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| EMIF02-AV01F3 Dual audio and video line IPADTM, EMI filter and ESD protection Features High-density capacitor EMI low-pass filter and ESD protection High-efficiency in EMI filtering Lead-free package 400 m pitch Very small PCB footprint: 0.91 mm x 1.31 mm Very thin package: 0.605 mm High reliability offered by monolithic integration Reduction of parasitic elements thanks to CSP integration Figure 1. Pin configuration (bump side view) 1 2 A B C Flip Chip 5 bumps Complies with the following standards IEC 61000-4-2 level 4 on external pin (A2, C2) - 15 kV (air discharge) - 8 kV (contact discharge) IEC 61000-4-2 level 1 on internal pin (A1, C1) - 2 kV (air discharge) - 2 kV (contact discharge) Figure 2. Schematic R A1 Application A2 Dual audio and video line interface protection and filtering in mobile phones C Description The EMIF02-AV01F3 is a highly integrated array designed to suppress EMI / RFI noise and provide impedance matching for mobile phones and portable applications. The EMIF02-AV01F3 is in Flip Chip package to offer space saving and high RF performance. Additionally, this low-pass filter includes an ESD protection circuitry to prevent damage to the application when subjected to ESD surges up to 15 kV. B2 Gnd 2 kV 15 kV 2 kV 15 kV C C1 R C2 TM: IPAD is a trademark of STMicroelectronics. April 2008 Rev 3 1/7 www.st.com 7 Characteristics EMIF02-AV01F3 1 Characteristics Table 1. Symbol Absolute maximum ratings (Tamb = 25 C) Parameter Internal pins (A1, C1) ESD discharge IEC 61000-4-2, air discharge ESD discharge IEC 61000-4-2, contact discharge External pins (A2, C2) ESD discharge IEC 61000-4-2, air discharge ESD discharge IEC 61000-4-2, contact discharge Maximum junction temperature Total Power Dissipation Operating temperature range Storage temperature range Value Unit Vpp 2 2 kV 15 8 125 200 -40 to +85 -55 to 150 C mW C C Tj PTOT Top Tstg Table 2. Symbol VBR IRM VRM VCL Rd IPP RI/O Cline Symbol VBR IRM RI/O Cline Electrical characteristics (Tamb = 25 C) Parameters Breakdown voltage Leakage current @ VRM Stand-off voltage Clamping voltage Dynamic impedance Peak pulse current Series resistance between input and output Input capacitance per line Test conditions IR = 1 mA VRM = 3 V per line 12 Vline = 0 V, VOSC = 30 mV, F = 100 kHz 2.56 15 3.2 Min 14 Typ Max 18 0.5 18 3.84 Unit V A nF IPP VCL VBR VRM IR IRM IRM IR VRM VBR VCL V I IPP 2/7 EMIF02-AV01F3 Characteristics Figure 3. 0.00 S21 (dB) attenuation dB Figure 4. 0.00 -10.00 Analog crosstalk dB -10.00 -20.00 -30.00 -20.00 -40.00 -50.00 -30.00 -60.00 -70.00 -40.00 -80.00 F (Hz) -50.00 10.0M 30.0M Line 1 100.0M 300.0M 1.0G Line 2 3.0G -90.00 -100.00 1.0M 3.0M 10.0M 30.0M F (Hz) 100.0M 300.0M 1.0G 3.0G Xtalk 1/2 Figure 5. Digital crosstalk Figure 6. ESD response to IEC 61000-4-2 (+15 kV air discharge) on one input (VIN) and one output (VOUT) INPUT : 10 V/Div 100 ns/Div Vin = 1 V/d OUTPUT : 10 V/Div 100 ns/Div Vout = 5 mV/d Figure 7. ESD response to IEC 61000-4-2 (-15 kV air discharge) on one input (VIN) and one output (VOUT) INPUT : 10 V/Div 100 ns/Div Figure 8. Line capacitance versus applied voltage CLINE(nF) 3.5 3.0 2.5 2.0 F=100 kHz VOSC=30 mVRMS Tj=25 C OUTPUT : 10 V/Div 100 ns/Div 1.5 1.0 0.5 VLINE (V) 0.0 0 1 2 3 4 5 6 3/7 Ordering information scheme EMIF02-AV01F3 2 Ordering information scheme Figure 9. Ordering information scheme EMIF EMI Filter Number of lines Information x = resistance value (Ohms) z = capacitance value / 10 (pF) or 2 letters = application 2 digits = version Package F = Flip Chip x = 3: lead free, pitch = 400 m, bump = 255 m yy - xx zz Fx 3 Package information In order to meet environmental requirements, ST offers these devices in ECOPACK(R) packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at www.st.com. Figure 10. Package dimensions 400 m 40 400 m 50 605 m 55 255 m 40 255 m 910 m 30 m 255 m 4/7 1310 m 30 m EMIF02-AV01F3 Ordering information Figure 11. Footprint Copper pad Diameter: 220 m recommended 260 m maximum Solder mask opening: 300 m minimum Figure 12. Marking Dot xx = marking z = manufacturing location yww = datecode (y = year ww = week) E Solder stencil opening: 220 m recommended xxz y ww Dot identifying Pin A1 location 4 0.1 O 1.5 0.1 Figure 13. Flip Chip tape and reel specification 1.75 0.1 3.5 0.1 1.01 0.71 0.05 All dimensions in mm 8 0.3 1.41 STE STE STE xxz yww User direction of unreeling xxz yww xxz yww 4 0.1 Note: Note: More information is available in the application note: AN2348:"Flip Chip: Package description and recommendations for use" AN1751: "EMI filters: Recommendations and measurements" 4 Ordering information Table 3. Ordering information Marking HH Package Flip Chip Weight 1.4 mg Base qty 5000 Delivery mode Tape and reel 7" Order code EIMF02-AV01F3 5/7 Revision history EMIF02-AV01F3 5 Revision history Table 4. Date 06-Oct-2006 11-Oct-2006 17-Apr-2008 Document revision history Revision 1 2 3 Initial release. Corrected test conditions for Cline in Table 2. Updated ECOPACK statement. Updated Figure 9, Figure 10 and Figure 13. Reformatted to current standards. Changes 6/7 EMIF02-AV01F3 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries ("ST") reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST's terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST'S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZE REPRESENTATIVE OF ST, ST PRODUCTS ARE NOT DESIGNED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS, WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER'S OWN RISK. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. (c) 2008 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 7/7 |
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