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TC2054/2055/2186
50 mA, 100 mA, and 150 mA CMOS LDOs with Shutdown and Error Output
Features
* Low Supply Current (55 A Typ.) for Longer Battery Life * Low Dropout Voltage: 140 mV (Typ.) @ 150 mA * High Output Voltage Accuracy: 0.4% (Typ) * Standard or Custom Output Voltages * Power-Saving Shutdown Mode * ERROR Output Can Be Used as a Low Battery Detector or Processor Reset Generator * Fast Shutdown Reponse Time: 60 sec (Typ) * Overcurrent and Overtemperature Protection * Space-Saving 5-Pin SOT-23A Package * Pin Compatible Upgrades for Bipolar Regulators * Standard Output Voltage Options: - 1.8V, 2.5V, 2.6V, 2.7V, 2.8V, 2.85V, 3.0V,
General Description
The TC2054, TC2055 and TC2186 are high accuracy (typically 0.4%) CMOS upgrades for older (bipolar) low dropout regulators. Designed specifically for battery-operated systems, the devices' total supply current is typically 55 A at full load (20 to 60 times lower than in bipolar regulators). The devices' key features include low noise operation, low dropout voltage - typically 45 mV (TC2054); 90 mV (TC2055); and 140 mV (TC2186) at full load - and fast response to step changes in load. An error output (ERROR) is asserted when the devices are out-of-regulation (due to a low input voltage or excessive output current). Supply current is reduced to 0.5 A (max) and both VOUT and ERROR are disabled when the shutdown input is low. The devices also incorporate overcurrent and overtemperature protection. The TC2054, TC2055 and TC2186 are stable with a low esr ceramic output capacitor of 1 F and have a maximum output current of 50 mA, 100 mA and 150 mA, respectively. This LDO Family also features a fast response time (60 s typically) when released from shutdown.
3.3V, 5.0V
Applications
* * * * * * Battery Operated Systems Portable Computers Medical Instruments Instrumentation Cellular / GSMS / PHS Phones Pagers
Package Type
VOUT 5 ERROR 4 TC2054 TC2055 TC2186 1 VIN
1M
Typical Application
1V IN 1 F 2 VOUT 5
VIN
VOUT 1 F
2
3
GND TC2054 TC2055 TC2186 SHDN 4
GND SHDN
5-Pin SOT-23A Top View
3
ERROR
ERROR
Shutdown Control (from Power Control Logic)
(c) 2006 Microchip Technology Inc.
DS21663C-page 1
TC2054/2055/2186
1.0 ELECTRICAL CHARACTERISTICS
Notice: Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions above those indicated in the operation sections of the specifications is not implied. Exposure to Absolute Maximum Rating conditions for extended periods my affect device reliability.
Absolute Maximum Ratings
Input Voltage .........................................................6.5V Output Voltage................................(-0.3) to (VIN + 0.3) Operating Temperature .................. -40C < TJ< 125C Storage Temperature..........................-65C to +150C Maximum Voltage on Any Pin ........VIN +0.3V to -0.3V
ELECTRICAL SPECIFICATIONS
Electrical Specifications: Unless otherwise noted, VIN = VR + 1V, IL = 100 A, CL = 3.3 F, SHDN > VIH, TA = +25C. BOLDFACE type specifications apply for junction temperature of -40C to +125C. Parameter Input Operating Voltage Maximum Output Current Sym VIN IOUTMAX Min 2.7 50 100 150 -- -- -- -1.5 -2.5 -- -- -- -- -- -- -- 160 -- -- Typ -- -- -- -- 20 40 0.05 0.5 0.5 2 45 90 140 55 0.05 50 300 0.04 160 Max 6.0 -- -- -- -- -- 0.5 0.5 0.5 -- 70 140 210 80 0.5 -- -- -- -- Units V mA Note 1 TC2054 TC2055 TC2186 Note 2 Conditions
Output Voltage VOUT Temperature Coefficient Line Regulation Load Regulation
VOUT TCVOUT VOUT/ VIN VOUT/ VOUT VIN - VOUT
VR - 2.0% VR 0.4% VR + 2.0%
V
ppm/C Note 3 % % (VR + 1V) < VIN < 6V TC2054;TC2055IL = 0.1 mA to IOUTMAX TC2186 IL = 0.1 mA to IOUTMAX Note 4 IL = 100 A IL = 50 mA IL = 100 mA IL = 150 mA
Dropout Voltage, Note 5
mV TC2015; TC2185 TC2185 Note 5 A A dB mA V/W C SHDN = VIH, IL=0 SHDN = 0V FRE 100 kHz VOUT = 0V Note 6
Supply Current Shutdown Supply Current Power Supply Rejection Ratio Output Short Circuit Current Thermal Regulation Thermal Shutdown Die Temperature
IIN IINSD PSRR IOUTSC VOUT/PD TSD
Note 1: The minimum VIN has to meet two conditions: VIN = 2.7V and VIN = VR + VDROPOUT. 2: VR is the regulator output voltage setting. For example: VR = 1.8V, 2.7V, 2.8V, 2.85V, 3.0V, 3.3V. 3: TCVOUT = 6
(V -V ) x 10 OUTMAX OUTMIN ----------------------------------------------------------------------------------------V x T OUT
4: Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested over a load range from 1.0mA to the maximum specified output current. Changes in output voltage due to heating effects are covered by the thermal regulation specification. 5: Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value at a 1V differential. 6: Thermal Regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied, excluding load or line regulation effects. Specifications are for a current pulse equal to IMAX at VIN = 6V for T = 10 ms. 7: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction-to-air (i.e. TA, TJ, JA). 8: Hysteresis voltage is referenced by VR. 9: Time required for VOUT to reach 95% of VR (output voltage setting), after VSHDN is switched from 0 to VIN.
DS21663C-page 2
(c) 2006 Microchip Technology Inc.
TC2054/2055/2186
ELECTRICAL SPECIFICATIONS (CONTINUED)
Electrical Specifications: Unless otherwise noted, VIN = VR + 1V, IL = 100 A, CL = 3.3 F, SHDN > VIH, TA = +25C. BOLDFACE type specifications apply for junction temperature of -40C to +125C. Parameter Output Noise Response Time (from Shutdown Mode) SHDN Input SHDN Input High Threshold VIH SHDN Input Low Threshold ERROR OUTPUT Minimum VIN Operating Voltage Output Logic Low Voltage ERROR Threshold Voltage VOUT to ERROR Delay Resistance from ERROR to GND VINMIN VOL VTH tDELAY RERROR 1.0 -- -- -- -- -- -- -- 0.95 x VR 50 2 126 -- 400 -- -- -- -- V mV V mV ms IOL = 0.1 mA 1 mA Flows to ERROR, IOL = 1 mA, VIN = 2V See Figure 4-2 Note 8 VOUT from VR = 3V to 2.8V VDD = 2.5V, VOUT = 2.5V VIL 60 -- -- -- -- 15 %VIN %VIN VIN = 2.5V to 6.0V VIN = 2.5V to 6.0V Sym eN tR Min -- -- Typ 600 60 Max -- -- Units nV / Hz s Conditions IL = IOUTMAX, F = 10 kHz VIN = 4V CIN = 1 F, COUT = 10 F IL = 0.1 mA, Note 9
ERROR Positive Hysteresis VHYS
Note 1: The minimum VIN has to meet two conditions: VIN = 2.7V and VIN = VR + VDROPOUT. 2: VR is the regulator output voltage setting. For example: VR = 1.8V, 2.7V, 2.8V, 2.85V, 3.0V, 3.3V. 3: TCVOUT = 6
( V OUTMAX - V OUTMIN ) x 10 ----------------------------------------------------------------------------------------V OUT x T
4: Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested over a load range from 1.0mA to the maximum specified output current. Changes in output voltage due to heating effects are covered by the thermal regulation specification. 5: Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value at a 1V differential. 6: Thermal Regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied, excluding load or line regulation effects. Specifications are for a current pulse equal to IMAX at VIN = 6V for T = 10 ms. 7: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction-to-air (i.e. TA, TJ, JA). 8: Hysteresis voltage is referenced by VR. 9: Time required for VOUT to reach 95% of VR (output voltage setting), after VSHDN is switched from 0 to VIN.
TEMPERATURE CHARACTERISTICS
Electrical Specifications: Unless otherwise noted, VDD = +2.7V to +6.0V and VSS = GND. Parameters Temperature Ranges: Extended Temperature Range Operating Temperature Range Storage Temperature Range Thermal Package Resistances: Thermal Resistance, 5L-SOT-23 JA -- 255 -- C/W TA TA TA -40 -40 -65 -- -- -- +125 +125 +150 C C C Sym Min Typ Max Units Conditions
(c) 2006 Microchip Technology Inc.
DS21663C-page 3
TC2054/2055/2186
2.0
Note:
TYPICAL PERFORMANCE CURVES
The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
Note: Unless otherwise indicated, VIN = VR + 1V, IL = 100 A, COUT = 3.3 F, SHDN > VIH, TA = +25C.
0 -20 PSRR (dB) -40 -60 -80 -100
0 -20 PSRR (dB) -40 -60 -80 -100
10 10 100 100 1000 1,000 10k 10,000 100k 100,000 1M 1,000,000
IOUT = 150 mA COUT = 10 F Ceramic
VINDC = 4V VINAC = 100mVp-p VOUTDC = 3V
IOUT = 100A COUT = 1 F Ceramic
VINDC = 4V VINAC = 100 mVp-p VOUTDC = 3V
10 10
100 100
1000 1,000
10k 10,000
100k 100,000
1M 1,000,000
f (Hz)
f (Hz)
FIGURE 2-1: Ratio.
0 -20 PSRR (dB) -40 -60 -80 -100
Power Supply Rejection
FIGURE 2-4: Ratio.
0 -20 PSRR (dB) -40 -60 -80 -100
Power Supply Rejection
VINDC = 4V VINAC = 100 mVp-p VOUTDC = 3V
VINDC = 4V VINAC = 100 mVp-p VOUTDC = 3V
IOUT = 150 mA COUT = 1 F Ceramic
10 10 100 100 1,000 1000 10,000 10k 100,000 100k 1,000,000 1M
IOUT = 150 mA COUT = 10 F Tantalum
10 10
100 100
1000 1,000
10k 10,000
100k 100,000
1M 1,000,000
f (Hz)
f (Hz)
FIGURE 2-2: Ratio.
Power Supply Rejection
FIGURE 2-5: Ratio.
0.160 0.140 VOUT = 1.8V
Power Supply Rejection
10 Noise (V/ Hz) 1
DOV (V)
0.120
COUT = 1F
0.100 0.080 0.060 0.040 0.020 T = 130C T = -45C
T = 25C
0.1 0.01 0.001 0.01
0.1
1 10 Frequency (kHz)
100
1000
0.000 0 50 100 150
ILOAD (mA)
FIGURE 2-3:
Output Noise vs. Frequency.
FIGURE 2-6:
Dropout Voltage vs. ILOAD.
DS21663C-page 4
(c) 2006 Microchip Technology Inc.
TC2054/2055/2186
Note: Unless otherwise indicated, VIN = VR + 1V, IL = 100 A, COUT = 3.3 F, SHDN > VIH, TA = +25C.
65.00 VOUT = 1.8V 63.00 61.00
1.9 1.88 1.86 1.84 VOUT (V) 1.82 1.8 1.78
VIN = 2.8V
IDD (A)
59.00 57.00
VIN = 2.8V
1.76 1.74
55.00 53.00 -45
1.72 1.7
5 55 105 155
0
15
30
45
60
75 ILOAD (mA)
90
105
120
135
150
Temperature (C)
FIGURE 2-7:
IDD vs. Temperature.
FIGURE 2-10: Current.
2.9
Output Voltage vs. Output
2.9 2.85 2.8 2.75 VOUT (V) 2.7 2.65 2.6 2.55 2.5 -50 -35 -20 -5 10 25 40 55 70 85 100 115 130 145
VIN = 3.8V VIN = 6.0V VOUT = 2.8V IOUT = 0.1mA VIN = 6.5V
2.85 2.8 2.75 VOUT (V) 2.7 2.65 2.6 2.55 2.5
VOUT = 2.8V IOUT = 0.1mA Temp = +130C
Temp = -45C
Temp = +25C
3.5
4
4.5
5 VIN (V)
5.5
6
6.5
7
Temperature (C)
FIGURE 2-8: Temperature.
1.9 1.88 1.86 1.84
VIN = 6.0V VOUT = 1.8V IOUT = 0.1mA
Output Voltage vs.
FIGURE 2-11: Voltage.
1.9 1.88 1.86
VOUT = 1.8V IOUT = 0.1mA
Output Voltage vs. Supply
VOUT (V)
1.82 1.8 1.78
VIN = 6.5V
1.84 VOUT (V) 1.82 1.8 1.78 1.76
Temp = +25C Temp = -45C Temp = +130C
VIN = 2.8V
1.76 1.74 1.74 1.72 1.7 -50 -35 -20 -5 10 25 40 55 70 85 100 115 130 145 1.72 1.7 2.7 3.2 3.7 4.2 4.7 VIN (V) 5.2 5.7 6.2 6.7 Temperature (C)
FIGURE 2-9: Temperature.
Output Voltage vs.
FIGURE 2-12: Voltage.
Dropout Voltage vs. Supply
(c) 2006 Microchip Technology Inc.
DS21663C-page 5
TC2054/2055/2186
Note: Unless otherwise indicated, VIN = VR + 1V, IL = 100 A, COUT = 3.3 F, SHDN > VIH, TA = +25C.
V IN = 3.8V VOUT = 2.8V C IN = 1 F Ceramic C OUT= 1 F Ceramic Frequency = 1 KHz V IN = 3.0V VOUT = 2.8V C IN = 1F Ceramic C OUT= 10F Ceramic Frequency = 10KHz V OUT
100mV/DIV
100mV / DIV
V OUT
Load Current Load Current 150mA Load 100A 150mA Load 100A
FIGURE 2-13:
Load Transient Response.
FIGURE 2-16:
Load Transient Response.
V IN = 4.0V VOUT = 3.0V C OUT = 10F C BYP = 0.01F I OUT = 100A
Load Transient Response in Dropout Mode
VOUT
100mV/DIV
V SHDN
150mA
VIN = 3.105V VOUT = 3.006V CIN = 1F Ceramic COUT = 1F Ceramic RLOAD = 20
100A
V OUT
FIGURE 2-14: Dropout Mode.
Load Transient Response in
FIGURE 2-17:
Shutdown Delay.
VOUT = 2.8V C OUT= 1F Ceramic C BYP = 470pF I OUT= 100A 50mV / DIV V OUT
V SHDN
2V / DIV
Input Voltage
6V
V OUT
4V
V IN = 4.0V VOUT = 3.0V C OUT = 10F C BYP = 0.01F I OUT = 100A
FIGURE 2-15:
Line Transient Response.
FIGURE 2-18:
Shutdown Wake-up Time.
DS21663C-page 6
(c) 2006 Microchip Technology Inc.
TC2054/2055/2186
Note: Unless otherwise indicated, VIN = VR + 1V, IL = 100 A, COUT = 3.3 F, SHDN > VIH, TA = +25C.
RPULLUP = 100k IOUT = 0.3mA VIN 1V/Div 2.8V VOUT 1V/Div 2.8V 3.0V 3.42V
VERROR 2V/Div
0V
FIGURE 2-19:
VOUT to ERROR Delay.
(c) 2006 Microchip Technology Inc.
DS21663C-page 7
TC2054/2055/2186
3.0 PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 3-1.
TABLE 3-1:
Pin Number 1 2 3
PIN FUNCTION TABLE
Symbol VIN GND SHDN Unregulated supply input. Ground terminal. Shutdown control input. The regulator is fully enabled when a logic high is applied to this input. The regulator enters shutdown when a logic low is applied to this input. During shutdown, output voltage falls to zero, ERROR is open circuited and supply current is reduced to 0.5A (max). Out-of-Regulation Flag. (Open-drain output). This output goes low when VOUT is out-of-tolerance by approximately -5%. Regulated voltage output. Description
4 5
ERROR VOUT
3.1
Unregulated Supply Input (VIN)
3.4
Out-of-Regulation Flag (ERROR)
Connect the unregulated input supply to the VIN pin. If there is a large distance between the input supply and the LDO regulator, some input capacitance is necessary for proper operation. A 1 F capacitor, connected from VIN to ground, is recommended for most applications.
The open-drain ERROR flag provides indication that the regulator output voltage is not in regulation. The ERROR pin will be low when the output is typically below 5% of its specified value.
3.5
Regulated Voltage Output (VOUT)
3.2
Ground Terminal (GND)
Connect the unregulated input supply ground return to GND. Also connect one side of the 1 F typical input decoupling capacitor close to this pin and one side of the output capacitor COUT to this pin.
Connect the output load to VOUT of the LDO. Also connect one side of the LDO output decoupling capacitor as close as possible to the VOUT pin.
3.3
Shutdown Control Input (SHDN)
The regulator is fully enabled when a logic-high is applied to SHDN. The regulator enters shutdown when a logic-low is applied to this input. During shutdown, the output voltage falls to zero and the supply current is reduced to 0.5 A (max).
DS21663C-page 8
(c) 2006 Microchip Technology Inc.
TC2054/2055/2186
4.0 DETAILED DESCRIPTION
VOUT VTH HYSTERESIS (VHYS)
The TC2054, TC2055 and TC2186 are precision fixed output voltage regulators. (If an adjustable version is desired, refer to the TC1070/TC1071/TC1187 data sheet (DS21353). Unlike bipolar regulators, the TC2054, TC2055 and TC2186 supply current does not increase with load current. In addition, VOUT remains stable and within regulation over the entire 0 mA to maximum output current operating load range. Figure 4-1 shows a typical application circuit. The regulator is enabled any time the shutdown input (SHDN) is at or above VIH, and shutdown (disabled) when SHDN is at or below VIL. SHDN may be controlled by a CMOS logic gate, or I/O port of a microcontroller. If the SHDN input is not required, it should be connected directly to the input supply. While in shutdown, supply current decreases to 0.05 A (typical), VOUT falls to zero volts, and ERROR is open-circuited.
VIN 1 F BATTERY TC2054 GND TC2055 TC2186 V+ SHDN Shutdown Control (to CMOS Logic or Tie to VIN if unused) ERROR R1 1M 0.2 F C2 BATTLOW or RESET VOUT 1 F C1 VOUT
ERROR VIH VOL
FIGURE 4-2:
Error Output Operation.
4.2
Output Capacitor
A 1 F (min) capacitor from VOUT to ground is required. The output capacitor should have an effective series resistance of 0.01. to 5 for VOUT = 2.5V, and 0.05. to 5 for VOUT < 2.5V. Ceramic, tantalum and aluminum electrolytic capacitors can be used. (Since many aluminum electrolytic capacitors freeze at approximately -30C, solid tantalums are recommended for applications operating below -25C). When operating from sources other than batteries, supply-noise rejection and transient response can be improved by increasing the value of the input and output capacitors and employing passive filtering techniques.
C2 Required Only if ERROR is used as a Processor RESET Signal (See Text)
4.3
Input Capacitor
FIGURE 4-1:
Typical Application Circuit.
4.1
ERROR Open-Drain Output
ERROR is driven low whenever VOUT falls out of regulation by more than -5% (typical). This condition may be caused by low input voltage, output current limiting or thermal limiting. The ERROR threshold is 5% below rated VOUT regardless of the programmed output voltage value (e.g. ERROR = VOL at 4.75V (typ.) for a 5.0V regulator and 2.85V (typ.) for a 3.0V regulator). ERROR output operation is shown in Figure 4-2. Note that ERROR is active when VOUT falls to VTH, and inactive when VOUT rises above VTH by VHYS. As shown in Figure 4-1, ERROR can be used as a battery low flag or as a processor RESET signal (with the addition of timing capacitor C2). R1 x C2 should be chosen to maintain ERROR below VIH of the processor RESET input for at least 200 ms to allow time for the system to stabilize. Pull-up resistor R1 can be tied to VOUT, VIN or any other voltage less than (VIN + 0.3V). The ERROR pin sink current is self-limiting to approximately 18 mA.
A 1 F capacitor should be connected from VIN to GND if there is more than 10 inches of wire between the regulator and this AC filter capacitor, or if a battery is used as the power source. Aluminum electrolytic or tantalum capacitors can be used (since many aluminum electrolytic capacitors freeze at approximately -30C, solid tantalum are recommended for applications operating below -25C). When operating from sources other than batteries, supply-noise rejection and transient response can be improved by increasing the value of the input and output capacitors and employing passive filtering techniques.
(c) 2006 Microchip Technology Inc.
DS21663C-page 9
TC2054/2055/2186
5.0
5.1
THERMAL CONSIDERATIONS
Thermal Shutdown
Equation 5-1 can be used in conjunction with Equation 5-2 to ensure regulator thermal operation is within limits. For example: Given: VINMAX VOUTMIN TAMAX Find: 1. Actual power dissipation 2. Maximum allowable dissipation Actual power dissipation: P D = ( V INMAX - V OUTMIN )I LOADMAX = [ ( 3.0 x 1.1 ) - ( 2.7 x 0.975 ) ]40 x 10
-3
Integrated thermal protection circuitry shuts the regulator off when the die temperature exceeds approximately 160C. The regulator remains off until the die temperature cools to approximatley 150C.
= 3.0V +10% = 2.7V - 2.5% = +55C
5.2
Power Dissipation
ILOADMAX = 40 mA
The amount of power the regulator dissipates is primarily a function of input and output voltage, and output current. Equation 5-1 is used to calculate worst case power dissipation:
EQUATION 5-1:
P D ( V INMAX - V OUTMIN )I LOADMAX Where: PD VINMAX VOUTMIN = Worst-case actual power dissipation = Maximum voltage on VIN = Minimum regulator output voltage
= 26.7mW Maximum allowable power dissipation: T JMAX - T AMAX P DMAX = ------------------------------------- JA = 125 - 55 -------------------220 = 318mW In this example, the TC2054 dissipates a maximum of only 26.7 mW; far below the allowable limit of 318 mW. In a similar manner, Equation 5-1 and Equation 5-2 can be used to calculate maximum current and/or input voltage limits.
ILOADMAX = Maximum output (load) current The maximum allowable power dissipation (Equation 5-2) is a function of the maximum ambient temperature (TAMAX), the maximum allowable die temperature (125 C) and the thermal resistance from junction-to-air (JA). The 5-Pin SOT-23A package has a JA of approximately 220C/Watt when mounted on a typical two layer FR4 dielectric copper clad PC board.
EQUATION 5-2:
T JMAX - T AMAX P DMAX = ------------------------------------- JA Where all terms are previously defined.
5.3
Layout Considerations
The primary path of heat conduction out of the package is via the package leads. Therefore, layouts having a ground plane, wide traces at the pads, and wide power supply bus lines combine to lower JA and, therefore, increase the maximum allowable power dissipation limit.
DS21663C-page 10
(c) 2006 Microchip Technology Inc.
TC2054/2055/2186
6.0
6.1
PACKAGING INFORMATION
Package Marking Information
TABLE 6-1:
(V) 1.8 2.5 2.7 2.8 2.85 3.0 5.0
PART NUMBER CODE AND TEMPERATURE RANGE
TC2054 SA SB SC SD SE SF SJ TC2055 TA TB TC TD TE TF TG TC2186 VA VB VC VD VE VF VG
&
represents part number code + temperature range and voltage represents year and 2-month period code represents lot ID number
6.2
Taping Information
Component Taping Orientation for 5-Pin SOT-23A (EIAJ SC-74A) Devices User Direction of Feed Device Marking W
PIN 1
P Standard Reel Component Orientation for 713 Suffix Device (Mark Right Side Up)
Carrier Tape, Number of Components Per Reel and Reel Size: Package 5-Pin SOT-23A Carrier Width (W) 8 mm Pitch (P) 4 mm Part Per Full Reel 3000 Reel Size 7 in.
(c) 2006 Microchip Technology Inc.
DS21663C-page 11
TC2054/2055/2186
5-Lead Plastic Small Outline Transistor (CT) (SOT-23)
E E1
p B p1 D
n
1
c A A2
Units Dimension Limits Number of Pins Pitch Outside lead pitch (basic) Overall Height Molded Package Thickness Standoff Overall Width Molded Package Width Overall Length Foot Length Foot Angle Lead Thickness Lead Width Mold Draft Angle Top Mold Draft Angle Bottom n p p1 A A2 A1 E E1 D L f c B a b
L
A1
INCHES* MIN NOM 5 .038 .075 .035 .035 .000 .102 .059 .110 .014 0 .004 .014 0 0 .006 .017 5 5 .046 .043 .003 .110 .064 .116 .018 5 .057 .051 .006 .118 .069 .122 .022 10 .008 .020 10 10 0.35 0.90 0.90 0.00 2.60 1.50 2.80 0.35 MAX MIN
MILLIMETERS NOM 5 0.95 1.90 1.18 1.10 0.08 2.80 1.63 2.95 0.45 0 0.09 0 0 0.15 0.43 5 5 5 1.45 1.30 0.15 3.00 1.75 3.10 0.55 10 0.20 0.50 10 10 MAX
* Controlling Parameter Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .005" (0.127mm) per side. EIAJ Equivalent: SC-74A Revised 09-12-05 Drawing No. C04-091
DS21663C-page 12
(c) 2006 Microchip Technology Inc.
TC2054/2055/2186
APPENDIX A: REVISION HISTORY
Revision C (May 2006)
* Page 1: Added overtemperature to bullet for overcurrent protection in features and general description verbiage. * Page 3: Added "Thermal Shutdown Die Temperature" to electrical characteristics table. Changed codition for "Minimum VIN Operating Voltage" * Page 3: Added Thermal Characteristics Table. * Page 5: Added new section 5.1 and new verbiage. * Page 13: Updated package outline drawing.
Revision B (May 2002)
* Data Sheet converted to Microchip standards.
Revision A (May 2001)
* Original Release of this Document under Telcom.
(c) 2006 Microchip Technology Inc.
DS21663C-page 13
TC2054/2055/2186
NOTES:
DS21663C-page 14
(c) 2006 Microchip Technology Inc.
TC2054/2055/2186
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. Device -XX Output Voltage X Temperature Range XXXX Package Examples:
a) b) c) a)
Output Voltage: XX XX XX XX XX XX XX V = = = = = = = 1.8V 2.5V 2.7V 2.8V 2.85V 3.0V 3.3V
TC2054-1.8VCTTR: 5LD SOT-23-A, 1.8V, Tape and Reel. TC2054-2.85VCTTR: 5LD SOT-23-A, 2.85V, Tape and Reel. TC2054-3.3VCTTR: 5LD SOT-23-A, 3.3V, Tape and Reel. TC2055-1.8VCTTR: 5LD SOT-23-A, 1.8V, Tape and Reel. TC2055-2.85VCTTR: 5LD SOT-23-A, 2.85V, Tape and Reel. TC2055-3.0VCTTR: 5LD SOT-23-A, 3.0V, Tape and Reel. TC2186-1.8VCTTR: 5LD SOT-23-A, 1.8V, Tape and Reel. TC2186-2.8VCTTR: 5LD SOT-23-A, 2.8V, Tape and Reel.
Device:
TC2054: TC2055: TC2186:
50 mA LDO with Shutdown and ERROR Output 100 mA LDO with Shutdown and ERROR Output 150 mA LDO with Shutdown and ERROR Output
b) c) a) b)
Temperature Range: Package:
= -40C to +125C
CTTR = Plastic Small Outline Transistor (SOT-23), 5-lead, Tape and Reel
(c) 2006 Microchip Technology Inc.
DS21663C-page 15
TC2054/2055/2186
NOTES:
DS21663C-page 16
(c) 2006 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices: * * * Microchip products meet the specification contained in their particular Microchip Data Sheet. Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip's Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. Microchip is willing to work with the customer who is concerned about the integrity of their code. Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as "unbreakable."
* *
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip's code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer's risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights.
Trademarks The Microchip name and logo, the Microchip logo, Accuron, dsPIC, KEELOQ, microID, MPLAB, PIC, PICmicro, PICSTART, PRO MATE, PowerSmart, rfPIC, and SmartShunt are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. AmpLab, FilterLab, Migratable Memory, MXDEV, MXLAB, SEEVAL, SmartSensor and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, Application Maestro, dsPICDEM, dsPICDEM.net, dsPICworks, ECAN, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, Linear Active Thermistor, Mindi, MiWi, MPASM, MPLIB, MPLINK, PICkit, PICDEM, PICDEM.net, PICLAB, PICtail, PowerCal, PowerInfo, PowerMate, PowerTool, REAL ICE, rfLAB, rfPICDEM, Select Mode, Smart Serial, SmartTel, Total Endurance, UNI/O, WiperLock and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. (c) 2006, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper.
Microchip received ISO/TS-16949:2002 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona, Gresham, Oregon and Mountain View, California. The Company's quality system processes and procedures are for its PICmicro(R) 8-bit MCUs, KEELOQ(R) code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip's quality system for the design and manufacture of development systems is ISO 9001:2000 certified.
(c) 2006 Microchip Technology Inc.
DS21663C-page 17
WORLDWIDE SALES AND SERVICE
AMERICAS
Corporate Office 2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-7200 Fax: 480-792-7277 Technical Support: http://support.microchip.com Web Address: www.microchip.com Atlanta Alpharetta, GA Tel: 770-640-0034 Fax: 770-640-0307 Boston Westborough, MA Tel: 774-760-0087 Fax: 774-760-0088 Chicago Itasca, IL Tel: 630-285-0071 Fax: 630-285-0075 Dallas Addison, TX Tel: 972-818-7423 Fax: 972-818-2924 Detroit Farmington Hills, MI Tel: 248-538-2250 Fax: 248-538-2260 Kokomo Kokomo, IN Tel: 765-864-8360 Fax: 765-864-8387 Los Angeles Mission Viejo, CA Tel: 949-462-9523 Fax: 949-462-9608 San Jose Mountain View, CA Tel: 650-215-1444 Fax: 650-961-0286 Toronto Mississauga, Ontario, Canada Tel: 905-673-0699 Fax: 905-673-6509
ASIA/PACIFIC
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ASIA/PACIFIC
India - Bangalore Tel: 91-80-4182-8400 Fax: 91-80-4182-8422 India - New Delhi Tel: 91-11-5160-8631 Fax: 91-11-5160-8632 India - Pune Tel: 91-20-2566-1512 Fax: 91-20-2566-1513 Japan - Yokohama Tel: 81-45-471- 6166 Fax: 81-45-471-6122 Korea - Gumi Tel: 82-54-473-4301 Fax: 82-54-473-4302 Korea - Seoul Tel: 82-2-554-7200 Fax: 82-2-558-5932 or 82-2-558-5934 Malaysia - Penang Tel: 60-4-646-8870 Fax: 60-4-646-5086 Philippines - Manila Tel: 63-2-634-9065 Fax: 63-2-634-9069 Singapore Tel: 65-6334-8870 Fax: 65-6334-8850 Taiwan - Hsin Chu Tel: 886-3-572-9526 Fax: 886-3-572-6459 Taiwan - Kaohsiung Tel: 886-7-536-4818 Fax: 886-7-536-4803 Taiwan - Taipei Tel: 886-2-2500-6610 Fax: 886-2-2508-0102 Thailand - Bangkok Tel: 66-2-694-1351 Fax: 66-2-694-1350
EUROPE
Austria - Wels Tel: 43-7242-2244-399 Fax: 43-7242-2244-393 Denmark - Copenhagen Tel: 45-4450-2828 Fax: 45-4485-2829 France - Paris Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79 Germany - Munich Tel: 49-89-627-144-0 Fax: 49-89-627-144-44 Italy - Milan Tel: 39-0331-742611 Fax: 39-0331-466781 Netherlands - Drunen Tel: 31-416-690399 Fax: 31-416-690340 Spain - Madrid Tel: 34-91-708-08-90 Fax: 34-91-708-08-91 UK - Wokingham Tel: 44-118-921-5869 Fax: 44-118-921-5820
02/16/06
DS21663C-page 18
(c) 2006 Microchip Technology Inc.

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