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TS256MRMMC4 Description TS256MRMMC4 is a 256MB MMCmobile memory card. It's a fastest, low-power, highly integration memory card. TS256MRMMC4 is designed to provide an inexpensive, mechanically robust storage medium in card form for multimedia consumer applications and mobile devices (handheld PCs, digital cameras, MP3 players, etc.) to store, copy, and move data at high-speed transfer rate. 256MB MMCmobile Features * Storage Capacity: 256MB * Support Dual Operating Voltage: 2.7~3.6V/1.65~1.95V * Support clock frequencies: 0~52MHz * Support different Bus width: x1, x4, x8 * Operating Temperature: -25C ~ 85C * Storage Temperature:-40~85 * Data access mode: Word mode * Data Transfer Rate(Maximum): Read:16MB/sec,Write:15MB/sec * Placement Fully compatible with MultiMediaCard system specification version 4.0 and backwards compatibility with previous specification * Form Factor: 18mm x 24mm x 1.4mm Front Pin Definition Back MMC Mode Pin No. 1 2 3 4 5 6 7 Name DAT3 CMD VSS1 VDD CLK VSS2 DAT0 Type I/O/PP I/O/PP/OD S S I S I/O/PP Description Data Command/Response Ground Power supply Clock Ground Data Name CS DI VSS VDD SCLK VSS2 DO SPI Mode Type I I/PP S S I S O/PP Description Chip select Data in Ground Power supply Clock Ground Data out 8 9 10 11 12 13 DAT1 DAT2 DAT4 DAT5 DAT6 DAT7 I/O/PP I/O/PP I/O/PP I/O/PP I/O/PP I/O/PP Data Data Data Data Data Data Not used Not used Not used Not used Not used Not used S: Power Supply; I:Input; O:Output; PP:Push-Pull; OD:Open-Drain; NC:Not Connected Transcend Information Inc. 1 TS256MRMMC4 MultiMediaCard Architecture 256MB MMCmobile Transcend Information Inc. 2 TS256MRMMC4 Temperature Characteristics Parameter Operating temperature Storage temperature Junction temperature 256MB MMCmobile Min. -25 -40 Max. 85 85 95 Unit Electrical Characteristics * Absolute Maximum Ratings Parameter Power Supply Voltage Input Voltage Input/Output Voltage Symbol VCC VIN VI/O Rating -0.6~+4.6 -0.6~+4.6 -0.6~+4.6 Unit V V V * Recommended Operation Conditions Parameter Power Supply Voltage (High Voltage Range) Power Supply Voltage (Low Voltage Range) Symbol VDDH VDDL Min. 2.7 1.65 Typ. 3.3 1.8 Max. 3.6 1.95 Unit V V Transcend Information Inc. 3 TS256MRMMC4 DC Characteristics * High Voltage Power Supply 256MB MMCmobile (Ta=-25 to 85,VDDH=2.7V to3.6V) Parameter Output Low Voltage (OD) Output High Voltage (PP) Output Low Voltage (PP) Input High Voltage Input Low Voltage Operating Current Stand-by Current Input Leakage Current Output Leakage Current Pin Capacitance Power Output Voltage Symbol VODOL VOH VOL VIH VIL ICC ISB ILI ILO CP VF Min. 0.75* VDDH Typ. Max. 0.3 Unit V V Condition IOL =2mA IOH =-100uA IOL =100uA 0.125* VDDH 0.625* VDDH -0.3 VDDH +0.3 0.25* VDDH 20(TBD) 400(TBD) -10/+10 -10/+10 7 1.50 1.8 1.95 V V V mA uA uA uA pF V IVCCF =0mA VIN =0 to VDDH VOUT =0 to VDDH IF240mA * Low Voltage Power Supply (Ta=-25 to 85,VDDL=1.65V to 1.95V) Parameter Output High Voltage Output Low Voltage Input High Voltage Input Low Voltage Operating Current Stand-by Current Input Leakage Current Output Leakage Current Pin Capacitance Symbol VOH VOL VIH VIL ICC ISB ILI ILO CP Min. VDDL -0.2 Typ. Max. 0.2 Unit V V V V mA uA uA uA pF Condition IOH =-100uA IOL =100uA 0.7* VDDL -0.3 VDDL +0.3 0.3* VDDL 20(TBD) 400(TBD) -10/+10 -10/+10 7 IVCCF =0mA VIN =0 to VDDL VOUT =0 to VDDL Transcend Information Inc. 4 TS256MRMMC4 AC Characteristics * High Speed Card Interface Timing 256MB MMCmobile (Ta=-25 to 85,VDDH=2.7V to3.6V) Parameter Clock Frequency (Data Transfer Mode) Clock Frequency (Identification Mode) Clock Low Time Clock Rise Time Clock Fall Time Input Set-up Time Input Hold Time Output Delay Time Signal Rise Time Signal Fall Time Symbol fpp fOD tWL tTLH tTHL tISU tIH tDLY trise tfall Min. 26 0 6.5 Max. 52 400 Unit MHz KHz ns Notes 3 3 3 3 5 14 3 3 ns ns ns ns ns ns ns CL30pF CL30pF CL30pF * Backwards Compatible Card Interface Timing Transcend Information Inc. 5 TS256MRMMC4 Parameter Clock Frequency (Data Transfer Mode) Clock Frequency (Identification Mode) Clock Low Time Clock Rise Time Clock Fall Time Input Set-up Time Input Hold Time Output Delay Time 256MB MMCmobile (Ta=-25 to 85,VDDH=2.7V to3.6V) Symbol fpp fOD tWL tTLH tTHL tISU tIH tDLY Min. 0 0 10 Max. 20 400 Unit MHz KHz ns Notes 10 10 3 3 9.7 35 ns ns ns ns ns CL30pF * Command Latch Cycle Transcend Information Inc. 6 TS256MRMMC4 Parameter CLE Setup Time CLE Hold Time CE Setup Time CE Hold Time ALE Setup Time ALE Hold Time WE Pulse Width Data Setup Time Data Hold Time Symbol Min. 30 tCLS1 tCLH1 tCS1 tCH1 tALS1 tALH1 tWP1 tDS1 tDH1 15 40 90 90 75 45 90 30 Unit ns ns ns ns ns ns ns ns ns 256MB MMCmobile Notes CL<=80pF CL<=80pF CL<=80pF CL<=80pF CL<=80pF CL<=80pF CL<=80pF CL<=80pF CL<=80pF * Address Latch Cycle Transcend Information Inc. 7 TS256MRMMC4 Parameter CLE Setup Time CE Setup Time ALE Setup Time ALE Hold Time Write Cycle Time WE Pulse Width WE High Hold Time Data Setup Time Data Hold Time Symbol tCLS2 tCS2 tALS2 tALH2 tWC2 tWP2 tWH2 tDS2 tDH2 Min. 90 195 30 15 150 45 105 90 30 Unit ns ns ns ns ns ns ns ns ns 256MB MMCmobile Remark CL<=80pF CL<=80pF CL<=80pF CL<=80pF CL<=80pF CL<=80pF CL<=80pF CL<=80pF CL<=80pF * Input Data Latch Cycle Transcend Information Inc. 8 TS256MRMMC4 Parameter CLE Hold Time CE Hold Time ALE Setup Time Write Cycle Time WE Pulse Width WE High Hold Time Data Setup Time Data Hold Time Symbol tCLH3 tCH3 tALS3 tWC3 tWP3 tWH3 tDS3 tDH3 Min. 285 195 90 60 45 15 30 30 Unit ns ns ns ns ns ns ns ns 256MB MMCmobile Remark CL<=80pF CL<=80pF CL<=80pF CL<=80pF CL<=80pF CL<=80pF CL<=80pF CL<=80pF Transcend Information Inc. 9 TS256MRMMC4 * Serial Access Cycle after Read Parameter CE Access Time Read Cycle Time RE Pulse Width RE High Hold Time Data Setup Time Data Hold Time Ready to RE Low Symbol tCEA4 tRC4 tRP4 tREH4 tDS4 tDH4 tRR4 Min. 285 60 45 15 5(TBD) 5(TBD) 285 Unit ns ns ns ns ns ns ns 256MB MMCmobile Remark CL<=80pF CL<=80pF CL<=80pF CL<=80pF CL<=80pF CL<=80pF CL<=80pF Transcend Information Inc. 10 TS256MRMMC4 Reliability and Durability Temperature Operation: -25C / 85C Storage: -40C (168h) / 85C (500h) Junction temperature: max. 95C 256MB MMCmobile Moisture and corrosion Operation: 25C / 95% rel. humidity Stress: 40C / 93% rel. hum./500h Salt Water Spray: 3% NaCl/35C; 24h acc. MIL STD Method 1009 Contact Pads: +/-4kV, Human body model according to ANSI EOS/ESD-S5.1-1998 Non Contact Pads area: +/-8kV(coupling plane discharge) +/-15kV(air discharge) Human body model according to IEC61000-4-2 10.000 mating cycles; test procedure: t.b.d. t.b.d. t.b.d. 1.5m free fall UV: 200nm, 15Ws/cm according to ISO 7816-1 No warp page; no mold skin; complete form; no cavities surface smoothness sigma -0.1 mm/cm within contour; no cracks; no pollution (fat, oil dust, etc.) ESD protection Durability Bending Torque Drop test UV light exposure Visual inspection Shape and form Above technical information is based on MMC4.0 standard specification and tested to be reliable. However, Transcend makes no warranty, either expressed or implied, as to its accuracy and assumes no liability in connection with the use of this product. Transcend reserves the right to make changes in specifications at any time without prior notice. Transcend Information Inc. 11 |
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