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2STA1694
High power PNP epitaxial planar bipolar transistor
Features

High breakdown voltage VCEO = -120 V Complementary to 2STC4467 Fast-switching speed Typical ft = 20 MHz Fully characterized at 125 oC
3 2 1
Applications
Audio power amplifier
TO-3P
Description
The device is a PNP transistor manufactured using new BiT-LA (Bipolar transistor for linear amplifier) technology. The resulting transistor shows good gain linearity behaviour. Figure 1. Internal schematic diagram
Table 1.
Device summary
Marking 2STA1694 Package TO-3P Packaging Tube
Order code 2STA1694
May 2008
Rev 2
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www.st.com 7
Electrical ratings
2STA1694
1
Electrical ratings
Table 2.
Symbol VCBO VCEO VEBO IC ICM PTOT Tstg TJ
Absolute maximum rating
Parameter Collector-base voltage (IE = 0) Collector-emitter voltage (IB = 0) Emitter-base voltage (IC = 0) Collector current Collector peak current (tP < 5ms) Total dissipation at Tc = 25 C Storage temperature Max. operating junction temperature Value -120 -120 -6 -8 -16 80 -65 to 150 150 Unit V V V A A W C C
Table 3.
Symbol Rthj-case
Thermal data
Parameter Thermal resistance junction-case _________ __max Value 1.563 Unit C/W
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2STA1694
Electrical characteristics
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Electrical characteristics
(Tcase = 25 C; unless otherwise specified)
Table 4.
Symbol ICBO IEBO
Electrical characteristics
Parameter Collector cut-off current (IE = 0) Emitter cut-off current (IC = 0) Test conditions VCB = -120 V VEB = -6 V IC = -50 mA IC = -100 A IE = -1 mA IC = -3 A IC = -3 A IB = -300 mA VCE = -4 V 70 20 -120 -120 -6 -1.5 140 MHz Min. Typ. Max. -10 Unit A
-10
A
Collector-emitter breakdown V(BR)CEO(1) voltage (I = 0) B V(BR)CBO Collector-base breakdown voltage (IE = 0)
V V V V
Emitter-base breakdown V(BR)EBO(1) voltage (I = 0) C VCE(sat) (1) hFE fT Collector-emitter saturation voltage DC current gain Transition frequency
IC = -0.5 A VCE = -12 V
1. Pulsed duration = 300 s, duty cycle 1.5%
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Package mechanical data
2STA1694
3
Package mechanical data
In order to meet environmental requirements, ST offers these devices in ECOPACK(R) packages. These packages have a Lead-free second level interconnect . The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com
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2STA1694
Package mechanical data
TO-3P Mechanical data
DIM. A A1 A2 b b1 b2 c D D1 E E1 E2 e L L1 L2 P Q Q1 MIN. 4.6 1.45 1.20 0.80 1.80 2.80 0.55 19.70 15.40 13.60 9.60 5.45 20 3.50 18.40 5 3.80 mm. TYP 1.50 1.40 1 MAX. 5 1.65 1.60 1.20 2.20 3.20 0.75 20.10 15.80
0.60 19.90 13.90
5.15 19.50 18.20 3.10
5.75 20.50 18.60 3.30
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Revision history
2STA1694
4
Revision history
Table 5.
Date 23-Nov-2007 15-May-2008
Document revision history
Revision 1 2 Initial release Document status promoted from preliminary data to datasheet. Changes
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2STA1694
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