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Fiber Optics
V23838-M305-M56 SFP - Small Form-factor Pluggable 1.25 Gigabit Ethernet (1000 Base-SX) 2.125/1.0625 Gbit/s Fibre Channel (200-M5/M6-SN-I / 100-M5/M6-SN-I) Multimode 850 nm Transceiver with LCTM Connector
Features * Small Form-factor Pluggable (SFP) MSA compatible transceiver1) * Advanced release mechanism * Easy access, even in belly to belly applications * Wire handle release for simplicity * Color coded black tab (multimode) * PCI height compatible File: 1130 * Excellent EMI performance * Common ground concept * RJ-45 style LCTM connector system * Single power supply (3.3 V) * Extremely low power consumption of 530 mW typical * Small size for high channel density * UL-94 V-0 certified * ESD Class 1C per JESD22-A114-B (MIL-STD 883D Method 3015.7) * According to FCC (Class B) and EN 55022 File: 1131 * For distances of up to 860 m (50 m fiber) * Laser safety according to Class 1 FDA and IEC * AC/AC Coupling according to MSA * Extended operating temperature range of -20C to 85C * SFP evaluation kit V23848-S5-V4 available upon request * A press fit cage and cage plugs are available as accessory products from Infineon (see SFP Accessories)
1)
MSA documentation can be found at www.infineon.com/fiberoptics under Transceivers, SFP Transceivers.
LCTM is a trademark of Lucent
Data Sheet
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V23838-M305-M56
Pin Configuration Pin Configuration
20 19 18 17 16 15 14 13 12 11
VEET TD- TD+ VEET VCCT VCCR VEER RD+ RD- VEER
1 2 3 4 5 6 7 8 9 10
VEET Tx Fault Tx Disable MOD-DEF(2) MOD-DEF(1) MOD-DEF(0) Rate Select LOS VEER VEER
Top of transceiver
Bottom of transceiver (as viewed through top of transceiver)
File: 1306
Figure 1
SFP Transceiver Electrical Pad Layout
Data Sheet
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V23838-M305-M56
Pin Configuration Pin Description Pin No. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20
1) 2) 3) 4) 5) 6) 7)
Name
Logic Level N/A LVTTL LVTTL LVTTL LVTTL N/A N/A LVTTL N/A N/A N/A LVPECL LVPECL N/A N/A N/A N/A LVPECL LVPECL N/A
Function Transmitter Ground1) Transmitter Fault Indication2) 8) Transmitter Disable3) Module Definition 24) 8) Module Definition 15) 8) Module Definition 06) 8) Not connected Loss Of Signal7) 8) Receiver Ground1) Receiver Ground1) Receiver Ground1) Inv. Received Data Out9) Received Data Out9) Receiver Ground1) Receiver Power Transmitter Power Transmitter Ground1) Transmit Data In10) Inv. Transmit Data In10) Transmitter Ground1)
VEET
Tx Fault Tx Disable MOD-DEF(2) MOD-DEF(1) MOD-DEF(0) Rate Select LOS
VEER VEER VEER
RD- RD+
VEER VCCR VCCT VEET
TD+ TD-
VEET
8) 9) 10)
Common transmitter and receiver ground within the module. A high signal indicates a laser fault of some kind and that laser is switched off. A low signal switches the transmitter on. A high signal or when not connected switches the transmitter off. MOD-DEF(2) is the data line of two wire serial interface for serial ID. MOD-DEF(1) is the clock line of two wire serial interface for serial ID. MOD-DEF(0) is grounded by the module to indicate that the module is present. A low signal indicates normal operation, light is present at receiver input. A high signal indicates the received optical power is below the worst case receiver sensitivity. Should be pulled up on host board to VCC by 4.7 - 10 k. AC coupled inside the transceiver. Must be terminated with 100 differential at the user SERDES. AC coupled and 100 differential termination inside the transceiver.
Data Sheet
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V23838-M305-M56
Description Description The Infineon Fibre Channel / Gigabit Ethernet multimode transceiver - part of Infineon SFP family - is compatible to the Physical Medium Depend (PMD) sublayer and baseband medium, type 1000 Base-SX (short wavelength) as specified in IEEE Std 802.3 and Fibre Channel FC-PI-2 (Rev. 5.0) 200-M5-SN-I, 200-M6-SN-I for 2.125 Gbit/s, and FC-PI-2 (Rev. 5.0) 100-M5-SN-I, 100-M6-SN-I for 1.0625 Gbit/s. The appropriate fiber optic cable is 62.5 m or 50 m multimode fiber with LCTM connector. Link Length as Defined by IEEE and Fibre Channel Standards Fiber Type min.1) at 1.0625 Gbit/s 50 m, 2000 MHz*km 50 m, 500 MHz*km 50 m, 400 MHz*km 62.5 m, 200 MHz*km 62.5 m, 160 MHz*km at 1.25 Gbit/s 50 m, 500 MHz*km 50 m, 400 MHz*km 62.5 m, 200 MHz*km 62.5 m, 160 MHz*km at 2.125 Gbit/s 50 m, 2000 MHz*km 50 m, 500 MHz*km 50 m, 400 MHz*km 62.5 m, 200 MHz*km 62.5 m, 160 MHz*km
1)
Reach max.2) 860 500 450 300 250 550 500 275 220 500 300 260 150 120
Unit
2 2 2 2 2 2 2 2 2 2 2 2 2 2
meters
meters
meters
2)
Minimum reach as defined by IEEE and Fibre Channel Standards. A 0 m link length (loop-back connector) is supported. Maximum reach as defined by IEEE and Fibre Channel Standards. Longer reach possible depending upon link implementation.
Data Sheet
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V23838-M305-M56
Description The Infineon SFP multimode transceiver is a single unit comprised of a transmitter, a receiver, and an LCTM receptacle. This transceiver supports the LCTM connectorization concept. It is compatible with RJ-45 style backpanels for high end datacom and telecom applications while providing the advantages of fiber optic technology. The module is designed for low cost SAN, LAN, Fibre Channel and Gigabit Ethernet applications. It can be used as the network end device interface in mainframes, workstations, servers, and storage devices, and in a broad range of network devices such as bridges, routers, hubs, and local and wide area switches. This transceiver operates at 1.0625 Gbit/s / 1.25 Gbit/s / 2.125 Gbit/s from a single power supply (+3.3 V). The 100 differential data inputs and outputs are LVPECL and CML compatible. Functional Description of SFP Transceiver This transceiver is designed to transmit serial data via multimode cable.
Tx Fault Automatic Shut-Down Tx Disable Tx Coupling Unit TD+ TD- Laser Driver e/o Laser
Power Control Monitor
o/e Multimode Fiber Rx Coupling Unit
RD+ RD- LOS MOD-DEF(2) MOD-DEF(1) EEPROM
File: 1361
Limiting Amp
TIA
o/e
Figure 2
Functional Diagram
Data Sheet
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V23838-M305-M56
Description The receiver component converts the optical serial data into CML compatible electrical data (RD+ and RD-). The Loss Of Signal (LOS) shows whether an optical signal is present. The transmitter converts CML compatible electrical serial data (TD+ and TD-) into optical serial data. Data lines are differentially 100 terminated. The transmitter contains a laser driver circuit that drives the modulation and bias current of the laser diode. The currents are controlled by a power control circuit to guarantee constant output power of the laser over temperature and aging. The power control uses the output of the monitor PIN diode (mechanically built into the laser coupling unit) as a controlling signal, to prevent the laser power from exceeding the operating limits. Single fault condition is ensured by means of an integrated automatic shutdown circuit that disables the laser when it detects laser fault to guarantee the laser Eye Safety. The transceiver contains a supervisory circuit to control the power supply. This circuit makes an internal reset signal whenever the supply voltage drops below the reset threshold. It keeps the reset signal active for at least 140 milliseconds after the voltage has risen above the reset threshold. During this time the laser is inactive. A low signal on TxDis enables transmitter. If TxDis is high or not connected the transmitter is disabled. The serial ID interface defines a 256 byte memory map in EEPROM, accessible over a 2 wire, serial interface at the 8 bit address 1010000X (A0h).
Data Sheet
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V23838-M305-M56
Description Regulatory Compliance (EMI) Feature ESD: Electrostatic Discharge to the Electrical Pins Immunity: Against Electrostatic Discharge (ESD) to the Duplex LC Receptacle Immunity: Against Radio Frequency Electromagnetic Field Standard EIA/JESD22-A114-B (MIL-STD 883D method 3015.7) EN 61000-4-2 IEC 61000-4-2 Comments Class 1C
Discharges ranging from 2 kV to 15 kV on the receptacle cause no damage to transceiver (under recommended conditions). With a field strength of 10 V/m, noise frequency ranges from 10 MHz to 2 GHz. No effect on transceiver performance between the specification limits. Noise frequency range: 30 MHz to 18 GHz
EN 61000-4-3 IEC 61000-4-3
Emission: FCC 47 CFR Part 15, Radiated Field Strength Class B CISPR 22 EN 55022 Class B Compliant with 89/336/EEC
File: 1400
EN 55022 EN 55024
SFP
V23838-M305-M56 Tested To Comply With FCC Standards
FOR HOME OR OFFICE USE
File: 1406
This device complies with part 15 of the FCC Rules1). Operation is subject to the following two conditions: 1 This device may not cause harmful interference. 2 This device must accept any interference received, including interference that may cause undesired operation.
1)
Any kind of modification not expressly approved by Infineon Technologies may affect the regulatory compliance of the concerned product. As a consequence thereof this could void the user's authority to operate the equipment.
Data Sheet
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V23838-M305-M56
Technical Data Technical Data Absolute Maximum Ratings Parameter Data Input Voltage Differential Data Input Voltage Swing Storage Ambient Temperature Operating Case Temperature1) Storage Relative Humidity Operating Relative Humidity Supply Voltage Data Output Current Receiver Optical Input Power
1)
Symbol
Limit Values min. max.
Unit V V C C % % V mA dBm
VID max VIDpk-pk TS TC
RHs RHo
VCC+0.5
5 -40 -20 5 5 85 85 95 85 4 50 3
VCC max Idata
RxP max
Operating case temperature measured at transceiver reference point (in cage through 2nd centre hole from rear, see Figure 9).
Exceeding any one of these values may permanently destroy the device.
Data Sheet
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V23838-M305-M56
Technical Data Electrical Characteristics (VCC = 2.97 V to 3.63 V, TC = -20C to 85C) Parameter Common Supply Voltage In-rush Current1) Power Dissipation Transmitter Differential Data Input Voltage Swing2) Tx Disable Voltage Tx Enable Voltage Tx Fault High Voltage Tx Fault Low Voltage Supply Current3) Receiver Differential Data Output Voltage VODpk-pk 500 Swing 4) LOS Active LOS Normal Receiver 3 dB Cut-off Frequency5) Receiver 10 dB Cut-off Frequency5) Rise Time6) Fall Time
6) 7)
Symbol min.
Values typ. 3.3 max. 3.63 30 400 500 2 700 3200
Unit
VCC-VEE IIR max P VIDpk-pk
TxDis TxEn TxFH TxFL
2.97
V mA mW mV V V V V mA mV V V GHz GHz ps ps
VCC
0.8
VEE
2.4
VCC
0.5 100 150 1000
VEE
ITx
LOSA LOSN
2.4
VCC
0.5 1.5 3
VEE
tR-Rx tF-Rx
DJRx TJRx JRx
11)
125 170 47 124 60 100 80 90
Contributed Deterministic Jitter Contributed Total Jitter8) Jitter (pk-pk)9) Supply Current 3)
1)
ps ps ps mVpp mA
Power Supply Noise Rejection10) PSNR
IRx
2) 3)
Measured with MSA recommended supply filter network (Figure 7). Maximum value above that of the steady state value. Internally AC coupled. Typical 100 differential input impedance. MSA defines maximum current at 300 mA.
Data Sheet
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V23838-M305-M56
Technical Data
4)
5) 6) 7)
8) 9) 10)
11)
Internally AC coupled. Load 50 to GND or 100 differential. For dynamic measurement a tolerance of 50 mV should be added. Fibre Channel PI Standard. Measured values are 20% - 80%. Deterministic Jitter is that jitter measured by a bathtub scan, using a 27-1 NRZ PRBS, and extrapolating to 1 BER. Total Jitter is that jitter measured by a bathtub scan, using a 27-1 NRZ PRBS, and extrapolating to 1x10-12 BER. Jitter (pk-pk) is measured using a 27-1 NRZ PRBS and a Digital Communications Analyzer. Measured using a 20 Hz to 1 MHz sinusoidal modulation with the MSA recommended power supply filter network (Figure 7) in place. A change in sensitivity of less than 1 dB can be typically expected. Supply current excluding Rx output load.
Data Sheet
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V23838-M305-M56
Technical Data Optical Characteristics (VCC = 2.97 V to 3.63 V, TC = -20C to 85C) Parameter Transmitter Optical Modulation Amplitude 1) @ 2.125 Gbit/s @ 1.0625 Gbit/s Launched Power (Average)2) Extinction Ratio (Dynamic) Center Wavelength Spectral Width (rms) Relative Intensity Noise Deterministic Jitter Total Jitter
4) 5) 3)
Symbol min. OMA 196 156
Values typ. max.
Unit
W 450 450 -6 14.5 850 0.15 860 0.85 -117 -50 56 120 20 35 85 135 85 150 150 -4 dBm dB nm nm dB/Hz dBm ps ps ps ps ps W 24 19 49 31 dBm -22 -19 -19 -19 W 29 24 96 55 W 34 32 109 67 dBm
2004-06-23
PO
ER C I RIN DJTx TJTx JTx
-8.5 9 830
Tx Disable Laser Output Power PO-TxDis
Jitter (pk-pk) Rise Time6) Fall Time6) Receiver7)
tR-Tx tF-Tx
OMA
Min. Optical Modulation Amplitude 8) @ 2.125 Gbit/s @ 1.0625 Gbit/s Sensitivity (Average Power)9) @ 2.125 Gbit/s @ 1.25 Gbit/s @ 1.0625 Gbit/s Stressed Receiver Sensitivity 50 m Fiber10) @ 2.125 Gbit/s @ 1.0625 Gbit/s Stressed Receiver Sensitivity 62.5 m Fiber10) @ 2.125 Gbit/s @ 1.0625 Gbit/s LOS Assert Level 11)
Data Sheet
PIN
SPIN
50 m
SPIN
62.5 m
PLOSA
11
-30
-28
V23838-M305-M56
Technical Data Optical Characteristics (VCC = 2.97 V to 3.63 V, TC = -20C to 85C) (cont'd) Parameter LOS Deassert Level LOS Hysteresis
11) 11)
Symbol min.
Values typ. -25 1 770 12 2 850 860 max. -20
Unit dBm dB nm dB
PLOSD PLOSA
-PLOSD C ORL
Input Center Wavelength Optical Return Loss
1)
2) 3)
4) 5) 6)
7) 8) 9) 10)
11)
Fibre Channel PI Standard. Typical OMA values based on -6 dBm launched power (average) and 15 dB extinction ratio. Into multimode fiber, 62.5 m or 50 m diameter. Deterministic Jitter is that jitter measured by a bathtub scan, using a 27-1 NRZ PRBS, and extrapolating to 1 BER. Total Jitter is that jitter measured by a bathtub scan, using a 27-1 NRZ PRBS, and extrapolating to 1x10-12 BER. Jitter (pk-pk) is measured using a 27-1 NRZ PRBS and a Digital Communications Analyzer. Values are 20% - 80%. Measured at nominal data rate, unfiltered, using an O/E plug-in with a bandwidth of 2.85 GHz or higher. Complies with FC 1x, FC 2x and Gigabit Ethernet eye mask when filtered. Receiver characteristics are measured with a worst case reference laser. Fibre Channel PI Standard. Average optical power at which the BER is 1x10-12. Measured with a 27-1 NRZ PRBS and ER = 9 dB. Measured at the given Stressed Receiver Eye Closure Penalty and DCD component given in Fibre Channel PI Standard (2.03/2.18 dB & 40/80 ps). See Figure 3.
1 LOS Level 0 LOS Assert (Minimum) Hysteresis (Minimum) LOS Deassert (Maximum)
LOS deassertion range
LOS persistence
LOS assertion range
LOS / Hysteresis (Typical)
Received Optical Power Level [dBm]
File: 1522
Figure 3
Data Sheet 12 2004-06-23
V23838-M305-M56
Technical Data Timing of Control and Status I/O Parameter Tx Disable Assert Time Symbol t_off Values min. max. 10 s Time from rising edge of Tx Disable to when the optical output falls below 10% of nominal Time from falling edge of Tx Disable to when the modulated optical output rises above 90% of nominal From power on or negation of Tx Fault using Tx Disable Time from fault to Tx Fault on Time Tx Disable must be held high to reset Tx Fault Time from LOS state to Rx LOS assert Time from non-LOS state to Rx LOS deassert Unit Condition
Tx Disable Negate Time
t_on
1
ms
Time to Initialize, t_init Including Reset of Tx Fault Tx Fault Assert Time Tx Disable to Reset t_fault t_reset 10
300
ms
100
s s
LOS Assert Time t_loss_on LOS Deassert Time I2C Bus Clock Rate t_loss_off f_i2cbus_ clock
100 100 100
s s kHz
Data Sheet
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V23838-M305-M56
Eye Safety Eye Safety This laser based multimode transceiver is a Class 1 product. It complies with IEC 60825-1/A2: 2001 and FDA performance standards for laser products (21 CFR 1040.10 and 1040.11) except for deviations pursuant to Laser Notice 50, dated July 26, 2001. CLASS 1 LASER PRODUCT To meet laser safety requirements the transceiver shall be operated within the Absolute Maximum Ratings. Note: All adjustments have been made at the factory prior to shipment of the devices. No maintenance or alteration to the device is required. Tampering with or modifying the performance of the device will result in voided product warranty. Failure to adhere to the above restrictions could result in a modification that is considered an act of "manufacturing", and will require, under law, recertification of the modified product with the U.S. Food and Drug Administration (ref. 21 CFR 1040.10 (i)). Laser Emission Data Wavelength Maximum total output power (as defined by IEC: 7 mm aperture at 14 mm distance) Beam divergence (full angle) / NA (half angle) 850 nm 709 W / -1.5 dBm 20 / 0.18 rad
FDA
Complies with 21 CFR 1040.10 and 1040.11
IEC
Class 1 Laser Product
File: 1401
Figure 4
Required Labels
Laser Emission
Tx
Top view
Rx
File: 1333
Figure 5
Data Sheet
Laser Emission
14 2004-06-23
V23838-M305-M56
Application Notes Application Notes EMI Recommendations To avoid electromagnetic radiation exceeding the required limits set by the standards, please take note of the following recommendations. When Gigabit switching components are found on a PCB (e.g. multiplexer, serializer-deserializer, clock data recovery, etc.), any opening of the chassis may leak radiation; this may also occur at chassis slots other than that of the device itself. Thus every mechanical opening or aperture should be as small as feasible and its length carefully considered. On the board itself, every data connection should be an impedance matched line (e.g. strip line or coplanar strip line). Data (D) and Data-not (Dn) should be routed symmetrically. Vias should be avoided. Where internal termination inside an IC or a transceiver is not present, a line terminating resistor must be provided. The decision of how best to establish a ground depends on many boundary conditions. This decision may turn out to be critical for achieving lowest EMI performance. At RF frequencies the ground plane will always carry some amount of RF noise. Thus the ground and VCC planes are often major radiators inside an enclosure. As a general rule, for small systems such as PCI cards placed inside poorly shielded enclosures, the common ground scheme has often proven to be most effective in reducing RF emissions. In a common ground scheme, the PCI card becomes more equipotential with the chassis ground. As a result, the overall radiation will decrease. In a common ground scheme, it is strongly recommended to provide a proper contact between signal ground and chassis ground at every location where possible. This concept is designed to avoid hotspots which are places of highest radiation, caused when only a few connections between chassis and signal grounds exist. Compensation currents would concentrate at these connections, causing radiation. However, as signal ground may be the main cause for parasitic radiation, connecting chassis ground and signal ground at the wrong place may result in enhanced RF emissions. For example, connecting chassis ground and signal ground at a front panel/bezel/chassis by means of a fiber optic transceiver/cage may result in a large amount of radiation especially where combined with an inadequate number of grounding points between signal ground and chassis ground. Thus the transceiver becomes a single contact point increasing radiation emissions. Even a capacitive coupling between signal ground and chassis ground may be harmful if it is too close to an opening or an aperture. For a number of systems, enforcing a strict separation of signal ground from chassis ground may be advantageous, providing the housing does not present any slots or other discontinuities. This separate ground concept seems to be more suitable in large systems where appropriate shielding measures have also been implemented. The return path of RF current must also be considered. Thus a split ground plane between Tx and Rx paths may result in severe EMI problems.
Data Sheet
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Application Notes The bezel opening for a transceiver should be sized so that all contact springs of the transceiver cage make good electrical contact with the face plate. Please consider that the PCB may behave like a dielectric waveguide. With a dielectric constant of 4, the wavelength of the harmonics inside the PCB will be half of that in free space. Thus even the smallest PCBs may have unexpected resonances. Large systems can have many openings in the front panel for SFP transceivers. In typical applications, not all of these ports will hold transceivers; some may be intentionally left empty. These empty slots may emit significant amounts of radiation. Thus it is recommended that empty ports be plugged with an EMI plug as shown in Figure 6. Infineon offers an EMI/dust plug, P/N V23818-S5-B1. SFP Accessories Cage: Infineon Technologies Part Number: V23838-S5-N1/V23838-S5-N1-BB Cage EMI/Dust Plug: Infineon Technologies Part Number: V23818-S5-B1 Host Board Connector: Tyco Electronics Part Number: 1367073-1 Cage Dust Plug: Infineon Technologies Part Number: V23818-S5-B2
CAGE
CAGE EMI/DUST PLUG
HOST BOARD CONNECTOR
iSFPTM
DUST PLUG
HOST BOARD
File: 1521
Figure 6
Data Sheet
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V23838-M305-M56
Application Notes EEPROM Serial ID Memory Contents (A0h)
Addr. Hex ASCII Name/Description 0 03 Identifier 1 04 Extended identifier 2 07 Connector
3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 00 00 00 01 40 40 0C 05 01 15 00 00 00 1E 0F 00 00 49 6E 66 69 6E 65 6F 6E 20 46 4F 20 I n f i n e o n F O Transceiver optical compatibility
Addr. Hex ASCII Name/Description 32 47 G Vendor name 33 6D m
34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 62 48 00 00 03 19 56 32 33 38 33 38 2D 4D 33 30 35 2D 4D 35 36 20 41 34 41 39 03 52 00 21 V 2 3 8 3 8 M 3 0 5 M 5 6 A 4 A 9 Vendor revision, product status dependent b H Reserved Vendor OUI
Vendor part number
Encoding BR, nominal Reserved Length (9 m) - km Length (9 m) Length (50 m) Length (62.5 m) Length (copper) Reserved Vendor name
Wavelength Reserved Check sum of bytes 0 - 62
Data Sheet
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V23838-M305-M56
Application Notes EEPROM Serial ID Memory Contents (A0h) (cont'd)
Addr. 64 65 66
67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95
20 20 20 20 20 20 20 20
Hex ASCII Name/Description 00 Transceiver signal options 1A 00 BR, maximum 32 BR, minimum
Vendor serial number
Addr. 96 97 98
99 100 101 102 103 104 105 106 107 108 109 110 111 112 113 114 115
Hex ASCII Name/Description 20 Vendor specific EEPROM 20 20
20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 00 Vendor specific. Reserved for future use
Vendor manufacturing date code
116 117 118 119 120 121 122 123
20 20
00 00 00
Diagnostic monitoring type Enhanced options SFF-8472 compliance Low order 8 bits of the sum of the contents of all the bytes from byte 64 to byte 94, inclusive
124 125 126 127 128 255
Data Sheet
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V23838-M305-M56
Application Notes Multimode 850 nm SFP Transceiver, AC/AC TTL
Host Board
3.3 V
1 H
Infineon SFP Transceiver
VCCT
0.1 F xx 1)
Protocol VCC Protocol VCC
10 F
0.1 F
1 H
16
VEET
4.7 to 10 k
1/17/20 3 2 19
0.1 F
4.7 to 10 k
Tx Disable Tx Fault
Tx Disable Tx Fault TD-
100
Laser Driver
TD+
18
0.1 F
VCCR
15
Protocol IC
ASIC IC
4.7 to 10 k
10 F
0.1 F
xx 1)
VEER
9/10/11/14
RD+
100
13
0.1 F
RD- LOS LOS
12 8
Pre-Amp./ Post Amp. 0.1 F
Rate Select 2) 3.3 V
Rate Select 2)
7
Diagnostic IC / EEPROM
PLD / PAL
4.7 to 10 k
4.7 to 10 k
4.7 to 10 k
6
MOD-DEF(0)
5
MOD-DEF(1)
4
MOD-DEF(2)
1) Design criterion of the capacitor used is the resonant frequency and its value must be in the order of the nominal data rate. Use of single layer capacitors recommended. Short trace lengths are mandatory. 2) Not implemented. File: 1320
Figure 7
Example SFP Host Board Schematic and Recommended Host Board Supply Filtering Network
Data Sheet
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V23838-M305-M56
Package Outlines Package Outlines
13.7
6.25
56.5 47.5
11.6
10.3
Dimensions in mm
1.3
13.7
File: 1215
Figure 8
29.80
TRANSCEIVER TEMPERATURE REFERENCE POINT
Dimensions in mm
File: 1224
Figure 9
Data Sheet
20
2004-06-23
8.5
13.4
V23838-M305-M56 Revision History: Previous Version: Page 1 4 9, 17 19 2004-06-23 2004-01-09 DS3
Subjects (major changes since last revision) Features changed Description changed Tables changed Figure 7 Host Board Schematic changed
Edition 2004-06-23 Published by Infineon Technologies AG, St.-Martin-Strasse 53, 81669 Munchen, Germany
(c) Infineon Technologies AG 2004.
All Rights Reserved. Attention please! The information herein is given to describe certain components and shall not be considered as a guarantee of characteristics. Terms of delivery and rights to technical change reserved. We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement, regarding circuits, descriptions and charts stated herein. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered.

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