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| STTH30R04 Ultrafast recovery diode Main product characteristics IF(AV) VRRM Tj VF (typ) trr 30 A 400 V 175 C 0.97 V 24 ns K A A K A K Features and benefits TO-220AC STTH30R04D K DO-247 STTH30R04W Ultrafast switching Low reverse current Low thermal resistance Reduces switching and conduction losses High junction temperature Insulated package: DOP3I - Electrical insulation = 2500 VRMS Package capacitance = 12 pF www..com K A A A A A K D2PAK STTH30R04G DOP3I STTH30R04PI Note: D2PAK - 2 anode terminals must be shorted on board. Description The compromise-free, high quality design of this diode has produced a device with low leakage current, regularly reproducible characteristics and intrinsic ruggedness. These characteristics make it ideal for heavy duty applications that demand long term reliability. Table 1. Symbol VRRM IF(RMS) IF(AV) IFRM IFSM Tstg Tj Repetitive peak reverse voltage RMS forward current Average forward current, = 0.5 Repetitive peak forward current Order codes Part Number STTH30R04D STTH30R04G STTH30R04G-TR STTH30R04W STTH30R04PI Marking STTH30R04D STTH30R04G STTH30R04G STTH30R04W STTH30R04PI Absolute ratings (limiting values at 25 C, unless otherwise specified) Parameter Value 400 50 TO-220AC / DO-247 / D DOP3I tp = 10 s, F = 1 kHz 2PAK Unit V A A A A C C Tc = 120 C Tc = 90 C 30 500 300 -65 to +175 -40 to +175 Surge non repetitive forward current tp = 10 ms Sinusoidal Storage temperature range Maximum operating junction temperature range March 2007 Rev 1 1/10 www.st.com Characteristics STTH30R04 1 Characteristics Table 2. Thermal parameters Parameter TO-220AC / DO-247 / D2PAK Rth(j-c) Junction to case DOP3I 1.9 Value 1.15 C/W Unit Symbol Table 3. Symbol Static electrical characteristics Parameter Test conditions Tj = 25 C Min Typ Max 15 VR = VRRM 3 15 IF = 15 A 30 150 1.26 0.8 1.0 1.45 IF = 30 A 0.97 1.3 1.2 V A Unit IR (1) Reverse leakage current Tj = 100 C Tj = 125 C Tj = 25 C Tj = 150 C VF(2) Forward voltage drop Tj = 25 C Tj = 100 C Tj = 150 C 1. Pulse test: tp = 5 ms, < 2 % 2. Pulse test: tp = 380 s, < 2 % To evaluate the conduction losses use the following equation: www..com P = 0.9 x IF(AV) + 0.01 x IF2(RMS) Table 4. Symbol Dynamic characteristics Parameter Test conditions IF = 1 A, dIF/dt = -200 A/s, VR = 30 V, Tj = 25 C Min Typ 24 78 Max 35 100 50 10 14 500 2.9 A ns V ns Unit trr Reverse recovery time IF = 1 A, dIF/dt = -15 A/s, VR = 30 V, Tj = 25 C IF = 1 A, IR = 1 A, IRR = 0.25 A, Tj = 25 C IRM tfr VFP Reverse recovery current Forward recovery time Forward recovery voltage IF = 30 A, dIF/dt = -200 A/s, VR = 160 V, Tj = 125 C dIF/dt = 100 A/s IF = 30 A VFR = 1.1 x VFmax, Tj = 25 C dIF/dt = 100 A/s IF = 30 A VFR = 1.1 x VFmax, Tj = 25 C 2/10 STTH30R04 Characteristics Figure 1. P(W) 50 45 40 35 30 25 20 15 Conduction losses versus average current =0.5 =0.2 =0.1 =0.05 =1 Figure 2. IFM(A) Forward voltage drop versus forward current 200 180 160 140 120 100 80 60 T TJ=150C (Maximum values) TJ=150C (Typical values) 10 5 0 0 5 10 15 20 25 30 35 40 IF(AV)(A) 40 =tp/T tp 20 0 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 TJ=25C (Maximum values) VFM(V) 1.8 2.0 2.2 2.4 2.6 Figure 3. Relative variation of thermal impedance junction to case versus pulse duration Figure 4. Peak reverse recovery current versus dIF/dt (typical values) Zth(j-c)/Rth(j-c) 1.0 Single pulse TO-220AC DPAK DO-247 DOP-3I 22 20 18 16 14 12 10 8 6 IRM(A) IF= 30 A VR=320 V Tj=125 C Tj=25 C www..com 4 2 tp(s) 0.1 1.E-03 1.E-02 1.E-01 1.E+00 dIF/dt(A/s) 10 100 1000 0 Figure 5. tRR(ns) Reverse recovery time versus dIF/dt (typical values) IF= 30 A VR=320 V Figure 6. QRR(nC) IF= 30 A VR=320 V Reverse recovery charges versus dIF/dt (typical values) 180 160 140 120 100 80 60 40 20 Tj=125 C Tj=25 C dIF/dt(A/s) 0 10 100 1000 750 700 650 600 550 500 450 400 350 300 250 200 150 100 50 0 Tj=125 C Tj=25 C dIF/dt(A/s) 10 100 1000 3/10 Characteristics STTH30R04 Figure 7. Thermal resistance junction to ambient versus copper surface under tab (Epoxy printed circuit board FR4, eCU = 35 m) DPAK Figure 8. Relative variations of dynamic parameters versus junction temperature Rth(j-a) (C/W) 80 70 60 50 1.4 1.2 1.0 0.8 QRR [Tj]/QRR [Tj = 125 C] and IRM [Tj]/IRM [Tj = 125 C] IF= 30 A VR=320 V IRM 40 0.6 30 20 10 SCU(cm) 0 0 2 4 6 8 10 12 14 16 18 20 QRR 0.4 0.2 T j(C) 0.0 25 50 75 100 125 150 Figure 9. VFp(V) IF=30 A Tj=125 C Transient peak forward voltage versus dIF/dt (typical values) Figure 10. Forward recovery time versus dIF/dt (typical values) 2000 1800 1600 1400 1200 1000 800 tFR(ns) IF=30 A VFR=1.1 x V F max. Tj=125C 5 5 4 4 3 3 2 2 1 1 0 600 www..com 400 dIF/dt(A/s) 0 50 100 150 200 250 300 350 400 450 500 200 0 0 100 200 300 dIF/dt(A/s) 400 500 Figure 11. Junction capacitance versus reverse voltage applied (typical values) C(pF) 1000 F=1MHz VOSC=30mVRMS Tj=25C 100 VR(V) 10 1 10 100 1000 4/10 STTH30R04 Package information 2 Package information Epoxy meets UL94, V0 Cooling method: by conduction (C) Recommended torque value: 0.8 Nm (TO-220FPAC) / 0.55 Nm (TO-220AC, DOP3I) Maximum torque value: 1.0 Nm (TO-220FPAC) / 0.70 Nm (TO-220AC, DOP31) D2PAK dimensions Dimensions Ref. Millimeters Min. A A E L2 C2 Table 5. Inches Min. 0.173 0.098 0.001 0.027 0.045 0.017 0.048 0.352 0.393 0.192 0.590 0.050 0.055 0.094 Max. 0.181 0.106 0.009 0.037 0.067 0.024 0.054 0.368 0.409 0.208 0.624 0.055 0.069 0.126 Max. 4.60 2.69 0.23 0.93 1.70 0.60 1.36 9.35 10.40 5.28 15.85 1.40 1.75 3.20 4.40 2.49 0.03 0.70 1.14 0.45 1.23 8.95 10.00 4.88 15.00 1.27 1.40 2.40 A1 A2 B D L L3 A1 B2 B G www..com B2 C C2 C R D E G L A2 M * V2 L2 L3 M R V2 * FLAT ZONE NO LESS THAN 2mm 0.40 typ. 0 8 0.016 typ. 0 8 Figure 12. D2PAK footprint (dimensions in mm) 16.90 10.30 1.30 5.08 8.90 3.70 5/10 Package information Table 6. DO-247 dimensions Dimensions Ref. Millimeters Min. A V STTH30R04 Inches Min. 0.191 0.086 0.015 0.039 0.078 Typ. Max. 0.203 0.102 0.031 0.055 Typ. Max. 5.15 2.60 0.80 1.40 4.85 2.20 0.40 1.00 2.00 2.00 10.90 15.45 19.85 3.70 18.50 14.20 34.60 5.50 2.00 5 60 3.55 D E Dia V F F2 H A F3 G 2.40 0.078 0.429 0.094 L5 H L L2 L4 F2 L3 F3 V2 F G M E L1 D 15.75 0.608 20.15 0.781 4.30 0.145 0.728 14.80 0.559 1.362 0.216 3.00 0.078 5 60 3.65 0.139 0.620 0.793 0.169 L L1 L2 L3 L4 L5 M V V2 Dia. 0.582 www..com 0.118 0.143 6/10 STTH30R04 Table 7. TO-220AC dimensions Package information Dimensions Ref. Millimeters Min. A H2 OI L5 L7 L6 L2 C A Inches Min. 0.173 0.048 0.094 0.019 0.024 0.044 0.194 0.393 Max. 0.181 0.051 0.107 0.027 0.034 0.066 0.202 0.409 Max. 4.60 1.32 2.72 0.70 0.88 1.70 5.15 10.40 4.40 1.23 2.40 0.49 0.61 1.14 4.95 10.00 C D E F F1 G F1 L9 L4 F D H2 L2 L4 16.40 typ. 13.00 2.65 15.25 6.20 3.50 14.00 2.95 15.75 6.60 3.93 0.645 typ. 0.511 0.104 0.600 0.244 0.137 0.551 0.116 0.620 0.259 0.154 M E G L5 L6 L7 L9 www..com M Diam. I 2.6 typ. 3.75 3.85 0.102 typ. 0.147 0.151 7/10 Package information Table 8. DOP3I dimensions Dimensions Ref. E R E1 OP c A STTH30R04 Millimeters Min. Max. 4.60 1.40 1.55 0.70 13.10 15.50 7.75 11.30 21.10 15.60 4.17 2.90 Inches Min. 0.173 0.047 0.057 0.020 0.474 0.594 0.297 0.425 0.815 0.565 0.161 0.106 Max. 0.181 0.055 0.061 0.028 0.516 0.610 0.305 0.445 0.831 0.614 0.164 0.114 A b c c1 4.40 1.20 1.45 0.50 12.15 15.10 7.55 10.80 20.4 14.35 4.08 2.70 G D Y D E E1 L e G L c1 Q b e P Q R Y 4.60 typ. 15.80 16.50 0.181 typ. 0.622 0.650 In order to meet environmental requirements, ST offers these devices in ECOPACK(R) www..com packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. 8/10 STTH30R04 Ordering information 3 Ordering information Part Number STTH30R04D STTH30R04G STTH30R04G-TR STTH30R04W STTH30R04PI Marking STTH30R04D STTH30R04G STTH30R04G STTH30R04W STTH30R04PI Package TO-220AC D PAK D2PAK DO-247 DOP3I 2 Weight 1.86 g 1.48 g 1.48 g 4.40 g 4.46 g Base qty 50 50 1000 30 30 Delivery mode Tube Tube Tape and reel Tube Tube 4 Revision history Date 31-Mar-2007 Revision 1 First issue. Description of Changes www..com 9/10 STTH30R04 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries ("ST") reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST's terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST'S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED www..com WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER'S OWN RISK. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. (c) 2007 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 10/10 |
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