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STFV3N150 , STFW3N150 STP3N150, STW3N150 N-channel 1500 V, 6 2.5 A, PowerMESHTM Power MOSFET , TO-220, TO-220FH, TO-247, TO-3PF Features Type STFV3N150 STFW3N150(1) STP3N150 STW3N150 VDSS 1500 V 1500 V 1500 V 1500 V RDS(on) max <9 <9 <9 <9 ID Pw 3 1 2 2.5 A 30 W 2.5 A 83 W 2.5 A 140 W 2.5 A 140 W 1 2 3 TO-220 TO-220FH 1. All data which refers solely to the TO-3PF package is preliminary 100% avalanche tested Intrinsic capacitances and Qg minimized High speed switching Fully isolated TO-3PF and TO-220FH plastic packages Creepage distance path is 5.4 mm (typ.) for TO-3PF Creepage distance path is > 4 mm for TO-220FH Figure 1. 1 2 3 3 1 2 TO-247 TO-3PF Internal schematic diagram Application Switching applications Description Using the well consolidated high voltage MESH OVERLAYTM process, STMicroelectronics has designed an advanced family of very high voltage Power MOSFETs with outstanding performances. The strengthened layout coupled with the company's proprietary edge termination structure, gives the lowest RDS(on) per area, unrivalled gate charge and switching characteristics. Table 1. Device summary Order codes STFV3N150 STFW3N150 STP3N150 STW3N150 February 2009 Marking 3N150 3N150 3N150 3N150 Rev 6 Package TO-220FH TO-3PF TO-220 TO-247 Packaging Tube Tube Tube Tube 1/16 www.st.com 16 Contents STFV3N150, STFW3N150, STP3N150, STW3N150 Contents 1 2 Electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 2.1 Electrical characteristics (curves) ............................ 6 3 4 5 Test circuits .............................................. 9 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 2/16 STFV3N150, STFW3N150, STP3N150, STW3N150 Electrical ratings 1 Electrical ratings Table 2. Symbol VDS VGS ID ID IDM (2) Absolute maximum ratings Value Parameter TO-220,TO-247 TO-220FH TO-3PF Drain-source voltage (VGS = 0) Gate-source voltage Drain current (continuous) at TC = 25 C Drain current (continuous) at TC = 100 C Drain current (pulsed) Total dissipation at TC = 25 C Insulation withstand voltage (RMS) from all three leads to external heat sink (t=1 s;TC=25 C) Derating factor 1.12 2.5 1.6 10 140 1500 30 2.5 (1) 1.6 10 (1) (1) Unit V V 2.5(1) 1.6 10 (1) (1) A A A W V W/C C C PTOT VISO 30 2500 0.24 -50 to 150 150 83 TBD 0.67 Tstg Tj Storage temperature Max. operating junction temperature 1. Limited by maximum temperature allowed 2. Pulse width limited by safe operating area Table 3. Symbol Rthj-case Rthj-amb Tj Thermal data Parameter Thermal resistance junction-case max Thermal resistance junction-ambient max Maximum lead temperature for soldering purpose 62.5 TO-220 TO-247 TO-220FH TO-3PF Unit 0.89 50 300 4.17 62.5 1.5 50 C/W C/W C/W Table 4. Symbol IAR EAS Avalanche characteristics Parameter Avalanche current, repetitive or not-repetitive (pulse width limited by Tj max) Single pulse avalanche energy (starting Tj = 25 C, ID = IAR, VDD = 50 V) Max value 2.5 450 Unit A mJ 3/16 Electrical characteristics STFV3N150, STFW3N150, STP3N150, STW3N150 2 Electrical characteristics (Tcase = 25 C unless otherwise specified) Table 5. Symbol V(BR)DSS IDSS IGSS VGS(th) RDS(on On /off states Parameter Drain-source breakdown voltage Test conditions ID = 1 mA, VGS = 0 Min. 1500 10 500 100 3 4 6 5 9 Typ. Max. Unit V A A nA V VDS = Max rating Zero gate voltage drain current (VGS = 0) VDS = Max rating, TC=125 C Gate-body leakage current (VDS = 0) VGS = 30 V Gate threshold voltage VDS = VGS, ID = 250 A Static drain-source on resistance VGS = 10 V, ID = 1.3 A Table 6. Symbol gfs (1) Ciss Coss Crss Dynamic Parameter Forward transconductance Input capacitance Output capacitance Reverse transfer capacitance Test conditions VDS = 30 V, ID = 1.3 A Min. Typ. 2.6 939 102 13.2 100 Max. Unit S pF pF pF pF VDS = 25 V, f = 1 MHz, VGS = 0 Coss eq. (2) Equivalent output capacitance Rg Qg Qgs Qgd Gate input resistance Total gate charge Gate-source charge Gate-drain charge VDS=0 to 1200 V, VGS = 0 f=1 MHz Gate DC Bias=0 Test signal level=20 mV open drain VDD = 1200 V, ID = 2.5 A, VGS = 10 V (see Figure 19) 4 29.3 4.6 17 nC nC nC 1. Pulsed: Pulse duration = 300 s, duty cycle 1.5% 2. Coss eq. is defined as a constant equivalent capacitance giving the same charging time as Coss when VDS increases from 0 to 80% VDSS 4/16 STFV3N150, STFW3N150, STP3N150, STW3N150 Electrical characteristics Table 7. Symbol td(on) tr td(off) tf Switching times Parameter Turn-on delay time Rise time Turn-off-delay time Fall time Test conditions VDD = 750 V, ID = 1.25 A, RG = 4.7 , VGS = 10 V (see Figure 18) Min. Typ. 24 47 45 61 Max Unit ns ns ns ns Table 8. Symbol ISD ISDM (1) VSD (2) trr Qrr IRRM trr Qrr IRRM Source drain diode Parameter Source-drain current Source-drain current (pulsed) Forward on voltage Reverse recovery time Reverse recovery charge Reverse recovery current Reverse recovery time Reverse recovery charge Reverse recovery current ISD = 2.5 A, VGS = 0 ISD = 2.5 A, di/dt = 100 A/s VDD= 60 V (see Figure 20) ISD = 2.5 A, di/dt = 100 A/s VDD= 60 V, Tj = 150 C (see Figure 20) 410 2.4 11.7 540 3.3 12.3 Test conditions Min. Typ. Max Unit 2.5 10 1.6 A A V ns C A ns C A 1. Pulse width limited by safe operating area 2. Pulsed: pulse duration = 300 s, duty cycle 1.5% 5/16 Electrical characteristics STFV3N150, STFW3N150, STP3N150, STW3N150 2.1 Figure 2. Electrical characteristics (curves) Safe operating area for TO-220 Figure 3. Thermal impedance for TO-220 Figure 4. Safe operating area for TO-220FH Figure 5. Thermal impedance for TO-220FH Figure 6. Safe operating area for TO-247 Figure 7. Thermal impedance for TO-247 6/16 STFV3N150, STFW3N150, STP3N150, STW3N150 Figure 8. Output characteristics Figure 9. Electrical characteristics Transfer characteristics Figure 10. Normalized BVDSS vs. temperature Figure 11. Static drain-source on resistance Figure 12. Gate charge vs. gate-source voltage Figure 13. Capacitance variations 7/16 Electrical characteristics Figure 14. Normalized gate threshold voltage vs. temperature STFV3N150, STFW3N150, STP3N150, STW3N150 Figure 15. Normalized on resistance vs. temperature Figure 16. Source-drain diode forward characteristics Figure 17. Maximum avalanche energy vs Tj 8/16 STFV3N150, STFW3N150, STP3N150, STW3N150 Test circuits 3 Test circuits Figure 19. Gate charge test circuit Figure 18. Switching times test circuit for resistive load Figure 20. Test circuit for inductive load Figure 21. Unclamped inductive load test switching and diode recovery times circuit Figure 22. Unclamped inductive waveform Figure 23. Switching time waveform 9/16 Package mechanical data STFV3N150, STFW3N150, STP3N150, STW3N150 4 Package mechanical data In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK(R) packages, depending on their level of environmental compliance. ECOPACK(R) specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. 10/16 STFV3N150, STFW3N150, STP3N150, STW3N150 Package mechanical data TO-220 mechanical data mm Dim Min A b b1 c D D1 E e e1 F H1 J1 L L1 L20 L30 P Q 4.40 0.61 1.14 0.48 15.25 1.27 10 2.40 4.95 1.23 6.20 2.40 13 3.50 16.40 28.90 3.75 2.65 3.85 2.95 0.147 0.104 10.40 2.70 5.15 1.32 6.60 2.72 14 3.93 0.393 0.094 0.194 0.048 0.244 0.094 0.511 0.137 Typ Max 4.60 0.88 1.70 0.70 15.75 Min 0.173 0.024 0.044 0.019 0.6 inch Typ Max 0.181 0.034 0.066 0.027 0.62 0.050 0.409 0.106 0.202 0.051 0.256 0.107 0.551 0.154 0.645 1.137 0.151 0.116 11/16 Package mechanical data STFV3N150, STFW3N150, STP3N150, STW3N150 TO-247 Mechanical data mm. Min. 4.85 2.20 1.0 2.0 3.0 0.40 19.85 15.45 5.45 14.20 3.70 18.50 3.55 4.50 5.50 3.65 5.50 14.80 4.30 Typ Max. 5.15 2.60 1.40 2.40 3.40 0.80 20.15 15.75 Dim. A A1 b b1 b2 c D E e L L1 L2 oP oR S 12/16 STFV3N150, STFW3N150, STP3N150, STW3N150 Package mechanical data TO-220FH (Fully plastic High voltage) MECHANICAL DATA DIM. MIN. A B D E F F1 F2 G G1 H L2 L3 L4 L5 L6 L7 L8 L9 15.9 9 14.5 2.4 28.6 9.8 3.4 16.4 9.3 15 0.626 0.354 0.570 0.094 4.4 2.5 2.5 0.45 0.75 1.3 1.3 4.95 2.4 10 16 30.6 10.6 1.126 0.385 0.134 0.645 0.366 0.590 mm TYP. MAX. 4.6 2.7 2.75 0.7 1 1.8 1.8 5.2 2.7 10.4 MIN. 0.173 0.098 0.098 0.017 0.030 0.051 0.051 0.195 0.094 0.393 0.630 1.204 0.417 inch TYP. MAX. 0.181 0.106 0.108 0.027 0.039 0.070 0.070 0.204 0.106 0.409 P011W 13/16 Package mechanical data STFV3N150, STFW3N150, STP3N150, STW3N150 TO-3PF mechanical data DIM. A C D D1 E F F2 G G1 H L L2 L3 L4 L5 L6 L7 N R Dia mm. typ min. 5.30 2.80 3.10 1.80 0.80 0.65 1.80 10.30 15.30 9.80 22.80 26.30 43.20 4.30 24.30 14.60 1.80 3.80 3.40 max. 5.70 3.20 3.50 2.20 1.10 0.95 2.20 11.50 15.70 10.20 23.20 26.70 44.40 4.70 24.70 15 2.20 4.20 3.80 5.45 10 7627132_C 14/16 STFV3N150, STFW3N150, STP3N150, STW3N150 Revision history 5 Revision history Table 9. Date 12-Jan-2007 17-Apr-2007 14-May-2007 29-Aug-2007 09-Apr-2008 13-Feb-2009 Document revision history Revision 1 2 3 4 5 6 First release Added new value on Table 6. The document has been reformatted RDS(on) value changed, updated Figure 15 Added new package: TO-3PF Added PTOT value for TO-3PF (Table 2: Absolute maximum ratings) Changes 15/16 STFV3N150, STFW3N150, STP3N150, STW3N150 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries ("ST") reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST's terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST'S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER'S OWN RISK. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. (c) 2009 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 16/16 |
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