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| High Temperature Thick Film Chip Resistors HTC Series * * * * * Operation to 200C Excellent high temperature stability Improved working voltage ratings Pb-free wrap-around terminations Standard chip sizes available from 1206 to 2512 Electrical Data Characteristic Resistance Range 150C Power Rating Max Voltage Rating Absolute TCR Operating Temperature Pad/Trace Area1 Termination 80mm2 200mW 200V 1206 2010 1W to 10MW; 1%, 5% 10W to 1MW; 0.5%, 5%, 1% 500mW 400V 100ppm/C -55C to +200C 200mm2 Wrap-around Pb-free with leach resistant Ni barrier 300mm2 750mW 500V 2512 Note1 : Recommended minimum pad and adjacent trace area for each termination for rated power on FR4 PCB. Environmental Data Test Load Life High Temperature Exposure Short Time Overload Moisture Resistance Thermal Shock Resistance to Soldering Heat Solderability Note2 : 0.01W added for all resistance values <10W. General Note Method MIL-STD-202 Method 108 (Rated Power for 1000hrs @ 150C) 1000 hours @ 200C MIL-PRF-55342H (6.25X rated power for 5secs) MIL-STD-202 Method 106G MIL-STD-202 Method 107G Condition B MIL-STD-202 Method 210F MIL-STD-202 Method 208 (245C, 5 seconds) Specification Maximum2 1.00% 1.00% 1.00% 1.00% 0.25% 0.25% Typical 0.25% 0.20% 0.10% 0.25% 0.05% 0.05% >95% Coverage IRC reserves the right to make changes in product specification without notice or liability. All information is subject to IRC's own data and is considered accurate at time of going to print. Advanced Film Division * 4222 South Staples Street * Corpus Christi Texas 78411 USA Telephone: 361 992 7900 * Facsimile: 361 992 3377 * Website: www.irctt.com A subsidiary of TTelectronics plc HTC Series Issue May 2009 Pulse Withstanding Chip Resistors Physical Data L A C Overglaze (Stability Enhancer) Protective Overcoat Sn Plating Ni Barrier Layer W High Reliability Resistance Element B Alumina Substrate Conductor T Part Type 1206 2010 2512 L (mm) 3.20.4 5.10.3 6.50.3 W (mm) 1.60.2 2.50.2 3.20.2 T max (mm) 0.7 0.8 0.8 A (mm) 0.40.15 0.60.25 0.60.25 B min (mm) 0.40.2 0.60.3 0.60.3 C (mm) 1.7 3.0 4.4 Weight (grams) 0.020 0.036 0.055 Construction: Thick film resistor material, overglaze and organic protection are screen printed on a 96% alumina substrate. Wrap-around terminations have an electroplated Ni barrier and pure Sn matte finish, ensuring excellent leach resistance properties and solderability. Marking: Components are not marked. Reels are marked with type, value, tolerance, date code and quantity. Solvent resistance: The body protection is resistant to all normal industrial cleaning solvents suitable for printed circuits. Power Derating Data 100 Ordering Data Prefix TKC - HTC - 2512LF - 100R - F Chip Type HTC (High Temperature Chip) % Of Rated P ower Chip Size and Termination 50 1206LF = 100% Tin (pb-free) termination 2010LF = 100% Tin (pb-free) termination 2512LF = 100% Tin (pb-free) termination Resistance Value (4 Digit Code) Ex. 1R00 = 1W; 100R = 100W; 10K0 =10KW; 1M50 = 1.5MW 10 Tolerance Code 150 200 J = 5%; F = 1%; D = 0.5% For additional information or to discuss your specific requirements, please contact our Applications Team using the contact details below. Temperature in C Advanced Film Division * 4222 South Staples Street * Corpus Christi Texas 78411 USA Telephone: 361 992 7900 * Facsimile: 361 992 3377 * Website: www.irctt.com HTC Series Issue May 2009 |
Price & Availability of TKC-HTC-1206LF-100R-D
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