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| (R) SMTY18AM LOW FORWARD VOLTAGE TVS: TranskyTM FEATURES AND BENEFITS High peak pulse power: 400W (8/20s) Stand-off voltage 16V Low forward voltage: 0.48V @ 0.85A @ 25C Low clamping factor VCL/VBR Fast response time Very thin package (1.0mm overall component height) A K STmite (DO-216AA) DESCRIPTION The TranskyTM is designed specifically for portable equipments and miniaturized electronics devices subject to ESD transient overvoltages. The TranskyTM combines the performance of a TransilTM or TVS (Tansient Voltage Supressor) and low forward voltage Schottky diode in a monolithic structure. COMPLIES WITH FOLLOWING STANDARDS IEC 61000-4-2 Level 4: 15kV (Air discharge) 8kV (Contact discharge) MIL Standard 883E-Method 3015-7: class 3C Human Body Model (HBM) Table 1: Order Code Part Number SMTY18AM Marking Y18 K A Table 2: Absolute Ratings (limiting values) Symbol VPP PPP IFSM Tstg Tj IEC 61000-4-2 standard Peak pulse power dissipation (see note 1) Non repetitive surge peak forward current Storage temperature range Maximum operating junction temperature Parameter Air discharge Contact discharge Tj initial = Tamb Tp = 10 ms Tj = initial = Tamb Value 15 8 400 25 -65 to + 175 150 Unit kV W A C C Note 1: 8/20s pulse waveform September 2004 REV. 2 1/6 SMTY18AM Table 3: Thermal Resistances Symbol Rth(j-a) Parameter Junction to ambient on PCB with recommended pad layout Value 250 Unit C/W Table 4: Static Electrical Characteristics (Tamb = 25C) Symbol VBR IRM VRM VCL Rd IPP C Parameter Breakdown voltage Leakage current @ VRM Stand-off voltage Clamping voltage Dynamic impedance Peak pulse current Capacitance VCL VBR VRM I IF VF IRM IR V IPP IRM max @ VRM Note 2 mA 4 Note 2: Tamb = 85C Note 3: 8/20s pulse waveform Note 4: Pulse test tp = 500s, d< 2% VCL max @ IPP Note 3 V 20 A 1 VF max @ 0.85A Note 4 V 0.48 T max 10-4/C 8.8 C typ @ 0V pF 500 V 16 2/6 SMTY18AM Figure 1: Peak pulse power versus exponential pulse duration PPP(W) 1000 Tj initial = 25C Figure 2: Relative variation of peak pulse power versus initial junction temperature % 110 100 90 80 70 60 100 50 40 30 20 tp(ms) 10 0.01 0.10 1.00 10.00 10 0 0 25 50 75 Tj(C) 100 125 150 175 Figure 3: Average power dissipation versus ambient temperature P(W) 0.5 Printed circuit board FR4 (eCU=35m), recommended pad layout Figure 4: Variation of thermal impedance junction to ambient versus pulse duration (Epoxy FR4, ecu=35m) Zth(j-a)(C/W) 1000.0 SCU=0.135cm 0.4 100.0 0.3 10.0 SCU=2cm 0.2 1.0 0.1 Tamb (C) 0.0 0 25 50 75 100 125 150 0.1 1.E-03 1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03 tp(s) Figure 5: Thermal resistance junction to ambient versus copper surface under tab Rth(j-a)(C/W) 250 Figure 6: Reverse leakage current versus junction temperature (typical values) IR(A) 1.E+05 VR=VRM 200 1.E+04 150 1.E+03 100 1.E+02 50 SCU(cm) 0 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 1.E+01 Tj(C) 1.E+00 0 25 50 75 100 125 150 3/6 SMTY18AM Figure 7: Clamping voltage versus peak pulse current (typical values) IPP(A) 100.0 Tj initial =25C Figure 8: Junction capacitance versus reverse voltage applied (typical values) C(pF) 1000 F=1MHz VOSC=30mVRMS Tj=25C 8/20s 10.0 10/1000s 1.0 VCL(V) 0.1 10 12 14 16 18 20 22 24 26 28 30 VR(V) 100 1 10 100 Figure 9: Forward voltage drop versus forward current (typical values) IF(A) 10.00 1.00 Tj=85C Tj=25C 0.10 VF(V) 0.01 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 4/6 SMTY18AM Figure 10: STmite Package Mechanical Data REF. DIMENSIONS Millimeters Inches Min. Typ. Max. Min. Typ. Max. 0.85 1.00 1.15 0.033 0.039 0.045 -0.05 0.05 -0.002 0.002 0.40 0.65 0.016 0.025 0.70 1.00 0.027 0.039 0.10 0.25 0.004 0.010 1.75 1.90 2.05 0.069 0.007 0.081 1.75 1.90 2.05 0.069 0.007 0.081 3.60 3.75 3.90 0.142 0.148 0.154 0.50 0.63 0.80 0.019 0.025 0.031 1.20 1.35 1.50 0.047 0.053 0.059 0.50 0.019 ref ref 0.07 0.003 0.07 0.003 L3 D b2 b H L2 L R E C A1 R1 0 to 6 A A A1 b b2 c D E H L L2 L3 R R1 Figure 11: Foot Print Dimensions (in millimeters) 1.82 1.38 2.03 1.10 0.75 0.50 0.71 Table 5: Ordering Information Ordering type SMTY18AM Marking Y18 Package STmite Weight 15.5 mg Base qty 12000 Delivery mode Tape & reel Table 6: Revision History Date 09-Jul-2004 13-Sep-2004 Revision 1 2 First issue STmite package dimensions reference A1 change: from blank (min) to -0.05mm and from 0.10 (max) to 0.05mm. Description of Changes 5/6 SMTY18AM Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners (c) 2004 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 6/6 |
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