 |
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
| Datasheet File OCR Text: |
| SPD22N08S2L-50 OptiMOS(R) Power-Transistor Feature * N-Channel Product Summary VDS R DS(on) ID 75 50 25 P- TO252 -3-11 V m A * Enhancement mode * Logic Level * 175C operating temperature * Avalanche rated * dv/dt rated Type SPD22N08S2L-50 Package Ordering Code P- TO252 -3-11 Q67060-S6062 Marking 2N08L50 Maximum Ratings, at Tj = 25 C, unless otherwise specified Parameter Continuous drain current TC=22C Symbol ID Value 25 18 Unit A Pulsed drain current TC=25C ID puls EAS EAR dv/dt VGS Ptot T j , Tstg 100 94 7.5 6 20 75 -55... +175 55/175/56 kV/s V W C mJ Avalanche energy, single pulse ID=22A, V DD=25V, RGS=25 Repetitive avalanche energy, limited by Tjmax 1) Reverse diode dv/dt IS=22A, V DS=60V, di/dt=200A/s, Tjmax=175C Gate source voltage Power dissipation TC=25C Operating and storage temperature IEC climatic category; DIN IEC 68-1 Page 1 2003-05-09 SPD22N08S2L-50 Thermal Characteristics Parameter Characteristics Thermal resistance, junction - case Thermal resistance, junction - ambient, leaded SMD version, device on PCB: @ min. footprint @ 6 cm2 cooling area 2) Symbol min. RthJC RthJA RthJA - Values typ. 1.34 max. 2 100 75 50 Unit K/W Electrical Characteristics, at Tj = 25 C, unless otherwise specified Parameter Static Characteristics Drain-source breakdown voltage V GS=0V, ID=1mA Symbol min. V(BR)DSS VGS(th) IDSS IGSS RDS(on) RDS(on) 75 1.2 Values typ. 1.6 max. 2 Unit V Gate threshold voltage, VGS = V DS ID=31A Zero gate voltage drain current V DS=75V, VGS=0V, Tj=25C V DS=75V, VGS=0V, Tj=125C A 0.01 1 1 48 38 1 100 100 65 50 nA m Gate-source leakage current V GS=20V, VDS=0V Drain-source on-state resistance V GS=4.5V, I D=11A Drain-source on-state resistance V GS=10V, I D=11A 1Defined by design. Not subject to production test. 2Device on 40mm*40mm*1.5mm epoxy PCB FR4 with 6cm (one layer, 70 m thick) copper area for drain connection. PCB is vertical without blown air. Page 2 2003-05-09 SPD22N08S2L-50 Electrical Characteristics Parameter Dynamic Characteristics Transconductance Input capacitance Output capacitance Reverse transfer capacitance Turn-on delay time Rise time Turn-off delay time Fall time Gate Charge Characteristics Gate to source charge Gate to drain charge Gate charge total Gate plateau voltage Qgs Qgd Qg VDD =60V, ID =22A, VGS =0 to 10V VDD =60V, ID =22A Symbol Conditions min. Values typ. 25 640 124 49 5 22 33 18 max. 850 165 74 7.5 33 50 27 Unit gfs Ciss Coss Crss td(on) tr td(off) tf VDS 2*ID *RDS(on)max, ID =22A VGS =0V, VDS =25V, f=1MHz 13 - S pF VDD =37V, VGS =10V, ID =22A, RG =9.1 ns - 2 8 25 3.3 2.7 12 33 - nC V(plateau) VDD =60V, ID =22A V Reverse Diode Inverse diode continuous forward current Inv. diode direct current, pulsed Inverse diode forward voltage Reverse recovery time Reverse recovery charge ISM VSD trr Qrr VGS =0V, IF =22A VR =40V, IF =lS , diF /dt=100A/s IS TC=25C - 0.9 44 66 25 100 1.3 55 83 A V ns nC Page 3 2003-05-09 SPD22N08S2L-50 1 Power dissipation Ptot = f (TC) parameter: VGS 4 V 80 SPD22N08S2L-50 2 Drain current ID = f (T C) parameter: VGS 10 V 28 SPD22N08S2L-50 A W 24 22 60 20 P tot 50 ID 100 120 140 160 C 190 18 16 40 14 12 30 10 8 20 6 10 4 2 0 0 20 40 60 80 0 0 20 40 60 80 100 120 140 160 C 190 TC TC 3 Safe operating area ID = f ( VDS ) parameter : D = 0 , TC = 25 C 10 3 SPD22N08S2L-50 4 Max. transient thermal impedance Z thJC = f (t p) parameter : D = t p/T 10 1 SPD22N08S2L-50 K/W A 10 t = 5.4s p 0 10 2 Z thJC ID 10 s 10 -1 /I D = 0.50 10 100 s -2 D 10 1 = V DS 0.20 0.10 0.05 single pulse R DS (on ) 10 1 ms -3 0.02 0.01 10 0 10 -1 10 0 10 1 V 10 2 10 -4 10 -7 10 -6 10 -5 10 -4 10 -3 10 -2 s 10 0 VDS Page 4 tp 2003-05-09 SPD22N08S2L-50 5 Typ. output characteristic ID = f (V DS); T j=25C parameter: tp = 80 s 60 SPD22N08S2L-50 6 Typ. drain-source on resistance RDS(on) = f (I D) parameter: VGS 160 SPD22N08S2L-50 Ptot = 75W h g f e V [V] GS a b A 50 45 40 c d m 3.0 3.5 4.0 4.5 5.0 5.5 6.0 10.0 c d 35 30 25 20 15 10 5 0 0 2 4 6 a c d e f g h R DS(on) 120 ID 100 e 80 f 60 g 40 b h 20 VGS [V] = c 4.0 d 4.5 e f 5.0 5.5 g h 6.0 10.0 8 V 0 11 0 4 8 12 16 20 24 28 32 36 A 42 VDS ID 7 Typ. transfer characteristics ID= f ( V GS ); V DS 2 x ID x RDS(on)max parameter: tp = 80 s 50 8 Typ. forward transconductance g fs = f(I D); T j=25C parameter: g fs 40 S A 30 gFS V VGS Page 5 ID 30 25 20 20 15 10 10 5 0 0 1 2 3 4 0 6 0 5 10 15 20 25 30 A ID 40 2003-05-09 SPD22N08S2L-50 9 Drain-source on-state resistance RDS(on) = f (Tj) parameter : ID = 11 A, VGS = 10 V 190 SPD22N08S2L-50 10 Typ. gate threshold voltage VGS(th) = f (T j) parameter: VGS = VDS 3 m 160 V V GS(th) R DS(on) 140 120 100 80 60 40 20 0 -60 98% 2 1.5 155A 31A 1 typ 0.5 -20 20 60 100 140 C 200 0 -60 -20 20 60 100 C Tj 180 Tj 11 Typ. capacitances C = f (V DS) parameter: VGS=0V, f=1 MHz 10 4 12 Forward character. of reverse diode IF = f (V SD) parameter: T j , tp = 80 s 10 2 SPD22N08S2L-50 nF A 10 3 Ciss IF Coss 10 1 C 2 10 10 0 T j = 25 C typ Crss T j = 175 C typ T j = 25 C (98%) T j = 175 C (98%) 10 1 10 5 10 15 20 -1 0 V VDS 30 0 0.4 0.8 1.2 1.6 2 2.4 V 3 VSD Page 6 2003-05-09 SPD22N08S2L-50 13 Typ. avalanche energy E AS = f (T j) par.: I D=22A, VDD = 25 V, RGS = 25 100 14 Typ. gate charge VGS = f (QGate) parameter: ID = 25 A pulsed 16 SPD22N08S2L-50 mJ 80 V 12 VGS 70 EAS 60 50 40 30 10 0,2 VDS max 0,8 VDS max 8 6 4 20 10 0 20 2 40 60 80 100 120 140 C Tj 0 180 0 4 8 12 16 20 24 28 32 nC 40 QGate 15 Drain-source breakdown voltage V(BR)DSS = f (Tj) parameter: ID=10 mA 92 SPD22N08S2L-50 V 88 V(BR)DSS 86 84 82 80 78 76 74 72 70 68 -60 -20 20 60 100 140 C 200 Tj Page 7 2003-05-09 SPD22N08S2L-50 Published by Infineon Technologies AG, Bereichs Kommunikation St.-Martin-Strasse 53, D-81541 Munchen (c) Infineon Technologies AG 1999 All Rights Reserved. Attention please! The information herein is given to describe certain components and shall not be considered as warranted characteristics. Terms of delivery and rights to technical change reserved. We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement, regarding circuits, descriptions and charts stated herein. Infineon Technologies is an approved CECC manufacturer. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office in Germany or our Infineon Technologies Reprensatives worldwide (see address list). Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. Further information Please notice that the part number is BSPD22N08S2L-50, for simplicity the device is referred to by the term SPD22N08S2L-50 throughout this documentation. Page 8 2003-05-09 |
Price & Availability of SPD22N08S2L-50
 |
|
|
|
|
All Rights Reserved © IC-ON-LINE 2003 - 2022 |
| [Add Bookmark] [Contact Us] [Link exchange] [Privacy policy] |
|
Mirror Sites : [www.datasheet.hk]
[www.maxim4u.com] [www.ic-on-line.cn]
[www.ic-on-line.com] [www.ic-on-line.net]
[www.alldatasheet.com.cn]
[www.gdcy.com]
[www.gdcy.net] |