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| EMIF10-LCD02F3 10-line IPADTM, EMI filter and ESD protection for LCD and cameras Features Lead-free package EMI symmetrical (I/O) low-pass filter High efficiency in EMI filtering 400 m pitch Compatible with high speed data rate Very low PCB space occupation: < 4mm2 Very thin package: 0.60 mm High efficiency in ESD suppression High reliability offered by monolithic integration High reduction of parasitic elements through integration and wafer level packaging Figure 1. Pin layout (bump side) Flip Chip 24 bumps 5 O1 O3 O5 O7 O9 4 O2 O4 O6 O8 O10 3 GND 2 I1 I3 1 I2 I4 I6 I8 I10 A B C D E Complies with the following standards IEC61000-4-2 level 4 on inputs and outputs - 15 kV (air discharge) - 8 kV (contact discharge) MIL STD 883E - Method 3015-6 Class 3 GND I5 I7 I9 GND GND Applications Where EMI filtering in ESD sensitive equipment is required : Figure 2. Device configuration Low-pass Filter LCD for mobile phones Computers and printers Communication systems MCU boards Ri/o = 70 Cline = 30pF Input Output Description The EMIF10-LCD02F3 is a 10-line highly integrated device designed to suppress EMI/RFI noise in all systems subjected to electromagnetic interference. The EMIF10 Flip Chip packaging means the package size is equal to the die size. This filter includes ESD protection circuitry, which prevents damage to the protected device when subjected to ESD surges up 15kV. GND GND GND TM: IPAD is a trademark of STMicroelectronics. April 2008 Rev 2 1/8 www.st.com 8 Characteristics EMIF10-LCD02F3 1 Characteristics Table 1. Symbol Tj Top Tstg Absolute maximum ratings (Tamb = 25 C) Parameter and test conditions Maximum junction temperature Operating temperature range Storage temperature range Value 125 -40 to +85 -55 to 150 Unit C C C Table 2. Symbol VBR IRM VRM VCL IPP RI/O Cline Symbol VBR IRM R2 Cline Electrical characteristics (Tamb = 25 C) Parameters Breakdown voltage Leakage current @ VRM Stand-off voltage Clamping voltage Peak pulse current Series resistance between Input & Output Input capacitance per line Test conditions IR = 1 mA VRM = 3 V Tolerance 20% Vline = 0 V, VOSC = 30 mV, F =1 MHz Min 6 Typ 8 50 70 30 Max 10 200 Unit V nA pF IPP VCL VBR VRM IRM IR VF V I IF 2/8 EMIF10-LCD02F3 Characteristics Figure 3. S21(dB) all lines attenuation Figure 4. measurement and Aplac simulation 0.00 dB -10.00 -20.00 -30.00 -40.00 -50.00 -60.00 -70.00 -80.00 -90.00 -100.00 100.0k Analog cross talk measurement 1.0M 10.0M f/Hz 100.0M Xtalk 1/2 1.0G Figure 5. ESD response to IEC 61000-4-2 Figure 6. (+15 kV air discharge) on one input and on one output ESD response to IEC 61000-4-2 (-15 kV air discharge) on one input and on one output Input 10V/d Input 10V/d Output 10V/d Output 10V/d 100ns/d 100ns/d Figure 7. Line capacitance versus applied voltage Cline (pF) 30 25 20 15 10 5 Vline (V) 0 0 1 2 3 4 5 6 3/8 Application information EMIF10-LCD02F3 2 Application information Figure 8. Device structure (one cell) Lbump I1 Rbump Rline Rbump Lbump O1 MODEL = D1 MODEL = D2 bulk bulk MODEL = D3 Rbump Cbump Cbump Lbump Rbump Cbump Lbump Rbump Cbump Lbump Rbump Lbump Rgnd Lgnd Rgnd Lgnd Rgnd Lgnd Rgnd Lgnd Figure 9. Aplac model variables aplacvar Rline 70 aplacvar C_d1 15p aplacvar C_d2 15p aplacvar C_d3 600p aplacvar Ls 950pH aplacvar Rs 150m aplacvar Lbump 50pH aplacvar Rbump 20m aplacvar Cbump 150f aplacvar Lgnd 50pH aplacvar Rgnd 100m aplacvar Rsub 10m Diode D1 BV=7 IBV=1m CJO=C_d1 M=0.28 RS=0.1 VJ=0.6 TT=100n Diode D2 BV=7 IBV=1m CJO=C_d2 M=0.28 RS=0.1 VJ=0.6 TT=100n Diode D3 BV=7 IBV=1m CJO=C_d3 M=0.28 RS=0.01 VJ=0.6 TT=100n 4/8 EMIF10-LCD02F3 Ordering information scheme 3 Ordering information scheme Figure 10. Ordering information scheme EMIF EMI Filter Number of lines Information x = resistance value (Ohms) z = capacitance value / 10 (pF) or 3 letters = application 2 digits = version Package F = Flip Chip 3 = Lead-free, pitch = 400 m, bump = 255 m yy - xxx zz F3 4 Package information In order to meet environmental requirements, ST offers these devices in ECOPACK(R) packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at www.st.com. Figure 11. Package dimensions 400m 40 255m 40 605m 55 400m 40 185m 10 185m 10 1.97mm 30m 1.97mm 30m 5/8 Ordering information EMIF10-LCD02F3 Figure 12. Footprint Copper pad Diameter: 220 m recommended 260 m maximum Solder mask opening: 300 m minimum Figure 13. Marking Dot, ST logo xx = marking z = manufacturing location yww = datecode (y = year ww = week) E Solder stencil opening: 220 m recommended xxz y ww Figure 14. Flip Chip tape and reel specification Dot identifying Pin A1 location 4 0.1 O 1.5 0.1 1.75 0.1 3.5 0.1 2.11 0.69 0.05 All dimensions in mm 8 0.3 STE STE STE xxz yww User direction of unreeling xxz yww xxz yww 4 0.1 2.11 Note: More information is available in the application notes: N2348: "STMicroelectronics 400 micro-metre Flip Chip: Package description and recommendation for use" AN1751: "EMI Filters: Recommendations and measurements" 5 Ordering information Table 3. Ordering information Marking GY Package Flip Chip Weight 5.0 mg Base qty 5000 Delivery mode Tape and reel 7" Order code EMIF10-LCD02F3 6/8 EMIF10-LCD02F3 Revision history 6 Revision history Table 4. Date 11-Jul-2005 28-Apr-2008 Document revision history Revision 1 2 First issue. Updated ECOPACK statement. Updated Figure 10, Figure 11, Figure 12 and Figure 14. Reformatted to current standards. Changes 7/8 EMIF10-LCD02F3 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries ("ST") reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST's terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST'S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER'S OWN RISK. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. (c) 2008 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 8/8 |
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