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PD - 97317 INSULATED GATE BIPOLAR TRANSISTOR WITH ULTRAFAST SOFT RECOVERY DIODE Features * * * * * * * * Low VCE (ON) Trench IGBT Technology Low switching losses Maximum Junction temperature 150 C Square RBSOA 100% of the parts tested for clamped inductive load Ultra fast soft Recovery Co-Pak Diode Tight parameter distribution Lead Free Package C IRGP4072DPBF VCES = 300V IC = 40A, TC = 100C G VCE(on) typ. = 1.46V E Benefits * High Efficiency in a wide range of applications * Suitable for a wide range of switching frequencies due to Low VCE (ON) and Low Switching losses * Rugged transient Performance for increased reliability * Low EMI n-channel C Applications * * * * Uninterruptible Power Supplies Battery operated vehicles Welding Solar converters and inverters E C G TO-247AC G Gate C Collector E Emitter Absolute Maximum Ratings Parameter VCES IC @ TC = 25C IC @ TC = 100C ICM ILM IF @ TC = 25C IF @ TC = 100C IFM VGE PD @ TC = 25C PD @ TC = 100C TJ TSTG Collector-to-Emitter Voltage Continuous Collector Current Continuous Collector Current Pulse Collector Current Clamped Inductive Load Current Diode Continous Forward Current Diode Continous Forward Current Diode Maximum Forward Current Transient Gate-to-Emitter Voltage Maximum Power Dissipation Maximum Power Dissipation Operating Junction and Storage Temperature Range Soldering Temperature, for 10 sec. Mounting Torque, 6-32 or M3 Screw 300 (0.063 in. (1.6mm) from case) 10 lbf*in (1.1 N*m) Max. 300 70 40 120 120 70 40 120 20 30 180 71 -55 to +150 Units V c e A Continuous Gate-to-Emitter Voltage V W C Thermal Resistance Parameter RJC (IGBT) RJC (Diode) RCS RJA Thermal Resistance Junction-to-Case-(each IGBT) Thermal Resistance Junction-to-Case-(each Diode) Thermal Resistance, Case-to-Sink (flat, greased surface) Thermal Resistance, Junction-to-Ambient (typical socket mount) Min. --- --- --- --- Typ. --- --- 0.24 80 Max. 0.70 0.87 --- --- Units C/W 1 www.irf.com 04/16/08 IRGP4072DPBF Electrical Characteristics @ TJ = 25C (unless otherwise specified) Parameter V(BR)CES V(BR)CES/TJ Min. 300 -- -- -- 2.6 -- -- -- -- -- -- -- Typ. -- 0.20 1.46 1.59 -- -13 28 1.0 450 2.26 1.53 -- Max. Units -- -- 1.70 -- 5.0 -- -- 25 -- 2.69 -- 100 nA V V Conditions VGE = 0V, IC = 1.0mA Ref.Fig Collector-to-Emitter Breakdown Voltage Temperature Coeff. of Breakdown Voltage VCE(on) VGE(th) VGE(th)/TJ Collector-to-Emitter Saturation Voltage Gate Threshold Voltage Threshold Voltage temp. coefficient Forward Transconductance Collector-to-Emitter Leakage Current Diode Forward Voltage Drop Gate-to-Emitter Leakage Current V/C VGE = 0V, IC = 1mA (25C-150C) V IC = 40A, VGE = 15V, TJ = 25C IC = 40A, VGE = 15V, TJ = 150C V VCE = VGE, IC = 500A mV/C VCE = VGE, IC = 1.0mA (25C - 150C) S VCE = 25V, IC = 40A A VGE = 0V, VCE = 300V VGE = 0V, VCE = 300V, TJ = 150C IF = 40A IF = 40A, TJ = 150C VGE = 30V 5,6,7 9,10,11 9, 10, 11, 12 gfe ICES VFM IGES 8 Switching Characteristics @ TJ = 25C (unless otherwise specified) Parameter Qg Qge Qgc Eon Eoff Etotal td(on) tr td(off) tf Eon Eoff Etotal td(on) tr td(off) tf Cies Coes Cres RBSOA Erec trr Irr Total Gate Charge (turn-on) Gate-to-Emitter Charge (turn-on) Gate-to-Collector Charge (turn-on) Turn-On Switching Loss Turn-Off Switching Loss Total Switching Loss Turn-On delay time Rise time Turn-Off delay time Fall time Turn-On Switching Loss Turn-Off Switching Loss Total Switching Loss Turn-On delay time Rise time Turn-Off delay time Fall time Input Capacitance Output Capacitance Reverse Transfer Capacitance Reverse Bias Safe Operating Area Reverse Recovery Energy of the Diode Diode Reverse Recovery Time Peak Reverse Recovery Current Min. -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- Typ. 73 13 26 409 838 1247 18 36 144 95 713 1076 1789 16 39 176 133 2265 190 58 Max. Units 110 20 39 525 1017 1542 23 50 121 124 -- -- -- -- -- -- -- -- -- -- pF VGE = 0V VCC = 30V ns J ns J nC IC = 40A VGE = 15V VCC = 240V Conditions Ref.Fig 23 CT1 IC = 40A, VCC = 240V, VGE = 15V RG = 10, L = 200H, TJ = 25C Energy losses include tail & diode reverse recovery CT3 IC = 40A, VCC = 240V, VGE = 15V RG = 10, L = 200H, TJ = 25C CT3 IC = 40A, VCC = 240V, VGE=15V RG=10, L=200H, TJ = 150C Energy losses include tail & diode reverse recovery 13, 15 CT3 WF1, WF2 14, 16 CT3 WF1 WF2 22 IC = 40A, VCC = 240V, VGE = 15V RG = 10, L = 200H TJ = 150C f = 1.0Mhz TJ = 150C, IC = 120A VCC = 240V, Vp =300V Rg = 10, VGE = +15V to 0V 4 CT2 FULL SQUARE -- -- -- 909 122 36 -- -- -- J ns A TJ = 150C VCC = 240V, IF = 40A VGE = 15V, Rg = 10, L =200H, Ls = 150nH 17, 18, 19 20, 21 WF3 Notes: VCC = 80% (VCES), VGE = 15V, L = 200H, RG = 10. This is only applied to TO-247AC package. Pulse width limited by max. junction temperature. 2 www.irf.com IRGP4072DPBF 80 70 60 50 40 30 20 10 0 25 50 75 100 125 150 T C (C) Ptot (W) 200 175 150 125 100 75 50 25 0 0 25 50 75 T C (C) 100 125 150 IC (A) Fig. 1 - Maximum DC Collector Current vs. Case Temperature 1000 Fig. 2 - Power Dissipation vs. Case Temperature 1000 100 10sec 100sec 100 IC (A) IC (A) 10 TC = 25C TJ = 150C Single Pulse 1msec 10 1 1 10 VCE (V) 100 1000 1 10 100 VCE (V) 1000 Fig. 3 - Forward SOA TC = 25C, TJ 150C; VGE =15V 200 180 160 140 ICE (A) Fig. 4 - Reverse Bias SOA TJ = 150C; VGE =15V 200 180 160 ICE (A) 120 100 80 60 40 20 0 0 2 4 6 VGE = 18V VGE = 15V VGE = 12V VGE = 10V VGE = 8.0V 140 120 100 80 60 40 20 0 VGE = 18V VGE = 15V VGE = 12V VGE = 10V VGE = 8.0V 8 10 0 2 4 6 8 10 VCE (V) VCE (V) Fig. 5 - Typ. IGBT Output Characteristics TJ = -40C; tp = 60s Fig. 6 - Typ. IGBT Output Characteristics TJ = 25C; tp = 60s www.irf.com 3 IRGP4072DPBF 200 180 160 140 ICE (A) 100 VGE = 18V VGE = 15V VGE = 12V VGE = 10V VGE = 8.0V 80 120 100 80 60 40 20 0 0 2 4 6 8 10 60 IF (A) -40c 25C 150C 40 20 0 0.0 1.0 2.0 VF (V) 3.0 4.0 VCE (V) Fig. 7 - Typ. IGBT Output Characteristics TJ = 150C; tp = 60s 20 18 16 14 VCE (V) Fig. 8 - Typ. Diode Forward Characteristics tp = 60s 20 18 16 14 VCE (V) 12 10 8 6 4 2 0 5 10 VGE (V) ICE = 20A ICE = 40A ICE = 80A 12 10 8 6 4 2 0 5 10 VGE (V) ICE = 20A ICE = 40A ICE = 80A 15 20 15 20 Fig. 9 - Typical VCE vs. VGE TJ = -40C 20 18 16 14 VCE (V) ICE (A) Fig. 10 - Typical VCE vs. VGE TJ = 25C 200 180 160 140 T J = 25C T J = 150C 12 10 8 6 4 2 0 5 10 VGE (V) ICE = 20A ICE = 40A ICE = 80A 120 100 80 60 40 20 0 15 20 0 5 VGE (V) 10 15 Fig. 11 - Typical VCE vs. VGE TJ = 150C Fig. 12 - Typ. Transfer Characteristics VCE = 50V; tp = 10s 4 www.irf.com IRGP4072DPBF 3000 2500 2000 Energy (J) 1000 EOFF 1500 1000 EON 500 0 0 10 20 30 40 IC (A) 50 60 70 80 Swiching Time (ns) tF tdOFF 100 tR tdON 10 0 10 20 30 40 IC (A) 50 60 70 80 Fig. 13 - Typ. Energy Loss vs. IC TJ = 150C; L = 200H; VCE = 240V, RG = 10; VGE = 15V 2500 EOFF 2000 Fig. 14 - Typ. Switching Time vs. IC TJ = 150C; L = 200H; VCE = 240V, RG = 10; VGE = 15V 1000 tdOFF Swiching Time (ns) Energy (J) tF 100 tR 1500 EON 1000 tdON 500 0 25 50 75 100 125 10 0 25 50 75 100 125 RG () Rg ( ) Fig. 15 - Typ. Energy Loss vs. RG TJ = 150C; L = 200H; VCE = 240V, ICE = 40A; VGE = 15V 40 RG = 10 35 RG = 22 Fig. 16 - Typ. Switching Time vs. RG TJ = 150C; L = 200H; VCE = 240V, ICE = 40A; VGE = 15V 40 35 IRR (A) 60 80 IRR (A) 30 30 25 RG = 47 RG = 100 25 20 15 0 20 40 IF (A) 20 0 25 50 RG () 75 100 Fig. 17 - Typ. Diode IRR vs. IF TJ = 150C Fig. 18 - Typ. Diode IRR vs. RG TJ = 150C www.irf.com 5 IRGP4072DPBF 40 2600 2400 80A 10 35 2200 Q RR (C) 2000 1800 1600 1400 1200 100 47 40A 22 IRR (A) 30 20A 25 20 300 400 500 600 700 800 diF /dt (A/s) 1000 300 400 500 600 700 800 diF /dt (A/s) Fig. 19 - Typ. Diode IRR vs. diF/dt VCC = 240V; VGE = 15V; IF = 40A; TJ = 150C Fig. 20 - Typ. Diode QRR vs. diF/dt VCC = 240V; VGE = 15V; TJ = 150C 1200 1000 800 Energy (J) 10000 RG = 10 RG = 22 RG = 47 Cies Capacitance (pF) 1000 600 400 200 0 20 30 40 RG = 100 Coes 100 Cres 10 50 IF (A) 60 70 80 0 50 100 VCE (V) 150 200 Fig. 21 - Typ. Diode ERR vs. IF TJ = 150C 16 VGE , Gate-to-Emitter Voltage (V) Fig. 22 - Typ. Capacitance vs. VCE VGE= 0V; f = 1MHz V CES = 150V V CES = 240V 14 12 10 8 6 4 2 0 0 25 50 75 Q G , Total Gate Charge (nC) Fig. 23 - Typical Gate Charge vs. VGE ICE = 40A; L = 100H 6 www.irf.com IRGP4072DPBF 1 D = 0.50 Thermal Response ( Z thJC ) 0.20 0.1 0.10 0.05 0.02 0.01 0.01 SINGLE PULSE ( THERMAL RESPONSE ) J R1 R1 J 1 2 R2 R2 R3 R3 3 R4 R4 C 1 2 3 4 4 Ri (C/W) 0.01788 0.12215 0.33816 0.22196 i (sec) 0.00001 0.000108 0.001262 0.007931 Ci= i/Ri Ci i/Ri Notes: 1. Duty Factor D = t1/t2 2. Peak Tj = P dm x Zthjc + Tc 0.001 0.01 0.1 1 0.001 1E-006 1E-005 0.0001 t1 , Rectangular Pulse Duration (sec) Fig 24. Maximum Transient Thermal Impedance, Junction-to-Case (IGBT) 10 Thermal Response ( Z thJC ) 1 D = 0.50 0.1 0.20 0.10 0.05 0.02 0.01 J J 1 R1 R1 2 R2 R2 R3 R3 3 C 3 Ri (C/W) i (sec) 0.2758 0.000776 0.3708 0.2252 0.002206 0.013373 0.01 1 2 Ci= i/Ri Ci i/Ri 0.001 SINGLE PULSE ( THERMAL RESPONSE ) Notes: 1. Duty Factor D = t1/t2 2. Peak Tj = P dm x Zthjc + Tc 0.001 0.01 0.1 1 0.0001 1E-006 1E-005 0.0001 t1 , Rectangular Pulse Duration (sec) Fig. 25. Maximum Transient Thermal Impedance, Junction-to-Case (DIODE) www.irf.com 7 IRGP4072DPBF L L VC C D UT 0 80 V Rg DU T 4 80V 1K Fig.C.T.1 - Gate Charge Circuit (turn-off) Fig.C.T.2 - RBSOA Circuit R= VCC ICM d io d e clamp / DU T L - 5V DU T / D RIVER Rg DUT Rg VCC VCC Fig.C.T.3 - Switching Loss Circuit Fig.C.T.4 - Resistive Load Circuit 8 www.irf.com IRGP4072DPBF 400 80 400 120 300 tf 200 VCE (V) 60 300 tr TEST CURRENT 90 VCE (V) 5% V CE 100 5% ICE 20 100 10% test current 30 5% V CE 0 Eof f Loss 0 0 Eon 0 -100 -0.35 0.15 time(s) -20 0.65 -100 -0.4 -0.3 -0.2 -0.1 0.0 0.1 time (s) -30 0.2 Fig. WF1 - Typ. Turn-off Loss Waveform @ TJ = 150C using Fig. CT.3 Fig. WF2 - Typ. Turn-on Loss Waveform @ TJ = 150C using Fig. CT.3 100 50 QRR 0 tRR -50 -100 VF (V) -150 -200 -250 -300 -350 -400 -1.00 Peak IRR 10% Peak IRR 50 40 30 20 10 0 -10 -20 -30 -40 -50 3.00 IF (A) 0.00 1.00 time (S) 2.00 Fig. WF3 - Typ. Diode Recovery Waveform @ TJ = 150C using Fig. CT.3 www.irf.com ICE (A) 9 ICE (A) 90% ICE 40 200 90% test current 60 IRGP4072DPBF TO-247AC Package Outline Dimensions are shown in millimeters (inches) TO-247AC Part Marking Information @Y6HQG@) UCDTADTA6IADSAQ@"A XDUCA6TT@H7GA GPUA8P9@A$%$& 6TT@H7G@9APIAXXA"$A! DIAUC@A6TT@H7GAGDI@AACA Ir)AAQAAvAhriyAyvrAvv vqvphrAAGrhqArrA DIU@SI6UDPI6G S@8UDAD@S GPBP 6TT@H7G GPUA8P9@ Q6SUAIVH7@S ,5)3( A "$C $%AAAAAAAAAAA$& 96U@A8P9@ @6SA A2A! X@@FA"$ GDI@AC TO-247AC package is not recommended for Surface Mount Application. Note: For the most current drawing please refer to IR website at http://www.irf.com/package/ Data and specifications subject to change without notice. This product has been designed and qualified for Industrial market. Qualification Standards can be found on IR's Web site. IR WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105 TAC Fax: (310) 252-7903 Visit us at www.irf.com for sales contact information. 04/08 10 www.irf.com |
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