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FGPF50N33BT 330V, 50A PDP Trench IGBT April 2009 FGPF50N33BT 330V, 50A PDP IGBT Features * High current capability * Low saturation voltage: VCE(sat) =1.6V @ IC = 50A * High input impedance * Fast switching tm General Description Using Novel Trench IGBT Technology, Fairchild's new series of trench IGBTs offer the optimum performance for PDP applications where low conduction and switching losses are essential. Applications * PDP System GC E TO-220F Absolute Maximum Ratings Symbol VCES VGES IC ICpulse (1)* ICpulse (2)* PD TJ Tstg TL Description Collector to Emitter Voltage Gate to Emitter Voltage Collector Current Pulsed Collector Current Pulsed Collector Current Maximum Power Dissipation Maximum Power Dissipation Operating Junction Temperature Storage Temperature Range Maximum Lead Temp. for soldering Purposes, 1/8" from case for 5 seconds @ TC = 25oC Ratings 330 30 50 120 160 43 17.2 -55 to +150 -55 to +150 300 Units V V A A A W W o o o @ TC = 25oC @ TC = 25oC @ TC = 25 C @ TC = 100 C o o C C C Thermal Characteristics Symbol RJC(IGBT) RJA Parameter Thermal Resistance, Junction to Case Thermal Resistance, Junction to Ambient Typ. - Max. 2.9 62.5 Units o o C/W C/W Notes: 1: Repetitive test , Pulse width=100usec , Duty=0.1 2: Half Sine Wave, D < 0.01, pluse width < 10usec *Ic_pluse limited by max Tj (c)2009 Fairchild Semiconductor Corporation 1 www.fairchildsemi.com FGPF50N33BT Rev. A FGPF50N33BT 330V, 50A PDP Trench IGBT Package Marking and Ordering Information Device Marking FGPF50N33BT Device FGPF50N33BTTU Package TO-220F Eco Status RoHS Packaging Type Tube Qty per Tube 50ea For Fairchild's definition of "green" Eco Status, please visit: http://www.fairchildsemi.com/company/green/rohs_green.html. Electrical Characteristics of the IGBT Symbol Off Characteristics BVCES BVCES TJ ICES IGES TC = 25C unless otherwise noted Parameter Test Conditions Min. Typ. Max. Units Collector to Emitter Breakdown Voltage VGE = 0V, IC = 250A, Tc=25oC VGE = 0V, IC = 250A, Tc=125oC Temperature Coefficient of Breakdown Voltage Collector Cut-Off Current VGE = 0V, IC = 250A VCE = VCES, VGE = 0V, Tc=25oC VCE = VCES, VGE = 0V, Tc=125oC G-E Leakage Current VGE = VGES, VCE = 0V 330 340 - 0.2 - 20 200 200 V V V/oC A A nA On Characteristics VGE(th) G-E Threshold Voltage IC = 250A, VCE = VGE IC = 20A, VGE = 15V, IC = 30A, VGE = 15V, VCE(sat) Collector to Emitter Saturation Voltage IC = 50A, VGE = 15V, TC = 25oC IC = 50A, VGE = 15V, TC = 125oC Dynamic Characteristics Cies Coes Cres Input Capacitance Output Capacitance Reverse Transfer Capacitance VCE = 30V, VGE = 0V, f = 1MHz 980 70 40 pF pF pF 2.3 3.3 1.2 1.3 1.6 1.7 4.3 1.5 V V V V V Switching Characteristics td(on) tr td(off) tf td(on) tr td(off) tf Qg Qge Qgc Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Total Gate Charge Gate to Emitter Charge Gate to Collector Charge VCE = 200V, IC = 20A, VGE = 15V VCC = 200V, IC = 20A, RG = 5, VGE = 15V, Resistive Load, TC = 125oC VCC = 200V, IC = 20A, RG = 5, VGE = 15V, Resistive Load, TC = 25oC 9 33 32 202 9 37 33 332 35 6 14 ns ns ns ns ns ns ns ns nC nC nC FGPF50N33BT Rev. A 2 www.fairchildsemi.com FGPF50N33BT 330V, 50A PDP Trench IGBT Typical Performance Characteristics Figure 1. Typical Output Characteristics 160 TC = 25 C o Figure 2. Typical Output Characteristics 160 TC = 125 C o 20V 15V 12V 20V 15V 12V Collector Current, IC [A] Collector Current, IC [A] 120 10V 120 80 80 10V VGE = 8V 40 40 VGE = 8V 0 0.0 1.5 3.0 4.5 Collector-Emitter Voltage, VCE [V] 6.0 0 0.0 1.5 3.0 4.5 Collector-Emitter Voltage, VCE [V] 6.0 Figure 3. Typical Saturation Voltage Characteristics 160 Common Emitter VGE = 15V Figure 4. Transfer Characteristics 160 Common Emitter VCE = 20V Collector Current, IC [A] 120 Collector Current, IC [A] TC = 25 C TC = 125 C o o TC = 25 C o 120 TC = 125 C o 80 80 40 40 0 0 1 2 3 4 Collector-Emitter Voltage, VCE [V] 5 0 0 3 6 9 12 Gate-Emitter Voltage,VGE [V] 15 Figure 5. Saturation Voltage vs. Case Temperature at Variant Current Level 2.0 Collector-Emitter Voltage, VCE [V] Common Emitter VGE = 15V Figure 6. Saturation Voltage vs. VGE 20 Collector-Emitter Voltage, VCE [V] Common Emitter TC = 25 C o 1.8 1.6 1.4 30A 50A 16 12 8 50A 1.2 IC = 20A 1.0 0.8 25 4 30A IC = 20A 50 75 100 o Case Temperature, TC [ C] 125 0 0 4 8 12 16 Gate-Emitter Voltage, VGE [V] 20 FGPF50N33BT Rev. A 3 www.fairchildsemi.com FGPF50N33BT 330V, 50A PDP Trench IGBT Typical Performance Characteristics Figure 7. Saturation Voltage vs. VGE 20 Common Emitter TC = 125 C o Figure 8. Capacitance Characteristics 1500 Cies Common Emitter VGE = 0V, f = 1MHz TC = 25 C o Collector-Emitter Voltage, VCE [V] 16 Capacitance [pF] 1000 12 8 30A Coes 500 4 IC = 20A 50A Cres 0 0 4 8 12 16 Gate-Emitter Voltage, VGE [V] 20 0 1 10 Collector-Emitter Voltage, VCE [V] 30 Figure 9. Gate charge Characteristics 15 Common Emitter o Figure 10. SOA Characteristics 500 10s Gate-Emitter Voltage, VGE [V] TC = 25 C 100 Collector Current, Ic [A] 100s 12 VCC = 100V 200V 9 10 6 1 DC Single Nonrepetitive Pulse TC = 25oC Curves must be derated linearly with increase in temperature 3 0.1 0 0 10 20 30 Gate Charge, Qg [nC] 40 0.01 0.1 1 10 100 Collector-Emitter Voltage, VCE [V] 400 Figure 11. Turn-on Characteristics vs. Gate Resistance 100 Figure 12. Turn-off Characteristics vs. Gate Resistance 4000 Common Emitter VCC = 200V, VGE = 15V IC = 20A TC = 25 C TC = 125 C o o 1000 Switching Time [ns] 10 td(on) Common Emitter VCC = 200V, VGE = 15V IC = 20A TC = 25 C TC = 125 C o o Switching Time [ns] tr tf 100 td(off) 1 0 10 20 30 40 Gate Resistance, RG [] 50 10 0 10 20 30 40 50 Gate Resistance, RG [] FGPF50N33BT Rev. A 4 www.fairchildsemi.com FGPF50N33BT 330V, 50A PDP Trench IGBT Typical Performance Characteristics Figure 13. Turn-on Characteristics vs. Collector Current 200 Common Emitter VGE = 15V, RG = 5 Figure 14. Turn-off Characteristics vs. Collector Current 5000 Common Emitter VGE = 15V, RG = 5 100 Switching Time [ns] TC = 25 C TC = 125 C o o tr 1000 Switching Time [ns] TC = 25 C TC = 125 C tf o o 100 td(off) td(on) 10 5 10 20 30 40 50 10 10 20 30 40 50 Collector Current, IC [A] Collector Current, IC [A] Figure 15. Switching Loss vs. Gate Resistance 5000 Common Emitter VCC = 200V, VGE = 15V IC = 20A Figure 16. Switching Loss vs. Collector Current 20000 10000 Common Emitter VGE = 15V, RG = 5 TC = 25 C o o Switching Loss [mJ] TC = 125 C o Eoff Switching Loss [mJ] 1000 TC = 25 C o 1000 TC = 125 C Eoff 100 Eon 100 Eon 10 10 0 10 20 30 40 Gate Resistance, RG [] 50 1 10 20 30 40 50 Collector Current, IC [A] Figure 17. Turn off Switching SOA Characteristics 200 100 Collector Current, IC [A] 10 Safe Operating Area 1 1 VGE = 15V, TC = 125 C o 10 100 500 Collector-Emitter Voltage, VCE [V] FGPF50N33BT Rev. A 5 www.fairchildsemi.com FGPF50N33BT 330V, 50A PDP Trench IGBT Typical Performance Characteristics Figure 18.Transient Thermal Impedance of IGBT 0.5 Thermal Response [Zthjc] 1 0.3 0.1 0.05 0.02 0.01 0.1 PDM t1 t2 0.01 single pulse Duty Factor, D = t1/t2 Peak Tj = Pdm x Zthjc + TC 1E-3 1E-5 1E-4 1E-3 0.01 0.1 1 10 100 Rectangular Pulse Duration [sec] FGPF50N33BT Rev. A 6 www.fairchildsemi.com FGPF50N33BT 330V, 50A PDP Trench IGBT Mechanical Dimensions TO-220F 3.30 0.10 10.16 0.20 (7.00) o3.18 0.10 2.54 0.20 (0.70) 6.68 0.20 15.80 0.20 (1.00x45) MAX1.47 9.75 0.30 0.80 0.10 (3 ) 0 0.35 0.10 2.54TYP [2.54 0.20] #1 0.50 -0.05 2.54TYP [2.54 0.20] 4.70 0.20 +0.10 2.76 0.20 9.40 0.20 Dimensions in Millimeters FGPF50N33BT Rev. A 7 15.87 0.20 www.fairchildsemi.com TRADEMARKS The following includes registered and unregistered trademarks and service marks, owned by Fairchild Semiconductor and/or its global subsidiaries, and is not intended to be an exhaustive list of all such trademarks. Auto-SPMTM Build it NowTM CorePLUSTM CorePOWERTM CROSSVOLTTM CTLTM Current Transfer LogicTM EcoSPARK(R) EfficentMaxTM EZSWITCHTM* TM* (R) Fairchild(R) Fairchild Semiconductor(R) FACT Quiet SeriesTM FACT(R) FAST(R) FastvCoreTM FETBenchTM FlashWriter(R)* FPSTM F-PFSTM FRFET(R) SM Global Power Resource Green FPSTM Green FPSTM e-SeriesTM GmaxTM GTOTM IntelliMAXTM ISOPLANARTM MegaBuckTM MICROCOUPLERTM MicroFETTM MicroPakTM MillerDriveTM MotionMaxTM Motion-SPMTM OPTOLOGIC(R) OPTOPLANAR(R) (R) PowerTrench PowerXSTM Programmable Active DroopTM QFET(R) QSTM Quiet SeriesTM RapidConfigureTM TM Saving our world, 1mW/W/kW at a timeTM SmartMaxTM SMART STARTTM SPM(R) STEALTHTM SuperFETTM SuperSOTTM-3 SuperSOTTM-6 SuperSOTTM-8 SupreMOSTM SyncFETTM Sync-LockTM (R) * (R) The Power Franchise (R) TinyBoostTM TinyBuckTM TinyLogic(R) TINYOPTOTM TinyPowerTM TinyPWMTM TinyWireTM TriFault DetectTM TRUECURRENTTM* SerDesTM PDP SPMTM Power-SPMTM UHC(R) Ultra FRFETTM UniFETTM VCXTM VisualMaxTM XSTM * Trademarks of System General Corporation, used under license by Fairchild Semiconductor. DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION, OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD'S WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY THEREIN, WHICH COVERS THESE PRODUCTS. LIFE SUPPORT POLICY FAIRCHILD'S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury of the user. 2. A critical component in any component of a life support, device, or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. ANTI-COUNTERFEITING POLICY Fairchild Semiconductor Corporation's Anti-Counterfeiting Policy. Fairchild's Anti-Counterfeiting Policy is also stated on our external website, www.fairchildsemi.com, under Sales Support. Counterfeiting of semiconductor parts is a growing problem in the industry. All manufacturers of semiconductor products are experiencing counterfeiting of their parts. Customers who inadvertently purchase counterfeit parts experience many problems such as loss of brand reputation, substandard performance, failed applications, and increased cost of production and manufacturing delays. Fairchild is taking strong measures to protect ourselves and our customers from the proliferation of counterfeit parts. Fairchild strongly encourages customers to purchase Fairchild parts either directly from Fairchild or from Authorized Fairchild Distributors who are listed by country on our web page cited above. Products customers buy either from Fairchild directly or from Authorized Fairchild Distributors are genuine parts, have full traceability, meet Fairchild's quality standards for handling and storage and provide access to Fairchild's full range of up-to-date technical and product information. Fairchild and our Authorized Distributors will stand behind all warranties and will appropriately address any warranty issues that may arise. Fairchild will not provide any warranty coverage or other assistance for parts bought from Unauthorized Sources. Fairchild is committed to combat this global problem and encourage our customers to do their part in stopping this practice by buying direct or from authorized distributors. PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Advance Information Preliminary No Identification Needed Obsolete Product Status Formative / In Design First Production Full Production Not In Production Definition Datasheet contains the design specifications for product development. Specifications may change in any manner without notice. Datasheet contains preliminary data; supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve design. Datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve the design. Datasheet contains specifications on a product that is discontinued by Fairchild Semiconductor. The datasheet is for reference information only. Rev. I40 (c) 2008 Fairchild Semiconductor Corporation www.fairchildsemi.com |
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