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| ACPF-7003 High Rx and Image Rejection Tx Filter for US PCS Band Data Sheet General Description TheACPF-7003isahighrejectionfullbandtransmitfilter designedforUSPCShandsets.Itsperformancerivalssplitbandsurfaceacousticwave(SAW)transmitfilters.Sincea singlefilterprovidestherejection,noswitchesarerequired, savingboardspaceandexternalcomponents,eliminatingswitchloss,andreducingprogrammingcomplexity. Furthermore,with25dBrejectionat1830MHz,itisatrue splitbandreplacement. TheACPF-7003FBARtransmitfilterutilizesAvagoTechnologies' Microcap bonded-wafer chip scale packaging technology. This process allows the ultra small filters to be assembled into a Molded Chip on Board (MCOB) Module. Features * High rejection from a single filter with no switches required * Truesplitbandreplacement * Passband:1850-1910MHz * 35dBminAttenuation,1930-1990MHz * 2.5dBTypicalInsertionLoss * 25dBimagerejectionat1830MHz * Spacesavingsolution -Smallfootprint:1.6x2.0-mmsolution -Lowprofilepackage:0.9mmhigh(Typ) -1.0mm(Max) Intypicalcellularphonearchitectures,thetransmitfilter Applications fitsbetweenthedriveramplifierandthepoweramplifier. ThisfilterreducesthenoiseintheRxbandbeingampli- * USPCSbandhandsets fiedbythetransmitchain,enhancingreceiversensitivity. * WirelessDataterminals Highrejectionkeepsunwantedsignalsoutofthereceive path. Avago Technologies' thin-Film Bulk Acoustic Resonator (FBAR)technologymakespossiblehigh-Qfiltersatafractiontheirusualsize. Electrical Specifications, Zo=50 +25 C Symbol f IL IL IL DS21 S21 S21 S21 S21 S21 S21 S21 S11,S22 Pinmax Parameters Passband[1850.6-1909.4] InsertionLoss1850.6-1855 MHz InsertionLoss1855-1905MHz InsertionLoss1905-1909.4 MHz Ripple,1850-1910MHz MinRejection,1930.6-1990 MHz MinRejection10-1715MHz MinRejection1715-1785 MHz MinRejection1785-1830 MHz MinRejection1990-2500 MHz MinRejection2500-3820 MHz MinRejection3820-5730 MHz In-bandreturnloss SafeInputPowerLevel Units MHz dB dB dB dB dB dB dB dB dB dB dB dB dBm 35 25 25 25 30 22 15 10 20 13 45 2.0 1.5 2.5 3.5 2.5 3.0 2.5 35 25 25 25 30 22 15 10 20 13 45 3.5 2.5 3.0 Min Typ Max Min -30 to +85 C Typ Max Absolute Maximum Ratings[2] Parameter Operatingtemperature[1] Storagetemperature[1] Unit C C Value -30to+85 -40to+125 Notes: 1. TemperatureisdefinedatcaseTC,thetemperatureoftheundersideofthefilterwhereitmakescontactwiththecircuitboard. 2. Specificationsareguaranteedoverthegiventemperaturerange.Operationinexcessofanyoneoftheseconditionsmayresultinpermanent damagetothedevice. Typical Performance (25 C, Zo = 50 Ohms) Figure 1. Attenuation (dB) vs. frequency Figure 2. Insertion Loss (dB) vs. frequency Figure 3. Attenuation (dB) vs. frequency (broadband) Figure 4. Return Loss (dB) vs. frequency Figure 5. S(1,1) Figure 6. S(2,2) PCB Interface & Mounting instructions MountingConsiderationandboarddescription TheACPF-7003FBARfilterhasoneinput(Pin1),oneoutput (Pin3)andtwogrounds(Pins2and4.) * Demoboarduses3milGetekMicrostrip. ThedemoboardusesCPWGtransmissionlinesforhigh isolationbetweenthetwoports.ItusesviaholestoconnecttheCPWGlinefromtheundersideoftheboardto thefiltermountingpadsontop. Note:Forbestperformance,trytoreproducethisboardstackupclosely. IfGround-Signal-Ground(GSG)typeboardisused,betterreturnloss canbeachievedsinceiteliminatesconnectormismatch. Layer1 (signal) Getek ML00D (=.9) Getek ML00D ( T =.9) Layer (ground) Getek ML00D (=.) Getek ML00D ( T =.) Layer (signal) Getek material ML00D and RG00D Figure 7. Board stack up description Demo boards Demoboardsareavailableforsampling.(SeeboarddrawinginFigures7,8,and9.) 0. mils mils 0. mils 8 mils Figure 8. PCB Footprint pad Figure 9. Closer look at the recommended board footprint and soldermask 0.0 0.1 0.0 0.1 1.0 MAX 0. 0.1 8X 1 SIDE VIEW 1. .0 Shaded Region Grounded B Pin 1 Marking A Figure 10. Detailed Bottom, Side and Top view of Package (dimensions in mm) LAYER 1 0.1 0.0 0.0 0. 0.0 OUT 0.0 Via to layer 0.1 C D 1. 0. 0.1 This region is Soldermask covering ground IN 1 0. 1.9 Dimension in mm 0.0 Region () & () is exposed ground for soldering filter pads LAYER (GROUND layer) 0. Metal voided To decrease Capacitance at Input Port 0. 0. Metal voided To decrease Capacitance at output Port Figure 11. Suggested PCB layers Alloy type Sn42Bi58 Sn43Pb43Bi14 Sn63Pb37 Sn60Pb40 Sn91/Zn9 Sn96.2Ag2.5Cu0.8Sb0.5 00 0 00 Temperature, C 10 100 0 0 Melting temperature (oC) 138 144-163 183 186 199 216 Recommended working temperature (oC) 160-180 165-185 200-240 200-240 200-240 235-255 Alloy type Sn95.8Ag3.5Cu0.7 Sn96.5Ag3.5 Sn100 Sn95Sb5 Sn97Cu3 Melting temperature (oC) 217 221 232 235 240 Recommended working temperature (oC) 235-255 240-260 260-280 260-280 260-300 Tested profile shown. 10 Time, seconds Figure 12. Recommended solder profile 0 0 100 00 0 00 0.0 0.0() .00 0.0(1) .0() +0.10 1.0 -0.00 1. 1.0 MIN. .0(8) 1.0 1.90(8) .00 USER DIRECTION OF UNREELING NOTE: 1. MEASURED FROM THE CENTRELINE OF THE SPROCKET HOLE TO THE CENTRELINE OF THE POCKET HOLE AND FROM THE CENTRELINE OF THE SPROCKET HOLE TO THE CENTERLINE OF THE POCKET . CUMULATIVE TOLERANCE OF 10 SPROCKET HOELS IS 0.0 . THIS THICKNESS IS APPLICABLE AS MEASURED AT THE EDGE OF THE TAPE. . MATERIAL: BLACK POLYSTYRENE . ALL DIMENSIONS IN MM. . ALLOWABLE CAMBER TO BE 1MM PER 0MM IN LENGTH . UNLESS OTHERWISE SPECIFIED TOLERANCE 0.10. 8. MEASUREMENT POINT TO BE 0. FROM BOTTOM POCKET. 9. SURFACE RESISITIVTY FROM 1.0X10 TO 1.0x10 11 OHMS/SQ Figure 13. Carrier tape drawing 8.0 0. 8 typ . 0.0(1) Figure 14. Reel drawing REEL Notes: 1. Cover tape material is clear polyester film coated withheatactivatedandantistaticproperties. 2. Alldimensionsareinmmexcepttapelength. 3. Surfaceresistivity:1010to1011Ohms/sq. CARRIER TAPE USER FEED DIRECTION COVER TAPE Figure 15. Tape and reel orientation Pin 1 Position Empty Pocket/Cavity Leader : 1 Pocket - 1 Trailer : 1 Pocket - 1 : Pin 1 Location A : WORK WEEK B : DATE CODE C,D : LOT NUMBER A C User Feed Direction B D A C B D A C B D End View Top View Figure 16. Device orientation in the carrier tape Ordering Information ACPF-7003-BLK=Bulkoption, 100piecesperantistaticbag ACPF-7003-TR1=Tapeandreeloption, 3000piecesper7-inchreel For product information and a complete list of distributors, please go to our web site: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies, Pte. in the United States and other countries. Data subject to change. Copyright (c) 2006 Avago Technologies Pte. All rights reserved. 5989-3923EN - April 7, 2006 |
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