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| STTH6006W Turbo 2 ultrafast - high voltage rectifier Table 1. Main product characteristics IF(AV) VRRM Tj VF (typ) trr (max) 60 A 600 V 175 C 1.1 V 60 ns K DO-247 STTH6006W A A K Features and benefits Ultrafast switching Low reverse current Low thermal resistance Reduces conduction and switching losses Description The STTH6006W uses ST Turbo 2 600 V technology. This device is specially suited for use in switching power supplies, and industrial applications. The VF / Trr trade-off has been specially established to increase the performance in welding applications. Table 3. Symbol VRRM IF(RMS) IF(AV) IFSM Tstg Tj 1. Table 2. Order code Marking STTH6006W Part number STTH6006W Absolute ratings (limiting values per diode at 25 C, unless otherwise specified) Parameter Repetitive peak reverse voltage RMS forward current Average forward current, = 0.5 Tc = 95 C Value 600 90 60 400 -65 to + 175 175 Unit V A A A C C Surge non repetitive forward current tp = 10 ms Sinusoidal Storage temperature range Maximum operating junction temperature(1) to avoid thermal runaway for a diode on its own heatsink dP tot 1 -------------- < ------------------------dT j R th ( j - a ) July 2007 Rev 2 1/7 www.st.com Characteristics STTH6006W 1 Characteristics Table 4. Thermal parameters Symbol Rth(j-c) Parameter Junction to case Value 0.75 Unit C/W Table 5. Symbol IR(1) VF(2) Static electrical characteristics Parameter Reverse leakage current Test conditions Tj = 25 C Tj = 125 C Forward voltage drop Tj = 25 C Tj = 150 C VR = VRRM Min. Typ Max. 50 A 160 1600 1.85 IF = 60 A V 1.10 1.40 Unit 1. Pulse test: tp = 5 ms, < 2 % 2. Pulse test: tp = 380 s, < 2 % To evaluate the conduction losses use the following equation: P = 1.07 x IF(AV) + 0.006 IF2(RMS) Table 6. Symbol Dynamic characteristics Parameter Test conditions IF = 0.5 A, Irr = 0.25 A, IR = 1 A, Tj = 25 C IF = 1 A, dIF/dt = -50 A/s, VR = 30 V, Tj = 25 C Reverse recovery current Forward recovery time Forward recovery voltage IF = 60 A, dIF/dt = -100 A/s, VR = 400 V, Tj = 150 C IF = 60 A dIF/dt = 200 A/s VFR = 1.1 x VFmax, Tj = 25 C dIF/dt = 200 A/s IF = 60 A VFR = 1.1 x VFmax, Tj = 25 C 3 60 10.5 Min. Typ Max. 60 ns 85 14 500 ns V Unit trr Reverse recovery time IRM tfr VFP 2/7 STTH6006W Characteristics Figure 1. Conduction losses versus average current Figure 2. Forward voltage drop versus forward current 110 100 90 80 70 60 50 40 30 20 10 0 PF(AV)(W) = 0.1 = 0.05 =1 = 0.2 = 0.5 200 180 160 140 120 100 80 60 IFM(A) Tj=150C (maximum values) Tj=150C (typical values) T 40 Tj=25C (maximum values) IF(AV)(A) 0 5 10 15 20 25 30 35 40 45 50 =tp/T 55 60 20 tp 0 65 70 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 VFM(V) 1.8 2.0 2.2 2.4 Figure 3. Relative variation of thermal Figure 4. impedance junction to case versus pulse duration 50 45 40 35 30 25 20 15 10 Peak reverse recovery current versus dIF/dt (typical values) 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 Zth(j-c)/Rth(j-c) Single pulse IRM(A) VR=400V Tj=125C IF=2 x IF(AV) IF=IF(AV) IF=0.5 x IF(AV) IF=0.25 x IF(AV) tp(s) 1.E-02 1.E-01 1.E+00 5 0 0 50 100 150 dIF/dt(A/s) 200 250 300 350 400 450 500 1.E-03 Figure 5. Reverse recovery time versus dIF/dt (typical values) VR=400V Tj=125C Figure 6. Reverse recovery charges versus dIF/dt (typical values) VR=400V Tj=125C IF=2 x IF(AV) 500 450 400 350 300 250 200 150 100 50 0 trr(ns) 3000 2750 2500 2250 IF=2 x IF(AV) Qrr(nC) 2000 1750 IF=IF(AV) IF=0.5 x IF(AV) IF=IF(AV) 1500 1250 1000 750 500 IF=0.5 x IF(AV) dIF/dt(A/s) 0 50 100 150 200 250 300 350 400 450 500 250 0 0 50 100 150 dIF/dt(A/s) 200 250 300 350 400 450 500 3/7 Characteristics STTH6006W Figure 7. Softness factor versus dIF/dt (typical values) Figure 8. Relative variations of dynamic parameters versus junction temperature 0.6 S factor IF 2 x IF(AV) VR = 400 V Tj = 125 C 1.25 0.5 1.00 tRR 0.4 0.75 0.3 IRM 0.50 0.2 QRR 0.25 0.1 Tj(C) dIF/dt(A/s) 0.00 25 350 400 450 500 IF=IF(AV) VR=400V Reference: Tj=125C 0.0 0 50 100 150 200 250 300 50 75 100 125 Figure 9. VFP(V) IF=IF(AV) Tj=125C Transient peak forward voltage versus dIF/dt (typical values) Figure 10. Forward recovery time versus dIF/dt (typical values) 1000 900 800 700 600 500 400 300 200 8.0 7.5 7.0 6.5 6.0 5.5 5.0 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0.0 tfr(ns) IF=IF(AV) VFR=1.1 x VF max. Tj=125C dIF/dt(A/s) 0 100 200 300 400 500 100 0 0 100 dIF/dt(A/s) 200 300 400 500 Figure 11. Junction capacitance versus reverse voltage applied (typical values) 1000 C(pF) F=1MHz VOSC=30mVRMS Tj=25C 100 VR(V) 10 1 10 100 1000 4/7 STTH6006W Package mechanical data 2 Package mechanical data Epoxy meets UL94, V0 Cooling method: by conduction (C) Recommended torque value: 0.80 Nm Maximum torque value: 1.0 Nm DO-247 dimensions Dimensions Ref. Millimeters Min. A V Table 7. Inches Min. Typ. Max. 0.203 0.102 0.031 0.055 0.078 Typ. Max. 4.85 2.20 0.40 1.00 2.00 2.00 10.90 15.45 19.85 3.70 18.50 14.20 34.60 5.50 2.00 5 60 3.55 5.15 0.191 2.60 0.086 0.80 0.015 1.40 0.039 D E Dia V F F2 H A F3 G 2.40 0.078 0.429 15.75 0.608 20.15 0.781 4.30 0.145 0.728 14.80 0.559 1.362 0.216 3.00 0.078 5 60 3.65 0.139 0.094 L5 H L L2 L4 F2 L3 F3 V2 F G M E L1 D 0.620 0.793 0.169 L L1 L2 L3 L4 L5 M V V2 Dia. 0.582 0.118 0.143 In order to meet environmental requirements, ST offers these devices in ECOPACK(R) packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. 5/7 Ordering information STTH6006W 3 Ordering information Table 8. Ordering information Marking STTH6006W Package DO-247 Weight 4.40 g Base qty 30 Delivery mode Tube Part Number STTH6006W 4 Revision history Table 9. Date 18-May-2006 11-Jul-2007 Revision history Revision 1 2 First issue. Reformatted to current standards. Updated Table 7. Changes 6/7 STTH6006W Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries ("ST") reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST's terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST'S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER'S OWN RISK. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. (c) 2007 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 7/7 |
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