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UG12JT, UGF12JT, UGB12JT Series
New Product
Vishay Semiconductors
formerly General Semiconductor
Reverse Voltage 500 to 600V Forward Current 12A Reverse Recovery Time 30ns
Ultrafast Rectifiers
ITO-220AC (UGF12 Series)
0.405 (10.27) 0.383 (9.72) 0.188 (4.77) 0.172 (4.36) 0.110 (2.80) 0.100 (2.54) 0.185 (4.70) 0.175 (4.44) 0.154 (3.91) 0.370 (9.40) 0.360 (9.14) 0.148 (3.74) 0.113 (2.87) 0.103 (2.62) 0.145 (3.68) 0.135 (3.43) 0.410 (10.41) 0.390 (9.91) PIN 1 0.160 (4.06) 0.140 (3.56) 2 1.148 (29.16) 1.118 (28.40) 0.110 (2.79) 0.100 (2.54) 0.560 (14.22) 0.530 (13.46)
CASE
TO-220AC (UG12 Series)
0.415 (10.54) MAX. DIA. 0.140 (3.56) DIA. 0.130 (3.30)
0.131 (3.39) DIA. 0.122 (3.08)
0.055 (1.39) 0.045 (1.14)
0.600 (15.5) 0.580 (14.5)
0.676 (17.2) 0.646 (16.4) 0.350 (8.89) 0.330 (8.38)
PIN 1 2
0.635 (16.13) 0.625 (15.87)
0.350 (8.89) 0.330 (8.38)
0.603 (15.32) 0.573 (14.55)
0.191 (4.85) 0.171 (4.35) 0.560 (14.22) 0.530 (13.46) 0.060 (1.52)
PIN 1 PIN 2
0.110 (2.80) 0.100 (2.54)
PIN 1 PIN 2
0.205 (5.20) 0.195 (4.95)
0.037 (0.94) 0.027 (0.69)
0.022 (0.55) 0.014 (0.36)
0.105 (2.67) 0.095 (2.41) 0.205 (5.20) 0.195 (4.95) 0.037 (0.94) 0.027 (0.68) 0.022 (0.56) 0.014 (0.36)
TO-263AB (UGB12 Series)
0.411 (10.45) 0.380 (9.65) 0.245 (6.22) MIN K 0.055 (1.40) 0.047 (1.19) 1 K 2 0.624 (15.85) 0.591 (15.00) 0-0.01 (0-0.254) 0.110 (2.79) 0.090 (2.29) 0.027 (0.686) 0.037 (0.940)
PIN 1 PIN 2 K - HEATSINK
0.190 (4.83) 0.160 (4.06) 0.055 (1.40) 0.045 (1.14)
Mounting Pad Layout TO-263AB
0.42 (10.66)
0.33 (8.38) 0.63 (17.02)
0.360 (9.14) 0.320 (8.13)
Dimensions in inches and (millimeters)
0.021 (0.53) 0.014 (0.36) 0.140 (3.56) 0.110 (2.79)
0.08 (2.032) 0.24 (6.096)
0.105 (2.67)
0.12 (3.05)
0.095 (2.41)
0.205 (5.20) 0.195 (4.95)
Features
* Plastic package has Underwriters Laboratories Flammability Classification 94V-0 * Ideally suited for freewheeling diode and power factor correction applications * Soft recovery characteristics * Excellent high temperature switching * Optimized to reduce switching losses * Glass passivated chip junction
Mechanical Data
Case: JEDEC TO-220AC, ITO-220AC & TO-263AB molded plastic body Terminals: Plated leads, solderable per MIL-STD-750, Method 2026 High temperature soldering in accordance with CECC 802 / Reflow guaranteed Polarity: As marked Mounting Position: Any Mounting Torque: 10 in-lbs maximum Weight: 0.08 oz., 2.24 g
www.vishay.com 1
Document Number 88758 30-Jul-02
UG12JT, UGF12JT, UGB12JT Series
Vishay Semiconductors
formerly General Semiconductor
Maximum Ratings
Parameter
(TC = 25C unless otherwise noted)
Symbol VRRM VRWM VRMS VDC IF(AV) IFSM TJ, TSTG VISOL
UG12HT 500 400 350 500 12 135 -55 to +150 4500(1) 3500(2) 1500(3)
UG12JT 600 480 420 600
Unit V V V V A A C V
Maximum repetitive peak reverse voltage Maximum working reverse voltage Maximum RMS voltage Maximum DC blocking voltage Maximum average forward rectified current Peak forward surge current 8.3ms single half sine-wave superimposed on rated load (JEDEC Method) Operating junction and storage temperature range RMS Isolation voltage (UGF types only) from terminals to heatsink with t = 1.0 second, RH 30%
Electrical Characteristics (TC = 25C unless otherwise noted)
Parameter Maximum instantaneous forward voltage(4) IF = 12A, TJ = 25C IF = 12A, TJ = 125C TJ = 25C TJ = 100C TJ = 125C Symbol VF IR trr trr S IRM tfr UG12HT 1.75 1.50 30 800 4.0 30 50 0.9 7.5 500 UG12JT Unit V A A mA ns ns -- A ns
Maximum DC reverse current at VRWM Maximum reverse recovery time at IF = 0.5A, IR = 1.0A, Irr = 0.25A
Maximum reverse recovery time at IF = 1.0A, di/dt = 50A/s, VR = 30V, Irr = 0.1 IRM Typical softness factor (tb/ta) IF = 12A, di/dt = 240A/s, VR = 400V, Irr = 0.1 IRM Maximum reverse recovery current at IF = 12A, di/dt = 96A/s, VR = 400V, TC = 125C Peak forward recovery time at IF = 12A, di/dt = 96A/s, VF = 1.1V
Thermal Characteristics (TC = 25C unless otherwise noted)
Parameter Typical thermal resistance from junction to case
Notes: (1) (2) (3) (4)
Symbol RJC
UG12 1.73
UGF12 3.04
UGB12 1.73
Unit C/W
Clip mounting (on case), where lead does not overlap heatsink with 0.110" offset Clip mounting (on case), where leads do overlap heatsink Screw mounting with 4-40 screw, where washer diameter is 4.9 mm (0.19") Pulse test: 300s pulse width, 1% duty cycle
Ordering Information
Product UG12HT & UG12JT UGF12HT & UGF12JT UGB12HT & UGB12JT Case TO-220AC ITO-220AC TO-263AB Package Code 45 45 31 45 81 Package Option Anti-Static tube, 50/tube, 2K/carton Anti-Static tube, 50/tube, 2K/carton 13" reel, 800/reel, 4.8K/carton Anti-Static tube, 50/tube, 2K/carton Anti-Static 13" reel, 800/reel, 4.8K/carton
www.vishay.com 2
Document Number 88758 30-Jul-02
UG12JT, UGF12JT, UGB12JT Series
Vishay Semiconductors
formerly General Semiconductor
Ratings and Characteristic Curves (TA = 25C unless otherwise noted)
Fig. 1 - Forward Current Derating Curve
16 200
Fig. 2 - Maximum Non-Repetitive Peak Forward Surge Current
Peak Forward Surge Current (A)
175 150 125 100 75 50 25 0
14
Average Forward Current (A)
12 10 8 6 4 2 0 0 25 50 75 UGF12HT, UGF12JT
UG12HT, UG12JT, UGB12HT, UGB12JT
100
125
150
175
1
10
100
Case Temperature (C)
Number of Cycles at 60 HZ
Fig. 3 - Typical Instantaneous Forward Characteristics Per Leg
100 10,000
Fig. 4 - Typical Reverse Leakage Characteristics Per Leg
Instantaneous Reverse Leakage Current (A)
TJ = 125C 1,000 TJ = 100C
Instantaneous Forward Current (A)
10 TJ = 125C
1 TJ = 100C TJ = 25C
100
0.1
10 TJ = 25C 1
0.01 0.1 0.3 0.5 0.7 0.9 1.0 1.3 1.5 1.7 1.9 2.1
0
20
40
60
80
100
Instantaneous Forward Voltage (V)
Percent of Rated Peak Reverse Voltage (%)
Fig. 5 - Typical Junction Capacitance Per Leg
Stored Charge / Reverse Recovery Time (nC/ns)
100
Fig. 6 - Reverse Switching Characteristics Per Leg
400 350 300 12A, 240A/s, 400V 250 200 150 100 1A, 50A/s, 30V 50 0 25 50 75 100 125 12A, 240A/s, 400V 1A, 50A/s, 30V trr Qrr
Junction Capacitance (pF)
10
1 1 10 100
Reverse Voltage (V) Document Number 88758 30-Jul-02
Junction Temperature (C) www.vishay.com 3

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