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| EMIF08-1502M16 8-line IPADTM low capacitance EMI filter and ESD protection in micro QFN package Features EMI (I/O) low-pass filter High efficiency in EMI filtering: - Greater than 30 dB attenuation at frequencies from 900 MHz to 1.8 GHz Cut-off frequency: 300 MHz Very low PCB space consumption: 3.3 mm x 1.5 mm Very thin package: 0.6 mm max. High efficiency in ESD suppression on inputs pins (IEC 61000-4-2 level 4) High reliability offered by monolithic integration High reduction of parasitic elements through integration Lead-free package Figure 1. 1 Micro QFN 16L 3.3 mm x 1.5 mm (bottom view) Basic cell configuration 170 Output 1 Input 1 Complies with following standards: IEC 61000-4-2 level 4 input pins - 15 kV (air discharge) - 8 kV (contact discharge) MIL STD 883G - Method 3015-7 Class 3A (all pins) Typical line capacitance = 14 pF typ. @ 2.5 V Description The EMIF08-1502M16 is an 8-line, highly integrated device designed to suppress EMI/RFI noise in all systems exposed to electromagnetic interference. This filter includes an ESD protection circuitry, which prevents damage to the application when subjected to ESD surges up to 15 kV on the input pins. Applications Where EMI filtering in ESD sensitive equipment is required: LCD and camera for Mobile phones Computers and printers Communication systems MCU boards TM: IPAD is a trademark of STMicroelectronics February 2008 Rev 2 1/10 www.st.com Characteristics EMIF08-1502M16 1 Characteristics Figure 2. Pin configuration (top view) Pin 1 Input 1 Output 1 Pin 16 Pin 2 Input 21 Output 2 Pin 15 Pin 3 Input 3 Output 3 Pin 14 Pin 4 Input 4 Output 4 Pin 13 Pin 5 Input 5 Output 5 Pin 12 Pin 6 Input 6 Output 6 Pin 11 Pin 7 Input 7 Output 7 Pin 10 Pin 8 Input 8 Output 8 Pin 9 Table 1. Symbol Absolute ratings (limiting values) Parameter ESD IEC 61000-4-2, air discharge on input pins ESD IEC 61000-4-2, contact discharge on input pins ESD IEC 61000-4-2, contact discharge on output pins Maximum junction temperature Operating temperature range Storage temperature range Value 15 8 4 125 - 40 to + 85 - 55 to + 150 Unit VPP Tj Top Tstg kV C C C 2/10 EMIF08-1502M16 Table 2. Symbol VBR IRM VRM VCL Rd IPP RI/O Cline Characteristics Electrical characteristics (Tamb = 25 C) Parameter Breakdown voltage Leakage current @ VRM Stand-off voltage Clamping voltage Dynamic resistance Peak pulse current Series resistance between Input & Output Input capacitance per line Test conditions IR = 1 mA IF = 10 mA VRM = 3 V per line Tolerance 10% VLINE = 2.5 V dc, VOSC = 30 mV, F = 1 MHz 153 12 170 14 Min. 6 0.5 Typ. 8 1.0 Max. 10 1.5 100 187 16.5 Unit V V nA pF IPP VBR VCL VRM IRM IR VF V I IF Symbol VBR VF IRM RI/O Cline Figure 3. 0.00 S21 attenuation measurement Figure 4. dB 0.00 -10.00 -20.00 Analog cross talk measurements dB - 15.00 -30.00 -40.00 -50.00 -60.00 -70.00 -80.00 - 30.00 F (Hz) - 45.00 1.0M 3.0M 10.0M 30.0M 100.0M 300.0M 1.0G 3.0G -90.00 -100.00 100.0k F (Hz) 1.0M 10.0M 100.0M 1.0G 3/10 Ordering information scheme EMIF08-1502M16 Figure 5. ESD response to IEC 61000-4-2 Figure 6. (+15 kV air discharge) on one input (Vin) and on one output (Vout) ESD response to IEC 61000-4-2 (- 15 kV air discharge) on one input (Vin) and on one output (Vout) Figure 7. Line capacitance versus reverse voltage applied (typical value) CLINE(pF) 24 22 20 18 16 14 12 10 8 6 4 2 0 0.0 0.5 1.0 1.5 2.0 VLINE(V) 2.5 3.0 3.5 4.0 4.5 5.0 2 Ordering information scheme Figure 8. Ordering information scheme EMIF EMI Filter Number of lines Information x = resistance value (Ohms) z = capacitance value / 10 (pF) Package Mx = Micro QFN x leads yy - xxx z Mx 4/10 EMIF08-1502M16 Package information 3 Package information Epoxy meets UL94, V0 In order to meet environmental requirements, ST offers these devices in ECOPACK(R) packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at www.st.com. Table 3. Micro QFN 3.3x1.5 16L dimensions Dimensions TOP VIEW D Ref. Millimeters Min. Typ. 0.55 0.02 0.20 3.30 2.60 1.50 0.35 0.40 0.20 0.20 0.30 0.008 Max. Min. Inches Typ. Max. INDEX AREA (D/2 x E/2) E A A1 0.50 0.00 0.15 3.20 2.45 1.40 0.20 0.60 0.020 0.022 0.024 0.05 0.000 0.001 0.002 0.25 0.006 0.008 0.010 3.40 0.126 0.130 0.134 2.70 0.096 0.102 0.106 1.60 0.055 0.059 0.063 0.45 0.008 0.014 0.018 0.016 SIDE VIEW A A1 b D D2 BOTTOM VIEW e INDEX AREA (D/2 x E/2) b EXPOSED PAD E E2 e K L E2 PIN # 1 ID L D2 K 0.40 0.008 0.012 0.016 Figure 9. Micro QFN 3.3x1.5 16L Figure 10. Marking footprint (dimensions in mm) 0.40 0.20 0.60 0.275 0.35 Dot : Pin 1 Identification X X= Marking WW= DataCode (week) Y=Data code(Year) P=Assembly plant XX WW YP 2.60 5/10 Package information Figure 11. Tape and reel specification Dot identifying Pin A1 location 2.00 0.1 4.00 0.1 O 1.55 0.05 EMIF08-1502M16 1.75 0.1 5.5 0.1 12.00 0.3 All dimensions in mm 3.70 0.1 XX WW YP XX WW YP XX WW YP XX WW YP XX WW YP XX WW YP 0.80 0.1 1.70 0.1 4.00 0.1 User direction of unreeling Note: Product marking may be rotated by 90 for assembly plant differentiation. In no case should this product marking be used to orient the component for its placement on a PCB. Only pin 1 mark is to be used for this purpose. 6/10 EMIF08-1502M16 Recommendation on PCB assembly 4 4.1 Recommendation on PCB assembly Stencil opening design 1. General recommendation on stencil opening design a) Stencil opening dimensions: L (Length), W (Width), T (Thickness). Figure 12. Stencil opening dimensions L T W b) General design rule Stencil thickness (T) = 75 ~ 125 m W Aspect Ratio = ---- 1.5 T LxW Aspect Area = --------------------------- 0.66 2T ( L + W ) 2. Reference design a) b) c) Stencil opening thickness: 100 m Stencil opening for central exposed pad: Opening to footprint ratio is 50%. Stencil opening for leads: Opening to footprint ratio is 90%. Figure 13. Recommended stencil window position 5 m 5 m 15 m 600 m 570 m 0.40 0.20 190 m 15 m 200 m 0.60 0.275 0.35 2600 m 50 m 250 m 2.60 350 m 1820 m 50 m 390 m Footprint Stencil window Footprint 390 m 7/10 Recommendation on PCB assembly EMIF08-1502M16 4.2 Solder paste 1. 2. 3. 4. Halide-free flux qualification ROL0 according to ANSI/J-STD-004. "No clean" solder paste is recommended. Offers a high tack force to resist component movement during high speed Solder paste with fine particles: powder particle size is 20-45 m. 4.3 Placement 1. 2. 3. 4. Manual positioning is not recommended. It is recommended to use the lead recognition capabilities of the placement system, not the outline centering Standard tolerance of 0.05 mm is recommended. 3.5 N placement force is recommended. Too much placement force can lead to squeezed out solder paste and cause solder joints to short. Too low placement force can lead to insufficient contact between package and solder paste that could cause open solder joints or badly centered packages. To improve the package placement accuracy, a bottom side optical control should be performed with a high resolution tool. For assembly, a perfect supporting of the PCB (all the more on flexible PCB) is recommended during solder paste printing, pick and place and reflow soldering by using optimized tools. 5. 6. 4.4 PCB design preference 1. 2. To control the solder paste amount, the closed via is recommended instead of open vias. The position of tracks and open vias in the solder area should be well balanced. The symmetrical layout is recommended, in case any tilt phenomena caused by asymmetrical solder paste amount due to the solder flow away. 8/10 EMIF08-1502M16 Ordering information 4.5 Reflow profile Figure 14. ST ECOPACK(R) recommended soldering reflow profile for PCB mounting Temperature (C) 260C max 255C 220C 180C 125 C 2C/s recommended 2C/s recommended 6C/s max 6C/s max 3C/s max 3C/s max 0 0 1 2 3 4 5 10-30 sec 90 to 150 sec 90 sec max 6 7 Time (min) Note: Minimize air convection currents in the reflow oven to avoid component movement. 5 Ordering information Table 4. Ordering information Marking G8(1) Package Micro QFN Weight 7.2 mg Base qty 3000 Delivery mode Tape and reel (7") Order code EMIF08-1502M16 1. The marking can be rotated by 90 to differentiate assembly location 6 Revision history Table 5. Date 24-Oct-2006 04-Feb-2008 Document revision history Revision 1 2 Initial release. Reformatted to current standards. Updated ECOPACK statement. Added Section 4: Recommendation on PCB assembly. Changes 9/10 EMIF08-1502M16 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries ("ST") reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST's terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST'S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER'S OWN RISK. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. (c) 2008 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 10/10 |
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