![]() |
|
If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
Datasheet File OCR Text: |
INTEGRATED CIRCUITS DATA SHEET TDA8786; TDA8786A 10-bit analog-to-digital interface for CCD cameras Product specification Supersedes data of 1997 May 20 File under Integrated Circuits, IC02 1997 Nov 17 Philips Semiconductors Product specification 10-bit analog-to-digital interface for CCD cameras FEATURES * Correlated Double Sampling (CDS), AGC, soft clipper, pre-blanking, 10-bit ADC and reference regulator included * Fully programmable via a 3-wire serial interface * Sampling frequency up to 18 MHz * AGC gain from 3.5 to 33.5 dB (in 0.1 dB steps) * Programmable soft clipper for white compression (starting at 40% of the input signal) * Standby mode available for each block for power saving applications (19 mW) * 6 dB fixed gain analog output for analog iris control * 8-bit and 10-bit DAC included for analog settings * Low power consumption of only 475 mW (typ.) * 5 V operation and 2.5 to 5 V operation for the digital outputs * CDS control pulse: TDA8786 = HIGH; TDA8786A = LOW * TTL compatible inputs, TTL and CMOS compatible outputs. QUICK REFERENCE DATA SYMBOL VCCA VCCD VCCO ICCA ICCD ICCO ADCres Vi(CDS)(p-p) GCDS fCLK(max) AGCdyn Ntot(rms) Ptot PARAMETER analog supply voltage digital supply voltage digital outputs supply voltage analog supply current digital supply current digital outputs supply current ADC resolution CDS input voltage (peak-to-peak value) CDS output amplifier gain maximum clock frequency AGC dynamic range total noise from CDS input to ADC output (RMS value) total power consumption CONDITIONS APPLICATIONS TDA8786; TDA8786A GENERAL DESCRIPTION The TDA8786; TDA8786A is a 10-bit analog-to-digital interface for CCD cameras. The device includes a correlated double sampling circuit, AGC, a soft clipper circuit and a low power 10-bit Analog-to-Digital Converter (ADC) together with its reference voltage regulator. The AGC and soft clipper circuits are controlled by on-chip DACs via a serial interface. A 10-bit DAC controls the ADC input clamp level. A pre-blanking function is also included. An additional DAC is provided for additional system controls; its output voltage range is 1.4 V (p-p) which is available at pin OFDOUT. * CCD camera systems. MIN. 4.5 4.5 2.5 - - - - - - 18 - - - TYP. 4.75 4.75 2.6 83 16 1 10 400 6 - 30 0.5 475 MAX. 5.5 5.5 5.5 - - - - 1200 - - - - - UNIT V V V mA mA mA bits mV dB MHz dB LSB mW fCLK = 18 MHz; CL = 20 pF; ramp input gain = 3.5 dB ORDERING INFORMATION TYPE NUMBER TDA8786G TDA8786AG 1997 Nov 17 PACKAGE NAME LQFP48 DESCRIPTION plastic low profile quad flat package; 48 leads; body 7 x 7 x 1.4 mm 2 VERSION SOT313-2 Philips Semiconductors Product specification 10-bit analog-to-digital interface for CCD cameras BLOCK DIAGRAM TDA8786; TDA8786A handbook, full pagewidth VCCA3 IN2 47 IN1 46 AGND3 48 45 CDSP2 44 CDSP1 43 CLPCDS 42 CLK 41 DGND2 VCCD2 39 VCCO OE 38 37 40 36 TRACKAND-HOLD TRACKAND-HOLD TRACKAND-HOLD CLOCK GENERATOR 35 OGND TRACKAND-HOLD 19 5 CLAMP TRACKAND-HOLD D9 34 CLAMP ref2 33 STGE AGND1 D8 D7 TDA8786 TDA8786A AMPOUT PBK 4 2 10-BIT ADC AGCOUT CLPOPB 7 1 ref1 PBIN VCCA1 PBOUT ADCIN 8 6 4-BIT DAC 9 10 1 OPTICAL BLACK CLAMP 9-BIT DAC 1 SOFT CLIPPER AGC OUTPUTS BUFFER +6 dB 32 D6 31 D5 30 D4 29 D3 28 D2 27 D1 26 25 10-BIT DAC 8-BIT DAC REGULATOR SERIAL INTERFACE 3 D0 DGND1 OFDOUT CLPADC 11 CLAMP 12 13 14 15 16 17 VRT 18 23 22 21 20 24 VCCD1 MGE361 Vref VCCA2 DACOUT AGND2 STDBY SEN DEC1 VRB SDATA SCLK Fig.1 Block diagram. 1997 Nov 17 3 Philips Semiconductors Product specification 10-bit analog-to-digital interface for CCD cameras PINNING SYMBOL CLPOPB PBK OFDOUT AMPOUT AGND1 VCCA1 AGCOUT PBIN PBOUT ADCIN CLPADC Vref DACOUT AGND2 VCCA2 VRB VRT DEC1 STGE SDATA PIN 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 DESCRIPTION TDA8786; TDA8786A optical black clamp control pulse input (active HIGH for TDA8786, active LOW for TDA8786A) pre-blanking control pulse input; if PBK is HIGH (LOW) the signal is replaced by the optical black level for TDA8786 (TDA8786A) analog output of the additional 8-bit control DAC (controlled via the serial interface) CDS amplifier output (fixed gain = +6 dB) analog ground 1 analog supply voltage 1 AGC and soft clipper amplifier signal output optical black clamp and pre-blanking block signal input (from AGCOUT via a capacitor) optical black clamp and pre-blanking block signal output ADC analog signal input (from PBOUT or AGCOUT via a capacitor) clamp control input for ADC analog input signal clamp (active HIGH for TDA8786 and active LOW for TDA8786A) ADC input clamp reference voltage (normally connected to pin VRB or DACOUT) DAC output for ADC clamp level analog ground 2 analog supply voltage 2 ADC reference voltage (BOTTOM) code 0 ADC reference voltage (TOP) code 1023 decoupling 1 (decoupled to ground via a capacitor) CDS offset storage serial data input for the 4 control DACs (9-bit DAC for AGC gain, 4-bit DAC for soft clipper; additional 8-bit DAC for OFD output voltage; 10-bit DAC for ADC clamp level and the stand-by mode per block; see Table 1) serial clock input for the control DACs and their serial interface; see Table 1 enable input for the serial interface shift register (active when SEN = logic 0); see Table 1 stand-by control pin (active HIGH); all the output bits are logic 0 when stand-by is enabled digital supply voltage 1 digital ground 1 ADC digital output 0 (LSB) ADC digital output 1 ADC digital output 2 ADC digital output 3 ADC digital output 4 ADC digital output 5 ADC digital output 6 ADC digital output 7 ADC digital output 8 ADC digital output 9 (MSB) digital output ground SCLK SEN STDBY VCCD1 DGND1 D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 OGND 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 1997 Nov 17 4 Philips Semiconductors Product specification 10-bit analog-to-digital interface for CCD cameras SYMBOL VCCO OE VCCD2 DGND2 CLK CLPCDS CDSP1 CDSP2 VCCA3 IN1 IN2 AGND3 PIN 37 38 39 40 41 42 43 44 45 46 47 48 digital output supply voltage DESCRIPTION TDA8786; TDA8786A output enable (LOW: digital outputs active; HIGH: digital outputs high impedance) digital supply voltage 2 digital ground 2 ADC clock input CDS clamp control input (active HIGH for TDA8786; active LOW for TDA8786A) CDS control pulse input 1 (active HIGH for TDA8786; active LOW for TDA8786A) CDS control pulse input 2 (active HIGH for TDA8786; active LOW for TDA8786A) analog supply voltage 3 input signal 1 from CCD (usually black channel) input signal 2 from CCD (usually video channel) analog ground 3 42 CLPCDS 40 DGND2 48 AGND3 39 VCCD2 45 VCCA3 44 CDSP2 43 CDSP1 37 VCCO 41 CLK 46 IN1 38 OE 47 IN2 CLPOPB PBK OFDOUT AMPOUT AGND1 VCCA1 AGCOUT PBIN PBOUT 1 2 3 4 5 6 7 8 9 36 OGND 35 D9 34 D8 33 D7 32 D6 TDA8786 TDA8786A 31 D5 30 D4 29 D3 28 D2 27 D1 26 D0 25 DGND1 ADCIN 10 CLPADC 11 Vref 12 DACOUT 13 AGND2 14 VCCD1 24 SCLK 21 VCCA2 15 DEC1 18 STGE 19 SDATA 20 SEN 22 VRB 16 VRT 17 STDBY 23 MGE360 Fig.2 Pin configuration. 1997 Nov 17 5 Philips Semiconductors Product specification 10-bit analog-to-digital interface for CCD cameras LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL VCCA VCCD VCCO VCC PARAMETER analog supply voltage digital supply voltage output stages supply voltage supply voltage difference between VCCA and VCCD between VCCA and VCCO between VCCD and VCCO Vi VCLK(p-p) Io Tstg Tamb Tj Note input voltage AC input voltage for switching (peak-to peak-value) output current storage temperature operating ambient temperature junction temperature referenced to VSSA referenced to VSSD CONDITIONS note 1 note 1 note 1 TDA8786; TDA8786A MIN. -0.3 -0.3 -0.3 -1.0 -1.0 -1.0 -0.3 - - -55 -20 - MAX. +7.0 +7.0 +7.0 +1.0 +4.0 +4.0 +7.0 VCCD 10 +150 +75 150 V V V V V V V V UNIT mA C C C 1. The supply voltages VCCA, VCCD and VCCO may have any value between -0.3 and +7.0 V provided that the supply voltage difference VCC remains as indicated. HANDLING Inputs and outputs are protected against electrostatic discharges in normal handling. However, to be totally safe, it is desirable to take normal precautions appropriate to handling integrated circuits. THERMAL CHARACTERISTICS SYMBOL Rth(j-a) PARAMETER thermal resistance from junction to ambient CONDITIONS in free air VALUE 76 UNIT K/W 1997 Nov 17 6 Philips Semiconductors Product specification 10-bit analog-to-digital interface for CCD cameras TDA8786; TDA8786A CHARACTERISTICS VCCA = VCCD = 4.75 V; VCCO = 2.6 V; fCLK = 18 MHz; Tamb = 25 C; unless otherwise specified. SYMBOL Supplies VCCA VCCD VCCO ICCA ICCD ICCO Digital inputs CLOCK INPUT: CLK (REFERENCED TO DGND) VIL VIH IIL IIH Zi Ci VIL VIH IIL IIH VIL VIH Ii tsu1 tsu2 LOW-level input voltage HIGH-level input voltage LOW-level input current HIGH-level input current input impedance input capacitance VCLK = 0.8 V VCLK = 2.0 V fCLK = 18 MHz fCLK = 18 MHz 0 2.0 -1 - - - 0 2.2 VIL = 0.6 V VIH = 2.2 V - - 0 2.2 -2 - - - - - - 2 2 - - -100 0 - - - 4 4 0.8 VCCD +1 20 - - 0.6 VCCD - - 0.6 VCCD +2 - - V V A A k pF analog supply voltage digital supply voltage digital outputs supply voltage analog supply current digital supply current digital outputs supply current CL = 20 pF on all data outputs; ramp input 4.5 4.5 2.5 - - - 4.75 4.75 2.6 83 16 1 5.5 5.5 5.5 - - - V V V mA mA mA PARAMETER CONDITIONS MIN. TYP. MAX. UNIT INPUTS: CDSP1 AND CDSP2 LOW-level input voltage HIGH-level input voltage LOW-level input current HIGH-level input current V V A A V V A ns ns INPUTS: SEN, STDBY, CLPCDS, CLPOPB, PBK AND CLPADC LOW-level input voltage HIGH-level input voltage input current INPUTS: SEN, SDATA AND SCLK (see Fig.14) SEN set-up time compared to SCLK rising edge SDATA set-up time compared to SCLK rising edge SEN set-up time compared to SCLK falling edge SEN hold time compared to SCLK rising edge SDATA hold time compared to SCLK rising edge tsu3 thd3 thd4 - - - 4 4 4 - - - ns ns ns 1997 Nov 17 7 Philips Semiconductors Product specification 10-bit analog-to-digital interface for CCD cameras SYMBOL PARAMETER CONDITIONS - -2 fi(CDS1,2) = fCLK(pix) Vi(CDS)(p-p) = 1200 mV black-to-white transition in one pixel (1 LSB typ.) see Fig.15 see Fig.15 12 MIN. TDA8786; TDA8786A TYP. MAX. UNIT Correlated Double Sampling; CDS Vi(CDS)(p-p) ISTGE,IN1,IN2 tCDS(min) CDS input amplitude (peak-to-peak value) input current pins 19, 46 and 47 CDS control pulses minimum active time (HIGH for TDA8786, LOW for TDA8786A) hold time IN1 compared to control pulse CDSP1 hold time of IN2 compared to control pulse CDSP2 400 - - 1200 +2 - mV A ns thd1 thd2 - - 1 -0.5 - - ns ns Amplifier outputs GAMPOUT ZAMPOUT VAMPOUT(p-p) output amplifier gain output amplifier impedance output amplifier dynamic voltage level (peak-to-peak value) output amplifier black level voltage AGC output amplifier dynamic voltage level (peak-to-peak value) AGC output amplifier black level voltage AGC output amplifier output impedance AGC output static drive current optical black clamp and blanking block output dynamic voltage (peak-to-peak value) optical black clamp and blanking block output black level voltage optical black clamp and blanking block output impedance OPB output current drive input current pin 8 minimum gain of AGC circuit AGC DAC input code = 00 (9-bit control) 8 at 10 kHz at 10 kHz static - - - 6 300 2.4 - - - dB V VAMPOUT(bl) VAGCOUT(p-p) - - 1.1 1800 - - V mV VAGCOUT ZAGCOUT IAGCOUT VOPB(p-p) - - - - 1.1 5 - 1.8 - - 1 - V mA V VOPB - 1.4 - V ZOPB - - 5 IOPB IPBIN GAGC(min) static - -2 - - - 3.5 1 +2 - mA A dB 1997 Nov 17 Philips Semiconductors Product specification 10-bit analog-to-digital interface for CCD cameras SYMBOL GAGC(max) VAGCOUT Vinflex(p-p) PARAMETER maximum gain of AGC circuit AGC output amplifier black level voltage voltage at soft clipper inflexion point (peak-to-peak value) soft clipper compression ratio soft clipper 4-bit control DAC input code = 00 soft clipper 4-bit control DAC input code = 15 Vi(sc) < Vinflex Vi(sc) > Vinflex at clamp level at clamp level at clamp level CONDITIONS AGC DAC input - code = 319 (9-bit control) - - - - - - - - - MIN. TDA8786; TDA8786A TYP. 33.5 1.1 MAX. - - UNIT dB V V V 40% - VAGCOUT(p-p) 100% - VAGCOUT(p-p) 1.0 0.66 - - - - - - CRsc CLAMPS gmADC gmPBK gmCDS VPBIN(clamp) ADC clamps transconductance PBK clamp transconductance CDS clamps transconductance clamp voltage at PBIN input 60 60 5.5 1.4 mS mS mS V Analog-to-Digital Converter; ADC fCLK(max) tCPH tCPL SRCLK Vi(ADC)(p-p) VRB VRT IADCIN ILE DLE td(s) maximum clock frequency clock pulse width HIGH clock pulse width LOW clock input slew rate (rising and falling edge) ADC input voltage level (peak-to-peak value) ADC reference voltage output code 0 ADC reference voltage output code 1023 input current pin 10 integral linearity error differential linearity error sampling delay time fCLK = 18 MHz; ramp input fCLK = 18 MHz; ramp input 10 to 90% 18 15 15 0.5 - - - -2 - - - - - - - 1.8 1.4 3.2 - 1.0 0.4 - - - - - - - - +2 2.0 0.75 5 MHz ns ns V/ns V V V A LSB LSB ns 1997 Nov 17 9 Philips Semiconductors Product specification 10-bit analog-to-digital interface for CCD cameras SYMBOL PARAMETER CONDITIONS - MIN. TDA8786; TDA8786A TYP. MAX. - UNIT Total chain timing (CDS + ADC + SOFT CLIPPER + PRE BLANKING + ADC) td time delay between CDSP1 and CLK 50% at rising edges of CLK and CDSP1: transition full-scale code 0 to code 1023; Vi(CDS)(p-p) = 1200 mV gain = 3.5 dB 40 ns N(rms) VOFDOUT(p-p) noise (RMS value) - - 0.5 - - LSB Digital-to-Analog Converters (OFDOUT DAC) additional 8-bit control DAC (OFD) output voltage (peak-to-peak value) DC output voltage for code 0 DC output voltage for code 255 additional 8-bit control DAC (OFD) output impedance OFD output current drive static 1.4 V VOFDOUT(0) VOFDOUT(255) ZOFDOUT - - - 2.0 3.4 2000 - - - V V IOFDOUT VDACOUT(p-p) - - - 50 - A ADC clamp control DAC (see Fig.5) ADC clamp 10-bit control DAC output voltage (peak-to-peak value) DC output voltage ADC clamp control DAC output impedance DAC output current drive maximum offset error of DAC + ADC clamp loop static code 0 code 1023 code 0 code 1023 ZDACOUT IDACOUT OFELOOP 0.9 V VDACOUT - - - - - - 1.4 2.3 - - 5 5 - - 250 50 - - V V A LSB LSB 1997 Nov 17 10 Philips Semiconductors Product specification 10-bit analog-to-digital interface for CCD cameras SYMBOL PARAMETER CONDITIONS MIN. TDA8786; TDA8786A TYP. MAX. UNIT Digital outputs (fCLK = 18 MHz; CL = 20 pF) VOH VOL IOZ to(h) to(d) HIGH-level output voltage LOW-level output voltage output current in 3-state mode output hold time output delay Ci = 20 pF; VCCO = 4.75 V Ci = 20 pF; VCCO = 3.15 V Ci = 20 pF; VCCO = 2.7 V Serial interface fSCLK(max) maximum frequency of serial interface 5 - - MHz IOH = -1 mA IOL = 1 mA 0.5 V < Vo < VCCO VCCO - 0.5 0 -20 5 - - - - - - - 12 17 21 VCCO 0.5 +20 - 15 20 24 V V A ns ns ns ns handbook, halfpage MGE365 33.5 GAGC (dB) 3.5 0 319 AGC control DAC input code 511 Fig.3 AGC gain as a function of DAC input code. 1997 Nov 17 11 Philips Semiconductors Product specification 10-bit analog-to-digital interface for CCD cameras TDA8786; TDA8786A handbook, full pagewidth MGE364 AGCOUT control DAC input code = 15 100% control DAC input code = 00 (1) (2) 40% 0 Vo (1) ----- = 1 Vi Vo (2) ----- = 0.66 Vi 0 40% 100% 130% soft clipper input Fig.4 Soft clipper output voltage as a function of soft clipper input voltage. handbook, halfpage MGE366 handbook, halfpage MGD599 2.3 ADC CLAMP DAC voltage output (V) 3.4 OFD DAC voltage output (V) 1.4 0 2.0 1023 ADC CLAMP control DAC input code 0 255 OFD control DAC input code Fig.5 DAC voltage output as a function of DAC input code. 1997 Nov 17 12 Philips Semiconductors Product specification 10-bit analog-to-digital interface for CCD cameras TDA8786; TDA8786A handbook, full pagewidth 8 x fSC = 2fCLK >12 ns CDSP1 >12 ns CDSP2 MGE370 Fig.6 CCD high band control signal timing (TDA8786). handbook, full pagewidth 8 x fSC = 3fCLK >12 ns CDSP1 >12 ns CDSP2 MGE369 Fig.7 CCD normal band control signal timing (TDA8786). 1997 Nov 17 13 Philips Semiconductors Product specification 10-bit analog-to-digital interface for CCD cameras TDA8786; TDA8786A handbook, full pagewidth 8 x fSC = 2fCLK CDSP1 >12 ns CDSP2 MGE371 >12 ns Fig.8 CCD high band control signal timing (TDA8786A). handbook, full pagewidth 8 x fSC = 3fCLK CDSP1 >12 ns CDSP2 MGE372 >12 ns Fig.9 CCD normal band control signal timing (TDA8786A). 1997 Nov 17 14 Philips Semiconductors Product specification 10-bit analog-to-digital interface for CCD cameras TDA8786; TDA8786A IPBIN handbook, halfpage (A) 450 I handbook, halfpage (A) 350 0 1.4 -450 30 mV MBK058 0 VPBIN (V) -350 200 mV MBK057 2.85 V (V) Fig.10 Typical PBK clamp current. Fig.11 Typical clamp currents for pins IN1, IN2 and STGE. ADC clamping When pin CLPADC is HIGH (TDA8786) (LOW for TDA8786A), the ADC input is clamped to voltage level Vref. Vref should normally be connected to VRB (ADC reference voltage code 0) or to DACOUT (10-bit DAC output). The DAC is controlled via the serial interface, its output covers the lower half of the ADC input range. IADCIN handbook, halfpage (A) 450 Vref 0 VADCIN (V) -450 30 mV 500 mV MBK059 slope = 1 k Fig.12 Typical ADC clamp current. 1997 Nov 17 15 Philips Semiconductors Product specification 10-bit analog-to-digital interface for CCD cameras TDA8786; TDA8786A handbook, full pagewidth SDATA D0 SCLK LSB D1 D2 D3 SHIFT REGISTER D4 D5 D6 D7 D8 D9 MSB 10 LATCH SELECTION A0 A1 A2 SEN 8 (D7 to D0) OFD LATCHES 9 (D8 to D0) AGC GAIN LATCHES 4 (D3 to D0) SOFT CLIP LATCHES 4 (D3 to D0) PARTIAL STANDBY 10 (D9 to D0) CLAMP REFERENCE LATCHES 8-bit DAC AGC control soft clip control standby control 10-bit DAC MGD526 Fig.13 Serial interface block diagram. handbook, full pagewidth tsu2 MSB thd4 D9 D8 D7 D6 D5 D4 LSB D3 D2 D1 D0 SDATA A2 A1 A0 SCLK SEN MGE373 tsu1 thd3 tsu3 tsu = 4 ns (min.); thd3 = thd4 = 4 ns (min.). Fig.14 Loading sequence of control DACs input data via the serial interface. 1997 Nov 17 16 Philips Semiconductors Product specification 10-bit analog-to-digital interface for CCD cameras Table 1 Serial interface programming (see note 1) TDA8786; TDA8786A ADDRESS BITS DATA BITS D9 to D0 A2 0 0 0 0 A1 0 0 1 1 A0 0 1 0 1 OFDOUT output control (D7 to D0). Soft clipper control. Only the 4 LSBs (D3 to D0) are used. Bits D9 to D4 should be set to logic 0. AGC gain control (D8 to D0). Partial standby controls for power consumption optimization. Only the 4 LSBs (D3 to D0) are used. Bits D9 to D4 should be set to logic 0: D0 = 1: CDS + AGC + soft clipper block in standby; ICCA + ICCD = 48 mA D1 = 1: optical black clamp + blanking block in standby; ICCA + ICCD = 92 mA D2 = 1: OFD DAC in standby; ICCA + ICCD = 98 mA D3 = 1: 6 dB amplifier (output on AMPOUT pin) in standby; ICCA + ICCD = 98.5 mA. 1 Note 1. At the end of each programming sequence (usually during the video vertical blanking), the soft clipper register must be reloaded (for example if the soft clipper is not used, code 15 must be entered in the soft clipper register at the end of each TDA8786(A) programming sequence). Table 2 Standby selection STDBY 1 0 D9 to D0 LOW active ICCA + ICCD 4 mA (typ.) 99 mA (typ.) 0 0 Clamp reference DAC (D9 to D0). 1997 Nov 17 17 Philips Semiconductors Product specification 10-bit analog-to-digital interface for CCD cameras TDA8786; TDA8786A handbook, full pagewidth IN1 and IN2 PIXEL N CDSP1 (active HIGH) sample N CDSP2 (active HIGH) ,,,,,,, ,,,,, ,, ,,, PIXEL N+1 PIXEL N+2 PIXEL N+3 PIXEL N+4 thd2 td th PIXEL N - 3 PIXEL N - 2 PIXEL N - 1 td (OUT) PIXEL N MGE367 thd1 CLK DATA OUTPUT D0 to D7 PIXEL N - 4 The hatched areas represent active video. Fig.15 Pixel frequency timing diagram. handbook, full pagewidth AGCOUT VIDEO OPTICAL BLACK HORIZONTAL FLYBACK DUMMY VIDEO CLPCDS (active HIGH) CLPOPB (active HIGH) PBK (active HIGH) PREBLANKING OUTPUT CLPADC (active HIGH) VIDEO BLACK LEVEL VIDEO MGE368 Fig.16 Line frequency timing diagram. 1997 Nov 17 18 Philips Semiconductors Product specification 10-bit analog-to-digital interface for CCD cameras APPLICATION INFORMATION TDA8786; TDA8786A TDA8786 and SAA8110 can be used with Sharp CCDs. TDA8786A and SAA8110 can be used with Sony CCDs. Table 3 gives as an example some references of ICs which may be used with Philips TDA8786(A)/SAA8110. This overview is not restrictive, both devices are compatible with other CCD/V-driver/PPG combinations including the more recent ones. Table 3 Possible components for the application of Figs 17 and 18 NTSC CCD TYPE Sony CCDs COMPONENT TYPE CCD V-driver timing generator Sharp CCDs CCD V-driver timing generator Notes to the application diagram 1. In the configuration of Figs 17 and 18, the microcontroller reads and writes data from/to the DSP using the SNERT-bus (UART mode 0). Optional external control is available via the I2C-bus. 2. Free I/O pins of the microcontroller can be used to control PGG, or for other purposes. 3. 83Cxxx processing is synchronized by VD interruption. Depending on VD polarity, it can be necessary to invert VD. 4. A customized 83Cxxx is available for this application. Please contact your nearest Philips sales office. CXD1257AR LZ95G55 ICX056AK MEDIUM RESOLUTION LZ2313H5 HIGH RESOLUTION LZ2353A LZ95G71 ICX068AK CXD1265R MEDIUM RESOLUTION LZ2323H5 LZ95G55 ICX057AK CXD1257AR PAL HIGH RESOLUTION LZ2363 LZ95G71 ICXo69AK CXD1265R LR36683N CXD1250MN, CXD1267N 1997 Nov 17 19 Philips Semiconductors Product specification 10-bit analog-to-digital interface for CCD cameras TDA8786; TDA8786A handbook, full pagewidth P0 P1 CDACOUT CLK1 CLK2 CDSPULSE1 CDSPULSE2 digital ground analog ground P0 (optional, PPG setting) P1 (optional, PPG settings) CDACOUT (optional, can be used for frequency tuning) CLK1 (to ADC and DSP) CLK2 (to DSP, CLK2 = 2 x CLK1) CDSPULSE1 CDSPULSE2 CLAMPCDS (CLAMP CDS, OPB, ADC can be the same) CLAMPOPB CLAMPADC PreBlank (optional) HD (to DSP and C) VD (to DSP and C) FI (to DSP and C) CLK1 CLAMPCDS CDSPULSE1 CDSPULSE2 100 nF VDDA1 100 nF 1 F OEN (optional) (from microcontroller) VDDD CLPCDS 100 nF VCCO OE VERTICAL DRIVER (PPG) CLAMPCDS CLAMPOPB CLAMPADC PreBlank Horizontal Drive Vertical Drive Field Id V4 V3 V2 V1 H1 H2 Electrical Reset Shutter Pulse VERTICAL DRIVER BUFFER Reset CCDout OFD level (optional) CLAMPOPB PreBlank VDDA1 V4 V3 V2 V1 H1 H2 Shutter CCD CLPOPB -xxV +xxV 100 nF SMP_CLK (from DSP) VDDA1 PBK OFDOUT AMPOUT 100 nF AMPOUT AGND1 VCCA1 AGCOUT PBIN 220 nF PBOUT ADCIN CLPADC Vref 220 nF 10 k BC848C VD (from PPG) 10 F VDDD P1.0 P1.1 P1.2 OEN (optional) (to ADC) P1.3 P1.4 P1.5 VDDD 4.7 F JB JB JB JB VDDD P1.6/SCL P1.7/SDA RST P3.0/RxD P3.1/TxD P3.2/INT0 P3.3/INT1 P3.4/T0 P3.5/T1 P3.6/WR P3.7/RD XTAL2 XTAL1 VSS VDD P0.0/AD0 CLAMPADC (from PPG) 1 nF VDDD 48 47 46 45 44 43 42 41 40 39 38 37 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 VRB DEC1 STGE SDATA SCLK STBY DACOUT AGND2 VCCD1 VCCA2 VRT SEN 36 35 34 DGND2 VCCD2 AGND3 VCCA3 CDSP2 CDSP1 CLK IN2 IN1 OGND D9 D8 D7 D6 D5 D4 D3 D2 D1 D0 DGND1 A B C D E F G H I J K SWITCH MODE POWER SUPPLIES (optional) ANALOG-TO-DIGITAL INTERFACE 33 32 31 5V 5V 5V VDDA1 VDDA2 VDDA3 VDDD TDA8786G or TDA8786AG 30 29 28 27 26 25 100 nF VDDD 10 k 2 3 4 5 6 7 8 9 10 11 13 14 15 16 17 18 19 20 21 22 44 43 VDDA1 VSS 4 EPROM A2 6 PCF8598 3 NC VDDD PTC 7 PCF8594 2 4.7 VDD WP k 8 PCF8582 1 SDA SCL 5 100 nF 100 nF P0.1/AD1 MICRO42 CONTROLLER P0.2/AD2 41 40 39 38 37 36 P0.3/AD3 P0.4/AD4 P0.5/AD5 P0.6/AD6 P0.7/AD7 4.7 k L 1 nF 1 nF 2.2 nF 200 nF M VDDD VDDD +5 V GND SCL SDA 83C54/ 35 EA VDDD 83C654 ALE (OM-XXX) 33 PSEN 32 31 30 29 28 27 26 25 24 P2.7/A15 P2.6/A14 P2.5/A13 P2.4/A12 P2.3/A11 P2.2/A10 P2.1/A9 P2.0/A8 MGK393 4 3 2 1 A0/SNDA SCL/SNCL HD (opt.) FIIN A1/SNRES 18 pF 12 MHz RESET_DSP (to DSP) 18 pF Fig.17 SAA8110G system configuration for camera application (continued in Fig.18). 1997 Nov 17 20 Philips Semiconductors Product specification 10-bit analog-to-digital interface for CCD cameras TDA8786; TDA8786A handbook, full pagewidth 26 25 22 A1/SNRES A0/SNDA SDA SCL/SNCL VDDD 100 nF VDDD optional 100 nF A1/SNRES VDDD(C3) VSSD(P2) SCL/SNCL VSSD(C3) Y7 VDDD(P2) XOUT XIN VSSD(C4) SDA A0/SNDA DIGITAL OUTPUT CONNECTOR 24 23 21 19 17 15 13 11 9 7 5 3 1 VDDD 20 18 16 14 12 10 8 6 4 VDDD 2 Y4 Y0 Y2 Y5 Y1 100 nF V DDD(C1) CLK1 VD HD FI CLK1 VSYNCIN HSYNCIN 80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 1 2 3 4 60 59 58 57 56 Y3 Y6 VDDD UV0 UV1 UV2 UV3 UV4 UV5 UV6 UV7 VSSD(P1) LLC CREF/PXQ HREF VSYNCOUT FIOUT CLK2 VDDD(P1) VDDA(BG) RBIAS CLK2 (from PPG) VDDD 47 k VDDA3 100 nF A B C D E F G H I J K FIIN 5 VSSD(C1) 6 CCD9 7 CCD8 8 CCD7 9 CCD6 10 CCD5 11 CCD4 12 CCD3 13 CCD2 14 CCD1 15 CCD0 16 VSSD(C2) 17 SCLK 18 VSSA(CD) 19 CDACOUT 20 10 nF DIGITAL SIGNAL PROCESSOR 55 54 53 52 51 SAA8110G 50 49 48 47 46 45 44 43 CDACOUT VDDA(CD) VDDD(C2) SDATA STROBE SMP SIS T0 VSSA(OB) OUT2 VDDA(O2) CDACRBIAS OUT1 VDDA(O1) P0 P1 RESET T2 T1 OUT3 VDDA(O3) 100 nF DECOUPL VSSA(BG) 100 nF 42 VDDA(DC) VDDA3 41 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 100 nF SVHS 3 16 5 27 4 L(1) L(1) 68 L(1) Y 150 k 100 nF VDDA2 L M SMP_CLK (to power supply) P0 P1 VDDD digital ground analog ground 100 nF VDDD RESET_DSP (from C) VDDA3 100 nF VDDA3 100 nF Green 6 1 7 2 12 8 3 9 4 10 5 15 14 13 11 L(1) L(1) 68 L(1) C U, Blue L(1) L(1) 68 L(1) V, Red CVBS CVBS-RCA MGK394 (1) Values depend on DSP output configuration. Fig.18 SAA8110G system configuration for camera application (continued from Fig.17). 1997 Nov 17 21 Philips Semiconductors Product specification 10-bit analog-to-digital interface for CCD cameras PACKAGE OUTLINE LQFP48: plastic low profile quad flat package; 48 leads; body 7 x 7 x 1.4 mm TDA8786; TDA8786A SOT313-2 c y X 36 37 25 24 ZE A e E HE A A2 A1 (A 3) Lp L detail X wM pin 1 index 48 1 12 ZD bp D HD wM B vM B vM A 13 bp e 0 2.5 scale 5 mm DIMENSIONS (mm are the original dimensions) UNIT mm A max. 1.60 A1 0.20 0.05 A2 1.45 1.35 A3 0.25 bp 0.27 0.17 c 0.18 0.12 D (1) 7.1 6.9 E (1) 7.1 6.9 e 0.5 HD 9.15 8.85 HE 9.15 8.85 L 1.0 Lp 0.75 0.45 v 0.2 w 0.12 y 0.1 Z D (1) Z E (1) 0.95 0.55 0.95 0.55 7 0o o Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT313-2 REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION ISSUE DATE 94-12-19 97-08-01 1997 Nov 17 22 Philips Semiconductors Product specification 10-bit analog-to-digital interface for CCD cameras SOLDERING Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "IC Package Databook" (order code 9398 652 90011). Reflow soldering Reflow soldering techniques are suitable for all LQFP packages. Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several methods exist for reflowing; for example, infrared/convection heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 50 and 300 seconds depending on heating method. Typical reflow peak temperatures range from 215 to 250 C. Wave soldering Wave soldering is not recommended for LQFP packages. This is because of the likelihood of solder bridging due to closely-spaced leads and the possibility of incomplete solder penetration in multi-lead devices. CAUTION Wave soldering is NOT applicable for all LQFP packages with a pitch (e) equal or less than 0.5 mm. TDA8786; TDA8786A If wave soldering cannot be avoided, for LQFP packages with a pitch (e) larger than 0.5 mm, the following conditions must be observed: * A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. * The footprint must be at an angle of 45 to the board direction and must incorporate solder thieves downstream and at the side corners. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Maximum permissible solder temperature is 260 C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 C within 6 seconds. Typical dwell time is 4 seconds at 250 C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Repairing soldered joints Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron (less than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C. 1997 Nov 17 23 Philips Semiconductors Product specification 10-bit analog-to-digital interface for CCD cameras DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values TDA8786; TDA8786A This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications. Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. 1997 Nov 17 24 Philips Semiconductors Product specification 10-bit analog-to-digital interface for CCD cameras NOTES TDA8786; TDA8786A 1997 Nov 17 25 Philips Semiconductors Product specification 10-bit analog-to-digital interface for CCD cameras NOTES TDA8786; TDA8786A 1997 Nov 17 26 Philips Semiconductors Product specification 10-bit analog-to-digital interface for CCD cameras NOTES TDA8786; TDA8786A 1997 Nov 17 27 Philips Semiconductors - a worldwide company Argentina: see South America Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113, Tel. +61 2 9805 4455, Fax. +61 2 9805 4466 Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213, Tel. +43 160 1010, Fax. +43 160 101 1210 Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6, 220050 MINSK, Tel. +375 172 200 733, Fax. +375 172 200 773 Belgium: see The Netherlands Brazil: see South America Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor, 51 James Bourchier Blvd., 1407 SOFIA, Tel. +359 2 689 211, Fax. +359 2 689 102 Canada: PHILIPS SEMICONDUCTORS/COMPONENTS, Tel. +1 800 234 7381 China/Hong Kong: 501 Hong Kong Industrial Technology Centre, 72 Tat Chee Avenue, Kowloon Tong, HONG KONG, Tel. +852 2319 7888, Fax. +852 2319 7700 Colombia: see South America Czech Republic: see Austria Denmark: Prags Boulevard 80, PB 1919, DK-2300 COPENHAGEN S, Tel. +45 32 88 2636, Fax. +45 31 57 0044 Finland: Sinikalliontie 3, FIN-02630 ESPOO, Tel. +358 9 615800, Fax. +358 9 61580920 France: 51 Rue Carnot, BP317, 92156 SURESNES Cedex, Tel. +33 1 40 99 6161, Fax. +33 1 40 99 6427 Germany: Hammerbrookstrae 69, D-20097 HAMBURG, Tel. +49 40 23 53 60, Fax. +49 40 23 536 300 Greece: No. 15, 25th March Street, GR 17778 TAVROS/ATHENS, Tel. +30 1 4894 339/239, Fax. +30 1 4814 240 Hungary: see Austria India: Philips INDIA Ltd, Band Box Building, 2nd floor, 254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025, Tel. +91 22 493 8541, Fax. +91 22 493 0966 Indonesia: see Singapore Ireland: Newstead, Clonskeagh, DUBLIN 14, Tel. +353 1 7640 000, Fax. +353 1 7640 200 Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053, TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007 Italy: PHILIPS SEMICONDUCTORS, Piazza IV Novembre 3, 20124 MILANO, Tel. +39 2 6752 2531, Fax. +39 2 6752 2557 Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108, Tel. +81 3 3740 5130, Fax. +81 3 3740 5077 Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL, Tel. +82 2 709 1412, Fax. +82 2 709 1415 Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR, Tel. +60 3 750 5214, Fax. +60 3 757 4880 Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905, Tel. +9-5 800 234 7381 Middle East: see Italy Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB, Tel. +31 40 27 82785, Fax. +31 40 27 88399 New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND, Tel. +64 9 849 4160, Fax. +64 9 849 7811 Norway: Box 1, Manglerud 0612, OSLO, Tel. +47 22 74 8000, Fax. +47 22 74 8341 Philippines: Philips Semiconductors Philippines Inc., 106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI, Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474 Poland: Ul. Lukiska 10, PL 04-123 WARSZAWA, Tel. +48 22 612 2831, Fax. +48 22 612 2327 Portugal: see Spain Romania: see Italy Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW, Tel. +7 095 755 6918, Fax. +7 095 755 6919 Singapore: Lorong 1, Toa Payoh, SINGAPORE 1231, Tel. +65 350 2538, Fax. +65 251 6500 Slovakia: see Austria Slovenia: see Italy South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale, 2092 JOHANNESBURG, P.O. Box 7430 Johannesburg 2000, Tel. +27 11 470 5911, Fax. +27 11 470 5494 South America: Al. Vicente Pinzon, 173, 6th floor, 04547-130 SAO PAULO, SP, Brazil, Tel. +55 11 821 2333, Fax. +55 11 821 2382 Spain: Balmes 22, 08007 BARCELONA, Tel. +34 3 301 6312, Fax. +34 3 301 4107 Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM, Tel. +46 8 632 2000, Fax. +46 8 632 2745 Switzerland: Allmendstrasse 140, CH-8027 ZURICH, Tel. +41 1 488 2686, Fax. +41 1 481 7730 Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1, TAIPEI, Taiwan Tel. +886 2 2134 2865, Fax. +886 2 2134 2874 Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd., 209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260, Tel. +66 2 745 4090, Fax. +66 2 398 0793 Turkey: Talatpasa Cad. No. 5, 80640 GULTEPE/ISTANBUL, Tel. +90 212 279 2770, Fax. +90 212 282 6707 Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7, 252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461 United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes, MIDDLESEX UB3 5BX, Tel. +44 181 730 5000, Fax. +44 181 754 8421 United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409, Tel. +1 800 234 7381 Uruguay: see South America Vietnam: see Singapore Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD, Tel. +381 11 625 344, Fax.+381 11 635 777 For all other countries apply to: Philips Semiconductors, International Marketing & Sales Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825 (c) Philips Electronics N.V. 1997 Internet: http://www.semiconductors.philips.com SCA56 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands 547047/1200/03/pp28 Date of release: 1997 Nov 17 Document order number: 9397 750 02926 |
Price & Availability of TDA8786G
![]() |
|
|
All Rights Reserved © IC-ON-LINE 2003 - 2022 |
[Add Bookmark] [Contact Us] [Link exchange] [Privacy policy] |
Mirror Sites : [www.datasheet.hk]
[www.maxim4u.com] [www.ic-on-line.cn]
[www.ic-on-line.com] [www.ic-on-line.net]
[www.alldatasheet.com.cn]
[www.gdcy.com]
[www.gdcy.net] |