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SGM3005
GENERAL DESCRIPTION
Ultra Low ON-Resistance, Low Voltage, Dual, SPDT Analog Switch
FEATURES
- - - - - Low Voltage Operation : 1. 8 V to 5. 5 V Low On-Resistance: 0. 5(TYP) Low On-Resistance Flatness -3 dB Bandwidth: 30 MHz Fast Switching Time tON 16 ns tOFF 15 ns Rail-to-Rail Operation Typical Power Consumption (<0.01 W) TTL/CMOS Compatible Microsize Package
The SGM3005 is a dual, low ON-resistance, low voltage, bidirectional, single-pole/double-throw (SPDT) CMOS analog switches designed to operate from a single +1.8V to +5.5V supply. Targeted applications include battery powered equipment that benefit from low RON (0.5) and fast switching speeds (tON = 16 ns, tOFF = 15 ns). The on resistance profile is very flat over the full analog signal range. This ensures excellent linearity and low distortion when switching audio signals. The SGM3005 is a committed dual single-pole/double -throw (SPDT) that consist of two normally open (NO) and two normally close (NC) switches. This configuration can be used as a dual 2-to-1 multiplexer. SGM3005 is available in a MSOP-10 and DFN-10 packages.
- - - -
PIN CONFIGURATIONSTOP VIEW
SGM3005
V+ 1 2 3 4 5 DFN-10 / MSOP-10 10 9 8 7 6 NO2 COM2 IN2 NC2 GND
APPLICATIONS
Battery powered, Handheld, and Portable Equipments Cellular/mobile Phones Laptops, Notebooks, Palmtops Communication Systems Sample-and-Hold Circuits Audio Signal Routing Audio and Video Switching Portable Test and Measurement Medical Equipment
NO1 COM1 IN1 NC1
FUNCTION TABLE
LOGIC 0 1 NC1, NC2 ON OFF NO1, NO2 OFF ON
Shengbang Microelectronics Co, Ltd Tel: 86/451/84348461 www.sg-micro.com
REV. C
ORDERING INFORMATION
MODEL PINPACKAGE SPECIFIED TEMPERATURE RANGE ORDERING NUMBER SGM3005XMS/TR SGM3005XD PACKAGE MARKING SGM3005XMS 3005D PACKAGE OPTION
SGM3005
MSOP-10 DFN-10
- 40C to +125C - 40C to +125C
Tape and Reel, 3000 Tape and Reel, 3000
ABSOLUTE MAXIMUM RATINGS
V+ to GND....................................................................- 0.3V to +6V Analog, Digital voltage range(1)..................... - 0.3V to V+ + 0.3V Continuous Current NO, NC, or COM..........................300mA Peak Current NO, NC, or COM......................................500mA Operating Temperature Range...........................- 40C to +125C Junction Temperature...........................................................+150C Storage Temperature.............................................- 65C to +150C
Package Thermal Resistance @ TA = 25 DFN-10, JA........................................................................................33/W
MSOP-10, JA...................................................................................205/W Lead Temperature (soldering, 10s).......................................260C ESD Susceptibility HBM..........................................................................................2000V MM..............................................................................................400V
Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. (1) Signals on NC, NO, or COM or IN exceeding V+ will be clamped by internal diodes. Limit forward diode current to maximum current ratings.
PIN DESCRIPTION
NAME
V+ GND IN1, IN2 COM1, COM2 NO1, NO2 NC1, NC2
PIN
1 6 4,8 3,9 2,10 5,7 Power supply ground
FUNCTION
Digital control pin to connect the COM terminal to the NO or NC terminals Common terminal Normally-open terminal Normally-closed terminal
Note: NO, NC and COM terminal may be an input or output.
2
SGM3005
ELECTRICAL CHARACTERISTICS
(V+ = +5 V 10%, GND = 0 V, TA = - 40C to +125C, unless otherwise noted. Typical values are at TA = + 25C.) SGM3005 - 40 to +125 UNITS 0 V+ 0 VNO or VNC V+, ICOM = -10 mA, Test Circuit 1 0 VNO or VNC V+, ICOM = -10 mA, Test Circuit 1 0 VNO or VNC V+, ICOM = -10 mA, Test Circuit 1 0.5 0.9 0.05 0.09 0.25 0.3 4 10 4 10 1000 2.4 0.8 VIN = VINH or VINH 0.01 0.1 1 1000 0.4 0.12 1.1 V V nA nA nA nA V V A A PARAMETER ANALOG SWITCH Analog Signal Range On-Resistance On-Resistance Match Between Channels On-Resistance Flatness LEAKAGE CURRENTS Source OFF Leakage current Channel ON Leakage current DIGITAL INPUTS Input High Voltage Input Low Voltage Input Current DYNAMIC CHARACTERISTICS Turn-On Time Turn-Off Time Charge Injection, Break-Before-Make Time Delay Off Isolation Channel-to-Channel Crosstalk Total Harmonic Distortion Bandwidth -3 dB Source OFF Capacitance Channel ON Capacitance POWER REQUIREMENTS Power Supply Current I+ V+ = +5.5V, VIN = 0V or 5V 0.001 1 A A TYP MAX tON tOFF Q tD OISO XTALK THD BW CNC(OFF), CNO(OFF) CNC(ON), CNO(ON), CCOM(ON) VNO or VNC = 3V, RL = 300, CL = 35pF, Test Circuit 4 VNO or VNC = 3V, RL = 300, CL = 35pF, Test Circuit 4 CL = 1.0nF, VG = 0V, RG = 0, Test Circuit 5 VNO1 or VNC1 = VNO2 or VNC2 = 3V, RL = 300, CL = 35pF, Test Circuit 6 RL = 50, CL = 5pF, Test Circuit 7 RL = 50, CL = 5pF, f = 100KHz f = 10KHz f = 100KHz 16 15 1 10 -75 -85 -90 -105 0.065 30 82 380 ns ns pC ns dB dB dB dB % MHz pF pF TYP TYP TYP TYP TYP TYP TYP TYP TYP TYP TYP TYP VINH VINL IINL or IINH MIN MAX TYP MAX INC(OFF), INO(OFF) INC(ON), INO(ON), ICOM(ON) VNO or VNC = 4.5V/1V, VCOM = 1V/4.5V, V+ = +5.5V ,Test Circuit 2 VNO or VNC = VCOM = 1V or 4.5V, V+ = +5.5V , Test Circuit 3 TYP MAX TYP MAX VNO, VNC, VCOM RON RON RFLAT(ON) MIN MAX TYP MAX TYP MAX TYP MAX SYMBOL CONDITIONS +25 MIN/ MAX
Test Circuit 8 f = 10KHz f = 20Hz to 20KHz, VCOM = 3.5VP-P, RL = 600, CL = 50pF RL = 50, CL = 5pF, Test Circuit 9
Specifications subject to change without notice.
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SGM3005
ELECTRICAL CHARACTERISTICS
(V+ = +3 V 10%, GND = 0 V, TA = - 40C to +125C, unless otherwise noted. Typical values are at TA = + 25C.) SGM3005 - 40 to +125 UNITS 0 V+ 0 VNO or VNC V+, ICOM = -10 mA, Test Circuit 1 0 VNO or VNC V+, ICOM = -10 mA, Test Circuit 1 0 VNO or VNC V+, ICOM = -10 mA, Test Circuit 1 0.6 1.0 0.05 0.1 0.25 0.3 5 11 5 11 1000 2.0 0.4 VIN = VINH or VINH 0.01 0.1 1 1000 0.4 0.13 1.3 V V nA nA nA nA V V A A PARAMETER ANALOG SWITCH Analog Signal Range On-Resistance On-Resistance Match Between Channels On-Resistance Flatness LEAKAGE CURRENTS Source OFF Leakage current Channel ON Leakage current DIGITAL INPUTS Input High Voltage Input Low Voltage Input Current DYNAMIC CHARACTERISTICS Turn-On Time Turn-Off Time Charge Injection, Break-Before-Make Time Delay Off Isolation Channel-to-Channel Crosstalk Total Harmonic Distortion Bandwidth -3 dB Source OFF Capacitance Channel ON Capacitance POWER REQUIREMENTS Power Supply Current I+ V+ = +3.3V, VIN = 0V or 3V 0.001 1 A A TYP MAX tON tOFF Q tD OISO XTALK THD BW CNC(OFF), CNO(OFF) CNC(ON), CNO(ON), CCOM(ON) VNO or VNC = 2V, RL = 300, CL = 35pF, Test Circuit 4 VNO or VNC = 2V, RL = 300, CL = 35pF, Test Circuit 4 CL = 1.0nF, VG = 0V, RG = 0, Test Circuit 5 VNO1 or VNC1 = VNO2 or VNC2 = 2V, RL = 300, CL = 35pF, Test Circuit 6 RL = 50, CL = 5pF, Test Circuit 7 RL = 50, CL = 5pF, f = 100KHz f = 10KHz f = 100KHz 17 16 3 11 -75 -85 -90 -105 0.06 30 82 380 ns ns pC ns dB dB dB dB % MHz pF pF TYP TYP TYP TYP TYP TYP TYP TYP TYP TYP TYP TYP VINH VINL IINL or IINH MIN MAX TYP MAX INC(OFF), INO(OFF) INC(ON), INO(ON), ICOM(ON) VNO or VNC = 3V/1V, VCOM = 1V/3V, V+ = +3.3V ,Test Circuit 2 VNO or VNC = VCOM = 1V or 3V, V+ = +3.3V , Test Circuit 3 TYP MAX TYP MAX VNO, VNC, VCOM RON RON RFLAT(ON) MIN MAX TYP MAX TYP MAX TYP MAX SYMBOL CONDITIONS +25 MIN/ MAX
Test Circuit 8 f = 10KHz f = 20Hz to 20KHz, VCOM = 2VP-P, RL = 600, CL = 50pF RL = 50, CL = 5pF, Test Circuit 9
Specifications subject to change without notice.
4
SGM3005
TYPICAL PERFORMANCE CHARACTERISTICS
On Response vs.Frequency 3 V+ = +5V TA = +25 0 On Response(dB)
Crosstalk(dB) -70 -80 -90 -100 -50 -60 V+ = +5V TA = +25 Crosstalk vs.Frequency
-3
-6
-9 0.1 1 10 Frequency(MHz) 100
-110 0.01
0.1 1 Frequency(MHz)
10
Off Isolation vs.Frequency -20 -30 Off Isolation(dB) -40 -50 -60 -70 -80 -90 -100 0.01 V+ = +5V TA = +25
0.1 1 Frequency(MHz)
10
5
SGM3005
TEST CIRCUITS
10mA V1
NO or NC VNO or VNC
COM
RON = V1/10mA
Test Circuit 1. On Resistance
INC(OFF) or INO(OFF)
A
VNO or VNC
NO or NC
COM VCOM
VNO or VNC
NO or NC
COM
ICOM(ON)
A
VCOM
Test Circuit 2: Off Leakage
Test Circuit 3: On Leakage
V+ 0.1F
V+ NO or NC VNO or VNC IN GND COM RL 300 VOUT CL 35pF
VIN
50%
50%
VOUT tON
90%
90%
tOFF
Test Circuit 4: Switching Times
V+ 0.1F
V+ RG VG IN GND VIN NO or NC COM CL 1nF VOUT VOUT VIN ON OFF VOUT ON 0V
V+
Test Circuit 5: Charge Injection
6
SGM3005
TEST CIRCUITS(Cont.)
V+ 0.1F
NC VNO or VNC IN NO
V+ COM RL 300 GND VOUT CL 35pF VIN 0 50%
VNO or VNC VOUT tD 90%
Test Circuit 6. Break-Before-Make Time Delay, tD
V+ 0.1F
V+ NO or NC Source Signal IN GND COM RL 50 VOUT CL 5pF
Test Circuit 7. Off Isolation
V+ 0.1F
V+ NO or NC Source Signal IN1 COM RL 50 CL 5pF
IN2 NO or NC GND COM RL 50 VNO or VNC VOUT CL 5pF
N.C.
VOUT
Channel To Channel Crosstalk = -20xlog
Test Circuit 8. Channel-to-Channel Crosstalk
7
SGM3005
TEST CIRCUITS(Cont.)
V+ 0.1F
V+ NO or NC Source Signal IN GND COM RL 50 VOUT CL 5pF
Test Circuit 9. Bandwidth
8
SGM3005
PACKAGE OUTLINE DIMENSIONS
MSOP-10
b
C
Symbol
E1
Dimensions In Millimeters Min Max
0.800 1.200 0.000 0.200 0.760 0.970 0.30 TYP 0.152 TYP 2.900 3.100 0.50 TYP 2.900 3.100 4.700 5.100 0.410 0.650 0 6
Dimensions In Inches Min Max
0.031 0.047 0.000 0.008 0.030 0.038 0.012 TYP 0.006 TYP 0.114 0.122 0.020 TYP 0.114 0.122 0.185 0.201 0.016 0.026 0 6
L
e
A2 A A1
A A1 A2 b c D e E E1 L
E
D
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SGM3005
PACKAGE OUTLINE DIMENSIONS
DFN-10
-A-
D D/2
Symbol
A
-B-
Dimensions In Millimeters Min NOM Max
0.70 0.00 0.18 2.23 1.49 0.20 0.17 0.30 0.40 0.50 0.15 0.13 10 5 0.75 0.02 0.20 REF 0.25 3.00 BSC 2.38 3.00 BSC 1.64 0.50 BSC 2.48 1.74 0.30 0.80 0.05
A1 A3 b D D2 E E2
E/2 INDEX AREA (D/2 x E/2) 4 0.15 C E
0.15 C TOP VIEW
e K K2 L
SEATING PLANE -C-
0.10 C A NX 0.08 C 7 A1 SIDE VIEW D2 SEE DETAIL B 1 2 SEE DETAIL C NX L E2/2 E2 D2/2 A3
L1 L2 N ND
INDEX AREA (D/2 x E/2) 4 7 N N-1
NX K NX b 5 0.10 M C A B 0.05 M C
e
6
(ND-1)x e BOTTOM VIEW
L2
L1
e
ODD TERMINAL SIDE
TERMINAL TIP 5
DETAIL B K2 (2 PLACES) EDGE OF PLASTIC BOOY EXPOSED SLUG/ HEAT SINK BOTTOM VIEW DETAIL C EXPOSED METALLIZED FEATURE L2
NOTES: 1. Dimensioning and tolerancing conform to ASME Y14.5M-1994. 2. All dimensions are in millimeters, angle is in degrees (). 3. N is the total number of terminals. 4. The terminal #1 identifier and terminal numbering convention shall conform to JESD 95-1 SPP-012. Details of terminal #1 identifier are optional, but must be located within the zone indicated. The terminal #1 identifier may be either a mold, embeded metal or mark feature. 5. Dimension b applies to metallized terminal and is measured between 0.15MM and 0.30MM from terminal tip. 6. ND refers to the maximum number of terminals on D side. 7. Unilateral coplanarity zone applies to the exposed heat sink slug as well as the terminals.
10
SGM3005
REVISION HISTORY
Location 11/06-- Data Sheet changed from REV.A to REV.B
Changes to ABSOLUTE MAXIMUM RATINGS. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Page
10/07-- Data Sheet changed from REV.B to REV.C
Changes to TYPICAL PERFORMANCE CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . . .. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Shengbang Microelectronics Co, Ltd
Unit 3, ChuangYe Plaza No.5, TaiHu Northern Street, YingBin Road Centralized Industrial Park Harbin Development Zone Harbin, HeiLongJiang 150078 P.R. China Tel.: 86-451-84348461 Fax: 86-451-84308461 www.sg-micro.com
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SGM3005

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