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  Datasheet File OCR Text:
 SMD Type
TrenchMOSTM standard level FET KUK7607-30B
TO-263
+ .1 1 .2 7 -00.1
Transistors IC
Unit: mm
+0.1 1.27-0.1 +0.2 4.57-0.2
Features
Very low on-state resistance Q101 compliant
+ .2 8 .7 -00.2
175
rated
Standard level compatible.
+0.1 1.27-0.1
0.1max
+0.1 0.81-0.1
+ .2 5 .2 8 -00.2
2.54
+0.2 -0.2 +0.1 5.08-0.1
+ .2 2 .5 4 -00.2
+ .2 1 5 .2 5 -00.2
2.54
+0.2 0.4-0.2
Absolute Maximum Ratings Ta = 25
Parameter Drain-source voltage Drain-gate voltage RGS = 20 KU Gate-source voltage Drain current (DC) Tmb = 25 ,VGS = 10 V Drain current (DC) Tmb = 100 ,VGS = 10 V Drain current (pulse peak value) *1 Total power dissipation Tmb = 25 Storage & operating temperature reverse drain current (DC) Tmb = 25 pulsed reverse drain current *1 non-repetitive avalanche energy *2 Thermal resistance junction to mounting base Thermal resistance junction to ambient * 1 Tmb = 25 ; pulsed; tp 10 is; 30 V; VGS = 10 V; RGS = 50U;starting Tmb = 25 Symbol VDS VDGR VGS ID ID IDM Ptot Tstg, Tj IDR IDRM EDS(AL)S Rth j-mb Rth j-a 108 75 435 157 -55 to 175 108 75 435 329 0.95 50 A A A J K/W K/W Rating 30 30 Unit V V V A A A W
*2 unclamped inductive load; ID = 75 A;VDS
5 .6 0
1 gate 1 Gate 2 drain 2 Drain 3 source 3 Source
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1
SMD Type
KUK7607-30B
Electrical Characteristics Ta = 25
Parameter drain-source breakdown voltage Symbol V(BR)DSS Testconditons ID = 0.25 mA; VGS = 0 V;Tj = 25 ID = 0.25 mA; VGS = 0 V;Tj = -55 ID = 1 mA; VDS = VGS;Tj = 25 gate-source threshold voltage VGS(th) ID = 1 mA; VDS = VGS;Tj = 175 ID = 1 mA; VDS = VGS;Tj = -55 Zero gate voltage drain current gate-source leakage current drain-source on-state resistance total gate charge gate-to-source charge gate-to-drain (Miller) charge input capacitance output capacitance reverse transfer capacitance turn-on delay time rise time turn-off delay time fall time internal drain inductance internal source inductance source-drain (diode forward) voltage reverse recovery time recovered charge IDSS IGSS RDSon Qg(tot) Qgs Qgd Ciss Coss Crss td(on) tr td(off) tf Ld Ls VSD trr Qr from drain lead 6 mm from package to centre of die from source lead to source bond pad Is = 40A; VGS = 0 V IS = 25 A; -dIF/dt = -100 A/is; VGS = -10 V; VDS = 20 V VDD = 25 V; RL = 1.2U;VGS = 10 V; RG = 10U VGS = 0 V; VDS = 25 V;f = 1 MHz VGS = 10 V; VDD = 24 V;ID = 25 A VDS = 30 V; VGS = 0 V;Tj = 25 VDS = 30 V; VGS = 0 V;Tj = 175 VGS = 20 V; VDS = 0 V .. Min 30 27 2 1
Transistors IC
Typ
Max
Unit V V
3
4
V V
4.4 0.02 1 500 2 5.9 100 7 13.3 36 9 12 1820 632 256 20 51 51 44 4.5 2.5 7.5 0.85 46 28 1.2 7446 1014 360
V iA iA nA mU mU nC nC nC pF pF pF ns ns ns ns nH nH nH V ns nC
VGS = 10 V; ID = 25 A;Tj = 25 VGS = 10 V; ID = 25 A;Tj = 175
2
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