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FERRITE CHIP BEADS 1. PART NO. EXPRESSION : Z3 SERIES Z3C300-RG-10 (a)(b)(c) (d) (e) (f) (g) (a) Series code (b) Dimension code (c) Material code (d) Impedance code : 300 = 30 (e) R : Reel (f) Current code : G = 700mA (g) 10 : Lead Free 2. CONFIGURATION & DIMENSIONS : A D L G B C PCB Pattern Unit:m/m A B C D G 1.00 Ref. H 1.00 Ref. L 3.00 Ref. 2.000.20 1.250.20 0.850.20 0.500.30 3. SCHEMATIC : 4. MATERIALS : b a Ag(100%) Ni(100%)-1.5um(min.) Sn(100%)-3.0um(min.) (a) Body : Ferrite (b) Termination : Ag/Ni/Sn 5. GENERAL SPECIFICATION : a) Temp. rise : 30C Max. b) Rated current : Base on temp. rise c) Storage temp. : -55C to +125C d) Operating temp. : -55C to +125C e) Resistance to solder heat : 260C.10secs NOTE : Specifications subject to change without notice. Please check our website for latest information. H 03.07.2008 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 1 FERRITE CHIP BEADS 6. ELECTRICAL CHARACTERISTICS : Part Number Z3C300-RG-10 Z3C600-RG-10 Z3C121-RF-10 Z3C151-RF-10 Z3C221-RD-10 Z3C301-RD-10 Z3C471-RD-10 Z3C601-RC-10 Z3C102-RB-10 EIA Size 0805 0805 0805 0805 0805 0805 0805 0805 0805 Impedance () 30 25% 60 25% 120 25% 150 25% 220 25% 300 25% 470 25% 600 25% 1000 25% Test Frequency ( MHz ) 100 100 100 100 100 100 100 100 100 DC Resistance () Max. 0.20 0.20 0.25 0.25 0.30 0.35 0.40 0.45 0.50 Z3 SERIES Rated Current ( mA ) Max. 700 700 600 600 400 400 400 300 200 Packaging : Paper Carrier Tape 7. IMPEDANCE VS. FREQUENCY CURVES : Z3C300-RG-1 FC 3C 300-RG -00 M C-300T 0 07 Z 2012 120 300 Z3C600-RG-1 FC 3C 600-RG -00 M C-600T 0 07 Z 2012 IM PED C AN E(Ohm ) Z IM PED C AN E(Ohm ) 90 240 180 60 Z 120 30 X 60 X 0 1 10 100 R 1000 0 1 10 100 R 1000 FR EQU CY(MH EN z) FR EQU CY(MH EN z) Z3C1 121-RF -00 21 0 FC Z2012-RF-106 M 3C C-121T 600 1200 Z3C1 -RF-1 0 FC 2051-R F-00 M 12C Z3C151 -151T06 500 1000 IM PED C AN E(Ohm ) 400 300 IM PED CE(Ohm AN ) Z 800 Z 600 200 X 400 100 200 X R 0 1 10 100 R 0 1000 1 10 100 1000 FR EQU CY(MH EN z) FRE EN Y(M QU C Hz) NOTE : Specifications subject to change without notice. Please check our website for latest information. 03.07.2008 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 2 FERRITE CHIP BEADS 7. IMPEDANCE VS. FREQUENCY CURVES : Z3 SERIES Z3C221-221T04 0 Z3C221-RD-1 FC 20 -R D-00 M 12C 1800 1800 Z3C301 -RD-1 FCM 301-RD -00 2012C-301T 0 04 Z 3C 1500 1500 IM PED CE m) AN (Oh IM PED CE(Ohm AN ) 1200 1200 900 Z 900 Z 600 600 300 X R 1 10 100 1000 300 X R 1 10 100 1000 0 0 FRE EN Y(M QU C Hz) F REQU CY EN (MH z) Z3C471 Z3C471 -471T04 FC 20 -R D-000 M 12C -RD-1 2500 Z3C601-601T03 0 Z3C601-RC-1 FC 20 -R C-00 M 12C 2500 2000 2000 Z 1500 IM PED CE m) AN (Oh IM PED CE m) AN (Oh Z 1500 1000 1000 500 500 X 0 1 10 100 X 0 1000 R FRE EN Y(M QU C Hz) R 1 10 100 1000 FRE EN Y(M QU C Hz) Z3C1 C-10 -1 2 02-RB 0 ZM2012 FC 3C102-R B-00 2T0 3000 2500 Z IM PED CE(Ohm AN ) 2000 1500 1000 500 0 1 10 R 100 X 1000 FR EQU CY(MH EN z) NOTE : Specifications subject to change without notice. Please check our website for latest information. 03.07.2008 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 3 FERRITE CHIP BEADS 8. RELIABILITY & TEST CONDITION : Z3 SERIES ITEM Electrical Characteristics Test Impedance DC Resistance Rated Current Temperature Rise Test Solder Heat Resistance PERFORMANCE TEST CONDITION HP4291A, HP4287A+16092A HP4338B 1. Applied the allowed DC current. 2. Temperature measured by digital surface thermometer. Preheat : 150C, 60sec. Solder : Sn-Ag3.0-Cu0.5 Solder Temperature : 2605C Flux for lead free : rosin Dip Time : 100.5sec. Refer to standard electrical characteristics list 30C max. ( t) Appearance : No significant abnormality Impedance change : Within 30% No mechanical damage Remaining terminal electrode : 70% min. Preheating Dipping 260C 150C Natural cooling 60 seconds 100.5 seconds Solderability More than 90% of the terminal electrode should be covered with solder. Preheating Dipping 245C 150C Natural cooling Preheat : 150C, 60sec. Solder : Sn-Ag3.0-Cu0.5 Solder Temperature : 2455C Flux for lead free : rosin Dip Time : 41sec. 60 seconds 41.0 seconds Terminal Strength The terminal electrode & the dielectric must not be damaged by the forces applied on the right conditions. For Z Series : Size 1 2 3 4 5 6 Force (Kfg) 0.2 0.5 0.6 1.0 1.0 1.0 1.5 2.0 > 25 Time (sec) W W 7 8 Flexture Strength The terminal electrode & the dielectric must not be damaged by the forces applied on the right conditions. 20(.787) Bending 45(1.772) 45(1.772) 40(1.575) Solder a chip on a test substrate, bend the substrate by 2mm (0.079in) and return. 100(3.937) NOTE : Specifications subject to change without notice. Please check our website for latest information. 03.07.2008 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 4 FERRITE CHIP BEADS 8. RELIABILITY & TEST CONDITION : Z3 SERIES ITEM Bending Strength PERFORMANCE The ferrite should not be damaged by forces applied on the right condition. R0.5(0.02) 1.0(0.039) TEST CONDITION Series name Z2 Z3 Z4 Z5 Z6 Z7 Z8 mm (inches) 0.80 (0.033) 1.40 (0.055) 2.00 (0.079) 2.70 (0.106) P-Kgf 0.3 1.0 2.5 2.5 Chip A Random Vibration Test Appearance : Cracking, shipping & any other defects harmful to the characteristics should not be allowed. Impedance : Within 30% Drop 10 times on a concrete floor from a height of 75cm. Appearance : No damage. Impedance : Within 30% of initial value. Frequency : 10-55-10Hz for 1 min. Amplitude : 1.52mm Directions & times : X, Y, Z directions for 2 hours. A period of 2 hours in each of 3 mutually perpendicular directions (Total 6 hours). a. No mechanical damage b. Impedance change : 30% Temperature : 1255C Applied Current : rated current Duration : 50012hrs Measured at room temperature after placing for 2 to 3hrs. Humidity : 90~95% RH. Temperature : 402C Duration : 50012hrs Measured at room temperature after placing for 2 to 3hrs. Drop Loading at High Temperature Humidity Thermal Shock Appearance : No damage. Impedance : Within 30% of initial value. Phase 1 2 Temperature (C) -552C +1255C Times (min.) 303 303 For Z Series : Condition for 1 cycle Step1 : -552C 303 min. Step2 : +1255C 303 min. Number of cycles : 5 Measured at room temperature after placing for 2 to 3hrs. Temperature : -552C Duration : 50012hrs Measured at room temperature after placing for 2 to 3hrs. Measured : 5 times Low temperature storage test Drop Drop 10 times on a concrete floor from a height of 75cm. a. No mechanical damage b. Impedance change : 30% Derating 6 6A 5A 4A 3A 2A 1.5A 1A Derating Curve Derated Current(A) For the ferrite chip bead which withstanding current over 1.5A, as the operating temperature over 85C, the derating current information is necessary to consider with. For the detail derating of current, please refer to the Derated Current vs. Operating Temperature curve. 5 4 3 2 1 0 85 125 Operating Tem perature(C) Operating Temperature(X ) C NOTE : Specifications subject to change without notice. Please check our website for latest information. 03.07.2008 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 5 FERRITE CHIP BEADS 9. SOLDERING AND MOUNTING : 9-1. Recommended PC Board Pattern 3.00 1.00 Z3 SERIES 9-2. Soldering Mildly activated rosin fluxes are preferred. The minimum amount of solder can lead to damage from the stresses caused by the difference in coefficients of expansion between solder, chip and substrate. The terminations are suitable for all wave and re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot air soldering tools. 9-2.1 Lead Free Solder Re-flow : Recommended temperature profiles for re-flow soldering in Figure 1. 9-2.2 Solder Wave : Wave soldering is perhaps the most rigorous of surface mount soldering processes due to the steep rise in temperature seen by the circuit when immersed in the molten solder wave, typical at 230C. Due to the risk of thermal damage to products, wave soldering of large size products is discouraged. Recommended temperature profile for wave soldering is shown in Fig. 2 9-2.3 Soldering Iron (Figure 3) : Products attachment with soldering iron is discouraged due to the inherent process control limitations. In the event that a soldering iron must be employed the following precautions are recommended. Note : d) 1.0mm tip diameter (max) a) Preheat circuit and products to 150C. e) Use a 20 watt soldering iron with tip diameter of 1.0mm b) 350C tip temperature (max) f) Limit soldering time to 3 secs. c) Never contact the ceramic with the iron tip Preheating Soldering 20~40s TP(260C/10s max.) 217 200 150 60~180s 25 480s max. 60~150s TEMPERATURE C TEMPERATURE C Natural cooling 1.00 PC board should be designed so that products are not sufficient under mechanical stress as warping the board. Products shall be positioned in the sideway direction against the mechanical stress to prevent failure. Preheating 260 245 150 Soldering Natural cooling Time(sec.) Figure 1. Re-flow Soldering Over 2min. Gradual Cooling Within 10s Preheating Soldering 3s (max.) 10s (max.) TEMPERATURE C Natural cooling Figure 2. Wave Soldering 350 330 150 Over 1min. Gradual Cooling Figure 3. Hand Soldering NOTE : Specifications subject to change without notice. Please check our website for latest information. 03.07.2008 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 6 FERRITE CHIP BEADS Z3 SERIES 9-3. Solder Volume Accordingly increasing the solder volume, the mechanical stress to product is also increased. Exceeding solder volume may cause the failure of mechanical or electrical performance. Solder shall be used not to be exceed as shown in Fig. 4. Upper limit Recommendable t Figure 4 NOTE : Specifications subject to change without notice. Please check our website for latest information. 03.07.2008 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 7 FERRITE CHIP BEADS 10. PACKAGING INFORMATION : 10-1. Reel Dimension A Z3 SERIES Type 7" x 8mm D B C A(mm) 9.00.5 B(mm) 60.02.0 60.02.0 C(mm) D(mm) 13.50.5 178.02.0 13.50.5 178.02.0 7" x 12mm 13.50.5 20.5 13.50.5 R10.5 7" x 8mm 7" x 12mm R1.9 R0.5 120 10-2 Tape Dimension / 8mm Material : Paper P2:20.1 E:1.750.1 Po:40.1 D:1.56 +0.1 -0.05 t Series Size 1 Bo(mm) 1.120.03 1.850.05 2.300.05 Ao(mm) 0.620.03 1.050.05 1.500.05 Ko(mm) 0.600.03 0.950.05 0.950.05 P(mm) 2.00.1 4.00.1 4.00.1 t(mm) 0.600.03 0.950.05 0.950.05 D1(mm) none none none F:3.50.1 W:8.00.1 Bo Z/L 2 3(09) P Ao Ko Material : Plastic P2:20.05 E:1.750.1 Po:40.1 D:1.5+0.1 A W:8.00.1 t Series Size 2 3(09) Bo(mm) 1.950.10 2.250.10 2.350.10 3.500.10 3.420.10 Ao(mm) 1.050.10 1.420.10 1.500.10 1.880.10 2.770.10 Ko(mm) 1.050.10 1.040.10 1.450.10 1.270.10 1.550.10 P(mm) 4.00.1 4.00.1 4.00.1 4.00.1 4.00.1 t(mm) 0.230.05 0.220.05 0.220.05 0.220.05 0.220.05 D1(mm) none 1.00.1 1.00.1 1.00.1 1.00.1 F:3.50.05 Bo Z/L 3(12) 4 5 P A D1:10.1 Ao Ko Section A-A 10-2.1 Tape Dimension / 12mm D:1.5+0.1 E:1.750.1 A W:12.00.1 Po:40.1 P2:20.05 t Series Size 6 Bo(mm) 4.950.1 4.950.1 6.100.1 Ao(mm) 1.930.1 3.660.1 5.400.1 Ko(mm) 1.930.1 1.850.1 2.000.1 P(mm) 4.00.1 8.00.1 8.00.1 t(mm) 0.240.05 0.240.05 0.300.05 D1(mm) 1.50.1 1.50.1 1.50.1 F:5.50.05 Bo Z/L 7 8 A D1:1.50.1 P Ao Ko Section A-A NOTE : Specifications subject to change without notice. Please check our website for latest information. 03.07.2008 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 8 FERRITE CHIP BEADS Z3 SERIES 10-3. Packaging Quantity Chip Size Chip / Reel Inner Box Middle Box Carton Bulk (Bags) 8 1000 4000 20000 40000 7000 7 1000 4000 20000 40000 12000 6 2000 8000 40000 80000 20000 5 2500 12500 62500 125000 30000 4 3000 15000 75000 150000 50000 3 (12) 2000 10000 50000 100000 100000 3 (09) 4000 20000 100000 200000 150000 2 4000 20000 100000 200000 200000 1 10000 50000 250000 500000 300000 10-4. Tearing Off Force F 165 to 180 Top cover tape The force for tearing off cover tape is 15 to 60 grams in the arrow direction under the following conditions. Room Temp. (C) 5~35 Room Humidity (%) 45~85 Room atm (hPa) 860~1060 Tearing Speed (mm/min) 300 Base tape Application Notice 1. Storage Conditions : To maintain the solderabililty of terminal electrodes : a) Temperature and humidity conditions : -10 ~ 40C and 30 ~ 70% RH. b) Recommended products should be used within 6 months from the time of delivery. c) The packaging material should be kept where no chlorine or sulfur exists in the air. 2. Transportation : a) Products should be handled with care to avoid damage or contamination from perspiration and skin oils. b) The use of tweezers or vacuum pick up is strongly recommended for individual components. c) Bulk handling should ensure that abrasion and mechanical shock are minimized. NOTE : Specifications subject to change without notice. Please check our website for latest information. 03.07.2008 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 9 |
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