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HSMF-C16x Data Sheet
Miniature Bi-Color Surface Mount ChipLEDs
Description This series of bi-color ChipLEDs is designed with the smallest footprint to achieve high density of components on board. They have the industry standard footprint of 1.6 mm x 0.8 mm and a height of only 0.5 mm. This makes them very suitable for cellular phone and mobile equipment backlighting and indication. They are available in a wide range of color combinations. In order to facilitate automated pick and place operation, these ChipLEDs are shipped in tape and reel, with 4000 units per reel. These parts are compatible with reflow soldering.
Features * Small size * 0603 industry standard footprint * Diffused optics * Operating temperature range of -30C to +85C * Compatible with reflow soldering * Available in various color combination * Available in 8 mm tape on 7" (178 mm) diameter reels Applications * Keypad backlighting * Symbol indicator * LCD backlighting * Pushbutton backlighting * Front panel indicator
Device Selection Guide Part Number HSMF-C162 HSMF-C163 HSMF-C164 HSMF-C165 HSMF-C166 HSMF-C167 HSMF-C168 HSMF-C169
Color AlInGaP Red / AlInGaP Amber AlInGaP Red / InGaN Green AlInGaP Red / InGaN Blue High Efficiency Red / GaP Green GaP Yellow / GaP Green GaP Orange / GaP Green InGaN Green / InGaN Blue AlInGaP Amber / InGaN Blue
Package Description Untinted, Diffused Untinted, Diffused Untinted, Diffused Untinted, Diffused Untinted, Diffused Untinted, Diffused Untinted, Diffused Untinted, Diffused
CAUTION: HSMF-C16x LEDs are class 1A ESD sensitive per JESD22-A114C.01 standard. Please observe appropriate precautions during handling and processing. Refer to Avago Technologies Application Note AN-1142 for additional details.
Package Dimensions
LED DIES CATHODE LINE
1 2
3 0.8 (0.031) 4
1.6 (0.063 )
DIFFUSED EPOXY 0.5 (0.020) PC BOARD 0.16 (0.006)
CATHODE LINE
0.4 (0.016)
0.3 (0.012)
SOLDERING TERMINALS
POLARITY 1 2 3 4
HSMF-C162 HSMF-C163 HSMF-C164 HSMF-C165 HSMF-C166 HSMF-C167 HSMF-C168 HSMF-C169 AMBER RED GREEN RED BLUE RED GREEN RED GREEN YELLOW GREEN ORANGE BLUE GREEN BLUE AMBER
NOTES: 1. ALL DIMENSIONS IN MILLIMETERS (INCHES). 2. TOLERANCE IS 0.1 mm ( 0.004 IN.) UNLESS OTHERWISE SPECIFIED.
Absolute Maximum Ratings for Each Die at TA = 25C Parameter DC Forward Current[1] Power Dissipation Reverse Voltage LED Junction Temperature Operating Temperature Range Storage Temperature Range Soldering Temperature
Note: 1. Derate linearly as shown in Figure 4.
AlInGaP 20 48 5 95
InGaN 10 38 5 95 -30 to +85 -40 to +85
GaP 20 52 5 95
Units mA mW V C C C
See reflow soldering profile (Figure 6 & 7)
2
Electrical Characteristics at TA = 25C Reverse Breakdown VR (Volts) @ IR = 100 A Min. 5 5 5 5 5 5 5 5 5 5 Capacitance C (pF), @ VF = 0, f = 1 MHz Typ. 15 11 15 11 35 35 5 7 6 9 Thermal Resistance RJ-PIN (C/W) Typ. 300 300 300 300 500 500 325 325 325 325
Color AlInGaP Red AlInGaP Amber AlInGaP Red[2] AlInGaP Amber[2] InGaN Green InGaN Blue HER GaP Orange GaP Yellow GaP Green
Forward Voltage VF (Volts) @ IF[1] Typ. 20 mA 20 mA 10 mA 10 mA 10 mA 10 mA 20 mA 20 mA 20 mA 20 mA 1.9 1.9 1.8 1.8 3.4 3.4 2.1 2.2 2.1 2.2
Max. 2.4 2.4 2.3 2.3 3.8 3.8 2.6 2.6 2.6 2.6
Notes: 1. VF Tolerance: 0.1 V. 2. The product testing is based on 20 mA. This is for reference only.
Optical Characteristics at TA = 25C Peak Wavelength peak (nm) Typ. 637 595 637 595 523 468 636 605 589 570 Color Dominant Wavelength d[2] (nm) Typ. 626 592 626 592 525 470 621 604 586 572 Luminous Efficacy v (lm/W) Typ. 155 480 155 480 500 80 145 380 500 595
Color AlInGaP Red AlInGaP Amber AlInGaP Red[4] AlInGaP Amber[4] InGaN Green InGaN Blue HER GaP Orange GaP Yellow GaP Green
Luminous Intensity Iv (mcd) @ IF[1] Min. 20 mA 20 mA 10 mA 10 mA 10 mA 10 mA 20 mA 20 mA 20 mA 20 mA 28.5 28.5 11.2 11.2 18 2.8 2.8 2.8 2.8 4.5
Typ. 90 90 35 35 45 10 10 8 8 15
Viewing Angle 2 1/2 Degrees[3] Typ. 120 120 120 120 120 120 120 120 120 120
Notes: 1. The luminous intensity Iv is measured at the peak of the spatial radiation pattern which may not be aligned with the mechanical axis of the lamp package. 2. The dominant wavelength d is derived from the CIE Chromatically Diagram and represents the perceived color of the device. 3. 1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity. 4. The product testing is based on 20 mA. This is for reference purpose.
3
Color Bin Limits[1] Green Color Bins[1] Dom. Wavelength (nm) Bin ID A B C D E Min. 561.5 564.5 567.5 570.5 573.5 Max. 564.5 567.5 570.5 573.5 576.5 Bin ID A B C D E F Yellow/Amber Color Bins[1] Dom. Wavelength (nm) Min. 582.0 584.5 587.0 589.5 592.0 594.5 Max. 584.5 587.0 589.5 592.0 594.5 597.0
Intensity (Iv) Bin Limits[1] Bin ID A B C D E F G H J K L M N P Q R S T U V W X Y Intensity @ 20 mA (mcd) Min. Max. 0.11 0.18 0.29 0.45 0.72 1.10 1.80 2.80 4.50 7.20 11.20 18.00 28.50 45.00 71.50 112.50 180.00 285.00 450.00 715.00 1125.00 1800.00 2850.00 0.18 0.29 0.45 0.72 1.10 1.80 2.80 4.50 7.20 11.20 18.00 28.50 45.00 71.50 112.50 180.00 285.00 450.00 715.00 1125.00 1800.00 2850.00 4500.00
Tolerance: 0.5 nm
Blue Color Bins[1] Dom. Wavelength (nm) Bin ID A B C D Min. 460.0 465.0 470.0 475.0 Max. 465.0 470.0 475.0 480.0
Tolerance: 0.5 nm
InGaN Green Color Bins[1] Dom. Wavelength (nm) Bin ID A B C D Min. 515.0 520.0 525.0 530.0 Max. 520.0 525.0 530.0 535.0
Tolerance: 1 nm
Orange Color Bins[1] Dom. Wavelength (nm) Bin ID A B C D E F Min. 597.0 600.0 603.0 606.0 609.0 612.0 Max. 600.0 603.0 606.0 609.0 612.0 615.0
Tolerance: 1 nm
Tolerance: 15%. Note: 1. Bin categories are established for classification of products. Products may not be available in all categories. Please contact your Avago representative for information on currently available bins.
Tolerance: 1 nm Note: 1. Bin categories are established for classification of products. Products may not be available in all categories. Please contact your Avago representative for information on currently available bins.
4
100 90
RELATIVE INTENSITY - %
InGaN BLUE InGaN GREEN
AS AMBER
AS ORANGE
1.0 GaP GREEN
RELATIVE INTENSITY
80 70 60 50 40 30 20 10
AS RED
GaP YELLOW 0.5 GaP ORANGE HER
0 400
450
500
550
600
650
700
WAVELENGTH - nm
0 500
550
600
650
700
750
WAVELENGTH - nm
Figure 1. Relative intensity vs. wavelength.
HSMF-C16x fig 1
100
IF - FORWARD CURRENT - mA
100
AS AlInGaP
IF - FORWARD CURRENT - mA
HER 10 GaP ORANGE GaP YELLOW 1 GaP GREEN
10
InGaN
1
0.1 1.5
2.0
2.5
3.0
3.5
4.0
0 1.5 1.6 1.7 1.8 1.9
2
2.1 2.2 2.3
VF - FORWARD VOLTAGE - V
VF - FORWARD VOLTAGE - V
Figure 2. Forward current vs. forward voltage.
HSMF-C16x fig 2
1.4 1.2 1.0 0.8 0.6 0.4 0.2 0 0 5 10 15 20 25 30 AS AlInGaP
1.6 1.4
LUMINOUS INTENSITY (NORMALIZED AT 10 mA)
1.4 1.2
LUMINOUS INTENSITY (NORMALIZED AT 20 mA)
LUMINOUS INTENSITY (NORMALIZED AT 20 mA)
1.2 1.0 0.8 0.6 0.4 0.2 0 0 2 4 6 8 10 12 14 16 InGaN
1.0 0.8 GaP 0.6 0.4 0.2 0 0 5 10 15 20 25 30
IF - FORWARD CURRENT - mA
IF - FORWARD CURRENT - mA
IF - FORWARD CURRENT - mA
Figure 3. Luminous intensity vs. forward current.
HSMF-C16x fig 3a
HSMF-C16x fig 3b
5
IF MAX. - MAXIMUM FORWARD CURRENT - mA
25 20 15 10 5 0 InGaN RELATIVE INTENSITY - % AlInGaP/GaP
100 90 80 70 60 50 40 30 20 10
0 10 20 30 40 50 60 70 80 90 100 TA - AMBIENT TEMPERATURE - C
0 -90 -80 -70 -60 -50 -40 -30 -20 -10
0
10 20 30 40 50 60 70 80 90
ANGLE
Figure 4. Maximum forward current vs. ambient temperature.
Figure 5. Relative intensity vs. angle.
HSMF-C16x fig 5
10 - 30 SEC.
TEMPERATURE
10 SEC. MAX. 230C MAX.
TEMPERATURE
217 C 200 C 150 C
255 - 260 C 3 C/SEC. MAX. 6 C/SEC. MAX. 3 C/SEC. MAX. 60 - 120 SEC. TIME 100 SEC. MAX.
140-160C 4C/SEC. MAX. OVER 2 MIN. TIME
4C/SEC. MAX. 3C/SEC. MAX.
(Acc. to J-STD-020C)
Figure 6. Recommended reflow soldering profile.
Figure 7. Recommended Pb-free reflow soldering profile.
0.60 (0.024) 0.30 (0.012) 0.40 (0.016)
0.40 (0.016) 0.70 (0.028) 0.70 (0.028)
Figure 8. Recommended soldering pad pattern.
HSMF-C16x fig 7
6
USER FEED DIRECTION
xxx xxxxx xxxxx xxxxx xxxxx
CATHODE SIDE
xx
PRINTED LABEL
Figure 9. Reeling orientation.
8.0 1.0 (0.315 0.039) 10.50 1.0 (0.413 0.039) O 13.1 0.5 (O 0.516 0.020)
O 20.20 MIN. (O 0.795 MIN.) 3.0 0.5 (0.118 0.020)
178.40 1.00 (7.024 0.039)
59.60 1.00 (2.346 0.039)
4.0 0.5 (0.157 0.020)
6 PS
5.0 0.5 (0.197 0.020)
NOTE: 1. ALL DIMENSIONS IN MILLIMETERS (INCHES).
Figure 10. Reel dimensions.
4.00 (0.157)
1.50 (0.059)
CATHODE
DIM. C (SEE TABLE 1)
0.20 0.05 (0.008 0.002)
1.75 (0.069) 3.50 0.05 (0.138 0.002) DIM. A (SEE TABLE 1) 8.00 0.30 (0.315 0.012) CARRIER TAPE COVER TAPE
DIM. B (SEE TABLE 1) 2.00 0.05 (0.079 0.002)
USER FEED DIRECTION 4.00 (0.157) TABLE 1 DIMENSIONS IN MILLIMETERS (INCHES) PART NUMBER HSMF-C16x SERIES
DIM. A DIM. B DIM. C 0.10 ( 0.004) 0.10 ( 0.004) 0.10 ( 0.004) 1.75 (0.069) 0.95 (0.037) 0.60 (0.024)
Figure 11. Tape dimensions.
END
START
THERE SHALL BE A MINIMUM OF 160 mm (6.3 INCH) OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE.
MOUNTED WITH COMPONENTS.
THERE SHALL BE A MINIMUM OF 160 mm (6.3 INCH) OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE.
MINIMUM OF 230 mm (9.05 INCH) MAY CONSIST OF CARRIER AND/OR COVER TAPE.
Figure 12. Tape leader and trailer dimensions.
HSMF-C16x fig 15
NOTES: 1. ALL DIMENSIONS IN MILLIMETERS (INCHES). 2. TOLERANCE IS 0.1 mm ( 0.004 IN.) UNLESS OTHERWISE SPECIFIED.
8
Reflow Soldering For more information on reflow soldering, refer to Application Note 1060, Surface Mounting SMT LED Indicator Components.
Storage Condition: 5 to 30C @ 60% RH max. Baking is required under the condition: a) the blue silica gel indicator becoming white/transparent color b) the pack has been opened for more than 1 week Baking recommended condition: 60 5C for 20 hours.
For product information and a complete list of distributors, please go to our web site: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies, Limited in the United States and other countries. Data subject to change. Copyright (c) 2007 Avago Technologies, Limited. All rights reserved. Obsoletes 5989-4810EN AV02-0584EN - July 23, 2007

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