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| DATA SHEET 1310NM FP LASER FOR 10GBASE-LRM SC AND LC TOSA FP-1310-10LRM-X FEATURES: 1310nm FP laser Very low power dissipation SC and LC optical receptacles 10Gbps direct modulation Impedance matching inside the laser package Differential electrical interface Compatible with all 10GBE MSAs (XFP, X2, XPAK, XENPAK) The HFE6x62-561 is specifically designed for applications based on the IEEE 10GBASE-LRM optical standard. The TOSA is designed to meet the fiber launch conditions specified for the multimode and single mode optical fiber options. Excellent optical performance is achieved by matching the electrical characteristics of the TOSA and laser to the external circuitry. Separate, differential laser bias and modulation pins significantly reduce the amount of electrical power required at the module level, and help to reduce the overall electro-magnetic emissions. The TOSA is designed to be paired with the linear ROSA HFD6x40417 available at www.finisar.com/aoc.php. Part Number FP-1310-10LRM-SCA FP-1310-10LRM-LCA Description 1310nm SC TOSA with FP laser 1310nm LC TOSA with FP laser FP-1310-10LRM-X 1310NM FP LASER FOR 10GBASE-LRM ABSOLUTE MAXIMUM RATINGS Parameter Storage temperature Case Operating temperature Lead solder temperature Continuous Optical Power Laser Diode Reverse Voltage Laser Diode Continuous Forward Current Monitor Photodiode Reverse Current Monitor Photodiode Reverse Voltage Rating -40oC to +90oC -5 to +85oC 260oC, 10 seconds 20 mW 2V 130 mA 2 mA 10V NOTICE: Stresses greater than those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operations section for extended periods of time may affect reliability. NOTICE: The inherent design of this component causes it to be sensitive to electrostatic discharge (ESD). To prevent ESD-induced damage and/or degradation to equipment, take normal ESD precautions when handling this product. FP-1310-10LRM-X ELECTRICAL-OPTICAL CHARACTERISTICS TCASE = 25C, TRANGE, CASE = -5 to 80C, 10.3125 Gbps, PRBS 231-1 Parameter Threshold current Operating current Test Conditions T=25C T=TRANGE T=25C T=TRANGE Modulation current T=25C T=TRANGE Output Power Slope Efficiency Encircled Flux Extinction Ratio LA (wiggle) Wavelength T=25C T=TRANGE Spectral Width T=25C T=TRANGE Relative Intensity Noise Modulation Bandwidth I=IOP I=IOP, T=25C I=IOP, T=TRANGE Rise / Fall time Transmitter Wavelength Dispersion Penalty Forward Voltage Laser Resistance Monitor Current Tracking Error T=TRANGE, I=IOP T=TRANGE, I=IOP T=25C, I=IOP, VB=-2.5V T=TMAX T=TMIN Monitor Dark Current Monitor Diode Capacitance Optical Return Loss Tolerance Input Impedance (Diff ) Diff. Return Loss Case to Signal Isolation 0.1 S21,3dB A FP-1310-10LRM-X 1310NM FP LASER FOR 10GBASE-LRM NOTES 1. 1. Operating current is the average bias current required to meet the ER, rise/fall, and bandwidth specifications. The target operating condition is 35 mA over threshold at high temperature, 30mA over threshold at RT. Output power specification must be met into both singlemode fiber and 62/125 multi-mode fiber. Encircled flux is measured at the end of a 10m patchcord through a fiber shaker per IEC 61280-1-4. TOSA would be capable of meeting other specifications when modulated over this ER range. Maximum change in power as fiber is rotated by 360. See Figure 1 below for the present 10GBASE-LRM spectral width vs. wavelength specification, and TOSA requirement curve that is further restricted to 3 nm for margin, but is limited by the IEEE curve below 1275nm. 7. 8. Measured per IEEE 802.3ae specifications. Measured with an optical receiver with a 10.3125 Gb/s filter (4th order Bessel-Thomson filter with 3 dB bandwidth = 0.75*bitrate). TWDP is measured as defined in IEEE 802.3aq. 9. 2. 10. Laser slope resistance is measured between "Bias+" and "Bias-" pins. 11. Tracking error is defined as the coupled power difference at Tmax or Tmin (relative to 25 C) where the back monitor current, Imon, is held constant at the value found at 25 C at I=Iop. 3. 4. 5. 6. FP-1310-10LRM-X TYPICAL PERFORMANCE CHARACTERISTICS 20oC 80oC 10.7Gbps, SONET Mask PINOUT PIN 1 2 3 4 5 6 7 8 Function Laser BIAS + MPD Cathode Ground Laser MOD + Laser MOD Ground MPD Anode Laser BIAS - FP-1310-10LRM-X 1310NM FP LASER FOR 10GBASE-LRM INTERNAL CONFIGURATION PIN 1 2 3 4 5 6 Function Bias + MPD-C Mod + Mod MPD-A Bias - FLEX MOUNTING DIMENSIONS - DIMENSIONS IN INCHES FP-1310-10LRM-X HFE6362-562 SC MOUNTING DIMENSIONS - DIMENSIONS IN MM [INCHES] HFE6162-562 LC MOUNTING DIMENSIONS - DIMENSIONS IN MM [INCHES] FP-1310-10LRM-X 1310NM FP LASER FOR 10GBASE-LRM ADVANCED OPTICAL COMPONENTS Finisar's ADVANCED OPTICAL COMPONENTS division was formed through strategic acquisition of key optical component suppliers. The company has led the industry in high volume Vertical Cavity Surface Emitting Laser (VCSEL) and associated detector technology since 1996. VCSELs have become the primary laser source for optical data communication, and are rapidly expanding into a wide variety of sensor applications. VCSELs' superior reliability, low drive current, high coupled power, narrow and circularly symmetric beam and versatile packaging options (including arrays) are enabling solutions not possible with other optical technologies. ADVANCED OPTICAL COMPONENTS is also a key supplier of Fabrey-Perot (FP) and Distributed Feedback (DFB) Lasers, and Optical Isolators (OI) for use in single mode fiber data and telecommunications networks AOC CAPABILITIES ADVANCED OPTICAL COMPONENTS' advanced capabilities include: 1, 2, 4, 8, and 10Gbps serial VCSEL solutions 1, 2, 4, 8, and 10Gbps serial SW DETECTOR solutions VCSEL and detector arrays 1, 2, 4, 8, and 10Gbps FP and DFB solutions at 1310 and 1550nm 1, 2, 4, 8, and 10Gbps serial LW DETECTOR solutions Optical Isolators from 1260 to 1600nm range Laser packaging in TO46, TO56, and Optical subassemblies with SC, LC, and MU interfaces for communication networks VCSELs operating at 670nm, 780nm, 980nm, and 1310nm in development Sensor packages include surface mount, various plastics, chip on board, chipscale packages, etc. Custom packaging options LOCATION Allen, TX - Business unit headquarters, VCSEL wafer growth, wafer fabrication and TO package assembly. Fremont, CA - Wafer growth and fabrication of 1310 to 1550nm FP and DFB lasers. Shanghai, PRC - Optical passives assembly, including optical isolators and splitters. SALES AND SERVICE Finisar's ADVANCED OPTICAL COMPONENTS division serves its customers through a worldwide network of sales offices and distributors. For application assistance, current specifications, pricing or name of the nearest Authorized Distributor, contact a nearby sales office or call the number listed below. Phone:1-866-MY-VCSEL USA (toll free) 1-214-509-2700 USA (Direct dial) 44 (0) 174 336 5533 Europe 886-935-409898 China & Taiwan 81-90-4437-1130 Japan 82-11-220-6153 Asia Pacific & Korea Fax: 1-214-509-3709 USA Email: support@adopco.com WEB: www.finisar.com/aoc.php (c)2007 Finisar Corporation. All rights reserved. Finisar is a registered trademark of Finisar Corporation. Features and specifications are subject to change without notice. 05/08 Rev G. |
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