 |
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
| Datasheet File OCR Text: |
| HIGH CURRENT MOLDED POWER INDUCTORS L826 SERIES 1. PART NO. EXPRESSION : L826-1R0MF (a) (b) (c) (d) (a) Series code (b) Inductance code : 1R0 = 1.0uH (c) Tolerance code : M = 20% (d) F : Lead Free 2. CONFIGURATION & DIMENSIONS : NC 3.0 G 2.4 4.0 3.0 2.2 C E D 2.2 F 7.6 B NC NC SWORLD 1R5 2 1 2 A H PCB Pattern Unit:m/m A 10.30.3 B 10.00.3 C 5.00.2 D 6.50.5 F 2.00.3 G 2.50.3 H 1.50.3 3. SCHEMATIC : NC 1 2 4. MATERIALS : a b (a) Core (b) Wire (c) Terminal c 5. FEATURES : a) Shielded Construction b) Frequency up to 5MHz NOTE : Specifications subject to change without notice. Please check our website for latest information. 15.01.2008 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 1 HIGH CURRENT MOLDED POWER INDUCTORS L826 SERIES 6. GENERAL SPECIFICATION : a) Test Freq. : 100KHz/0.25VDC b) Ambient Temp. : 20C c) Operating Temp. : -55C to +125C d) Storage Temp. : -55C to +125C e) Heat Rated Current (Irms) : Will cause the coil temp. rise approximately T=40C without core loss. f) Saturation Current (Isat) : Will cause L 0 to drop approximately 20% typ. g) Part Temperature (Ambient+Temp. Rise) : Should not exceed 125C under worst case operating conditions. 7. ELECTRICAL CHARACTERISTICS : E ( mm ) 0.3 1.5 1.5 1.5 1.3 1.3 1.2 Inductance L 0 ( H ) 20% @ 0 Adc 0.56 1.20 1.50 2.20 3.30 4.70 Irms (A) Max. 23 18 17 14 12 10 Isat (A) Max. 30 20 18 16 14 12 DCR (m ) Max. 1.8 2.9 3.5 4.8 7.3 11 Part No. L826-R56MF L826-1R2MF L826-1R5MF L826-2R2MF L826-3R3MF L826-4R7MF NOTE : Specifications subject to change without notice. Please check our website for latest information. 15.01.2008 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 2 HIGH CURRENT MOLDED POWER INDUCTORS L826 SERIES 8. CHARACTERISTICS CURVES : L826-R56MF S MPI1005P3-R56 0.8 0.7 0.6 0.5 0.4 0.3 0.2 20 0.1 0 10 0 0.2 0 L826-1R2MF SMPI1005P3-1R2 100 90 80 1.6 1.4 1.2 1 0.8 0.6 0.4 20 10 0 60 50 40 30 100 90 80 INDUCTANCE (uH) INDUCTANCE (uH) 60 50 40 30 TEMP. RISE(oC) 0 5 10 15 20 25 30 0 2 4 6 8 10 12 14 16 18 20 DC CURRENT(A) DC CURRENT(A) L826-1R5MF SMPI1005P3-1R5 2 1.75 1.5 1.25 1 0.75 0.5 20 0.25 0 10 0 0 L826-2R2MF S MPI1005P3-2R2 100 90 80 2.4 3 100 90 80 INDUCTANCE (uH) INDUCTANCE (uH) TEM P. RISE(oC) 60 50 40 30 1.8 60 50 1.2 40 30 0.6 20 10 0 0 2 4 6 8 10 12 14 16 18 0 2 4 6 8 10 12 14 16 DC CURRENT(A) DC CURRENT(A) L826-3R3MF SMPI1005P3-3R3 4.2 3.6 1 00 90 80 L826-4R7MF S MPI1005P3-4R7 6.4 5.6 4.8 4 3.2 2.4 1.6 20 0.8 0 10 0 60 50 40 30 100 90 80 INDUCTANCE (uH) TEM P. RISE(oC) 2.4 1.8 1.2 0.6 0 60 50 40 30 20 10 0 0 2 4 6 8 10 12 14 0 2 4 6 8 10 12 DC CURRENT(A) DC CURRENT(A) NOTE : Specifications subject to change without notice. Please check our website for latest information. 15.01.2008 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 3 TEM P. RISE(oC) 3 70 INDUCTANCE (uH) 70 TEM P. RISE(oC) 70 70 TEM P. RISE(oC) 70 70 HIGH CURRENT MOLDED POWER INDUCTORS L826 SERIES 9. CORE LOSS : 100KHz and 500KHz 40000 material 30000 gauss loss 100 200 100KHz 500KHz 351.7 665.9 1,039 1,471 1,923 2,537 3,148 3,902 266 1,234 2,932 5,195 8,336 12,025 15,715 20,444 25,429 31,002 KW 3 3 K /mm W/ 20000 300 400 500KHZ 500 600 700 100KHZ 10000 800 800 1000 0 0 200 400 600 900 1000 gauss gauss 100KHz 4000 material 3000 gauss loss 300 400 500 600 100KHz K W/ /3 3 Km Wm 351.7 665.9 1,039 1,471 1,923 2,537 3,148 3,902 2000 1000 700 800 900 400 600 800 1000 0 200 gau ss gauss 1000 500KHz 40000 30000 K/ / KW 3m W m 3 20000 10000 0 0 200 400 g au ss gauss 600 800 1000 NOTE : Specifications subject to change without notice. Please check our website for latest information. 15.01.2008 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 4 HIGH CURRENT MOLDED POWER INDUCTORS L826 SERIES 10. RELIABILITY AND TEST CONDITION : ITEM Electrical Characteristics Test Inductance DCR Heat Rated Current (Irms) PERFORMANCE Refer to standard electrical characteristics list TEST CONDITION HP4284A, CH11025, CH3302, CH1320, CH1320S LCR meter. CH16502, Agilent33420A Micro-Ohm Meter. Irms(A) will cause the coil temperature rise approximately T=40C without core loss 1. Applied the allowed DC current 2. Temperature measured by digital surface thermometer Isat(A) will cause Lo to drop approximately 20% typical Saturation Current (Isat) Mechanical Performance Test Solderability Test More than 90% of the terminal electrode should be covered with solder. Preheat : 150C, 60sec. Solder : Sn99.95-Cu0.05 Solder Temperature : 2305C Flux for lead free : rosin Dip Time : 41sec. Preheating Dipping 230C Natural cooling 150C 60 seconds 41 seconds Solder Heat Resistance 1. Appearance : No significant abnormality 2. Inductance change : Within 20% Preheat : 150C, 60sec. Solder : Sn99.95-Cu0.05 Solder Temperature : 2605C Flux for lead free : rosin Dip Time : 100.5sec. Preheating 260C Dipping Natural cooling 150C 60 seconds 100.5 seconds Reliability Test High Temperature Life Test Low Temperature Life Test Thermal Shock Temperature : 1255C Time : 50012 hours Measure at room temperature after placing for 2 to 3 hrs. 1. Appearance : No damage 2. Inductance : Within 20% of initial value. No disconnection or short circuit. Temperature : -555C Time : 50012 hours Measure at room temperature after placing for 2 to 3 hrs. Conditions of 1 cycle. Step 1 2 3 4 Temperature (C) -553 Room Temperature +1253 Room Temperature Times (min.) 303 Within 3 303 Within 3 Total : 5 cycles Measure at room temperature after placing for 2 to 3 hrs. Humidity Resistance 1. Appearance : No damage 2. Inductance : Within 20% of initial value. No disconnection or short circuit. Temperature : 405C Humidity : 90% to 95% Applied Current : Rated Curent Time : 50012 hours Measure at room temperature after placing for 2 to 3 hrs. NOTE : Specifications subject to change without notice. Please check our website for latest information. 15.01.2008 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 5 HIGH CURRENT MOLDED POWER INDUCTORS L826 SERIES 11. SOLDERING AND MOUNTING : 11-1. Recommended PC Board Pattern 3.0 2.4 4.0 3.0 2.2 2.2 NC 11-2. Soldering Mildly activated rosin fluxes are preferred. The minimum amount of solder can lead to damage from the stresses caused by the difference in coefficients of expansion between solder, chip and substrate. Our terminations are suitable for all wave and re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot air soldering tools. 11-2.1 Solder Re-flow : Recommended temperature profiles for re-flow soldering in Figure 1. 11-2.2 Soldering Iron (Figure 2) : Products attachment with soldering iron is discouraged due to the inherent process control limitations. In the event that a soldering iron must be employed the following precautions are recommended. Note : a) Preheat circuit and products to 150C. b) 280C tip temperature (max) c) Never contact the ceramic with the iron tip d) 1.0mm tip diameter (max) e) Use a 20 watt soldering iron with tip diameter of 1.0mm f) Limit soldering time to 3 secs. Preheating TEMPERATURE C 250~260 230 180 150 60~120s Soldering 7.6 TEMPERATURE C 10s max. Natural cooling Preheating 280 260 150 Soldering Natural cooling 30~60s Over 1min. Gradual Cooling Within 3secs. Figure 1. Re-flow Soldering Figure 2. Iron Soldering NOTE : Specifications subject to change without notice. Please check our website for latest information. 15.01.2008 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 6 HIGH CURRENT MOLDED POWER INDUCTORS L826 SERIES 12. PACKAGING INFORMATION : 12-1. Reel Dimension COVER TAPE 2.00.5 D B OC A EMBOSSED CARRIER Type 13" x 24mm A(mm) 24.00.5 B(mm) 1002.0 C(mm) 13.50.5 D(mm) 330 12-2 Tape Dimension 1.750.1 4.00.1 2.00.1 O1.5+0.1 t F W 0.15 MIN P Ao Bo Ko Series L826 Ao(mm) 11.00.1 Bo(mm) 10.40.1 Ko(mm) 5.40.1 P(mm) 16.00.1 W(mm) 24.00.3 F(mm) 11.50.05 t(mm) 0.40.05 12-3. Packaging Quantity Size Chip / Reel Inner Box Carton L826 500 1000 4000 NOTE : Specifications subject to change without notice. Please check our website for latest information. 15.01.2008 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 7 HIGH CURRENT MOLDED POWER INDUCTORS L826 SERIES 12-4. Tearing Off Force F 165 to 180 The force for tearing off cover tape is 15 to 60 grams in the arrow direction under the following conditions. Room Temp. (C) 5~35 Room Humidity (%) 45~85 Room atm (hPa) 860~1060 Tearing Speed (mm/min) 300 Top cover tape Base tape Application Notice 1. Storage Conditions : To maintain the solderabililty of terminal electrodes : a) Temperature and humidity conditions : Less than 30C and 70% RH. b) Recommended products should be used within 6 months from the time of delivery. c) The packaging material should be kept where no chlorine or sulfur exists in the air. 2. Transportation : a) Products should be handled with care to avoid damage or contamination from perspiration and skin oils. b) The use of tweezers or vacuum pick up is strongly recommended for individual components. c) Bulk handling should ensure that abrasion and mechanical shock are minimized. NOTE : Specifications subject to change without notice. Please check our website for latest information. 15.01.2008 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 8 |
Price & Availability of L826-4R7MF
 |
|
|
|
|
All Rights Reserved © IC-ON-LINE 2003 - 2022 |
| [Add Bookmark] [Contact Us] [Link exchange] [Privacy policy] |
|
Mirror Sites : [www.datasheet.hk]
[www.maxim4u.com] [www.ic-on-line.cn]
[www.ic-on-line.com] [www.ic-on-line.net]
[www.alldatasheet.com.cn]
[www.gdcy.com]
[www.gdcy.net] |