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| MADS-001317-1320AG GaAs Solder Bump Flip Chip Schottky Diode Features * * * * * * Low Series Resistance, 4 Low Capacitance, 45 fF High Cutoff Frequency Silicon Nitride Passivation Polyimide Scratch Protection Solderable Bump Die Attach Mounting Side with Solder Bumps M/A-COM Products Rev. V2 Description M/A-COM's MADS-001317-1320AG is a Gallium Arsenide Flip-Chip Schottky diode with solder bumps. These devices are fabricated on OMCVD epitaxial wafers using a process designed for high device uniformity and extremely low parasitics. This device can be used up to 80 GHz. This diode is fully passivated with silicon nitride and has an additional layer of a polymer for scratch protection. The protective coatings prevent damage to the junction during handling and circuit attachment. Applications The high cutoff frequency of this device allows use through millimeter wave frequencies. Typical Applications include single and double balanced mixers in PCN transceivers, radios, police radar detectors and automotive radar detectors. Electrical Specifications TA = 25C Parameters and Test Conditions Junction Capacitance at 0V at 1 MHz Symbol Cj Units pF Min. -- Typ. 0.020 Max. -- Total Capacitance at 0V at 1 MHz1 Ct pF .030 0.045 0.060 Forward Voltage at 1mA Vf Volts .60 .70 .80 Dynamic Resistance at 9.5 - 10.5 mA Rd Ohms -- 4 7 Reverse Breakdown Voltage at 10 A Vb Volts 4.5 7 -- 1. Total Capacitance is equivalent to the sum of junction capacitance (Cj) and parasitic capacitance (Cp). 1 ADVANCED: Data Sheets contain information regarding a product M/A-COM is considering for * North America Tel: 800.366.2266 / Fax: 978.366.2266 development. Performance is based on target specifications, simulated results, and/or prototype * Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 measurements. Commitment to develop is not guaranteed. * Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding a product M/A-COM has under developVisit www.macom.com for additional data sheets and product information. ment. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. Commitment to produce in M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or volume is not guaranteed. information contained herein without notice. MADS-001317-1320AG GaAs Solder Bump Flip Chip Schottky Diode M/A-COM Products Rev. V2 Circuit Mounting Dimensions (Inches) 0.008" 0.013" (2) PL 0.011" (2) PL 2 ADVANCED: Data Sheets contain information regarding a product M/A-COM is considering for * North America Tel: 800.366.2266 / Fax: 978.366.2266 development. Performance is based on target specifications, simulated results, and/or prototype * Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 measurements. Commitment to develop is not guaranteed. * Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding a product M/A-COM has under developVisit www.macom.com for additional data sheets and product information. ment. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. Commitment to produce in M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or volume is not guaranteed. information contained herein without notice. MADS-001317-1320AG GaAs Solder Bump Flip Chip Schottky Diode Device Installation Procedures The following guidelines should be observed to avoid damaging GaAs Flip-Chips. M/A-COM Products Rev. V2 Cleanliness These devices should be handled in a clean environment. Do not attempt to clean die after installation. Static Sensitivity Gallium Arsenide Schottky diodes are ESD sensitive and can be damaged by static electricity. Since Schottky diodes are rated as Class 0, proper ESD techniques should be used when handling these devices. General Handling These devices have a polymer layer which provides scratch protection for the junction area and the anode air bridge. Die can be handled with plastic tweezers or picked and placed automatically with a #27 tip vacuum pencil. Assembly Requirements using Tin Lead Solder This Flip Chip Diode employs a 6 m thick, Sn 63/Pb 37 Solderable interface as part of the 50 m high solder bump. These chips are designed to be soldered onto hard or soft substrates with the junction side down. They should be mounted onto silkscreened circuits using 60/40 Sn/Pb solder paste. A typical profile for a Sn 63/Pb 37soldering process is provided in Application Note, M538 Surface Mounting Instructions on the M/A-COM website www.macom.com Typical Spice Parameters Is (A) 1.7 E-14 Rs () 4.6 N 1.08 Ct0 (pF) .047 M .38 Ik (A) .016 Vj (V) .86 FC .99 BV (V) 7 IBV (A) 1.0 E-5 Absolute Maximum Ratings @ 25C 2 Parameter Operating Temperature Storage Temperature Incident LO Power Incident RF Power Mounting Temperature Ordering Information Part Number MADS-001317-1320AG Maximum Ratings -65C to +125C -65C to +150C +20 dBm +20 dBm +300C for 10 seconds. Packaging Gel Pack 2. Exceeding these limits may cause permanent damage. 3 ADVANCED: Data Sheets contain information regarding a product M/A-COM is considering for * North America Tel: 800.366.2266 / Fax: 978.366.2266 development. Performance is based on target specifications, simulated results, and/or prototype * Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 measurements. Commitment to develop is not guaranteed. * Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding a product M/A-COM has under developVisit www.macom.com for additional data sheets and product information. ment. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. Commitment to produce in M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or volume is not guaranteed. information contained herein without notice. |
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