battery
From microcontroller Battery
Stand-By VCC
Stand-By VCC - Standby switching -
Figure 3
3. Muting Function (Pin 22)
Standby switching
Driving pin 22 low triggers audio muting. The time constant for muting is determined from R1 and C4. Select the constants considering the pop noise that is produced when powering the TB2905HQ on/off or turning muting on/off. (See Figures 4 and 5.) Pin 22 is designed to be controlled at 3.3 V. The pin functions as a current source switch for the internal muting circuit and is designed so that its discharging current is 200 A. The value of the external pull-up resistor is based on this current. Example: When changing the control voltage from 3.3 V to 5 V, 5 V/3.3 V x 47 k = 71 k The TB2905HQ internally triggers muting when the voltage is dropped, taking in a current of 200 A. It cannot take in the current if the pull-up resistance is too low. The series resistance (R1) for pin 22 must, therefore, be at least 47 k.
ATT - VMUTE
20 0 -20 -40 -60 -80 -100 -120 0 0.5 1 1.5 2 2.5 3 Vcc = 13.2 V f = 1kHz RL = 4 VOUT = 20dBm
3.3u 1 k Muting ON/OFF control
R1
22 C4
Muting attenuation ATT (dB)
Muting pin voltage: VMUTE
(V)
Figure 4
Muting function
Figure 5
Muting attenuation - VMUTE (V)
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4. Offset Detection Function
Pin 25 can be used to detect an offset voltage that may appear on an output pin due to input capacitor leakage or other reasons.
V Output DC voltage (+) (for RS1) VCC/2 (normal DC voltage) Vref Electrical volume Vref/2 Capacitor leakage or short-circuit RS1 RS2 + 5V L.P.F. smoothing circuit To microcontroller The microcontroller shuts down the system if the output is lower than the specified voltage. Output DC voltage (-) (for RS2) Output offset voltage (upon input capacitor leakage or short-circuit) - Vbias 25 A
B
Figure 6
Example application and detection mechanism
Output DC voltage (+)
Offset detection threshold (RS1 detection) VCC/2 (normal DC voltage) Offset detection threshold (RS2 detection)
GND Time
Voltage at point A (output of pin 25)
GND Time
Voltage at point B (LPF output)
GND RS2 Time
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5. Output Clipping Detection Function (Pin 25)
Pin 25 has open-collector output (active low) structure, as shown in Figure 7. If the output waveform is clipped, the clipping detection circuit in the IC activates and turns the Q1 NPN transistor on. The microcontroller can use this signal to control the volume and tone control circuits, thus improving sound quality.
Pin 25 should be left open when this function is not used.
(Example application) 5V Q1 Output clipping detector
25
Volume control circuit L.P.F. smoothing circuit Tone control circuit Pin 25: Open-collector output (active low)
AC (A) Output AC waveform (A) Clipped level
t DC Clipped level (B) Clipping detection circuit (B)
t
DC (C) Clipping detection pin (output of pin 25) (C) 5V
GND
t
Figure 8
Clipping detection mechanism
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6. Pop Noise Suppression
The TB2905HQ uses AC-GND as a common NF pin for all amplifiers, thus requiring that the ratio of input capacitance C1 to AC-GND capacitance C6 be 1:4. Powering up the IC initiates the charging of C1 and C6. If the IC is turned off before the charging of C1 and C6 completes, the input DC balance becomes unbalanced, causing a pop noise to be produced. To suppress the noise, it is recommended that a longer charging time be used for C2 as well as for C1 and C6. Note that the time which audio output takes to start will be longer, since C2 determines the muting time (the time from when the power is turned on to when audio output starts). The pop noise which is generated when the muting function is turned on/off will vary according to the time constant for C4. The greater the capacitance, the lower the pop noise. Note that the time from when the muting control signal is applied to C4 to when the muting function is turned on/off will be longer.
7. External Component Constants
Component Name Recommended Value Effect Purpose Smaller than Recommended Value Larger than Recommended Value Remarks
C1
0.22 F
To eliminate DC
Cutoff frequency is increased
Cutoff frequency is reduced
Affects the pop noise generated when VCC is turned on
C2 C3
10 F 0.1 F
To reduce ripple To provide sufficient oscillation margin To reduce pop noise Ripple filter
Powering on/off is faster
Powering on/off is slower
Reduces noise and provides sufficient oscillation margin High pop noise Low pop noise Duration until muting function Duration until muting function is turned on/off is short is turned on/off is long Power supply humming and ripple filtering Affects the pop noise generated when VCC is turned on
C4 C5
1 F 3900 F
C6
1 F
NF for all outputs
Pop noise is suppressed when C1:C6 = 1:4
8. Preventive measure against oscillation
For preventing the oscillation, check that the application circuit and actual load makes no abnormal oscillation under all the necessary condition. Especially, perform the temperature test to check the oscillation margin since the oscillation margin is varied according to the causes described below, 1) Layout of printed board 2) Type of Speaker 3) Value and kind of the capacitor between the output(+) and output(-) 4) Value and kind of the CR filter or the capacitor between each output and GND.
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Maximum Ratings (Ta = 25*Z )
Characteristics Peak supply voltage (0.2 s) DC supply voltage Operating supply voltage Output current (peak) Power dissipation Operating temperature Storage temperature Symbol VCC (surge) VCC (DC) VCC (opr) IO (peak) PD (Note 5) Topr Tstg Rating 50 25 18 9 125 -40~85 -55~150 Unit V V V A W C C
Note 5: Package thermal resistance (jT = 1C/W) (Ta = 25C, with infinite heat sink) The absolute maximum ratings of a semiconductor device are a set of specified parameter values which must not be exceeded during operation, even for an instant. Exposure to conditions beyond those listed above may cause permanent damage to the device or affect device reliability, which could increase potential risks of personal injury due to IC blowup and/or burning. The equipment manufacturer should design so that no maximum rating value is exceeded with respect to current, voltage, power dissipation, temperature, etc. Ensuring that the parameter values remain within these specified ranges during device operation will help to ensure that the integrity of the device is not compromised.
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Electrical Characteristics
Characteristics Quiescent supply current
(unless otherwise specified, VCC =13.2 V, f =1 kHz, RL = 4 , Ta = 25C)
Symbol ICCQ POUT MAX (1) Output power POUT MAX (2) POUT (1) POUT (2) POUT MAX (1) Output power (RL = 2 ) POUT MAX (2) POUT (1) POUT (2) Total harmonics distortion Voltage gain Interchannel voltage gain Output noise voltage * THD GV GV Test Circuit Standby state POWER: ON, clipping detection on pin 25 POWER: ON, offset detection on pin 25 POWER: OFF MUTE: OFF MUTE: ON, R1 = 47 k MUTE: ON VOUT = 7.75 Vrms Mute: OFF Rpull-up = 47 k, +V= 5.0 V Based on normal output DC voltage VIN = 0 VCC = 14.4 V, max POWER VCC = 13.7 V, max POWER VCC = 14.4 V, THD = 10% THD = 10% VCC = 14.4 V, max POWER VCC = 13.7 V, max POWER VCC = 14.4 V, THD = 10% THD = 10% POUT = 2 W VOUT = 0.775 Vrms VOUT = 0.775 Vrms Rg = 0 , DIN45405 Rg = 0 , BW = 20 Hz~20 kHz frip = 100 Hz, Rg = 620 Vrip = 0.775 Vrms Rg = 620 VOUT = 0.775 Vrms Test Conditions Min 23 42 24 -1.0 50 -150 7.5 2.5 0 2.5 0 80 Typ. 200 47 43 29 25 80 77 55 45 0.03 26 0 130 120 60 70 0 90 2 90 Max 300 0.2 28 1.0 270 150 10 VCC 6.0 0.5 6.0 V 0.5 dB V dB dB mV k A % dB dB Vrms W W Unit mA
VNO (1) VNO (2)
Ripple rejection retio Crosstalk Output offset voltage Input resistance Standby current
R.R. C.T. VOFFSET RIN ISB VSB H
Standby control voltage
VSB M VSB L
Muting control voltage
VM H VM L
Muting attenuation
ATT M
Offset detection threshold voltage
Voff-set
1.0
1.5
2.0
V
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Test Circuit
3900 F
1 TAB
20 VCC1
6 VCC2 OUT1 (+) 9
0.22 F C1 11
IN1 PW-GND1 8 OUT1 (-) 7 RL
OUT2 (+) 0.22 F C1 12 IN2
5 RL
PW-GND2 2 OUT2 (-) 3
1 F C6 16 AC-GND
OUT3 (+) 0.22 F C1 15 IN3
17 RL
PW-GND3 18 OUT3 (-) 19
OUT4 (+) 0.22 F C1 14 IN4
21 RL
PW-GND4 24 OUT4 (-) 23
PRE-GND
13 RIP 10 10 F C2 STBY 4 OFF-SET CLP-DET MUTE 25 22 47 k 1 F C4 R1 3.3V PLAY MUTE : PRE-GND : PW-GND
Components in the testing circuit are only used to determine the device's characteristics. Toshiba does not guarantee that those components prevent the application equipment from malfunctioning or failing.
C3 0.1 F
C5
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T.H.D - POUT (OUT)
100 VCC = 13.2 V RL = 4 Ch = 1 ch, 3 ch 100
T.H.D - POUT (OUT)
VCC = 13.2 V RL = 4 Ch = 2 ch, 4 ch
(%)
10
(%) Total harmonic distortion T.H.D
10
Total harmonic distortion T.H.D
1
1
10 kHz 0.1 1 kHz
0.1
10 kHz
100 Hz
100 Hz 0.01 0.1 1 10 100 0.01 0.1
1 kHz 1 10 100
Output power
POUT
(W)
Output power
POUT
(W)
T.H.D - POUT (OUT)
100 VCC RL = 4 Ch = 1 ch, 3 ch 100
T.H.D - POUT (OUT)
VCC RL = 4 Ch = 2 ch, 4 ch 13.2 V
9V
9V 13.2 V
(%)
(%)
10
16 V
10
16 V
Total harmonic distortion T.H.D
1
Total harmonic distortion T.H.D
1
0.1
0.1
0.01 0.1
1
10
100
0.01 0.1
1
10
100
Output power
POUT
(W)
Output power
POUT
(W)
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T.H.D - POUT (OUT)
100 VCC = 13.2 V RL = 2 Ch = 1 ch, 3 ch 100
T.H.D - POUT (OUT)
VCC = 13.2 V RL = 2 Ch = 2 ch, 4 ch
(%)
10
(%) Total harmonic distortion T.H.D
10
Total harmonic distortion T.H.D
1 10 kHz
1
10 kHz 0.1 100 Hz
0.1 1 kHz
100 Hz 0.01 0.1 0.01 0.1
1 kHz
1
10
100
1
10
100
Output power
POUT
(W)
Output power
POUT
(W)
T.H.D - POUT (OUT)
100 VCC RL = 2 Ch = 1 ch, 3 ch 13.2 V 100
T.H.D - POUT (OUT)
VCC RL = 2 Ch = 2 ch, 4 ch 13.2 V
(%)
10
(%)
9V
9V 10
Total harmonic distortion T.H.D
1
Total harmonic distortion T.H.D
1
16 V
16 V
0.1
0.1
0.01 0.1
1
10
100
0.01 0.1
1
10
100
Output power
POUT
(W)
Output power
POUT
(W)
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T.H.D - f
(%)
VCC = 13.2 V RL = 4 OUT 1/3 1
T.H.D - f
(%)
10 VCC = 13.2 V RL = 2 OUT 1/3 1
10
Total harmonic distortion T.H.D
OUT 2/4 0.1
Total harmonic distortion T.H.D
OUT 2/4 0.1
0.01 0.01
0.1
1
10
100
0.01 0.01
0.1
1
10
100
Frequency (Hz)
Frequency (Hz)
C.T. - f (OUT1)
0 -10 VCC = 13.2 V RL = 2 VOUT = 0dBm (0.775 Vrms) Rg = 620 0 -10
C.T. - f (OUT2)
VCC = 13.2 V RL = 2 VOUT = 0dBm (0.775 Vrms) Rg = 620
Cross talk C.T. (dB)
-20 -30 -40 -50 -60 -70 10
Cross talk C.T. (dB)
-20 -30 -40 -50 -60 -70 10
CT (1-2) CT (1-3) CT (1-4)
CT (2-1) CT (2-3) CT (2-4)
100
1000
10000
100000
100
1000
10000
100000
Frequency (Hz)
Frequency (Hz)
C.T. - f (OUT3)
0 -10 VCC = 13.2 V RL = 2 VOUT = 0dBm (0.775 Vrms) Rg = 620 0 -10
C.T. - f (OUT4)
VCC = 13.2 V RL = 2 VOUT = 0dBm (0.775 Vrms) Rg = 620
Cross talk C.T. (dB)
-20 -30 -40
Cross talk C.T. (dB)
-20 -30 -40 -50
CT (3-1) -50 -60 -70 10 CT (3-2) CT (3-4)
CT (4-1) -60 -70 10
CT (4-2)
CT (4-3) 100 1000 10000 100000 100 1000 10000 100000
Frequency (Hz)
Frequency (Hz)
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VNO - Rg
300 VCC = 13.2 V RL = 4 Filter DIN audio 0 -10 -20 -30 -40 -50 100 VCC = 13.2 V RL = 4
R.R. - f
(Vrms)
250
200
VNO
150
R.R.
(dB)
3ch
1ch
*o--IZG"d
-60 50
Sbv*oeZ--|
-70 -80 0.01
2ch
4ch
0 10
100
1000
10000
100000
0.1
1
10
100
Signal source resistance Rg ()
Zu
"g
*"
f (kHz)
GV - f
28 27 VCC = 13.2 V RL = 4 70 Gv_3ch f = 1 kHz Gv_1ch 60 RL = 4 4ch drive
PD - POUT
GV (dB)
26 Gv_4ch 25 Gv_2ch 24 23 22 21 20 0.01
(W) PD Power dissipation
50 40 30 20
Voltage gain
VCC = 16 V VCC = 13.2 V VCC = 9 V
10 0 0.1
0.1
1
10
100
1
10
100
Frequency (Hz)
Output power
POUT/ (W)
PD - POUT (RL = 2 )
120 f = 1 kHz 100 RL = 2 4ch drive VCC = 16 V 500 450 400 350 RL = Vin = 0
Iccq - VCC
PD
(W)
(mA) Iccq
VCC = 13.2 V VCC = 9 V 1 10 100
80
Power dissipation
300 250 200 150 100 50
60
40
20
0 0.1
0 0
5
10
15
20
25
Output power
POUT/ (W)
VCC
(V)
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PD MAX -Ta
120 @ 100 A B @ 60 INFINITE HEAT SINK RJC = 1C/W HEAT SINK (RHS = 3.5C/W) RJC + RHS = 4.5C/W 80 NO HEAT SINK RJA = 39C/W
PD MAX ---e`Z
(W)
40
20 B 0 0 25 50 75
A
100
125
150
ZuI*"x
Ta
(C)
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Package Dimensions
Weight: 7.7 g (typ.)
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About solderability, following conditions were confirmed * Solderability (1) Use of Sn-63Pb solder Bath * solder bath temperature = 230C * dipping time = 5 seconds * the number of times = once * use of R-type flux (2) Use of Sn-3.0Ag-0.5Cu solder Bath * solder bath temperature = 245C * dipping time = 5 seconds * the number of times = once * use of R-type flux
RESTRICTIONS ON PRODUCT USE
* The information contained herein is subject to change without notice.
030619EBF
* The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of TOSHIBA or others. * TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the "Handling Guide for Semiconductor Devices," or "TOSHIBA Semiconductor Reliability Handbook" etc.. * The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury ("Unintended Usage"). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in this document shall be made at the customer's own risk. * The products described in this document are subject to the foreign exchange and foreign trade laws. * TOSHIBA products should not be embedded to the downstream products which are prohibited to be produced and sold, under any law and regulations. * This product generates heat during normal operation. However, substandard performance or malfunction may cause the product and its peripherals to reach abnormally high temperatures. The product is often the final stage (the external output stage) of a circuit. Substandard performance or malfunction of the destination device to which the circuit supplies output may cause damage to the circuit or to the product.
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