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 3SK295
Silicon N-Channel Dual Gate MOS FET
REJ03G0814-0300 (Previous ADE-208-387A) Rev.3.00 Aug. 10, 2005
Application
* UHF RF amplifier
Features
* Low noise figure. NF = 2.0 dB typ. at f = 900 MHz * Capable of low voltage operation
Outline
RENESAS Package code: PLSP0004ZA-A (Package name: MPAK-4)
2
3 1 4
1. Source 2. Gate1 3. Gate2 4. Drain
Note:
Marking is "ZQ-"
Attention: This device is very sensitive to electro static discharge. It is recommended to adopt appropriate cautions when handling this transistor.
Rev.3.00, Aug 10.2005, page 1 of 6
3SK295
Absolute Maximum Ratings
(Ta = 25C)
Item Drain to source voltage Gate 1 to source voltage Gate 2 to source voltage Drain current Channel power dissipation Channel temperature Storage temperature Symbol VDS VG1S VG2S ID Pch Tch Tstg Ratings 12 8 8 25 150 150 -55 to +150 Unit V V V mA mW
C C
Electrical Characteristics
(Ta = 25C)
Item Drain to source breakdown voltage Gate 1 to source breakdown voltage Gate 2 to source breakdown voltage Gate 1 cutoff current Gate 2 cutoff current Drain current Gate 1 to source cutoff voltage Gate 2 to source cutoff voltage Forward transfer admittance Input capacitance Output capacitance Reverse transfer capacitance Power gain Noise figure Symbol V(BR)DSX V(BR)G1SS V(BR) G2SS IG1SS IG2SS IDS(on) VG1S(off) VG2S(off) |yfs| Ciss Coss Crss PG NF Min 12 8 8 -- -- 0.5 -0.5 0 16 1.2 0.6 -- 16 -- Typ -- -- -- -- -- -- -- -- 20.8 1.5 0.9 0.01 19.5 2.0 Max -- -- -- 100 100 10 +0.5 +1.0 -- 2.2 1.2 0.03 -- 3 Unit V V V nA nA mA V V mS pF pF pF dB dB Test conditions ID = 200 A , VG1S = -3 V, VG2S = -3 V IG1 = 10 A, VG2S = VDS = 0 IG2 = 10 A, VG1S = VDS = 0 VG1S = 6 V, VG2S = VDS = 0 VG2S = 6 V, VG1S = VDS = 0 VDS = 6 V, VG1S = 0.5 V, VG2S = 3 V VDS = 10 V, VG2S = 3 V, ID = 100 A VDS = 10 V, VG1S = 3 V, ID = 100 A VDS = 6 V, VG2S = 3 V, ID = 10 mA, f = 1 kHz VDS = 6 V, VG2S = 3 V, ID = 10 mA, f = 1 MHz VDS = 4 V, VG2S = 3 V, ID = 10 mA, f = 900 MHz
Rev.3.00, Aug 10.2005, page 2 of 6
3SK295
Main Characteristics
Maximum Channel Power Dissipation Curve
Pch (mW)
200 20 VG2S = 3 V 1.2 V
Typical Output Characteristics
Pulse test
(mA)
16 1.0 V
150
Channel Power Dissipation
ID
100
12 0.8 V 8 0.6 V 4 VG1S = 0.4 V 2 4 6 8 10
50
Drain Current
50 100 150 200
0
0
Ambient Temperature
Ta (C)
Drain to Source Voltage VDS (V)
Drain Current vs. Gate1 to Source Voltage
20 3.0 V 2.0 V VDS = 6 V
Drain Current vs. Gate2 to Source Voltage
20 2.0 V 1.5 V VDS = 6 V
Pulse test
(mA)
16
2.5 V 1.5 V
(mA)
Pulse test
16 1.0 V 12
ID
12
Drain Current
Drain Current
ID
1.0 V
8
8 VG1S = 0.5 V
4 VG2S = 0.5 V 0 1 2 3 4 5
4
0
1
2
3
4
5
Gate1 to Source Voltage VG1S (V)
Gate2 to Source Voltage VG2S (V)
Forward Transfer Admittance vs. Gate1 to Source Voltage
Forward Transfer Admittance |yfs| (mS)
30 VDS = 6 V f = 1 kHz VG2S = 3.0 V 18 2.5 V 2.0 V 1.5 V 6 0.5 V 0 0.4 0.8 1.2 1.6 2.0 0 1 1.0 V 25
Power Gain vs. Drain Current
PG (dB) Power Gain
24
20
15
12
10 VDS = 4 V VG2S = 3 V f = 900 MHz 2 5 10 20
5
Gate1 to Source Voltage VG1S (V)
Drain Current
ID
(mA)
Rev.3.00, Aug 10.2005, page 3 of 6
3SK295
Noise Figure vs. Drain Current
5 VDS = 4 V VG2S = 3 V f = 900 MHz
Power Gain vs. Drain to Source Voltage
25
4
PG (dB) Power Gain
NF (dB)
20
3
15
Noise Figure
2
10 VG2S = 3 V ID = 10 mA f = 900 MHz 2 4 6 8 10
1 0 1
5
2
5
10
20
0
Drain Current
ID
(mA)
Drain to Source Voltage
VDS (V)
Noise Figure vs. Drain to Source Voltage
5
NF (dB) Noise Figure
4
3
2 VG2S = 3 V ID = 10 mA f = 900 MHz 2 4 6 8 10
1
0
Drain to Source Voltage
VDS (V)
Rev.3.00, Aug 10.2005, page 4 of 6
3SK295
S11 Parameter vs. Frequency
.8 .6 .4 3 .2 4 5 10 0 .2 .4 .6 .8 1.0 1.5 2 3 45 10 -10 -.2 -5 -4 -3 -.4 -.6 -.8 -1.5 -2 -120 -90 -60 -1 180 0 150 30 1 1.5 2 120
S21 Parameter vs. Frequency
90
Scale: 0.5 / div.
60
-150
-30
Condition: VDS = 4 V, VG2S = 3 V ID = 10 mA, Zo = 50 100 to 1000 MHz (50 MHz step)
Condition: VDS = 4 V, VG2S = 3 V ID = 10 mA, Zo = 50 100 to 1000 MHz (50 MHz step)
S12 Parameter vs. Frequency
90 120
S22 Parameter vs. Frequency
.8 .6 .4 3 1 1.5 2
Scale: 0.002/ div.
60
150
30 .2
4 5 10
180
0
0
.2
.4
.6 .8 1.0 1.5 2
3 45
10 -10
-.2 -150 -30 -.4 -120 -90 -60 -.6 -.8 -1.5
-5 -4 -3 -2 -1
Condition: VDS = 4 V, VG2S = 3 V ID = 10 mA, Zo = 50 100 to 1000 MHz (50 MHz step)
Condition: VDS = 4 V, VG2S = 3 V ID = 10 mA, Zo = 50 100 to 1000 MHz (50 MHz step)
Rev.3.00, Aug 10.2005, page 5 of 6
3SK295
Package Dimensions
JEITA Package Code SC-61AA RENESAS Code PLSP0004ZA-A Package Name MPAK-4 / MPAK-4V MASS[Typ.] 0.013g
D e2 b1 B B e
A Q c
E
HE
Reference Symbol Dimension in Millimeters
L A A xM S A b
L1 A3 e2
LP
e
A2
A
I1
b5 yS A1 S e1
b b2 c c1 c
b1 b3 c1
I1
b4
A-A Section
B-B Section
Pattern of terminal position areas
A A1 A2 A3 b b1 b2 b3 c c1 D E e e2 HE L L1 LP x y b4 b5 e1 I1 Q
Min 1.0 0 1.0 0.35 0.55
Nom
0.1 2.7 1.35
1.1 0.25 0.42 0.62 0.4 0.6 0.13 0.11 1.5 0.95 0.85 2.8
Max 1.3 0.1 1.2 0.5 0.7
0.15 3.1 1.65
2.2 0.35 0.15 0.25
3.0 0.75 0.55 0.65 0.05 0.05 0.55 0.75 1.05
1.95 0.3
Ordering Information
Part Name 3SK295ZQ-TL-E Quantity 3000 Shipping Container 178 mm Reel, 8 mm Emboss Taping
Note: For some grades, production may be terminated. Please contact the Renesas sales office to check the state of production before ordering the product.
Rev.3.00, Aug 10.2005, page 6 of 6
Sales Strategic Planning Div.
Keep safety first in your circuit designs!
Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan
1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage. Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or mishap. Notes regarding these materials 1. These materials are intended as a reference to assist our customers in the selection of the Renesas Technology Corp. product best suited to the customer's application; they do not convey any license under any intellectual property rights, or any other rights, belonging to Renesas Technology Corp. or a third party. 2. Renesas Technology Corp. assumes no responsibility for any damage, or infringement of any third-party's rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or circuit application examples contained in these materials. 3. All information contained in these materials, including product data, diagrams, charts, programs and algorithms represents information on products at the time of publication of these materials, and are subject to change by Renesas Technology Corp. without notice due to product improvements or other reasons. It is therefore recommended that customers contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor for the latest product information before purchasing a product listed herein. The information described here may contain technical inaccuracies or typographical errors. Renesas Technology Corp. assumes no responsibility for any damage, liability, or other loss rising from these inaccuracies or errors. Please also pay attention to information published by Renesas Technology Corp. by various means, including the Renesas Technology Corp. Semiconductor home page (http://www.renesas.com). 4. When using any or all of the information contained in these materials, including product data, diagrams, charts, programs, and algorithms, please be sure to evaluate all information as a total system before making a final decision on the applicability of the information and products. Renesas Technology Corp. assumes no responsibility for any damage, liability or other loss resulting from the information contained herein. 5. Renesas Technology Corp. semiconductors are not designed or manufactured for use in a device or system that is used under circumstances in which human life is potentially at stake. Please contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor when considering the use of a product contained herein for any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater use. 6. The prior written approval of Renesas Technology Corp. is necessary to reprint or reproduce in whole or in part these materials. 7. If these products or technologies are subject to the Japanese export control restrictions, they must be exported under a license from the Japanese government and cannot be imported into a country other than the approved destination. Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the country of destination is prohibited. 8. Please contact Renesas Technology Corp. for further details on these materials or the products contained therein.
RENESAS SALES OFFICES
Refer to "http://www.renesas.com/en/network" for the latest and detailed information. Renesas Technology America, Inc. 450 Holger Way, San Jose, CA 95134-1368, U.S.A Tel: <1> (408) 382-7500, Fax: <1> (408) 382-7501 Renesas Technology Europe Limited Dukes Meadow, Millboard Road, Bourne End, Buckinghamshire, SL8 5FH, U.K. Tel: <44> (1628) 585-100, Fax: <44> (1628) 585-900 Renesas Technology Hong Kong Ltd. 7th Floor, North Tower, World Finance Centre, Harbour City, 1 Canton Road, Tsimshatsui, Kowloon, Hong Kong Tel: <852> 2265-6688, Fax: <852> 2730-6071 Renesas Technology Taiwan Co., Ltd. 10th Floor, No.99, Fushing North Road, Taipei, Taiwan Tel: <886> (2) 2715-2888, Fax: <886> (2) 2713-2999 Renesas Technology (Shanghai) Co., Ltd. Unit2607 Ruijing Building, No.205 Maoming Road (S), Shanghai 200020, China Tel: <86> (21) 6472-1001, Fax: <86> (21) 6415-2952 Renesas Technology Singapore Pte. Ltd. 1 Harbour Front Avenue, #06-10, Keppel Bay Tower, Singapore 098632 Tel: <65> 6213-0200, Fax: <65> 6278-8001 Renesas Technology Korea Co., Ltd. Kukje Center Bldg. 18th Fl., 191, 2-ka, Hangang-ro, Yongsan-ku, Seoul 140-702, Korea Tel: <82> 2-796-3115, Fax: <82> 2-796-2145
http://www.renesas.com
Renesas Technology Malaysia Sdn. Bhd. Unit 906, Block B, Menara Amcorp, Amcorp Trade Centre, No.18, Jalan Persiaran Barat, 46050 Petaling Jaya, Selangor Darul Ehsan, Malaysia Tel: <603> 7955-9390, Fax: <603> 7955-9510
(c) 2005. Renesas Technology Corp., All rights reserved. Printed in Japan.
Colophon .3.0


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