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| EMIF02-MIC03M6 2-line IPADTM, EMI filter and ESD protection for microphone Features Pin 1 EMI symmetrical (I/O) low-pass filter High efficiency in EMI filtering Very low PCB space consumption: 1.0 mm x 1.45 mm Very thin package: 0.6 mm max High efficiency in ESD suppression High reliability offered by monolithic integration High reduction of parasitic elements through integration and wafer level packaging. Lead-free and halogen-free package Micro QFN 6 leads 1.45 mm x 1.00 mm (bottom view) Figure 1. Pin configuration (top view) Complies with following standards IEC 61000-4-2 level 4, input and output pins - 8 kV (contact discharge) MICR in 1 6 MICR out Application GND MICL in 2 5 GND MICL out Mobile phones 3 4 Description The EMIF02-MIC03M6 is a 2-line highly integrated device designed to suppress EMI/RFI noise in all systems exposed to electromagnetic interference. This filter includes ESD protection circuitry, which prevents damage to the application when subjected to ESD surges up to 8 kV on all pins. Figure 2. Basic cell configuration Low-pass filter Input Output GND GND GND R = 68 , Cline = 45 pF typ. TM: IPAD is a trademark of STMicroelectronics February 2008 Rev 1 1/10 www.st.com Characteristics EMIF02-MIC03M6 1 Table 1. Symbol VPP Tj Top Tstg Characteristics Absolute ratings (limiting values at Tamb = 25 C unless otherwise specified) Parameter ESD discharge IEC61000-4-2 contact discharge Junction temperature Operating temperature range Storage temperature range Value 8 125 -40 to + 85 -55 to +150 Unit kV C C C Table 2. Symbol VBR IRM VRM VCL Rd IPP RI/O Cline Symbol VBR IRM RI/O Cline (1) Electrical characteristics (Tamb = 25 C) Parameter I Breakdown voltage Leakage current @ VRM Stand-off voltage Clamping voltage Dynamic resistance Peak pulse current Series resistance between Input & Output Input capacitance per line Test conditions IR = 1 mA VRM = 3 V per line Tolerance 20% VR = 0 V, F = 1 MHz, VOSC = 30 mV 68 45 Min. 6 Typ. 8 VCL VBR VRM IPP IR IRM IRM IR VRM VBR VCL V IPP Max. Unit V 500 nA pF 1. Tolerance 20% Figure 3. dB S21 attenuation measurement Figure 4. dB Analog cross talk measurements (MIC R / MIC L) 0.00 -5.00 -10.00 -15.00 -20.00 -25.00 -30.00 -35.00 -40.00 0.00 -10.00 -20.00 -30.00 -40.00 -50.00 -60.00 F (Hz) 300.0k 1.0M 3.0M 10.0M 30.0M 100.0M 300.0M 1.0G 3.0G -70.00 -80.00 300.0k F (Hz) 1.0M 3.0M Xtalk R- L 10.0M 30.0M 100.0M 300.0M 1.0G Xtalk L-R 3.0G 2/10 EMIF02-MIC03M6 Ordering information scheme Figure 5. ESD response to IEC 61000-4-2 (+8 kV air discharge) on MIC lines Figure 6. ESD response to IEC 61000-4-2 (-8 kV air discharge) on MIC lines vi = 20 V/d vi = 20 V/d Input Input vo = 10 V/d vo = 10 V/d Output Output 20 ns/d 20 ns/d 2 Ordering information scheme Figure 7. Ordering information scheme EMIF EMI Filter Number of lines Information xxx = application zz = version Package Mx = Micro QFN x leads yy - xxx zz Mx 3/10 Package information EMIF02-MIC03M6 3 Package information Epoxy meets UL94, V0 In order to meet environmental requirements, ST offers these devices in ECOPACK(R) packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at www.st.com. Table 3. Micro QFN 1.45 x 1.00 6L dimensions D N Dimensions Ref. E Millimeters Min. Typ. 0.55 0.02 0.25 1.45 1.00 0.50 0.20 0.30 0.35 0.40 0.008 Max. 0.60 0.05 0.30 Min. Inches Typ. Max. 1 2 A A1 0.50 0.00 0.18 0.020 0.022 0.024 0.000 0.001 0.002 0.007 0.010 0.012 0.057 0.039 0.020 A A1 1 2 b D L k b e E e K L 0.012 0.014 0.016 Figure 8. Footprint in mm [inches] 0.50 [0.020] 0.25 [0.010] Figure 9. Marking Dot : Pi n 1 Identification 0.60 [0.023] 0.30 1.60 [0.012] [0.063] L 4/10 EMIF02-MIC03M6 Figure 10. Tape and reel specification Dot identifying pin 1 location 2.0+/-0.05 4.00+/-0.1 1.5 +/- 0.1 Package information 1.75 +/- 0.1 3.5 +/- 0.03 0.75 All dimensions in mm 8.0 +/- 0.3 1.65 L L L 1.20 User direction of unreeling 4.00 Note: Product marking may be rotated by 90 for assembly plant differentiation. In no case should this product marking be used to orient the component for its placement on a PCB. Only pin 1 mark is to be used for this purpose. 5/10 Recommendation on PCB assembly EMIF02-MIC03M6 4 4.1 Recommendation on PCB assembly Stencil opening design 1. General recommendation on stencil opening design a) Stencil opening dimensions: L (Length), W (Width), T (Thickness). Figure 11. Stencil opening dimensions L T W b) General design rule Stencil thickness (T) = 75 ~ 125 m W Aspect Ratio = ---- 1.5 T Lx W Aspect Area = --------------------------- 0.66 2T ( L + W ) 2. Reference design a) b) Stencil opening thickness: 100 m Stencil opening for leads: Opening to footprint ratio is 90%. Figure 12. Recommended stencil window position 7 m 7 m 15 m 650 m 620 m 236 m 15 m 250 m Footprint Stencil window Footprint 6/10 EMIF02-MIC03M6 Recommendation on PCB assembly 4.2 Solder paste 1. 2. 3. 4. Halide-free flux qualification ROL0 according to ANSI/J-STD-004. "No clean" solder paste is recommended. Offers a high tack force to resist component movement during high speed. Solder paste with fine particles: powder particle size is 20-45 m. 4.3 Placement 1. 2. 3. 4. Manual positioning is not recommended. It is recommended to use the lead recognition capabilities of the placement system, not the outline centering. Standard tolerance of 0.05 mm is recommended. 3.5 N placement force is recommended. Too much placement force can lead to squeezed out solder paste and cause solder joints to short. Too low placement force can lead to insufficient contact between package and solder paste that could cause open solder joints or badly centered packages. To improve the package placement accuracy, a bottom side optical control should be performed with a high resolution tool. For assembly, a perfect supporting of the PCB (all the more on flexible PCB) is recommended during solder paste printing, pick and place and reflow soldering by using optimized tools. 5. 6. 4.4 PCB design preference 1. 2. To control the solder paste amount, the closed via is recommended instead of open vias. The position of tracks and open vias in the solder area should be well balanced. The symmetrical layout is recommended, in case any tilt phenomena caused by asymmetrical solder paste amount due to the solder flow away. 7/10 Recommendation on PCB assembly EMIF02-MIC03M6 4.5 Reflow profile Figure 13. ST ECOPACK(R) recommended soldering reflow profile for PCB mounting Temperature (C) 260C max 255C 220C 180C 125 C 2C/s recommended 2C/s recommended 6C/s max 6C/s max 3C/s max 3C/s max 0 0 1 2 3 4 5 10-30 sec 90 to 150 sec 90 sec max 6 7 Time (min) Note: Minimize air convection currents in the reflow oven to avoid component movement. 8/10 EMIF02-MIC03M6 Ordering information 5 Ordering information Table 4. Ordering information Marking L(1) Package Micro QFN Weight 2.2 mg Base qty 3000 Delivery mode Tape and reel (7") Order code EMIF02-MIC03M6 1. The marking can be rotated by 90 to differentiate assembly location 6 Revision history Table 5. Date 13-Feb-2008 Document revision history Revision 1 Initial release Changes 9/10 EMIF02-MIC03M6 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries ("ST") reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST's terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST'S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER'S OWN RISK. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. (c) 2008 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 10/10 |
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