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| BCR2PM-12RE Triac Low Power Use REJ03G1468-0100 Rev.1.00 Jul 31, 2006 Features * IT (RMS) : 2 A * VDRM : 600 V * IRGTI, IRGT : 10 mA * Insulated Type * Planar Passivation Type * The product guaranteed maximum junction temperature 150C. Outline RENESAS Package code: PRSS0003AA-B (Package name: TO-220F(2) ) 2 1. T1 Terminal 2. T2 Terminal 3. Gate Terminal 3 1 1 2 3 Applications Electric rice cooker, electric pot, and controller for other heater Precautions on Usage When the BCR2PM-12RE is used, do not attach the heat radiating fin. Maximum Ratings Parameter Repetitive peak off-state voltageNote1 Non-repetitive peak off-state voltageNote1 Symbol VDRM VDSM Voltage class 12 600 720 Unit V V Rev.1.00 Jul 31, 2006 page 1 of 6 BCR2PM-12RE Parameter RMS on-state current Surge on-state current I2t for fusing Peak gate power dissipation Average gate power dissipation Peak gate voltage Peak gate current Junction temperature Storage temperature Mass Notes: 1. Gate open. Symbol IT (RMS) ITSM I2 t PGM PG (AV) VGM IGM Tj Tstg -- Ratings 2 10 0.41 1 0.1 6 1 - 40 to +150 - 40 to +150 2.0 Unit A A A2s W W V A C C g Conditions Commercial frequency, sine full wave 360 conduction 60Hz sinewave 1 full cycle, peak value, non-repetitive Value corresponding to 1 cycle of half wave 60Hz, surge on-state current Typical value Electrical Characteristics Parameter Repetitive peak off-state current On-state voltage Gate trigger voltageNote2 Gate trigger currentNote2 Gate non-trigger voltage Thermal resistance Symbol IDRM VTM VRGT VRGT IRGT IRGT VGD Rth (j-a) Min. -- -- -- -- -- -- 0.1 -- Typ. -- -- -- -- -- -- -- -- Max. 1.0 1.6 2.0 2.0 10 10 -- 45 Unit mA V V V mA mA V C/W Test conditions Tj = 150C, VDRM applied Tj = 25C, ITM = 1.5 A, Instantaneous measurement Tj = 25C, VD = 6 V, RL = 6 , RG = 330 Tj = 25C, VD = 6 V, RL = 6 , RG = 330 Tj = 150C, VD = 1/2 VDRM Junction to ambient, Natural convection Notes: 2. Measurement using the gate trigger characteristics measurement circuit. Rev.1.00 Jul 31, 2006 page 2 of 6 BCR2PM-12RE Performance Curves Maximum On-State Characteristics 102 7 Tj = 25C 5 3 2 101 7 5 3 2 100 7 5 3 2 10-1 0.6 1.0 1.4 1.8 2.2 2.6 3.0 3.4 3.8 10 Rated Surge On-State Current Surge On-State Current (A) 9 8 7 6 5 4 3 2 1 0 100 23 5 7 101 23 5 7 102 On-State Current (A) On-State Voltage (V) Conduction Time (Cycles at 60 Hz) Gate Trigger Current (Tj = tC) x 100 (%) Gate Trigger Current (Tj = 25C) Gate Characteristics (II and III) 3 2 Gate Trigger Current vs. Junction Temperature 103 7 5 3 2 IRGT I, IRGT III 102 7 5 3 2 101 -60 -40-20 0 20 40 60 80 100120 140160 Typical Example Gate Voltage (V) 101 7 5 3 2 100 7 5 3 2 PGM = 1 W VGM = 6 V VGT PG(AV) = 0.1 W IGM = 1 A IRGT I, IRGT III 10-1 7 VGD = 0.1 V 5 0 2 3 5 7101 2 3 5 7 102 2 3 5 7 103 10 Gate Current (mA) Junction Temperature (C) Gate Trigger Voltage (Tj = tC) x 100 (%) Gate Trigger Voltage (Tj = 25C) Gate Trigger Voltage vs. Junction Temperature Transient Thermal Impedance (C/W) 103 7 5 3 2 102 7 5 3 2 Typical Example Maximum Transient Thermal Impedance Characteristics (Junction to ambient) 103 7 5 3 2 102 7 5 3 2 101 7 5 3 2 100 7 5 3 2 10-1 VRGT I VRGT III ( 101 -60 -40-20 0 20 40 60 80 100120 140 160 Natural Convection No Fins Print Board t = 1.6 mm Solder Land : 2 mm ) 101 2 3 5 7102 2 3 5 7 103 2 3 5 7104 2 3 5 7 105 Junction Temperature (C) Conduction Time (Cycles at 60 Hz) Rev.1.00 Jul 31, 2006 page 3 of 6 BCR2PM-12RE Allowable Ambient Temperature vs. RMS On-State Current 160 Natural Convection No Fins Print Board t = 1.6 mm Solder Land : 2 mm Maximum On-State Power Dissipation 1.8 On-State Power Dissipation (W) 1.4 Ambient Temperature (C) 1.6 360 Conduction 1.2 Resistive, inductive loads 1.0 0.8 0.6 0.4 0.2 0 0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 140 120 100 80 60 40 20 0 0 ( ) Curves apply regardless of conduction angle Resistive, inductive loads 0.4 0.8 1.2 1.6 2.0 2.4 2.8 3.2 RMS On-State Current (A) RMS On-State Current (A) Repetitive Peak Off-State Current (Tj = tC) x 100 (%) Repetitive Peak Off-State Current (Tj = 25C) Repetitive Peak Off-State Current vs. Junction Temperature Holding Current vs. Junction Temperature Holding Current (Tj = tC) x 100 (%) Holding Current (Tj = 25C) 106 7 5 3 2 105 7 5 3 2 104 7 5 3 2 103 7 5 3 2 102 Typical Example 103 7 5 4 3 2 102 7 5 4 3 2 Typical Example -60 -40 -20 0 20 40 60 80 100 120 140 160 101 -60 -40 -20 0 20 40 60 80 100 120140 160 Junction Temperature (C) Junction Temperature (C) Latching Current vs. Junction Temperature Breakover Voltage vs. Junction Temperature Breakover Voltage (Tj = tC) x 100 (%) Breakover Voltage (Tj = 25C) Latching Current (mA) 10 7 5 3 2 10 7 5 3 2 100 7 5 3 2 10-1 -40 1 2 160 Typical Example 140 120 100 80 60 40 20 0 -60 -40-20 0 20 40 60 80 100120 140 160 Distribution T2+, G- Typical Example T2-, G- Typical Example 0 40 80 120 160 Junction Temperature (C) Junction Temperature (C) Rev.1.00 Jul 31, 2006 page 4 of 6 BCR2PM-12RE Breakover Voltage vs. Rate of Rise of Off-State Voltage (Tj = 125C) 160 140 120 100 80 60 40 20 0 100 2 3 5 7101 2 3 5 7102 2 3 5 7 103 III Quadrant I Quadrant Typical Example Tj = 125C Breakover Voltage (dv/dt = xV/s) x 100 (%) Breakover Voltage (dv/dt = 1V/s) Breakover Voltage (dv/dt = xV/s) x 100 (%) Breakover Voltage (dv/dt = 1V/s) Breakover Voltage vs. Rate of Rise of Off-State Voltage (Tj = 150C) 160 140 120 100 80 60 40 20 0 100 2 3 5 7101 2 3 5 7102 2 3 5 7103 III Quadrant I Quadrant Typical Example Tj = 150C Rate of Rise of Off-State Voltage (V/s) Rate of Rise of Off-State Voltage (V/s) Gate Trigger Current vs. Gate Current Pulse Width Gate Trigger Current (tw) x 100 (%) Gate Trigger Current (DC) 10 7 5 3 2 102 7 5 3 2 101 100 IRGT III 3 Gate Trigger Characteristics Test Circuits 6 6 Typical Example IRGT I 6V V A 330 6V V A 330 Test Procedure II Test Procedure III 23 5 7 101 23 5 7 102 Gate Current Pulse Width (s) Rev.1.00 Jul 31, 2006 page 5 of 6 BCR2PM-12RE Package Dimensions Package Name TO-220F(2) JEITA Package Code SC-67 RENESAS Code PRSS0003AA-B Previous Code MASS[Typ.] 2.0g Unit: mm 10.5Max 5.2 2.8 5.0 1.2 17 3.2 0.2 13.5Min 3.6 1.3Max 0.8 2.54 2.54 8.5 0.5 2.6 Order Code Lead form Standard packing Quantity Standard order code Standard order code example BCR2PM-12RE BCR2PM-12RE-A8 Straight type Vinyl sack 100 Type name Lead form Plastic Magazine (Tube) 50 Type name - Lead forming code Note : Please confirm the specification about the shipping in detail. Rev.1.00 Jul 31, 2006 page 6 of 6 4.5 Sales Strategic Planning Div. Keep safety first in your circuit designs! Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan 1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage. Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or mishap. Notes regarding these materials 1. These materials are intended as a reference to assist our customers in the selection of the Renesas Technology Corp. product best suited to the customer's application; they do not convey any license under any intellectual property rights, or any other rights, belonging to Renesas Technology Corp. or a third party. 2. Renesas Technology Corp. assumes no responsibility for any damage, or infringement of any third-party's rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or circuit application examples contained in these materials. 3. All information contained in these materials, including product data, diagrams, charts, programs and algorithms represents information on products at the time of publication of these materials, and are subject to change by Renesas Technology Corp. without notice due to product improvements or other reasons. It is therefore recommended that customers contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor for the latest product information before purchasing a product listed herein. The information described here may contain technical inaccuracies or typographical errors. Renesas Technology Corp. assumes no responsibility for any damage, liability, or other loss rising from these inaccuracies or errors. Please also pay attention to information published by Renesas Technology Corp. by various means, including the Renesas Technology Corp. Semiconductor home page (http://www.renesas.com). 4. When using any or all of the information contained in these materials, including product data, diagrams, charts, programs, and algorithms, please be sure to evaluate all information as a total system before making a final decision on the applicability of the information and products. Renesas Technology Corp. assumes no responsibility for any damage, liability or other loss resulting from the information contained herein. 5. Renesas Technology Corp. semiconductors are not designed or manufactured for use in a device or system that is used under circumstances in which human life is potentially at stake. Please contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor when considering the use of a product contained herein for any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater use. 6. The prior written approval of Renesas Technology Corp. is necessary to reprint or reproduce in whole or in part these materials. 7. If these products or technologies are subject to the Japanese export control restrictions, they must be exported under a license from the Japanese government and cannot be imported into a country other than the approved destination. Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the country of destination is prohibited. 8. Please contact Renesas Technology Corp. for further details on these materials or the products contained therein. RENESAS SALES OFFICES Refer to "http://www.renesas.com/en/network" for the latest and detailed information. Renesas Technology America, Inc. 450 Holger Way, San Jose, CA 95134-1368, U.S.A Tel: <1> (408) 382-7500, Fax: <1> (408) 382-7501 Renesas Technology Europe Limited Dukes Meadow, Millboard Road, Bourne End, Buckinghamshire, SL8 5FH, U.K. Tel: <44> (1628) 585-100, Fax: <44> (1628) 585-900 Renesas Technology (Shanghai) Co., Ltd. Unit 204, 205, AZIACenter, No.1233 Lujiazui Ring Rd, Pudong District, Shanghai, China 200120 Tel: <86> (21) 5877-1818, Fax: <86> (21) 6887-7898 Renesas Technology Hong Kong Ltd. 7th Floor, North Tower, World Finance Centre, Harbour City, 1 Canton Road, Tsimshatsui, Kowloon, Hong Kong Tel: <852> 2265-6688, Fax: <852> 2730-6071 Renesas Technology Taiwan Co., Ltd. 10th Floor, No.99, Fushing North Road, Taipei, Taiwan Tel: <886> (2) 2715-2888, Fax: <886> (2) 2713-2999 Renesas Technology Singapore Pte. Ltd. 1 Harbour Front Avenue, #06-10, Keppel Bay Tower, Singapore 098632 Tel: <65> 6213-0200, Fax: <65> 6278-8001 Renesas Technology Korea Co., Ltd. Kukje Center Bldg. 18th Fl., 191, 2-ka, Hangang-ro, Yongsan-ku, Seoul 140-702, Korea Tel: <82> (2) 796-3115, Fax: <82> (2) 796-2145 http://www.renesas.com Renesas Technology Malaysia Sdn. Bhd Unit 906, Block B, Menara Amcorp, Amcorp Trade Centre, No.18, Jalan Persiaran Barat, 46050 Petaling Jaya, Selangor Darul Ehsan, Malaysia Tel: <603> 7955-9390, Fax: <603> 7955-9510 (c) 2006. Renesas Technology Corp., All rights reserved. Printed in Ja an. p Colophon .6.0 |
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