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XC6120
Series
ETR0209-004
Highly Accurate, Ultra Small, Low Power Consumption Voltage Detector
GENERAL DESCRIPTION
The XC6120 series are highly precise, low power consumption voltage detectors, manufactured using CMOS and laser trimming technologies. With low power consumption and high accuracy, the series is suitable for precision mobile equipment. The XC6120 in ultra small packages are ideally suited for high-density mounting. The XC6120 is available in both CMOS and N-channel open drain output configurations.
APPLICATIONS
Microprocessor reset circuitry Memory battery back-up circuits Power-on reset circuits Power failure detection System battery life and charge voltage monitors
FEATURES
: 2% (VDF(T) 1.5V) : 30mV (VDF(T)<1.5V) Low Power Consumption : 0.6 A (TYP.) [VDF(T)=2.7V, VIN2.97V] Detect Voltage Range : 1.0V ~ 5.0V in 0.1V increments Operating Voltage Range : 0.7V ~ 6.0V Detect Voltage Temperature Characteristics : 100ppm/ (TYP.) Output Configuration : CMOS (XC6120C) : N-channel open drain (XC6120N) Operating Temperature Range : -40 ~85 Ultra Small Packages : USP-3, SSOT-24 Highly Accurate
TYPICAL APPLICATION CIRCUIT
TYPICAL PERFORMANCE CHARACTERISTICS
Supply Current vs. Input Voltage
XC6120x272xx
3.5
(Unused for the CMOS output products)
Supply Current: ISS ( A) Supply Current: ISS (A)
3.0 2.5 2.0 1.5 1.0 0.5 0.0 0 1 2 3 4
Ta= 85 25 -40
5
6
Input Voltage: VIN (V)
1/13
XC6120 Series
PIN CONFIGURATION
VIN VOUT
VSS
VOUT
VIN
NC
VSS
USP-3 (BOTTOM VIEW)
SSOT-24 (TOP VIEW)
PIN ASSIGNMENT
PIN NUMBER USP-3 SSOT-24 1 3 2 4 2 3 1 PIN NAME VIN VSS VOUT NC FUNCTION Power Input Ground Output No Connection
PRODUCT CLASSIFICATION
Ordering Information XC6120
DESIGNATOR DESCRIPTION Output Configuration Detect Voltage (VDF) Detect Accuracy Packages Device Orientation SYMBOL C N 10~50 2 H N R L DESCRIPTION : CMOS output : N-ch open drain output : For example 1.0V 1, 0 : 2% : USP-3 (1 reel=3,000 pcs) : SSOT-24 (SC-82) (1 reel=3,000 pcs) : Embossed tape, standard feed : Embossed tape, reverse feed
BLOCK DIAGRAMS
(1) XC6120C (2) XC6120N
2/13
XC6120
Series
ABSOLUTE MAXIMUM RATINGS
Ta=25
PARAMETER Input Voltage Output Current CMOS Output
SYMBOL VIN IOUT VOUT Pd Ta Tstg
RATING VSS-0.3~7.0 10 VSS-0.3~VIN+0.3 VSS-0.3~7.0 120 150 -40~+85 -55~+125
UNITS V mA V mW
N-ch Open Drain Output USP-3 Power Dissipation SSOT-24 Operating Temperature Range Storage Temperature Range
Output Voltage
ELECTRICAL CHARACTERISTICS
XC6120 Series
PARAMETER Operating Voltage Detect Voltage Hysteresis Width Supply Current 1 Supply Current 2 SYMBOL VIN VDF VHYS ISS1 ISS2 IOUTN Output Current IOUTP (*2) ILEAK Temperature Characteristics Detect Delay Time (*3) Release Delay Time (*5) VDF Ta VDF TDF TDR CONDITION VDF(T)=1.0 5.0V (*1) VDF(T)=1.0V 5.0V VDF(T)=1.0V 5.0V VIN=VDF(T) 1.1 VIN= VDF(T) 0.9V VIN=0.7V VOUT=0.5V VOUT=0.3V VOUT=0.1V XC6120C XC6120N 0.09 0.08 0.05 VDF 0.03 MIN. 0.7 TYP. E-1 VDF 0.05 E-2 E-3 0.57 0.56 0.30 -0.95 0.001 0.001 100 30 20 -0.60 0.100 100 100 VDF 0.07 MAX. 6.0 UNITS V V V A A mA mA A ppm/oC s s
Ta=25
CIRCUIT -
VIN=6.0V, VOUT=5.5V VIN=6.0V, VOUT=6.0V
-40 oC Ta 85 oC VIN=6.0V 0.7V VIN=VDF to VOUT=0.5V VIN=0.7V 6.0V VIN=VDR to VOUT=VDR (*4)
*1: VDF (T): Setting detect voltage *2: For XC6120C Series only *3: A time taking from the time at VIN = VDF to the time at VOUT=0.5V when VIN falls from 6.0V to 0.7V. *4: VDR: Release voltage (VDR = VDF + VHYS) *5: A time taking from the time at VIN = VDR to the time at VOUT = VDR when VIN rise from 0.7V to 6.0V.
XC6120N Series recommended pull-up resistance Input Voltage Range 0.7V~6.0V 0.8V~6.0V 1.0V~6.0V Pull-up Resistance 220k 100k 33k
3/13
XC6120 Series
ELECTRICAL CHARACTERISTICS (Continued)
DETECT VOLTAGE ACCURACY AND SUPPLY CURRENT SPECIFICATIONS
SYMBOL PARAMETER SETTING DETECT VOLTAGE VDF(T) 1.0 1.1 1.2 1.3 1.4 1.5 1.6 1.7 1.8 1.9 2.0 2.1 2.2 2.3 2.4 2.5 2.6 2.7 2.8 2.9 3.0 3.1 3.2 3.3 3.4 3.5 3.6 3.7 3.8 3.9 4.0 4.1 4.2 4.3 4.4 4.5 4.6 4.7 4.8 4.9 5.0
( 6)
E-1
E-2
E-3
DETECT VOLTAGE
VDF (V) XC6120xxx2 Series MIN. 0.970 1.070 1.170 1.270 1.370 1.470 1.568 1.666 1.764 1.862 1.960 2.058 2.156 2.254 2.352 2.450 2.548 2.646 2.744 2.842 2.940 3.038 3.136 3.234 3.332 3.430 3.528 3.626 3.724 3.822 3.920 4.018 4.116 4.214 4.312 4.410 4.508 4.606 4.704 4.802 4.900 MAX. 1.030 1.130 1.230 1.330 1.430 1.530 1.632 1.734 1.836 1.938 2.040 2.142 2.244 2.346 2.448 2.550 2.652 2.754 2.856 2.958 3.060 3.162 3.264 3.366 3.468 3.570 3.672 3.774 3.876 3.978 4.080 4.182 4.284 4.386 4.488 4.590 4.692 4.794 4.896 4.998 5.100 0.7 1.9 0.6 1.80 0.6 1.7 0.5 1.60 0.5 1.4 0.4 1.35 TYP.
SUPPLY CURRENT 1
ISS1 ( A) MAX.
SUPPLY CURRENT 2
ISS2 ( TYP. A) MAX.
When setting detect voltage is 1.0V VDF(T) 1.5V, detect accuracy is When setting detect voltage is 1.5V VDF(T) 5.0V, detect accuracy is
30mV. 2%.
4/13
XC6120
Series
TEST CIRCUITS
Circuit 1
R=100k (Unused for the CMOS output products)
Circuit 2
Circuit 3
Circuit 4
R=100k (Unused for the CMOS output products)
Measurement of waveform
5/13
XC6120 Series
OPERATIONAL EXPLANATION
Typical Application Circuit
R
VIN
(Unused for the CMOS output products)
VOUT
VIN
VOUT
VSS
Timing Charge
Input Voltage (VIN)
Release Voltage (VDR) Detect Voltage (VDF) Minimum Operating Voltage (VMIN) Ground Voltage (VSS)

Output Voltage (VOUT) Ground Voltage (VSS)
Note: For explaining in a simplified case, an operation time of the circuit is not counted.
The following explains the operation of the typical application circuit along number symbols shown in the timing chart. When input voltage (VIN) rises above detect voltage (VDF), output voltage (VOUT) will be equal to input voltage (VIN). (A condition of high impedance exists with N-ch open drain output configurations.) When input voltage (VIN) falls below detect voltage (VDF), output voltage (VOUT) will be equal to the ground voltage (VSS) level. When input voltage (VIN) falls to a level below that of the minimum operating voltage (VMIN), output will become unstable. If In this condition, VIN will equal the pulled-up output (should output be pulled-up.) (Input voltage, VIN, in the typical application circuit.) When input voltage (VIN) rises above the minimum operating voltage (VMIN) level until it achieves a release voltage (VDR), output keeps the ground voltage level (VSS). When the input voltage (VIN) rises above the release voltage (VDR), output voltage (VOUT will be equal to input voltage (VIN). (A condition of high impedance exists with N-ch open drain output configurations.) The difference between VDR and VDF represents the hysteresis width.
6/13
XC6120
Series
NOTE ON USE
1. 2. 3. 4. Please use this IC within the stated maximum ratings. Operation beyond these limits may cause degrading or permanent damage to the device. In order to stabilize the IC's operations, please ensure that VIN pin's input frequency's rise and fall times are more than several s / V. With a resistor connected between the VIN pin and the power supply VDD some errors may be observed from the input voltage at the detect and release voltage. Those errors are not constant because of the fluctuation of the supply current. When a resistor is connected between the VIN pin and the power supply VDD, oscillation may occur as a result of through current and voltage drop at the RIN at the time of voltage release. (refer to the Oscillation Description (1) below ) Especially in the CMOS output configurations, oscillation may occur regardless of detect/release operation if load current (IOUT) exists. (refer to the Oscillation Description (2) below) Please use N-ch open drains configuration, when a resistor RIN is connected between the VIN pin and the power supply VDD power source. In such cases, please ensure that RIN is less than 10k and that C is more than 0.1 F.
5.
XC6120N
[Figure 1: Circuit connected with the input resistor] Oscillation Description
(1) Oscillation as a result of through current Since the XC6120 series are CMOS ICs, transient through current will flow when the IC's internal circuit switching operates regardless of output configuration. Consequently, oscillation is liable to occur as a result of the similar operations as in (1) above. This oscillation does not occur during the detect operation. (2) Output current oscillation with the CMOS output configuration As shown in figure 2, when the voltage applied at the power supply (VDD) rises from below detect voltage to above release voltage, the IC commence release operations and the internal P-ch driver transistor will be on. The output current (IOUT) flows the input resistor (RIN) via the P-ch driver transistor. Because of the input resistor (RIN) and the output current (IOUT), an input pin voltage drops RIN x IOUT. If the voltage drop level is larger than the IC's hysteresis width (VHYS), the input pin voltage will falls below the VDF and detect operations will commerce so that the internal P-ch driver transistor will be off. The voltage drop will stop because the output current (IOUT) which was flowing the P-ch driver transistor will run down. The input pin voltage will become the same voltage level as the input voltage (VIN). For this, the input pin voltage will rise above the release voltage (VDR), therefore, the release operations will begin over again. Oscillation may occur with this repetition. Further, this condition will also appear via means of a similar mechanism during detect operations.
XC6120C
[Figure 2: Oscillation caused by the input resistor of the CMOS output product and the output current]
7/13
XC6120 Series
TYPICAL PERFORMANCE CHARACTERISTICS
(1) Supply Current vs. Input Voltage
XC6120x102xx
3.5
3.5
XC6120x502xx
Supply Current: ISS (A)
2.5 2.0 1.5 1.0 0.5 0.0 0 1 2 3 4
Supply Current: ISS (A)
3.0
Ta= 85 25 -40
3.0 2.5 2.0 1.5 1.0 0.5 0.0 0 1 2 3 4
Ta= 85 25 -40
5
6
5
6
Input Voltage: VIN (V)
Input Voltage: VIN (V)
(2) Output Voltage vs. Input Voltage
XC6120C202xx
Ta= 25 6
7
XC6120N202xx
Vpull-up=6V Rpull-up=100k Ta= 85
Output Voltage: VOUT (V)
Output Voltage: VOUT (V)
5 4 3 2 1 0 0 1 2 3 4 5 6
6 5 4 3 2 1 0 0.0 0.5
25 -50
1.0
1.5
2.0
2.5
3.0
Input Voltage: VIN (V)
Input Voltage: VIN (V)
(3) Detect Voltage, Release Voltage vs. Ambient Temperature
XC6120x102xx
1.20 1.15 1.10 VDR 1.05 1.00 VDF 0.95 0.90 -50 -25 0 25 50 75 0.95 0.90 100 1.05 1.00 1.20
2.4 2.3 2.2
XC6120x202xx
2.4
Release Voltage: VDR (V)
1.10
2.2 VDR 2.1 2.0 VDF 1.9 1.8 100
2.1 2.0 1.9 1.8 -50 -25 0 25 50 75
Ambient Temperature: Ta ()
Ambient Temperature: Ta ()
8/13
Release Voltage: VDR (V)
Detect Voltage: VDF (V)
Detect Voltage: VDF (V)
1.15
2.3
XC6120
Series
TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(4) Output Current (Nch Driver) vs. Input Voltage
XC6120x502xx
VOUT=0.5V 10
XC6120x502xx
10 VOUT=0.3V Ta= -40 8 25 85 6
Output Current(Nch): IOUTN (mA)
Ta= -40 8 25 85
6
Output Current(Nch): IOUTN (mA)
2 3 4 5 6
4
4
2
2
0 0 1
0 0 1 2 3 4 5 6
Input Voltage: VIN [V]
Input Voltage: VIN (V)
(5) Output Current (Pch Driver) vs. Input Voltage
XC6120x502xx
VOUT=0.1V 6
0.00
XC6120C102xx
VOUT=VIN-0.5V
Output Current(Nch): IOUTN (mA)
Output Current(Pch): IOUTP (mA)
5 Ta= -40 4 25 3 85 2 1 0 0 1 2 3 4 5 6
-0.25 -0.50 -0.75 -1.00 -1.25 -1.50 1 2 3 4
Ta= 85 25 -40
5
6
Input Voltage: VIN (V)
Input Voltage: VIN (V)
XC6120C102xx
VOUT=VIN-0.3V 0.00
0.00
XC6120C102xx
VOUT=VIN-0.1V
Output Current(Pch): IOUTP (mA)
Output Current(Pch): IOUTP (mA)
-0.20
Ta= 85 25 -40
-0.05 -0.10 -0.15 -0.20 -0.25 -0.30
Ta= 85 25 -40
-0.40
-0.60
-0.80
-1.00 1 2 3 4 5 6
1
2
3
4
5
6
Input Voltage: VIN (V)
Input Voltage: VIN (V)
9/13
XC6120 Series
PACKAGING INFORMATION
USP-3
SSOT-24
*Solder filet is not formed because of no plating at the lead side
USP-3 Reference Pattern Layout
USP-3 Reference Metal Mask Design
*Thickness of solder paste
120 m
recommended
10/13
XC6120
Series
MARKING RULE
SSOT-24 Represents output configuration and detect voltage Range MARK K L M N
SSOT-24 (TOP VIEW)
OUTPUT CONFIGURATION OUTPUT VOLTAGE CMOS Nch open drain 1.0V 3.0V 1.0V 3.0V 2.9V 5.0V 2.9V 5.0V
PRODUCT SERIES XC6120C XC6120N
Represents detect voltage MARK 0 1 2 3 4 5 6 7 8 9 A B C D E DETECT VOLTAGE (V) 1.0 1.1 1.2 1.3 1.4 3.0 3.1 3.2 3.3 3.4 3.5 3.6 3.7 3.8 3.9 4.0 4.1 4.2 4.3 4.4 MARK F H K L M N P R S T U V X Y Z DETECT VOLTAGE (V) 1.5 1.6 1.7 1.8 1.9 2.0 2.1 2.2 2.3 2.4 2.5 2.6 2.7 2.8 2.9 4.5 4.6 4.7 4.8 4.9 5.0 -
Represents production lot number 01 to 09, 10, 11, , 99, 0A, , 0Z, 1A, repeated. (G, I, J, O, Q, W excluded. Reversed character is not used.)
11/13
XC6120 Series
MARKING RULE (Continued)
USP-3
3 1

Represents product series
MARK 0
PRODUCT SERIES XC6120******
2
USP-3
3
Standard
Represents output configuration and integer number of detect voltage Nch open drain (XC6120N Series)
(TOP VIEW)
CMOS Output (XC6120C Series)
MARK A B C D E
DETECT VOLTAGE (V) 1.X 2.X 3.X 4.X 5.X
MARK F H K L M
DETECT VOLTAGE (V) 1.X 2.X 3.X 4.X 5.X
Standard
Represents decimal point of detect voltage
MARK 3 0
DETECT VOLTAGE (V) X.3 X.0
PRODUCT SERIES XC6120**3*** XC6120**0***
Represents production lot number 01 to 09, 10, 11, , 99, 0A, , 0Z, 1A, (G, I, J, O, Q, W excepted.)
repeated.
12/13
XC6120
Series
1. The products and product specifications contained herein are subject to change without notice to improve performance characteristics. Consult us, or our representatives before use, to confirm that the information in this catalog is up to date. 2. We assume no responsibility for any infringement of patents, patent rights, or other rights arising from the use of any information and circuitry in this catalog. 3. Please ensure suitable shipping controls (including fail-safe designs and aging protection) are in force for equipment employing products listed in this catalog. 4. The products in this catalog are not developed, designed, or approved for use with such equipment whose failure of malfunction can be reasonably expected to directly endanger the life of, or cause significant injury to, the user. (e.g. Atomic energy; aerospace; transport; combustion and associated safety equipment thereof.) 5. Please use the products listed in this catalog within the specified ranges. Should you wish to use the products under conditions exceeding the specifications, please consult us or our representatives. 6. We assume no responsibility for damage or loss due to abnormal use. 7. All rights reserved. No part of this catalog may be copied or reproduced without the prior permission of Torex Semiconductor Ltd.
13/13

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