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AOZ9006DIL
Single-Cell Battery Protection IC with Integrated MOSFET
General Description
The AOZ9006DIL is a battery protection IC with integrated dual common-drain N-channel MOSFET. The device includes accurate voltage detectors and delay circuits, and is suitable for protecting single-cell lithium-ion / lithium-polymer rechargeable battery packs from overcharge, over-discharge, and over-current conditions. The AOZ9006DIL is available in a 2mm x 5mm 6-pin DFN package and is rated over a -40C to +85C ambient temperature range.
Features
Integrated Common-Drain N-Channel MOSFET
48m (max.) source to source on resistance
High-accuracy voltage detection circuit Overcharge detection accuracy 25mV (+25C), 30mV (-5C to +55C) Overcharge release accuracy 50mV Over-discharge detection accuracy 50mV Over-discharge release accuracy 100mV Discharge over-current detection accuracy 15mV
Load short-circuit detection accuracy 200mV 20% accurate internal detection delay times (external capacitors are unnecessary) Charger connection pin withstands up to 28V Wide operating temperature range -40C to +85C Low current consumption 3.0A (typ.), 5.5A (max.) in operation mode at +25C Small 2mm X 5mm 6-pin DFN package

Applications

Lithium-ion rechargeable battery packs Lithium-polymer rechargeable battery packs
RoHS
Compliant
Typical Application
1
DO VSS VDD
OUTM
EBR2 2k
C1 0.1F EB+ R1 220
AOZ9006DIL
OUTM VM
Figure 1. Typical Application
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AOZ9006DIL
Ordering Information
Overdischarge Detection Voltage (VDL) 2.3V Overdischarge Release Voltage (VDU) 2.4V Discharge Overcurrent Threshold (VDIOV)* 0.10V Load Shortcircuiting Detection Voltage (VSHORT) 0.5V Charge Overcurrent Threshold (VCIOV)* -0.10V
Part Number AOZ9006DIL
Overcharge Detection Voltage (VCU) 4.275V
Overcharge Release Voltage (VCL) 4.175V
0V Battery Charge Function Yes
Shutdown Function Yes
*Please refer to page 8 for calculation of charge and discharge current limits. All AOS products are offered in packages with Pb-free plating and compliant to RoHS standards. * Parts marked as Green Products (with "L" suffix) use reduced levels of Halogens, and are also RoHS compliant. Please visit www.aosmd.com/web/quality/rohs_compliant.jsp for additional information.
Table 1. Delay Time Combination
Overcharge Detection Delay Time (tCU)
1.2s
Over-discharge Detection Delay Time (tDL)
150ms
Discharge Over-current Detection Delay Time (tDIOV)
9ms
Charge Over-current Detection Delay Time (tCIOV)
9ms
Load Short-circuiting Detection Delay Time (tSHORT)
300s
Pin Configuration
DO VSS VDD
1 2 3
6 5 4
OUTM OUTM VM
PAD
2x5 DFN-6
(Top View)
Pin Description
Pin Name
DO VSS VDD VM OUTM PAD
Pin Name
1 2 3 4 5, 6 Drain
Pin Function
Discharge MOSFET Gate. This pad is for test purposes only. Always leave this pad unconnected. Ground. VSS is the source of the internal Discharge MOSFET. Connect VSS directly to the cathode of lithium-ion/lithium polymer battery cell. Input supply pin. Connect a 0.1F capacitor between VDD and VSS. Over-current/Charger Detection Pin. Connect a 2k resistor between VM and the negative terminal of the battery pack. Output pin. OUTM is the source of the internal Charge MOSFET. Connect OUTM directly to the negative terminal of the battery pack. MOSFET Common-Drain Connection. This pad is for test purposes only. Always leave this pad unconnected. www.aosmd.com
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AOZ9006DIL
Block Diagram
EB+
R1 220
VDD
OverDischarge Comp
Oscillator
Counter/ Logic
0V Battery Charge Function
Single-Cell Lithium-Ion/ Lithium-Polymer Battery
VDD C1 0.1F
Over-Charge Comp
VSS
Charge Detection Discharge Over-Current Comp Charge Over-Current Comp Short-Circuit Comp
RVMD VM RVMS
R2 2k DO CO
Battery Protection IC
Discharge FET
Charge FET
OUTM
EB-
AOZ9006DIL
Dual Common-Drain MOSFET
Figure 1. AOZ9006DIL Function Block Diagram
Absolute Maximum Ratings
Exceeding the Absolute Maximum ratings may damage the device.
Ratings Symbol
VDD VM VDSS ID TOPR TSTD PD
Parameter
Supply Voltage VM Pin Voltage Drain-Source Voltage Drain Current(1)
Conditions
Min.
-0.3 VDD - 28
Max.
12 VDD + 0.3 30 4.1
Unit
V V V A C C W
RJA = 84C/W, TA =
25oC -40 -55
Operating Temperature Storage Temperature Total Power Dissipation(1) RJA = 84C/W, TA = 25oC
85 125 1.0
Note: 1. The value of RJA is measured with the device mounted on 1-in2 FR-4 board with 2-oz. copper, in a still air environment with TA = 25C. The value in any given application depends on the user's specific board design.
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AOZ9006DIL
Electrical Characteristics
TA = 25C unless otherwise specified. Parameters specified over TA = -40C to +85C are guaranteed by design only and not production tested. Control IC
Symbol
DETECTION VOLTAGE VCU Overcharge Detection Voltage TA = 25C TA = -5C to +55C TA = -40C to +85C VCL VDL VDU VDIOV VSHORT VCIOV Overcharge Release Voltage Over-Discharge Detection Voltage Over-Discharge Release Voltage Discharge Over-Current Threshold Load Short-Circuiting Detection Voltage Charge Over-Current Threshold TA = 25C TA = -40C to +85C TA = 25C TA = -40C to +85C TA = 25C TA = -40C to +85C TA = 25C TA = -40C to +85C TA = 25C TA = -40C to +85C TA = 25C TA = -40C to +85C 0 V BATTERY CHARGE FUNCTION V0CHA 0V battery charge starter battery voltage (0V battery charging function "available") Operating Voltage Between VDD Pin and VSS Pin Operating Voltage Between VDD Pin and VM Pin Current Consumption During Operation Current Consumption at Shutdown TA = 25C TA = -40C to +85C 1.2 1.7 V 4.250 4.245 4.215 4.125 4.095 2.250 2.190 2.300 2.250 0.085 0.079 0.3 0.16 -0.13 -0.14 4.275 4.275 4.275 4.175 4.175 2.300 2.300 2.400 2.400 0.100 0.100 0.50 0.50 -0.1 -0.1 4.300 4.305 4.315 4.225 4.24 2.350 2.430 2.500 2.590 0.115 0.124 0.7 0.84 -0.07 -0.06 V V V V V V V
Parameter
Condition
Min.
Typ.
Max.
Unit
INPUT VOLTAGE VDSOP1 VDSOP2 Internal Circuit Operating Voltage Internal Circuit Operating Voltage 1.5 1.5 8 28 V V
INPUT CURRENT (Shutdown Function) IOPE IPDN VDD = 3.5V, VVM = 0V, TA = 25C VDD = 3.5V, VVM = 0V, TA = -40C to +85C VDD = VVM = 1.5V, TA = 25C VDD = VVM = 1.5V, TA = -40C to +85C Internal Resistance RVMD RVMS Resistance Between VM Pin and VDD Pin Resistance Between VM Pin and VSS Pin VDD = 1.8V, VVM = 0V, TA = 25C VDD = 1.8V, VVM = 0V, TA = -40C to +85C VDD = 3.5V, VVM = 1.0V, TA = 25C VDD = 3.5V, VVM = 1.0V, TA = -40C to +85C 100 78 10 7.2 300 300 20 20 900 1310 40 44 k k 1.0 0.7 3.0 3.0 5.5 6.0 0.2 0.3 A A
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AOZ9006DIL
Electrical Characteristics (Continued)
TA = 25C unless otherwise specified. Parameters specified over TA = -40C to +85C are guaranteed by design only and not production tested. Control IC (Continued)
Symbol
Detection Delay Time tCU tDL tDIOV tCIOV tSHORT Overcharge Detection Delay Time Over-Discharge Detection Delay Time Discharge Over-Current Detection Delay Time Charge Over-Current Detection Delay Time Load Short-Circuiting Detection Delay Time TA = 25C TA = -40C to +85C TA = 25C TA = -40C to +85C TA = 25C TA = -40C to +85C TA = 25C TA = -40C to +85C TA = 25C TA = -40C to +85C .96 0.7 120 83 7.2 5 7.2 5 240 150 1.2 1.2 150 150 9 9 9 9 300 300 1.4 2 180 255 11 15 11 15 360 540 ms ms ms ms s
Parameter
Condition
Min.
Typ.
Max.
Unit
Integrated MOSFET:
Symbol
BVDS_C ILEAK_C BVDS_D ILEAK_D RSS
Parameter
Charge Control MOSFET Drain-Source Breakdown Charge Control MOSFET Leakage Discharge Control MOSFET Drain-Source Breakdown Voltage Discharge Control MOSFET Leakage Current Total Output Resistance (OUTM to VSS)
Condition
VDD = VCU VDD = VCU VDD = VDL VDD = VDL VDD = 3.5V, IOUT = 1.5A
Min.
30
Typ.
Max.
1
Unit
V A V
30 1 32 40 48
A m
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AOZ9006DIL
Typical Performance Characteristics
On-Regions Characteristics
30 3.5V 15 20 ID(A) V GS = 2.5V ID(A) 10 125C 5 25C 0 0 1 2 3 4 5 V DS(Volts) 0 0.0 0.5 1.0 1.5 2.0 2.5 V GS(Volts) 20 V DS = 5V
Transfer Characteristics
10
V GS = 2V
On-Resistance vs. Drain Current and Gate Voltage
80 70 60 RSS(ON)(m ) 50 40 30 20 10 0 0 5 10 ID (A) 15 20 V DD = 2.5V V DD = 4.5V Normalize ON-Resistance 1.6 1.4
On-Resistance vs. Junction Temperature
V DD=4.5V 1.2 V DD=2.5V 1.0 0.8 0.6 -50 -25
0
25
50
75 100 125 150 175
Tem perature (C)
On-Resistance vs. Gate-Source Voltage
60 1E+01 1E+00 1E-01 40 125C IS(A) 1E-02 1E-03 20 25C 1E-04 1E-05 1 2 3 4 5 6 7 8 9 10 0.0
Body-Diode Characteristics
50 RSS(ON)(m )
125C
30 25C
10 V DD (Volts)
0.2
0.4
0.6
0.8
1.0
V SD (Volts)
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AOZ9006DIL
Theory of Operation
Please refer to the Timing Diagrams for more information.
Over-Discharge Status
When the battery voltage falls below over-discharge detection voltage (VDL) for the over-discharge detection delay time (tDL) or longer, the IC turns off the discharging control MOSFET to stop discharging. This condition is the over-discharge status. Under the over-discharge status, the VM pin voltage is pulled up by the resistor between the VM pin and VDD pin in the IC (RVMD). The resistance (RVMS) between the VM pin and VSS pin is not connected in the over-discharge status. When voltage difference between the VM pin and VDD pin is 1.3V (Typ.) or lower, the productions with "Shut-down Function Available" feature can enter the shut-down status to save power. At this status, the current consumption is reduced to the shut-down current consumption (IPON). The shut-down status is released when a charger is connected and the voltage difference between the VM pin and VDD pin becomes 1.3V (Typ.) or higher. When a battery in the over-discharge status is connected to a charger and provides that the VM pin voltage is lower than -0.7V (Typ.), the AOZ9006DIL releases the overdischarge status and turns on the discharging MOSFET when the battery voltage reaches over-discharge detection voltage (VDL) or higher. If VM pin voltage is not lower than -0.7V (Typ.), the AOZ9006DIL releases the over-discharge status and turns on the discharging MOSFET when the battery voltage reaches overdischarge detection voltage (VDU) or higher.
Normal Status
The AOZ9006DIL monitors the voltage between the VDD pin and VSS pin and the voltage difference between the VM pin and VSS pin to control charging and discharging. Since the device only draws a few microamperes of current during operation and the voltage drop across the low-pass filter R1 is negligible, the voltage between VDD and VSS is equal to the battery voltage. When the battery voltage is in the range between over-discharge detection voltage (VDL) and overcharge detection voltage (VCU), and the VM pin voltage is in the range between the charge over-current detection voltage (VCIOV) and discharge over-current detection voltage (VDIOV), the IC turns both the charging and discharging control FETs on. In this normal status, charging and discharging can be carried out freely. Caution: Products with "Shut-down Function Available" feature may not enable discharging when the battery is connected for the first time. Connect the charger or short VM pin to VSS can restore the normal status.
Overcharge Status
When the battery voltage rises higher than overcharge detection voltage (VCU) for the overcharge detection delay time (tCU) or longer in the normal status, the AOZ9006DIL turns off the charging control MOSFET to stop charging. This condition is the overcharge status. The resistance (RVMD) between the VM pin and VDD pin, and the resistance (RVMS) between the VM pin and VSS pin are not connected. The overcharge status is released in the following two cases: 1. When the battery voltage falls below overcharge release voltage (VCL) and VM pin voltage is higher than -0.7V (Typ.) (charger is removed), the AOZ9006DIL turns on the charging control MOSFET and returns to the normal status. 2. When a load is connected and battery voltage is below overcharge detection voltage (VCU), the AOZ9006DIL turns on the charging control MOSFET and returns to the normal status. Caution: When both charger and load are connected after overcharge detection, charging control FET still remains off and a portion of the load current may flow through body diode of charging control FET if the charger can not supply the full load current. This condition may overheat the charging control FET. Please refer to the Typical Characteristics for more information.
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Discharge Over-Current Status (Discharge Over-current, Load Short-circuiting)
When a battery is in the normal status, and the discharge current becomes higher than specified value and the status lasts for the discharge over-current detection delay time (tDIOV), the IC turns off the discharge control MOSFET and stops discharging. This status is the discharge over-current status. In the discharge overcurrent status, the VM pin and VSS pin are shorted by the resistor between VM pin and VSS pin (RVMS) in the IC. When the load is disconnected, the VM pin returns to the VSS potential. When the impedance between the EB+ pin and EB- pin (Refer to Figure 1) increases and is equal to the impedance that enables automatic restoration and the voltage at the VM pin returns to discharge overcurrent detection voltage (VDIOV) or lower, the discharge over-current status is restored to the normal status. Even if the connected impedance is smaller than automatic restoration level, the AOZ9006DIL will be restored to the normal status from discharge over-current detection status when the voltage at the VM pin becomes the discharge over-current detection voltage (VDIOV) or lower
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AOZ9006DIL
by connecting the charger. The resistance (RVMD) between the VM pin and VDD pin is not connected in the discharge over-current detection status. When a battery is in the normal status, and the discharge current becomes abnormally higher (EB+ pin and EB- pin shorted), and thus the VM pin voltage is equal or higher than load short-circuiting detection voltage (VSHORT) for load short-circuiting detection delay time (tSHORT), the IC turns off the discharge control MOSFET and stops discharging. This status is the load shorting-circuiting status. In the load shorting-circuiting status, the VM pin and VSS pin are shorted by the resistor between VM pin and VSS pin (RVMS) in the IC. When the short-circuiting condition is released, the VM pin returns to the VSS potential. The resistance (RVMD) between the VM pin and VDD pin is not connected in the load shorting-circuiting status.
0V Battery Charging Function "Available"
This function is used to recharge a connected battery whose voltage is 0V due to self-discharge. When the 0V battery charge starting charger voltage (V0CHA) or a higher voltage is applied between the EB+ and EB- pins by connecting a charger, the charging control MOSFET gate is fixed to the VDD pin voltage. When the voltage between the gate and source of the charging control MOSFET becomes equal to or higher than the turn-on voltage due to the charger voltage, the charging control MOSFET is turned on to start charging. At this time, the discharging control MOSFET is off and the charging current flows through the internal parasitic diode in the discharging control MOSFET. When the battery voltage becomes equal to or higher than overdischarge release voltage (VDU), the AOZ9006DIL enters the normal status.
Charge Over-current Status
When a battery in the normal status is in the status, and the charge current is higher than the specified value and the status lasts for the charge over-current detection delay time (tCIOV), the charge control MOSFET is turned off and charging is stopped. This status is the charge over-current status. This IC will be restored to the normal status from the charge over-current status when, the voltage at the VM pin returns to charge over-current detection voltage (VCIOV) or higher by removing the charger. The charge over-current detection function does not work in the over-discharge status. The resistance (RVMD) between the VM pin and VDD pin, and the resistance (RVMS) between the VM pin and VSS pin are not connected in the charge over-current status.
Calculation of Current Limit
The charge and discharge current limit is determined by the charge and discharge over-current threshold voltages (VDIOV and VCIOV), and the total resistance of the internal MOSFET (RSS). Use the following equations to determine the maximum and minimum current limits: I DIOV _ MAX = VDIOV _ MAX R SS_ MIN VCIOV _ MAX R SS_ MIN ; I DIOV _ MIN = VDIOV _ MIN R SS_ MAX
I CIOV _ MAX =
; I CIOV _ MIN =
VCIOV _ MIN
R SS_ MAX
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AOZ9006DIL
Timing Diagrams
VCU
Battery Voltage
VCL VDU VDL
Charge tCU tDL
Battery Current
Discharge
VDD
VM Pin VDIOV Voltage V SS
VEB-
Connect Charger
Connect Load
Connect Charger
Mode
(1)
(2)
(1)
(3)
(1)
Mode: 1. Normal Mode 2. Overcharge Mode 3. Over-Discharge Mode Figure 2. Overcharge and Over-discharge Detection Timing Diagram
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AOZ9006DIL
VCU VCL
Battery Voltage
VDU VDL
Charge
Battery Current
tDIOV Discharge tSHORT
VDD
VM Pin Vshort Voltage
VDIOV VSS
Normal Load
Overcurrent Load
Short Circuit
Normal Load
Mode
(1)
(4)
(1)
(4)
(1)
Mode: 1. Normal Mode 4. Discharge Over-current Mode Figure 3. Discharging Over-current Detection Timing Diagram
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AOZ9006DIL
Battery Voltage
VCU VCL VDU VDL
Charge
Battery Current
tCIOV Discharge tCIOV
VDD
VM Pin Voltage
VSS VCIOV VEBConnected Charger with Charge Overcurrent Connected Charger with Charge Overcurrent (1) (5)
Mode
(3)
(1)
(5)
Mode: 1. Normal Mode 3. Over-Discharge Mode 5. Charge Over-Current Mode Figure 4. Charging Over-current Detection Timing Diagram
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AOZ9006DIL
Applications Information
1
DO VSS VDD
OUTM
EBR2 2k
C1 0.1F EB+ R1 220
AOZ9006DIL
OUTM VM
Figure 5. AOZ9006D Applications Circuit
A low-pass filter formed by R1 and C1 reduces supply voltage fluctuation on the VDD pin. R1 also provides ESD protection and serves as a current-limiting resistor in the event of charger reverse connection. The supply current of AOZ9006DIL has to flow through R1, so a small R1 should be chosen to guarantee detection accuracy of VDD voltage. Choose a resistor value between 100 and 330 for R1. Choose the value of C1 to be 0.022F or higher. Both R1 and C1 should be placed as close as possible to AOZ9006DIL to minimize parasitic effect.
R2 provides ESD protection and serve as a currentlimiting resistor in the event of charger reverse connection. A large value resistor should be chosen to limit power consumption during this condition. However, an extremely large value of R2, of course, will cause inaccuracy of VM pin voltage detection. Choose a resistor value between 300 and 4k for R2.
Table 2. External Components Selection Range Designator
C1 R1 R2
Purpose
Reduce supply voltage fluctuation, provide ESD protection, and limit current when a charger is reversely connected Reduce supply voltage fluctuation Provide ESD protection and limit current when a charger is reversely connected
Min.
0.022F 100 300
Typ.
0.1F 220 2k
Max.
1.0F 330 4k
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AOZ9006DIL
Package Dimensions, 2x5 6L, EP1_P
b c A1 L 1 (All) 1 (All) D D1 L1
E1 E
E2
e
A
BOTTOM VIEW
RECOMMENDED LAND PATTERN 0.50 0.60 0.25
Dimensions in millimeters
Symbols A A1 b c D D1 E E1 E2 e L L1 1 2 Min. 0.70 0.00 0.20 0.10 Nom. 0.75 -- Max. 0.80 0.05
Dimensions in inches
Symbols A A1 b c D D1 E E1 E2 e L L1 1 2 Min. 0.028 0.000 0.008 0.004 Nom. 0.030 -- Max. 0.031 0.002
0.23 0.30 0.15 0.20 2.00 BSC 1.30 1.35 1.55 5.00 BSC 4.50 BSC 2.67 0.50 BSC 0.40 0.50 0 -- 0 10 3 BSC 2.60 2.95 0.60 0.10 12
0.009 0.012 0.006 0.008 0.079 BSC 0.051 0.053 0.061 0.197 BSC 0.177 BSC 0.105 0.116 0.020 BSC 0.016 0.020 0.024 0 -- 0.004 0 10 12 3 BSC 0.102
2.77
0.57 1.80 UNIT: mm
Notes: 1. Package body sizes exclude mold flash and gate burrs. Mold flash at the non-lead sides should be less than 6 mils. 2. Controlling dimension is millimeter, converted inch dimensions are not necessarily exact.
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AOZ9006DIL
Tape and Reel Dimensions, DFN 2 x 5
DFN2X5 Carrier Tape
P1 P2 D1 D0 E1 R0.3 Max E2 E B0
K0 T Unit: mm Package DFN 2X5 A0 2.41 0.10 B0 5.34 0.10 K0 1.10 0.10 D0 1.50 +0.1/-0 D1 E 1.50 12.00 +0.1/-0 0.10 E1 1.75 0.10 E2 5.50 0.10 P0 4.00 0.10 P1 4.00 0.10 P0 A0
R0.3 Typ
Feeding Direction P2 2.00 0.10 T 0.30 0.10
DFN 2X5 Reel
W2
o318
o242 o254 30 M R6 P B o110 30
R
6:1
W1
6.01
Tape Size Reel Size 12mm o330
M o330.00 +0.3/-0.4
W1 12.40 +2.0/-0.0
W2 18.40 Max
B 2.40 0.3
P 0.5
R 1
DFN2X5 Tape
Leader/Trailer & Orientation
Trailer Tape 300mm min.
Components Tape Orientation in Pocket
Leader Tape 500mm min.
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AOZ9006DIL
AOZ9006D Package Marking
Option Code Part Number Code
Z9006DIX FAYWLT
Fab & Assembly Location
Assembly Lot Code
Year & Week Code
This datasheet contains preliminary data; supplementary data may be published at a later date. Alpha & Omega Semiconductor reserves the right to make changes at any time without notice. LIFE SUPPORT POLICY ALPHA & OMEGA SEMICONDUCTOR PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury of the user. 2. A critical component in any component of a life support, device, or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness.
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