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TDA7563B 4 x 50W multifunction quad power amplifier with built-in diagnostics feature Features Multipower BCD technology MOSFET output power stage DMOS power output New Hi-efficiency (class SB) High output power capability 4x28W/4 @ 14.4V, 1KHZ, 10% THD, 4x50W max, power Max. output power 4x72W/2 Full I C bus driving: - St-by - Independent front/rear soft play/mute - Selectable gain 30dB /16dB (for low noise line output function) - High efficiency enable/disable - I2C bus digital diagnostics (including DC bus AC load detection) Full fault protection DC offset detection Four independent short circuit protection Clipping detector pin with selectable threshold (2%/10%) St-by/mute pin Linear thermal shutdown with multiple thermal warning ESD protection Device summary Order code TDA7563B TDA7563BH TDA7563BPD TDA7563BPDTR Package Flexiwatt27 (vertical) Flexiwatt27 (horizontal) PowerSO36 PowerSO36 Packing Tube Tube Tube Tape and reel 2 Flexiwatt27 (Horizontal) PowerSO36 Flexiwatt27 (Vertical) Description The TDA7563B is a new BCD technology quad bridge type of car radio amplifier in Flexiwatt27 package specially intended for car radio applications. Thanks to the DMOS output stage the TDA7563B has a very low distortion allowing a clear powerful sound. Among the features, its superior efficiency performance coming from the internal exclusive structure, makes it the most suitable device to simplify the thermal management in high power sets. The dissipated output power under average listening condition is in fact reduced up to 50% when compared to the level provided by conventional class AB solutions. This device is equipped with a full diagnostics array that communicates the status of each speaker through the I2C bus. Table 1. December 2007 Rev 2 1/33 www.st.com 1 Contents TDA7563B Contents 1 2 3 Block diagram and application circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Pins description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 3.1 3.2 3.3 3.4 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Electrical characteristics curves . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 4 Diagnostics functional description . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 4.1 4.2 4.3 4.4 Turn-on diagnostic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Permanent diagnostics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Output DC offset detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 AC diagnostic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 5 Multiple faults . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 5.1 Faults availability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 6 Thermal protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 6.1 Fast muting . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 7 I2C Bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 7.1 7.2 I2C Programming/reading sequences . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 I2C Bus interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 7.2.1 7.2.2 7.2.3 7.2.4 Data validity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Start and stop conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Byte format . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Acknowledge . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 8 9 Software specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 Examples of bytes sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 2/33 TDA7563B Contents 10 11 Package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 3/33 List of tables TDA7563B List of tables Table 1. Table 2. Table 3. Table 4. Table 5. Table 6. Table 7. Table 8. Table 9. Table 10. Table 11. Table 12. Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Thermal data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Double fault table for turn on diagnostic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 IB1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 IB2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 DB1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 DB2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 DB3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 DB4 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 4/33 TDA7563B List of figures List of figures Figure 1. Figure 2. Figure 3. Figure 4. Figure 5. Figure 6. Figure 7. Figure 8. Figure 9. Figure 10. Figure 11. Figure 12. Figure 13. Figure 14. Figure 15. Figure 16. Figure 17. Figure 18. Figure 19. Figure 20. Figure 21. Figure 22. Figure 23. Figure 24. Figure 25. Figure 26. Figure 27. Figure 28. Figure 29. Figure 30. Figure 31. Figure 32. Figure 33. Figure 34. Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Application circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Pins connection diagram of the Flexiwatt27 (top of view). . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Pins connection diagram of the PowerSO36 slug up (top of view) . . . . . . . . . . . . . . . . . . . . 7 Quiescent current vs. supply voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Output power vs. supply voltage (4W) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Output power vs. supply voltage (2W) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Distortion vs. output power (4W, STD) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Distortion vs. output power (4, HI-EFF) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Distortion vs. output power (2, STD) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Distortion vs. frequency (4W) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Distortion vs. frequency (2W) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Crosstalk vs. frequency . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Supply voltage rejection vs. freq. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Power dissipation and efficiency vs. output power (4W, STD, SINE) . . . . . . . . . . . . . . . . . 13 Power dissipation and efficiency vs. output power (4W, HI-EFF, SINE). . . . . . . . . . . . . . . 13 Power dissipation vs. average ouput power (audio program simulation, 4W) . . . . . . . . . . 13 Power dissipation vs. average ouput power (audio program simulation, 2W) . . . . . . . . . . 13 Turn - on diagnostic: working principle . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 SVR and output behaviour (Case 1: without turn-on diagnostic) . . . . . . . . . . . . . . . . . . . . 14 SVR and output pin behaviour (Case 2: with turn-on diagnostic) . . . . . . . . . . . . . . . . . . . . 15 Short circuit detection thresholds . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Load detection thresholds - high gain setting . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Load detection threshold - low gain setting . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Restart timing without Diagnostic Enable (Permanent) . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Restart timing with Diagnostic Enable (Permanent) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Current detection: Load impedance |Z| vs. output peak voltage. . . . . . . . . . . . . . . . . . . . . 18 Thermal foldback diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Data validity on the I2C Bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 Timing diagram on the I2C Bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 Acknowledge on the I2C Bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 Flexiwatt27 (horizontal) mechanical data and package dimensions. . . . . . . . . . . . . . . . . . 29 Flexiwatt27 (vertical) mechanical data and package dimensions . . . . . . . . . . . . . . . . . . . . 30 PowerSO36 (slug up) mechanical data and package dimensions . . . . . . . . . . . . . . . . . . . 31 5/33 Block diagram and application circuit TDA7563B 1 Block diagram and application circuit Figure 1. Block diagram CLK ST-BY/MUTE I2CBUS Mute1 Mute2 DATA VCC1 VCC2 Thermal Protection & Dump Reference Clip Detector CD_OUT IN RF F 16/30dB OUT RF+ Short Circuit Protection & Diagnostic OUT RFOUT RR+ IN RR R 16/30dB IN LF F 16/30dB Short Circuit Protection & Diagnostic OUT RROUT LF+ OUT LFOUT LR+ OUT LR- IN LR R 16/30dB Short Circuit Protection & Diagnostic Short Circuit Protection & Diagnostic SVR AC_GND RF RR LF LR TAB S_GND PW_GND Figure 2. Application circuit C8 0.1F V(4V .. VCC) 2 DATA I2C BUS CLK C1 0.22F IN RF C2 0.22F IN RR C3 0.22F IN LF C4 0.22F IN LR S-GND 13 17 11 5 12 15 16 23 26 C7 3300F Vcc1 7 Vcc2 21 18 19 20 22 25 24 10 9 8 6 3 4 TAB + OUT LR + OUT LF + OUT RR + OUT RF 14 1, 27 47K C5 1F C6 10F CD OUT V D00AU1231A 6/33 TDA7563B Pins description 2 Pins description Figure 3. Pins connection diagram of the Flexiwatt27 (top of view) 27 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 TAB DATA PW_GND RR OUT RRCK OUT RR+ VCC2 OUT RFPW_GND RF OUT RF+ AC GND IN RF IN RR S_GND IN LR IN LF SVR OUT LF+ PW_GND LF OUT LFVCC1 OUT LR+ CD-OUT OUT LRPW_GND LR STBY TAB D00AU1230 27 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 TAB DATA PW_GND RR OUT RRCK OUT RR+ VCC2 OUT RFPW_GND RF OUT RF+ AC GND IN RF IN RR S_GND IN LR IN LF SVR OUT LF+ PW_GND LF OUT LFVCC1 OUT LR+ CD-OUT OUT LRPW_GND LR STBY TAB D00AU1416 Flexiwatt27 (vertical) Flexiwatt27 (horizontal) Figure 4. Pins connection diagram of the PowerSO36 slug up (top of view) VCC OUT3N.C. N.C. PWGND OUT3+ ACGND IN3 IN4 SGND IN2 IN1 SVR OUT1+ PWGND N.C. OUT1VCC 36 35 34 33 32 31 30 29 28 27 26 25 24 23 22 21 20 19 D04AU1547A 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 TAB CK N.C. OUT4+ N.C. PWGND VCC DATA OUT4OUT2STBY VCC PWGND N.C. OUT2+ N.C. N.C. CD 7/33 Electrical specifications TDA7563B 3 3.1 Electrical specifications Absolute maximum ratings Table 2. Symbol Vop VS Vpeak VCK VDATA IO IO Ptot Tstg, Tj Absolute maximum ratings Parameter Operating supply voltage DC supply voltage Peak supply voltage (for t = 50ms) CK pin voltage Data pin voltage Output peak current (not repetitive t = 100ms) Output peak current (repetitive f > 10Hz) Power dissipation Tcase = 70C Storage and junction temperature Value 18 28 50 6 6 8 6 85 -55 to 150 Unit V V V V V A A W C 3.2 Thermal data Table 3. Symbol Rth j-case Thermal data Parameter Thermal resistance junction to case Max. PowerSO Flexiwatt 1 1 Unit C/W 3.3 Electrical characteristics Refer to the test circuit, VS = 14.4V; RL = 4; f = 1KHz; GV = 30dB; Tamb = 25C; unless otherwise specified. Table 4. Symbol Electrical characteristics Parameter Test condition Min. Typ. Max. Unit Power amplifier VS Id Supply voltage range Total quiescent drain current Max. power (VS = 15.2V, square wave input (2Vrms)) PO Output power THD = 10% THD = 1% 25 20 8 170 50 28 22 18 300 V mA W W W 8/33 TDA7563B Table 4. Symbol Electrical specifications Electrical characteristics (continued) Parameter Test condition RL = 2; EIAJ (VS = 13.7V) RL = 2; THD 10% RL = 2; THD 1% RL = 2; MAX POWER PO = 1W to 10W; STD MODE HE MODE; PO = 1.5W HE MODE; PO = 8W Min. 55 40 32 60 Typ. 68 50 40 75 0.03 0.02 0.15 0.2 0.02 50 60 29.5 -1 15.5 -1 Rg = 600 20Hz to 22kHz Rg = 600; GV = 16dB 20Hz to 22kHz f = 100Hz to 10kHz; Vr = 1Vpk; Rg = 600 50 100 90 Vst-by = 0 80 Mute & Play -100 7 D2/D1 (IB1) 0 to 1 D2/D1 (IB1) 1 to 0 0 3.5 VCM = 1Vpk-pk; Rg = 0 7 Vst-by/mute = 8.5V Vst-by/mute < 1.5V 20 0 0 55 VS 40 5 5 300 110 1 100 0 7.5 5 5 100 8 20 20 1.5 5 10 50 15 60 16 60 100 30 130 30.5 1 16.5 1 100 30 0.1 0.1 0.5 0.5 0.05 Max. Unit W W W W % % % % % dB K dB dB dB dB V V dB KHz dB A dB mV V ms ms V V dB V A A A mV PO Output power THD Total harmonic distortion PO = 1-10W, f = 10kHz GV = 16dB; STD Mode VO = 0.1 to 5VRMS CT RIN GV1 GV1 GV2 GV2 EIN1 EIN2 SVR BW ASB ISB AM VOS VAM TON TOFF VSBY VMU CMRR VOP IMU CDLK CDSAT Cross talk Input impedance Voltage gain 1 Voltage gain match 1 Voltage gain 2 Voltage gain match 2 Output noise voltage 1 Output noise voltage 2 Supply voltage rejection Power bandwidth Stand-by attenuation Stand-by current Mute attenuation Offset voltage Min. supply mute threshold Turn on delay Turn off delay St-by/mute pin for st-by St-by/mute pin for mute Input CMRR St-by/mute pin for operating St-by/mute pin current Clip det high leakage current Clip det sat. voltage f = 1KHz to 10KHz, Rg = 600 CD off / VCD = 6V CD on; ICD = 1mA 9/33 Electrical specifications Table 4. Symbol CDTHD TDA7563B Electrical characteristics (continued) Parameter Clip det THD level D0 (IB1) = 0 1 2 3 % Test condition D0 (IB1) = 1 Min. 5 Typ. 10 Max. 15 Unit % Turn on diagnostics 1 (Power amplifier mode) Pgnd Short to GND det. (below this limit, the Output is considered in short circuit to GND) Short to Vs det. (above this limit, the output isconsidered in short circuit to Vs) Power amplifier in st-by Normal operation thresholds. (Within these limits, the output is considered without faults). Shorted load det. Open load det. Normal load det. 130 1.5 70 Vs -1.2 1.2 V Pvs V Pnop Lsc Lop Lnop 1.8 Vs -1.8 0.5 V Turn on diagnostics 2 (Line driver mode) Pgnd Short to GND det. (below this limit, the output is considered in short circuit to GND) Short to Vs det. (above this limit, the output isconsidered in short circuit to Vs) Normal operation thresholds. (Within these limits, the output is considered without faults). Shorted Load det. Open Load det. Normal Load det. 400 4.5 200 Power amplifier in st-by 1.2 V Pvs Vs -1.2 V Pnop Lsc Lop Lnop 1.8 Vs -1.8 1.5 V Permanent diagnostics 2 (Power amplifier mode or line driver mode) Pgnd Short to GND det. (below this limit, the Output is considered in short circuit to GND) Short to Vs det. (above this limit, Power amplifier in mute or play, the output is considered in short one or more short circuits circuit to Vs) protection activated Normal operation thresholds. (Within these limits, the output is considered without faults). Power amplifier mode LSC Shorted load Det. Line driver mode 1.5 Vs -1.2 1.2 V Pvs V Pnop 1.8 Vs -1.8 0.5 V 10/33 TDA7563B Table 4. Symbol VO INL IOL Electrical specifications Electrical characteristics (continued) Parameter Test condition Power amplifier in play, AC input signals = 0 VO < (VS-5)pk Min. 1.5 500 250 Typ. 2 Max. 2.5 Unit V mA mA Offset detection Normal load current detection Open load current detection I2C Bus interface SCL VIL VIH Clock frequency Input low voltage Input high voltage 2.3 400 1.5 KHz V V 3.4 Figure 5. Id (mA) 250 230 210 190 170 150 130 110 90 70 8 Electrical characteristics curves Quiescent current vs. supply voltage Figure 6. Output power vs. supply voltage (4) Po (W) 70 65 Vin = 0 NO LOADS 60 55 50 45 40 35 30 25 20 15 10 RL = 4 Ohm f = 1 KHz Po-max THD = 10 % THD = 1 % 10 12 Vs (V) 14 16 18 5 8 9 10 11 12 13 Vs (V) 14 15 16 17 18 Figure 7. Po (W) 100 90 80 70 60 50 40 30 20 10 8 9 Output power vs. supply voltage (2) Figure 8. Distortion vs. output power (4, STD) 10 Po-max RL = 2 Ohm f = 1 KHz THD = 10 % THD (%) STANDARD MODE Vs = 14.4 V RL = 4 Ohm 1 f = 10 KHz 0.1 THD = 1 % f = 1 KHz 10 11 12 Vs (V) 13 14 15 16 0.01 0.1 1 Po (W) 10 11/33 Electrical specifications TDA7563B Figure 9. Distortion vs. output power (4, HI- Figure 10. Distortion vs. output power (2, EFF) STD) THD (%) 10 10 THD (%) 1 HI-EFF MODE Vs = 14.4 V RL = 4 Ohm f = 10 KHz 1 HI-EFF MODE Vs = 14.4 V RL = 2 Ohm f = 10 KHz 0.1 f = 1 KHz 0.01 0.1 f = 1 KHz 0.001 0.1 1 Po (W) 10 0.01 0.1 1 Po (W) 10 Figure 11. Distortion vs. frequency (4) Figure 12. Distortion vs. frequency (2) THD (%) 10 THD (%) 10 1 STANDARD MODE Vs = 14.4 V RL = 4 Ohm Po = 4 W 1 STANDARD MODE Vs = 14.4 V RL = 2 Ohm Po = 4 W 0.1 0.1 0.01 10 100 f (Hz) 1000 10000 0.01 10 100 f (Hz) 1000 10000 Figure 13. Crosstalk vs. frequency Figure 14. Supply voltage rejection vs. freq. CROSSTALK (dB) 90 80 70 60 50 40 30 20 10 STANDARD MODE RL = 4 Ohm Po = 4 W Rg = 600 Ohm SVR (dB) 90 80 70 60 50 40 30 20 10 STD & HE MODE Rg = 600 Ohm Vripple = 1 Vpk 100 f (Hz) 1000 10000 100 f (Hz) 1000 10000 12/33 TDA7563B Electrical specifications Figure 15. Power dissipation and efficiency vs. Figure 16. Power dissipation and efficiency vs. output power (4, STD, SINE) output power (4W, HI-EFF, SINE) Ptot (W) 90 80 70 60 50 40 30 20 10 0 0 2 4 6 8 Ptot STANDARD MODE Vs = 14.4 V RL = 4 x 4 Ohm f = 1 KHz SINE n n (%) 90 80 70 60 50 40 30 20 10 0 10 12 14 16 18 20 22 24 26 28 30 Po (W) 90 80 70 60 50 40 30 20 10 0 0.1 1 10 Ptot HI-EFF MODE Vs = 14.4 V RL = 4 x 4 Ohm f = 1 KHz SINE Ptot (W) n (%) 90 80 n 70 60 50 40 30 20 10 0 Po (W) Figure 17. Power dissipation vs. average ouput Figure 18. Power dissipation vs. average ouput power (audio program simulation, power (audio program simulation, 4) 2) Ptot (W) 45 40 35 30 25 20 15 10 5 0 0 1 2 Po (W) 3 4 5 CLIP START Ptot (W ) 90 80 70 60 50 Vs = 14 V RL = 4 x 4 Ohm GAUSSIAN NOISE STD MODE Vs = 14 V RL = 4 x 2 Ohm GAUSSIAN NOISE STD MODE HI-EFF MODE 40 30 20 10 0 0 1 2 3 CLIP START HI-EFF MODE 4 5 Po (W ) 6 7 8 9 13/33 Diagnostics functional description TDA7563B 4 4.1 Diagnostics functional description Turn-on diagnostic It is activated at the turn-on (stand-by out) under I2Cbus request. Detectable output faults are: SHORT TO GND SHORT TO Vs SHORT ACROSS THE SPEAKER OPEN SPEAKER To verify if any of the above misconnections are in place, a subsonic (inaudible) current pulse (fig. 19) is internally generated, sent through the speaker(s) and sunk back.The Turn On diagnostic status is internally stored until a successive diagnostic pulse is requested (after a I2C reading). If the "stand-by out" and "diag. enable" commands are both given through a single programming step, the pulse takes place first (power stage still in stand-by mode, low, outputs= high impedance). Afterwards, when the Amplifier is biased, the PERMANENT diagnostic takes place. The previous Turn On state is kept until a short appears at the outputs. Figure 19. Turn - on diagnostic: working principle Vs~5V Isource I (mA) Isource Isink CH+ CHIsink ~100mS Measure time t (ms) Figure 20 and 21 show SVR and OUTPUT waveforms at the turn-on (stand-by out) with and without turn-on diagnostic. Figure 20. SVR and output behaviour (Case 1: without turn-on diagnostic) Vsvr Out Permanent diagnostic acquisition time (100mS Typ) Bias (power amp turn-on) Diagnostic Enable (Permanent) t FAULT event Permanent Diagnostics data (output) permitted time Read Data I2CB DATA 14/33 TDA7563B Diagnostics functional description Figure 21. SVR and output pin behaviour (Case 2: with turn-on diagnostic) Vsvr Out Turn-on diagnostic acquisition time (100mS Typ) Permanent diagnostic acquisition time (100mS Typ) Diagnostic Enable (Turn-on) Turn-on Diagnostics data (output) permitted time Diagnostic Enable (Permanent) FAULT event t Bias (power amp turn-on) permitted time Read Data Permanent Diagnostics data (output) permitted time I2CB DATA The information related to the outputs status is read and memorized at the end of the current pulse top. The acquisition time is 100 ms (typ.). No audible noise is generated in the process. As for SHORT TO GND / Vs the fault-detection thresholds remain unchanged from 30 dB to 16 dB gain setting. They are as follows: TDA7563B Figure 22. Short circuit detection thresholds S.C. to GND x Normal Operation x S.C. to Vs 0V 1.2V 1.8V VS-1.8V VS-1.2V D01AU1253 VS Concerning SHORT ACROSS THE SPEAKER / OPEN SPEAKER, the threshold varies from 30 dB to 16 dB gain setting, since different loads are expected (either normal speaker's impedance or high impedance). The values in case of 30 dB gain are as follows: Figure 23. Load detection thresholds - high gain setting S.C. across Load x Normal Operation x Open Load 0V 0.5 1.5 70 130 D01AU1254 Infinite If the Line-Driver mode (Gv= 16 dB and Line Driver Mode diagnostic = 1) is selected, the same thresholds will change as follows: Figure 24. Load detection threshold - low gain setting S.C. across Load x Normal Operation x Open Load 0 1.5 4.5 200 400 D01AU1252 infinite 15/33 Diagnostics functional description TDA7563B 4.2 Permanent diagnostics Detectable conventional faults are: - - - - 1. Short to GND Short to Vs Short across the speaker Output offset detection The following additional features are provided: The TDA7563B has 2 operating statuses: RESTART mode. The diagnostic is not enabled. Each audio channel operates independently from each other. If any of the a.m. faults occurs, only the channel(s) interested is shut down. A check of the output status is made every 1 ms (Figure 25). Restart takes place when the overload is removed. DIAGNOSTIC mode. It is enabled via I2C bus and self activates if an output overload (such to cause the intervention of the short-circuit protection) occurs to the speakers outputs . Once activated, the diagnostics procedure develops as follows (Figure 26): - To avoid momentary re-circulation spikes from giving erroneous diagnostics, a check of the output status is made after 1ms: if normal situation (no overloads) is detected, the diagnostic is not performed and the channel returns back active. Instead, if an overload is detected during the check after 1 ms, then a diagnostic cycle having a duration of about 100 ms is started. After a diagnostic cycle, the audio channel interested by the fault is switched to RESTART mode. The relevant data are stored inside the device and can be read by the microprocessor. When one cycle has terminated, the next one is activated by an I2C reading. This is to ensure continuous diagnostics throughout the carradio operating time. To check the status of the device a sampling system is needed. The timing is chosen at microprocessor level (over half a second is recommended). 2. - - - Figure 25. Restart timing without Diagnostic Enable (Permanent) - Each 1mS time, a sampling of the fault is done Out 1-2mS 1mS 1mS 1mS 1mS Overcurrent and short circuit protection intervention (i.e. short circuit to GND) t Short circuit removed Figure 26. Restart timing with Diagnostic Enable (Permanent) 1-2mS 100/200mS 1mS 1mS t Overcurrent and short circuit protection intervention (i.e. short circuit to GND) Short circuit removed 16/33 TDA7563B Diagnostics functional description 4.3 Output DC offset detection Any DC output offset exceeding 2 V are signalled out. This inconvenient might occur as a consequence of initially defective or aged and worn-out input capacitors feeding a DC component to the inputs, so putting the speakers at risk of overheating. This diagnostic has to be performed with low-level output AC signal (or Vin = 0). The test is run with selectable time duration by microprocessor (from a "start" to a "stop" command): - - START = Last reading operation or setting IB1 - D5 - (OFFSET enable) to 1 STOP = Actual reading operation Excess offset is signalled out if persistent throughout the assigned testing time. This feature is disabled if any overloads leading to activation of the short-circuit protection occurs in the process. 4.4 AC diagnostic It is targeted at detecting accidental disconnection of tweeters in 2-way speaker and, more in general, presence of capacitively (AC) coupled loads. This diagnostic is based on the notion that the overall speaker's impedance (woofer + parallel tweeter) will tend to increase towards high frequencies if the tweeter gets disconnected, because the remaining speaker (woofer) would be out of its operating range (high impedance). The diagnostic decision is made according to peak output current thresholds, as follows: Iout > 500mApk = normal status Iout < 250mApk = open tweeter To correctly implement this feature, it is necessary to briefly provide a signal tone (with the amplifier in "play") whose frequency and magnitude are such to determine an output current higher than 500mApk with in normal conditions and lower than 250mApk should the parallel tweeter be missing. The test has to last for a minimum number of 3 sine cycles starting from the activation of the AC diagnostic function IB2 17/33 Diagnostics functional description Figure 27. Current detection: Load impedance |Z| vs. output peak voltage Load |z| (Ohm) 50 Iout (peak) <250mA 30 20 TDA7563B Low current detection area (Open load) D5 = 1 of the DBx byres Iout (peak) >500mA 10 5 3 2 High current detection area (Normal load) D5 = 0 of the DBx bytes 1 1 2 3 4 5 6 7 8 Vout (Peak) 18/33 TDA7563B Multiple faults 5 Multiple faults When more misconnections are simultaneously in place at the audio outputs, it is guaranteed that at least one of them is initially read out. The others are notified after successive cycles of I2C reading and faults removal, provided that the diagnostic is enabled. This is true for both kinds of diagnostic (Turn on and Permanent). The table below shows all the couples of double-fault possible. It should be taken into account that a short circuit with the 4 ohm speaker unconnected is considered as double fault. Table 5. Double fault table for turn on diagnostic S. GND (so) S. GND (so) S. GND (sk) S. Vs S. Across L. Open L. S. GND / / / / S. GND (sk) S. GND S. GND / / / S. Vs S. Vs + S. GND S. Vs S. Vs / / S. Across L. S. GND S. GND S. Vs S. Across L. / Open L. S. GND Open L. (*) S. Vs N.A. Open L. (*) S. GND (so) / S. GND (sk) in the above table make a distinction according to which of the 2 outputs is shorted to ground (test-current source side= so, test-current sink side = sk). More precisely, in Channels LF and RR, so = CH+, sk = CH-; in Channels LR and RF, so = CH-, sk = CH+ . In Permanent Diagnostic the table is the same, with only a difference concerning Open Load(*) , which is not among the recognisable faults. Should an Open Load be present during the device's normal working, it would be detected at a subsequent Turn on Diagnostic cycle (i.e. at the successive Car Radio Turn on). 5.1 Faults availability All the results coming from I2Cbus, by read operations, are the consequence of measurements inside a defined period of time. If the fault is stable throughout the whole period, it will be sent out. To guarantee always resident functions, every kind of diagnostic cycles (Turn on, Permanent, Offset) will be reactivate after any I2C reading operation. So, when the micro reads the I2C, a new cycle will be able to start, but the read data will come from the previous diag. cycle (i.e. The device is in Turn On state, with a short to Gnd, then the short is removed and micro reads I2C. The short to Gnd is still present in bytes, because it is the result of the previous cycle. If another I2C reading operation occurs, the bytes do not show the short). In general to observe a change in Diagnostic bytes, two I2C reading operations are necessary. 19/33 Thermal protection TDA7563B 6 Thermal protection Thermal protection is implemented through thermal foldback (Figure 28). Thermal foldback begins limiting the audio input to the amplifier stage as the junction temperatures rise above the normal operating range. This effectively limits the output power capability of the device thus reducing the temperature to acceptable levels without totally interrupting the operation of the device. The output power will decrease to the point at which thermal equilibrium is reached. Thermal equilibrium will be reached when the reduction in output power reduces the dissipated power such that the die temperature falls below the thermal foldback threshold. Should the device cool, the audio level will increase until a new thermal equilibrium is reached or the amplifier reaches full power. Thermal foldback will reduce the audio output level in a linear manner. Three Thermal warning are available through the I2C bus data. Figure 28. Thermal foldback diagram Vout TH. WARN. TH. WARN. TH. WARN. ON ON ON Vout 125 140 155 TH. SH. START TH. SH. END Tj ( C) < TSD CD out > T (with same input SD signal) Tj ( C) Tj ( C) 6.1 Fast muting The muting time can be shortened to less than 1.5ms by setting (IB2) D5 = 1. This option can be useful in transient battery situations (i.e. during car engine cranking) to quickly turnoff the amplifier for avoiding any audible effects caused by noise/transients being injected by preamp stages. The bit must be set back to "0" shortly after the mute transition. 20/33 TDA7563B I2C Bus 7 7.1 I2C Bus I2C Programming/reading sequences A correct turn on/off sequence respectful of the diagnostic timings and producing no audible noises could be as follows (after battery connection): - - - - TURN-ON: PIN2 > 7V --- 10ms --- (STAND-BY OUT + DIAG ENABLE) --- 500 ms (min) --- MUTING OUT TURN-OFF: MUTING IN --- 20 ms --- (DIAG DISABLE + STAND-BY IN) --- 10ms -- PIN2 = 0 Car Radio Installation: PIN2 > 7V --- 10ms DIAG ENABLE (write) --- 200 ms --I2C read (repeat until All faults disappear). OFFSET TEST: Device in Play (no signal) -- OFFSET ENABLE - 30ms - I2C reading (repeat I2C reading until high-offset message disappears). 7.2 I2C Bus interface Data transmission from microprocessor to the TDA7563B and viceversa takes place through the 2 wires I2C BUS interface, consisting of the two lines SDA and SCL (pull-up resistors to positive supply voltage must be connected). 7.2.1 Data validity As shown by Figure 29, the data on the SDA line must be stable during the high period of the clock. The HIGH and LOW state of the data line can only change when the clock signal on the SCL line is LOW. 7.2.2 Start and stop conditions As shown by Figure 30 a start condition is a HIGH to LOW transition of the SDA line while SCL is HIGH. The stop condition is a LOW to HIGH transition of the SDA line while SCL is HIGH. 7.2.3 Byte format Every byte transferred to the SDA line must contain 8 bits. Each byte must be followed by an acknowledge bit. The MSB is transferred first. 21/33 I2C Bus TDA7563B 7.2.4 Acknowledge The transmitter* puts a resistive HIGH level on the SDA line during the acknowledge clock pulse (see Figure 31). The receiver** the acknowledges has to pull-down (LOW) the SDA line during the acknowledge clock pulse, so that the SDAline is stable LOW during this clock pulse. * Transmitter - - - - master (P) when it writes an address to the TDA7563B slave (TDA7563B) when the P reads a data byte from TDA7563B slave (TDA7563B) when the P writes an address to the TDA7563B master (P) when it reads a data byte from TDA7563B ** Receiver Figure 29. Data validity on the I2C Bus SDA SCL DATA LINE STABLE, DATA VALID CHANGE DATA ALLOWED D99AU1031 Figure 30. Timing diagram on the I2C Bus SCL I2CBUS SDA D99AU1032 START STOP Figure 31. Acknowledge on the I2C Bus SCL 1 2 3 7 8 9 SDA MSB START D99AU1033 ACKNOWLEDGMENT FROM RECEIVER 22/33 TDA7563B Software specifications 8 Software specifications All the functions of the TDA7563B are activated by I2C interface. The bit 0 of the "ADDRESS BYTE" defines if the next bytes are write instruction (from P to TDA7563B) or read instruction (from TDA7563B to P). Chip address D7 1 1 0 1 1 0 0 D0 X D8 Hex X = 0 Write to device X = 1 Read from device If R/W = 0, the P sends 2 "Instruction Bytes": IB1 and IB2. Table 6. Bit D7 D6 D5 0 Diagnostic enable (D6 = 1) Diagnostic defeat (D6 = 0) Offset Detection enable (D5 = 1) Offset Detection defeat (D5 = 0) Front Channel Gain = 30dB (D4 = 0) Gain = 16dB (D4 = 1) Rear Channel Gain = 30dB (D3 = 0) Gain = 16dB (D3 = 1) Mute front channels (D2 = 0) Unmute front channels (D2 = 1) Mute rear channels (D1 = 0) Unmute rear channels (D1 = 1) CD 2% (D0 = 0) CD 10% (D0 = 1) IB1 Instruction decoding bit D4 D3 D2 D1 D0 23/33 Software specifications Table 7. Bit D7 D6 D5 D4 D3 D2 D1 D0 0 0 Normal muting time (D5 = 0) Fast muting time (D5 = 1) Stand-by on - Amplifier not working - (D4 = 0) Stand-by off - Amplifier working - (D4 = 1) Power amplifier mode diagnostic (D3 = 0) Line driver mode diagnostic (D3 = 1) Current Detection Diagnostic Enabled (D2 =1) Current Detection Diagnostic Defeat (D2 =0) Right ChannelPower amplifier working in standard mode (D1 = 0) Power amplifier working in high efficiency mode (D1 = 1) Left ChannelPower amplifier working in standard mode (D0 = 0) Power amplifier working in high efficiency mode (D0 = 1) TDA7563B IB2 Instruction decoding bit If R/W = 1, the TDA7563B sends 4 "Diagnostics Bytes" to P: DB1, DB2, DB3 and DB4. Table 8. Bit D7 D6 DB1 Instruction decoding bit Thermal warning 1 active (D7 = 1), Tj =155C Diag. cycle not activated or not terminated (D6 = 0) Diag. cycle terminated (D6 = 1) Channel LF Current Detection Output peak current <250mA - Output load (D5 = 1) Output peak current >500mA - Output load (D5 = 0) Channel LF Turn-on diagnostic (D4 = 0) Permanent diagnostic (D4 = 1) Channel LF Normal load (D3 = 0) Short load (D3 = 1) Channel LF Turn-on diag.: No open load (D2 = 0) Open load detection (D2 = 1) Offset diag.: No output offset (D2 = 0) Output offset detection (D2 = 1) Channel LF No short to Vcc (D1 = 0) Short to Vcc (D1 = 1) Channel LF No short to GND (D1 = 0) Short to GND (D1 = 1) D5 D4 D3 D2 D1 D0 24/33 TDA7563B Table 9. Bit D7 D6 Software specifications DB2 Instruction decoding bit Offset detection not activated (D7 = 0) Offset detection activated (D7 = 1) X Channel LR Current Detection Output peak current <250mA - Output load (D5 = 1) Output peak current >500mA - Output load (D5 = 0) Channel LR Turn-on diagnostic (D4 = 0) Permanent diagnostic (D4 = 1) Channel LR Normal load (D3 = 0) Short load (D3 = 1) Channel LR Turn-on diag.: No open load (D2 = 0) Open load detection (D2 = 1) Permanent diag.: No output offset (D2 = 0) Output offset detection (D2 = 1) Channel LR No short to Vcc (D1 = 0) Short to Vcc (D1 = 1) Channel LR No short to GND (D1 = 0) Short to GND (D1 = 1) D5 D4 D3 D2 D1 D0 25/33 Software specifications Table 10. Bit D7 D6 Stand-by status (= IB2 - D4) Diagnostic status (= IB1 - D6) Channel RF Current Detection Output peak current <250mA - Output load (D5 = 1) Output peak current >500mA - Output load (D5 = 0) Channel RF Turn-on diagnostic (D4 = 0) Permanent diagnostic (D4 = 1) Channel RF Normal load (D3 = 0) Short load (D3 = 1) Channel RF Turn-on diag.: No open load (D2 = 0) Open load detection (D2 = 1) Permanent diag.: No output offset (D2 = 0) Output offset detection (D2 = 1) Channel RF No short to Vcc (D1 = 0) Short to Vcc (D1 = 1) Channel RF No short to GND (D1 = 0) Short to GND (D1 = 1) TDA7563B DB3 Instruction decoding bit D5 D4 D3 D2 D1 D0 26/33 TDA7563B Table 11. Bit D7 D6 Software specifications DB4 Instruction decoding bit Thermal warning 2 active (D7 = 1), Tj = 140C Thermal warning 3 active (D6 = 1) Tj = 120C Channel RR Current Detection Output peak current <250mA - Output load (D5 = 1) Output peak current >500mA - Output load (D5 = 0) Channel RR Turn-on diagnostic (D4 = 0) Permanent diagnostic (D4 = 1) Channel R RNormal load (D3 = 0) Short load (D3 = 1) Channel RR Turn-on diag.: No open load (D2 = 0) Open load detection (D2 = 1) Permanent diag.: No output offset (D2 = 0) Output offset detection (D2 = 1) Channel RR No short to Vcc (D1 = 0) Short to Vcc (D1 = 1) Channel RR No short to GND (D1 = 0) Short to GND (D1 = 1) D5 D4 D3 D2 D1 D0 27/33 Examples of bytes sequence TDA7563B 9 Examples of bytes sequence 1 - Turn-On diagnostic - Write operation Start Address byte with D0 = 0 ACK IB1 with D6 = 1 ACK IB2 ACK STOP 2 - Turn-On diagnostic - Read operation Start Address byte with D0 = 1 ACK DB1 ACK DB2 ACK DB3 ACK DB4 ACK STOP The delay from 1 to 2 can be selected by software, starting from 1ms 3a - Turn-On of the power amplifier with 30dB gain, mute on, diagnostic defeat, CD = 2% . Start Address byte with D0 = 0 ACK IB1 X0000000 ACK IB2 XXX1XX11 ACK STOP 3b - Turn-Off of the power amplifier Start Address byte with D0 = 0 ACK IB1 X0XXXXXX ACK IB2 XXX0XXXX ACK STOP 4 - Offset detection procedure enable Start Address byte with D0 = 0 ACK IB1 XX1XX11X ACK IB2 XXX1XXXX ACK STOP 5 - Offset detection procedure stop and reading operation (the results are valid only for the offset detection bits (D2 of the bytes DB1, DB2, DB3, DB4) . Start Address byte with D0 = 1 ACK DB1 ACK DB2 ACK DB3 ACK DB4 ACK STOP The purpose of this test is to check if a D.C. offset (2V typ.) is present on the outputs, produced by input capacitor with anomalous leackage current or humidity between pins. The delay from 4 to 5 can be selected by software, starting from 1ms 28/33 TDA7563B Package information 10 Package information In order to meet environmental requirements, ST (also) offers these devices in ECOPACK(R) packages. ECOPACK(R) packages are lead-free. The category of second Level Interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. Figure 32. Flexiwatt27 (horizontal) mechanical data and package dimensions DIM. A B C D E F (1) G G1 H (2) H1 H2 H3 L (2) L1 L2 (2) L3 L4 L5 L6 M M1 M2 N P R R1 R2 R3 R4 V V1 V2 V3 MIN. 4.45 1.80 mm TYP. 4.50 1.90 1.40 2.00 0.39 1.00 26.00 29.23 17.00 12.80 0.80 22.04 10.5 15.70 7.85 5 5.45 1.95 3.00 4.73 5.61 2.20 3.50 1.70 0.50 0.30 1.25 0.50 MAX. 4.65 2.00 MIN. 0.175 0.070 inch TYP. 0.177 0.074 0.055 0.079 0.015 0.040 1.023 1.150 0.669 0.503 0.031 0.868 0.413 0.618 0.309 0.197 0.214 0.077 0.118 0.186 0.220 0.086 0.138 0.067 0.02 0.12 0.049 0.02 MAX. 0.183 0.079 OUTLINE AND MECHANICAL DATA 0.37 0.80 25.75 28.90 0.42 0.57 1.20 26.25 29.30 0.014 0.031 1.014 1.139 0.016 0.022 0.047 1.033 1.153 21.64 10.15 15.50 7.70 5.15 1.80 2.75 22.44 10.85 15.90 7.95 5.85 2.10 3.50 0.852 0.40 0.610 0.303 0.203 0.070 0.108 0.883 0.427 0.626 0.313 0.23 0.083 0.138 3.20 3.80 0.126 0.15 5 (Typ.) 3 (Typ.) 20 (Typ.) 45 (Typ.) Flexiwatt27 (Horizontal) (1): dam-bar protusion not included; (2): molding protusion included 7399738 A 29/33 Package information TDA7563B Figure 33. Flexiwatt27 (vertical) mechanical data and package dimensions DIM. A B C D E F (1) G G1 H (2) H1 H2 H3 L (2) L1 L2 (2) L3 L4 L5 M M1 N O R R1 R2 R3 R4 V V1 V2 V3 MIN. 4.45 1.80 0.75 0.37 0.80 25.75 28.90 mm TYP. 4.50 1.90 1.40 0.90 0.39 1.00 26.00 29.23 17.00 12.80 0.80 22.47 18.97 15.70 7.85 5 3.5 4.00 4.00 2.20 2 1.70 0.5 0.3 1.25 0.50 MAX. 4.65 2.00 1.05 0.42 0.57 1.20 26.25 29.30 MIN. 0.175 0.070 0.029 0.014 0.031 1.014 1.139 inch TYP. 0.177 0.074 0.055 0.035 0.015 0.040 1.023 1.150 0.669 0.503 0.031 0.884 0.747 0.618 0.309 0.197 0.138 0.157 0.157 0.086 0.079 0.067 0.02 0.12 0.049 0.019 MAX. 0.183 0.079 0.041 0.016 0.022 0.047 1.033 1.153 OUTLINE AND MECHANICAL DATA 22.07 18.57 15.50 7.70 22.87 19.37 15.90 7.95 0.869 0.731 0.610 0.303 0.904 0.762 0.626 0.313 3.70 3.60 4.30 4.40 0.145 0.142 0.169 0.173 5 (Typ.) 3 (Typ.) 20 (Typ.) 45 (Typ.) Flexiwatt27 (vertical) (1): dam-bar protusion not included (2): molding protusion included V C B V H H1 H3 O V3 H2 R3 R4 A L4 V1 N R2 R L L1 L2 L3 V1 V2 R2 L5 G G1 F R1 R1 R1 E FLEX27ME D Pin 1 M M1 7139011 30/33 TDA7563B Package information Figure 34. PowerSO36 (slug up) mechanical data and package dimensions DIM. A A2 A4 A5 a1 b c D D1 D2 E E1 E2 E3 E4 e e3 G H h L N s MIN. 3.25 3.1 0.8 0.030 0.22 0.23 15.8 9.4 1 13.9 10.9 5.8 2.9 0.65 11.05 0 15.5 0.8 0.075 15.9 1.1 1.1 10 8 0 0.61 0.031 14.5 11.1 2.9 6.2 3.2 0.547 0.429 0.228 0.114 0.026 0.435 0.003 0.625 0.043 0.043 10 8 mm TYP. MAX. 3.43 3.2 1 -0.040 0.38 0.32 16 9.8 MIN. 0.128 0.122 0.031 0.0011 0.008 0.009 0.622 0.37 0.039 0.57 0.437 0.114 0.244 1.259 inch TYP. MAX. 0.135 0.126 0.039 -0.0015 0.015 0.012 0.630 0.38 OUTLINE AND MECHANICAL DATA 0.2 0.008 PowerSO36 (SLUG UP) (1) "D and E1" do not include mold flash or protusions. Mold flash or protusions shall not exceed 0.15mm (0.006") (2) No intrusion allowed inwards the leads. 7183931 D 31/33 Revision history TDA7563B 11 Revision history Table 12. Date 5-Oct-2006 19-Dec-2007 Document revision history Revision 1 2 Intial release. Updated Table 3: Thermal data. Changes 32/33 TDA7563B Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries ("ST") reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST's terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST'S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. 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