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STPS0530Z
Schottky rectifiers
Main product characteristics
IF(AV) VRRM VF(max) 0.5 A 30 V 0.33 V
Features and benefits

K
Very small conduction losses Negligible switching losses Extremely fast switching SOD-123 STPS0503Z
A
Description
Single Schottky rectifier suited for switch mode power supplies and high frequency DC to DC converters. Packaged in SOD-123, this device is intended for use in low voltage, high frequency inverters, free wheeling and polarity protection applications. Due to the small size of the package this device fits GSM and PCMCIA requirements. Table 1.
Symbol VRRM IF(RMS) IF(AV) IFSM dV/dt Tstg Tj TL
1.
dPtot --------------dTj
Order code
Order code STPS0503Z Marking Z53
Absolute ratings (limiting values)
Parameter Repetitive peak reverse voltage RMS forward current Average forward current = 0.5 Surge non repetitive forward current Critical rate of rise of reverse voltage Storage temperature range Maximum operating junction temperature (1) Maximum temperature for soldering during 10 s Ta = 55 C tp = 10 ms sinusoidal Value 30 2 0.5 5.5 10000 -65 to + 150 150 260 Unit V A A A V/s C C C
<
1 ------------------------Rth ( j - a )
condition to avoid thermal runaway for a diode on its own heatsink
October 2006
Rev 2
1/7
www.st.com 7
Characteristics
STPS0530Z
1
Characteristics
Table 2.
Symbol Rth(j-a) Junction to ambient
2
Thermal resistance
Parameter Value 340 (1) Unit C/W
1. Copper area on PCB S = 2.5 mm
Table 3.
Static electrical characteristics
Value
Symbol
Parameter
Test conditions
STPS0530Z Typ. Max. 12
Unit
Tj = 25 C IR(1) Reverse leakage current Tj = 125 C Tj = 25 C Tj = 125 C Tj = 25 C VF(2) Forward voltage drop Tj = 125 C Tj = 25 C Tj = 125 C
1. Pulse test: tp = 5 ms, < 2% 2. Pulse test: tp = 380 s, < 2%
A mA A mA
VR = 15 V
3
5 130
VR = VRRM
9
21 0.375
IF = 0.1 A
0.20
0.22 V 0.43
IF = 0.5 A
0.31
0.33
To evaluate the maximum conduction losses use the following equation: P = 0.23 x IF(AV) + 0.18 IF2(RMS)
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STPS0530Z
Characteristics
Figure 1.
PF(AV)(W)
0.22 0.20 0.18 0.16 0.14 0.12 0.10 0.08 0.06
Conduction losses versus average Figure 2. current
IF(AV)(A)
= 0.05 = 0.1 = 0.2 = 0.5
Average forward current versus ambient temperature ( = 0.5)
0.55 0.50 0.45
=1
0.40 0.35 0.30 0.25 0.20 0.15
Rth(j-a)=340C/W S=2.5mm
T
0.04 0.02 0.00 0.0 0.1 0.2 0.3 0.4
0.10
IF(AV)(A)
=tp/T
0.5
0.05
tp
Tamb(C)
0 25 50 75 100 125
0.00
0.6
Figure 3.
Non repetitive surge peak forward current versus overload duration (maximum values)
Figure 4.
Relative variation of thermal impedance junction to ambient versus pulse duration
IM(A)
4.0 3.5
1.0E+00
Zth(j-a)/Rth(j-a)
= 0.5 = 0.2
3.0 2.5 2.0 1.5 1.0
IM
Tamb=50C Tamb=75C Tamb=25C
1.0E-01
= 0.1
1.0E-02
Single pulse
T
0.5 0.0 1.E-03
t
=0.5
t(s)
1.0E-03
tp(s)
1.E-01 1.E+00
1.E-03 1.E-02 1.E-01 1.E+00
=tp/T
1.E+01
tp
1.E-02
1.E+02
Figure 5.
Reverse leakage current versus reverse voltage applied (typical values)
Tj=125C
Figure 6.
Reverse leakage current versus junction temperature (typical values)
VR=30V
IR(mA)
1.E+01
1.E+01
IR(mA)
1.E+00
Tj=100C
1.E+00
Tj=75C
1.E-01
Tj=50C
1.E-01
1.E-02
Tj=25C
1.E-02
VR(V)
1.E-03 0 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30
1.E-03 0 25 50
Tj(C)
75 100 125
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Characteristics
STPS0530Z
Figure 7.
Junction capacitance versus reverse voltage applied (typical values)
F=1MHz VOSC=30mVRMS Tj=25C
Figure 8.
Forward voltage drop versus forward current
C(pF)
1000
IFM(A)
2.0 1.8 1.6 1.4 1.2
Tj=125C (Typical values) Tj=25C (Maximum values) Tj=125C (Maximum values)
100
1.0 0.8 0.6 0.4
VR(V)
10 1 10 100
0.2 0.0 0.00
VFM(V)
0.10 0.20 0.30 0.40 0.50 0.60 0.70 0.80
Figure 9.
Thermal resistance junction to ambient versus copper surface under each lead (epoxy printed circuit board FR4, Cu = 35 m, typical values)
Rth(j-a)(C/W)
350 300 250 200 150 100 50
S(mm)
0 0 10 20 30 40 50 60 70 80 90 100
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STPS0530Z
Package information
2
Package information

Epoxy meets UL94, V0. Band indicates cathode. SOD-123 dimensions
Dimensions
H b E A2 A1
Table 4.
Ref
Millimeters Min. Max. 1.45 0 0.85 0.1 1.35 0
Inches Min. Max. 0.057 0.004 0.053
A A1
D A
A2 b
0.033
0.55 Typ. 0.15 Typ. 2.55 1.4 0.25 3.55 3.95 2.85 1.7
0.022 Typ. 0.039 Typ. 0.1 0.055 0.01 0.14 0.156 0.112 0.067
c
c D
G
E G H
Figure 10. Footprint (in millimeters)
4.45
0.65
0.97
2.51
0.97
In order to meet environmental requirements, ST offers these devices in ECOPACK(R) packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.
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Ordering information
STPS0530Z
3
Ordering information
Ordering type STPS0530Z Marking Z53 Package SOD-123 Weight 0.01 g Base qty 3000 Delivery mode Tape & reel
4
Revision history
Date Mar-2003 17-Oct-2006 Revision 1A 2 Initial release. Reformated to current standards. Updated maximum junction temperatures to 150 C and updated package illustration to show cathode bar on page 1 Changes
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STPS0530Z
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