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ASDL-3023
IrDA Data Compliant Low Power 4Mbit/s with Remote Control Infrared Transceiver
Data Sheet
Description
The ASDL-3023 is a new generation low profile high speed enhanced infrared (IR) transceiver module that provides the capability of (1) interface between logic and IR signals for through-air, serial, half-duplex IR data link,and(2)IRremotecontroltransmissionforuniversal remotecontrolapplications.TheASDL-3023canbeused forIrDAaswellasremotecontrolapplicationwithoutthe need of any additional external components for multiplexing. TheASDL-3023isfullycomplianttoIrDAPhysicalLayer specificationversion1.4lowpowerfrom9.6kbit/sto4.0 Mbit/s(FIR)andIEC825Class1eyesafetystandards. The ASDL-3023 can be shutdown completely to achieve verylowpowerconsumption.Intheshutdownmode,the PINdiodewillbeinactiveandthusproducingverylittle photocurrent even under very bright ambient light. It is alsodesignedtointerfacetoinput/outputlogiccircuitsas lowas1.5V.Thesefeaturesareidealforbatteryoperated mobile devices such as PDAs and mobile phones that requirelowpowerconsumption.
Features
General Features
* Operatingtemperaturefrom-25C~85C - Criticalparametersareguaranteedover temperatureandsupplyvoltage * VccSupply2.4to3.6V * InterfacetoVariousSuperI/OandControllerDevices -Input/OutputInterfaceVoltageof1.5V * MiniaturePackage MiniaturePackage(shielded) Height:1.75mm Height:1.95mm Width:7.5mm Width:8.0mm Depth:2.75mm Depth:3.00mm * MoistureLevel3 * PowerSavingusing3ILEDrange(SIR,MIR/FIR,RC mode) * LEDstuckhighprotection * HighEMIPerformance * HighESDPerformance * DesignedtoAccommodateLightLosswithCosmetic Windows * IEC825-Class1EyeSafe
Applications
Mobiledatacommunicationanduniversalremotecontrol * MobilePhones * PDAs * DigitalStillCamera * Printer * HandyTerminal * IndustrialandMedicalInstrument
IrDA Features
* FullyComplianttoIrDA1.4PhysicalLayerLowPower Specificationsfrom9.6kbit/sto4.0Mb/s - Linkdistanceupto30cm(minimum) * Completeshutdown * LowPowerConsumption - Lowshutdowncurrent - Lowidlecurrent
Application Support Information
The Application Engineering Group is available to assist you with the application design associated with ASDL3023infraredtransceivermodule.Youcancontactthem through your local sales representatives for additional details.
Remote Control Features
* Wideangleandhighradiantintensity * Spectrallysuitedtoremotecontroltransmission function * Minimumpeakwavelengthof880nm * 2RCTransmissionMode - SingleTXD(ProgrammableMode) - DualTXD(Direct)
Vdd
R1
GND
CX2
Vdd (7)
CX1
GND (8)
ASDL-3023 TRANSCEIVER MODULE
IOVCC(5) SD(4)
CX5
Regulated Voltage & Current Source
TRANSCEIVER IC
Photodetector
RECEIVER
RXD(3) VLED
R2
Low Pass Filter AGC & Signal Reference Processor
Amplifier
Output Buffer
CX3
CX4
LEDA (1)
TXD_RC Input TXD_IR Input TRANSMIT TER
TRANSMITTER
RC_Buffer
TxD_RC(6) TxD_IR(2)
Eye Safety-RC
Switched Current Source
IR_Buffer
LED
Eye Safety-IR
Figure 1a. Functional Block Diagram of ASDL-3023
Vdd
R1
GND
CX2
Vdd (7)
CX1
GND (8)
ASDL-3023 TRANSCEIVER MODULE
IOVCC(5) SD(4)
CX5
Regulated Voltage & Current Source
TRANSCEIVER IC
Photodetector
RECEIVER
RXD(3) VLED
R2
Low Pass Filter AGC & Signal Reference Processor
Amplifier
Output Buffer
SHIELD
CX3
CX4
LEDA (1)
TXD_RC Input TXD_IR Input
TRANSMITTER
RC_Buffer
TxD_RC(6) TxD_IR(2)
Eye Safety-RC
Switched Current Source
LED
IR_Buffer
Eye Safety-IR
TRANSMIT TER
Figure 1b. Functional Block Diagram of ASDL-3023-S21
Order Information
Part Number
ASDL-3023-021 ASDL-3023-008 ASDL-3023-S21(Shielded)
Packaging Type
TapeandReel TapeandReel TapeandReel
Package
FrontOption TopOption FrontOption
Quantity
2500 2500 2500
Marking Information
Theunitismarkedwith`XYWLL'ontheshield Y=year W=workweek LL=lotnumber
ASDL-3023-021, ASDL-3023-008 and ASDL-3023-S21 Pinout, Rear View
Rear View
I/O Pins Configuration Table
Pin
1 2
Symbol
LEDA TxD_IR RxD SD IOVCC TxD_RC VCC GND
Description
LEDAnode IrDAtransmitterdatainput. IrDAreceivedata Shutdown Input/OutputASICvoltage RCtransmitterdatainput. SupplyVoltage Ground
I/O Type
Input. ActiveHigh Output. ActiveLow Input. ActiveHigh Input. ActiveHigh
Notes
Note1 Note2 Note3 Note4 Note5 Note6 Note7 Note8
8
7
6
5
4
3
2
1
Figure 2a. Pin out for ASDL-3023-021 and ASDL-3023-008,
Rear View
3 4 5 6
8
7
6
5 4 (Shielded)
3
2
1
7 8
Figure 2b. Pin out for ASDL-3023-S21
Notes: 1. Tiedthroughexternalresistor,R2,toVled.Refertothetablebelowforrecommendedseriesresistorvalue. 2. ThispinisusedtotransmitserialdatawhenSDpinislow.Ifheldhighforlongerthan50ms,theLEDisturnedoff.DoNOTfloatthispin. 3. ThispiniscapableofdrivingastandardCMOSorTTLload.Noexternalpull-uporpull-downresistorisrequired.Thepinisintri-statewhenthe transceiverisinshutdownmode 4. CompleteshutdownofICandPINdiode.ThepinisusedforsettingIRreceiverbandwidth,rangeofIRLEDcurrentandRCdriveprogramming mode.Refertosectionon"BandwidthSelectionTiming"and"RemoteControlDriveModes"formoreinformation.DoNOTfloatthispin.*** 5. ConnecttoASIClogiccontrollersupplyvoltageorVcc.ThevoltageatthispinshouldbeequaltoorlessthanVcc. 6. LogichighturnsontheRCLED.Ifheldhighlongerthan50ms,theRCLEDisturnedoff.DoNOTfloatthepin. 7. (i)Regulated,2.4Vto3.6V (ii)Thispinrecommendedtoturnonbeforeotherpin. 8. Connecttosystemground.
4
Recommended Application Circuit Components
Component
R1 R2
Recommended Value
4.7W,5%,0.25wattforVcc3.0V 2.7W,for2.4VLED2.7V; 3.3W,for2.7Note
CX1,CX3,CX5 CX2,CX4
1 1
Notes:CX1,CX2,CX3&CX4mustbeplacedwithin0.7cmofASDL-3023 toobtainoptimumnoiseimmunity
Absolute Maximum Ratings
Forimplementationswherecasetoambientthermalresistanceis50C/W. Parameter
StorageTemperature OperatingTemperature LEDAnodeVoltage SupplyVoltage InputVoltage:TXD,SD/Mode OutputVoltage:RXD PeakIRLEDCurrent PeakRCLEDCurrent
Symbol
TS TA VLEDA VCC VI VO IIRLED(PK) IRCLED(PK)
Min.
-40 -25 -0.3 -0.3 -0.3 -0.3
Max.
+100 +85 6.5 6 5.5 5.5 200 300
Units
C C V V V V mA mA
Conditions
Ref
25%dutycycle,90mspulsewidth Fig3 10%dutycycle,90mspulsewidth Fig4
CAUTION: The CMOS INhereNT TO The deSIgN Of ThIS COMpONeNT INCreASeS The COMpONeNT'S SUSCepTIbIlITy TO dAMAge frOM eleCTrOSTATIC dISChArge (eSd). IT IS AdvISed ThAT NOrMAl STATIC preCAUTIONS be TAkeN IN hANdlINg ANd ASSeMbly Of ThIS COMpONeNT TO preveNT dAMAge ANd/Or degrAdATION whICh MAy be INdUCed by eSd
Recommended Operating Conditions
Parameter
OperatingTemperature SupplyVoltage Input/OutputVoltage LogicInputVoltageforTXD, SD/Mode ReceiverInputIrradiance LogicHigh LogicLow LogicHigh
Symbol Min.
TA VCC IOVCC VIH VIL EIH -25 2.4 1.5 IOVcc-0.5 0 0.0090 0.0225 LogicLow EIL ILEDA ILEDA
Typ.
Max.
+85 3.6 3.6 IOVcc 0.4 500 500 0.3
Units
C V V V V
Conditions
mW/cm2 Forin-bandsignals 115.2kbit/s[3] 0.576Mbit/sin-band signals4.0Mbit/s[3] mW/cm2 mA mA Forin-bandsignals[3]
IRLED(LogicHigh)Current PulseAmplitude-SIRMode IRLED(LogicHigh)Current PulseAmplitude-MIR/FIR Mode RCLED(LogicHigh)Current PulseAmplitude ReceiverDataRate AmbientLight
65
150 250 0.0096 4.0
ILEDA
mA Mbit/s SeeIrDASerialInfrared PhysicalLayerLink Specification,AppendixA forambientlevels
Note: 3. Anin-bandopticalsignalisapulse/sequencewherethepeakwavelength,lp,isdefinedas850lp900nm,andthepulsecharacteristicsare compliantwiththeIrDASerialInfraredPhysicalLayerLinkSpecificationv1.4.
Electrical and Optical Specifications
Specifications(Min.&Max.values)holdovertherecommendedoperatingconditionsunlessotherwisenoted.Unspecifiedtestconditionsmaybeanywhereintheiroperatingrange.Alltypicalvalues(Typ.)areat25C,Vccsetto3.0Vand IOVccsetto1.5Vunlessotherwisenoted.
Receiver
Parameter
ViewingAngle PeakSensitivityWavelength RxD_IrDAOutputVoltage
Symbol
2q1/2 lP LogicHigh VOH LogicLow VOL tRPW(SIR) tRPW(MIR) tRPW(FIR) tRPW(FIR) tr,tf tL tRW
Min.
30
Typ.
875
Max.
Units
nm V V ms ns ns ns ns ms ms
Conditions
[4,5] [4,6]
RxD_IrDAPulseWidth(SIR)
IOVcc -0.5 0 1 100 80 200 60
IOVCC 0.4 4 500 175 290 100 200
IOH=-200mA,EI0.3mW/cm2
q1/215,CL=9pF q1/215,CL=9pF q1/215,CL=9pF q1/215,CL=9pF CL=9pF EI=9.0mW/cm2 EI=10mW/cm2
RxD_IrDAPulseWidth(MIR) RxD_IrDAPulseWidth(Single)(FIR)[4,7] RxD_IrDAPulseWidth(Double)(FIR)[4,7] RxD_IrDARise&FallTimes ReceiverLatencyTime[8] ReceiverWakeUpTime[9]
Infrared (IR) Transmitter
Parameter
IRRadiantIntensity (SIRMode) IRRadiantIntensity(MIR/FIR Mode) IRViewingAngle IRPeakWavelength TxD_IrDALogicLevels TxD_IrDAInputCurrent WakeUpTime[10] MaximumOpticalPulse Width[11] TXDPulseWidth(SIR) TXDPulseWidth(MIR) TXDPulseWidth(FIR) TxDRise&FallTimes(Optical)
Symbol
IEH IEH 2q1/2 lP VIH VIL IH IL tTW tPW(Max) tPW(SIR) tPW(MIR) tPW(FIR) tr,tf
Min.
4 10 30 850 IOVcc-0.5 0
Typ.
20 50
Max.
Units
mW/sr mW/sr
Conditions
IR_ILEDA=65mA, q1/215,TxD_IRVIH,TA=25C IR_ILEDA=150mA, q1/215,TxD_IRVIH,TA=25C
885
High Low High Low
60 900 IOVCC 0.5
0.02 -0.02 180 25 1.6 217 125
120
nm V V mA mA ns ms ms ns ns ns ns V
VIVIH 0VIVIL
600 40
IRLEDAnodeOn-State Voltage (SIRMode) IRLEDAnodeOn-State Voltage(MIR/FIRMode)
VON
(IR_LEDA)
2.2
VON
(IR_LEDA)
2.1
V
tPW(TXD_IR)=1.6msat115.2 kbit/s tPW(TXD_IR)=217nsat1.152 Mbit/s tPW(TXD_IR)=125nsat4.0Mbit/s tPW(TXD_IR)=1.6msat115.2 kbit/s tPW(TXD_IR)=125nsat4.0Mbit/s IR_ILEDA=65mA, IRVLED=3.6V, R=4.7W,VI(TxD)VIH IR_ILEDA=150mA, IRVLED=3.6V, R=4.7W, VI(TxD_IR)VIH
Remote Control (RC) Transmitter
Parameter
RCRadiantIntensity RCViewingAngle RCPeakWavelength TxD_RCLogicLevels TxD_RCInputCurrent RCLEDAnodeOn-State Voltage High Low High Low
Symbol
IEH 2q1/2 lP VIH VIL IH IL VON
(RC_LEDA)
Min.
Typ.
80
Max.
Units
mW/sr
Conditions
RC_ILEDA=250mA, q1/215,TxD_RCVIH,TA=25C
30 880 IOVcc-0.5 0 0.02 -0.02 2 885
60 900 IOVCC 0.5 1 1
nm V V mA mA V VIVIH 0VIVIL RC_ILEDA=250mA,RCVLED=3.6V, R=4.7W,VI(TxD_RC)VIH
Transceiver
Parameters
InputCurrent SupplyCurrent High Low Shutdown Idle (Standby) Active
Symbol
IH IL ICC1 ICC2 ICC3
Min.
-1
Typ.
0.01 -0.02 2.0 3.5
Max.
1 1 1 2.9
Units
mA mA mA mA mA
Conditions
VIVIH 0VIVIL VSDIOVCC-0.5,TA=25C VI(TxD)VIL,EI=0 VI(TxD)VIL,EI=10mW/cm2
Note: [4] Anin-bandopticalsignalisapulse/sequencewherethepeakwavelength,lP,isdefinedas850nmlP900nm,andthepulsecharacteristics arecompliantwiththeIrDASerialInfraredPhysicalLayerLinkSpecificationversion1.4. [5] Forin-bandsignals115.2kbit/swhere9mW/cm2EI500mW/cm2. [6] Forin-bandsignals1.152Mbit/swhere22mW/cm2EI500mW/cm2. [7] Forin-bandsignals4Mbit/swhere22mW/cm2EI500mW/cm2. [8] LatencyisdefinedasthetimefromthelastTxD_IrDAlightoutputpulseuntilthereceiverhasrecoveredfullsensitivity. [9] ReceiverWakeUpTimeismeasuredfromVccpowerONtovalidRxD_IrDAoutput. [10] TransmitterWakeUpTimeismeasuredfromVccpowerONtovalidlightoutputinresponsetoaTxD_IrDApulse. [11] TheMaxOpticalPWisdefinedasthemaximumtimewhichtheIRLEDwillturnon,this,istopreventthelongTurnOntimefortheIRLED.
ILED(PK) Maximum Peak LED Current - mA
300 250 200 150 100 50 0 -40 -20 0 20 40 60 TA - Ambient Temperature - oC 80 100
I LED(DC) , Maximum DC LED Current - mA
350
Max. Permissible Peak LED Current
70 60 50 40 30 20 10 0 -40 -20
Max. Permissible DC LED Current
R ja = 400degC/W
0 20 40 60 TA - Ambient Temperature - oC
80
100
Figure 3. Maximum Peak IR LED current vs. ambient temperature. Derated based on TJMAX = 100C.
Figure 4. Maximum Peak RC LED current vs. ambient temperature. Derated based on TJMAX = 100C.
Figure 5a. Timing Waveform - RXD Output Waveform
Figure 5b. Timing Waveform - LED Optical Waveform
Figure 5c. Timing Waveform - TXD "Stuck-on" Protection Waveform
Figure 5d. Timing Waveform - Receiver Wakeup Time Waveform
Figure 5e. Timing Waveform - TXD Wakeup Time Waveform
Package Dimension: ASDL-3023-021 (Shieldless, Front) and ASDL-3023-008 (Shieldless, Top)
0
Package Dimension: ASDL-3023-S21 (Shielded, Front)
Tape & Reel Dimensions
ASDL-3023-021(Shieldless,Front)
ASDL-3023-008(Shieldless,Top)
ASDL-3023-S21(Shielded,Front)
Progressive Direction Empty (40mm min) Parts Mounted Leader (400mm min) Empty (40mm min)
Option # 021 S21 008
"B" 330 330 330
"C" 80 80 80
Quantity 2500 2500 2500
Unit: mm
Detail A 2.0 0.5 13.0 0.5 B C
R1.0 LABEL 21 0.8
Detail A
16.4
+2 0
2.0 0.5
ASDL-3023 Moisture Proof Packaging
AllASDL-3023optionsareshippedinmoistureproofpackage.Onceopened,moistureabsorptionbegins. ThispartiscomplianttoJEDECLevel3.
UNITS IN A SEALED MOISTURE-PROOF PACKAGE
PACKAGE IS OPENED (UNSEALED)
PARTS ARE NOT RECOMMENDED TO BE USED
NO
ENVIRONMENT LESS THAN 30 oC AND LESS THAN 60% RH YES
PACKAGE IS OPENED LESS THAN 168 HOURS NO
YES
NO BAKING IS NECESSARY
NO
PACKAGE IS OPENED LESS THAN 15 DAYS YES PERFORM RECOMMENDED BAKING CONDITIONS
Figure 6. Baking Conditions Chart
Recommended Storage Conditions
StorageTemperature RelativeHumidity 10Cto30C below60%RH
Baking Conditions
Package
Inreels Inbulk
Temp
60C 100C
Time
48hours 4hours
Time from unsealing to soldering
Afterremovalfromthebag,thepartsshouldbesoldered within7daysifstoredattherecommendedstorageconditions.WhenMBB(MoistureBarrierBag)isopenedand thepartsareexposedtotherecommendedstorageconditionsmorethan7daysbutlessthan15daystheparts must be baked before reflow to prevent damage to the parts.
Note: To use the parts that exposed for more than 15 days is not recommended.
Bakingshouldonlybedoneonce.
4
Recommended Reflow Profile
255 230 217 200 180 150 120 80 25 0 P1 HEAT UP 50 P2 SOLDER PASTE DRY 100 150 200 P3 SOLDER REFLOW P4 COOL DOWN 250 300 t-TIME (SECONDS) R1 MAX 260C R3 R4
T - TEMPERATURE (C)
R2
60 sec to 90 sec Above 217C
R5
Process Zone
HeatUp SolderPasteDry SolderReflow CoolDown PeakTemperature Timewithin5CofactualPeakTemperature Time25CtoPeakTemperature
Symbol
P1,R1 P2,R2 P3,R3 P3,R4 P4,R5
DT
25Cto150C 150Cto200C 200Cto260C 260Cto200C 200Cto25C >217C 260C 25Cto260C
Maximum DT/Dtime or Duration
3C/s 100sto180s 3C/s -6C/s -6C/s 60sto90s 20sto40s 8mins
Timemaintainedaboveliquiduspoint,217C
The reflow profile is a straight-line representation of a nominal temperature profile for a convective reflow solder process. The temperature profile is divided into four process zones, each with different DT/Dtime temperaturechangeratesorduration.TheDT/Dtimeratesor duration are detailed in the above table. The temperatures are measured at the component to printed circuit boardconnections. In process zone P1, the PC board and ASDL-3023 pins areheatedtoatemperatureof150Ctoactivatetheflux in the solder paste. The temperature ramp up rate, R1, islimitedto3Cpersecondtoallowforevenheatingof boththePCboardandASDL-3023pins. Process zone P2 should be of sufficient time duration (100to180seconds)todrythesolderpaste.Thetemperatureisraisedtoaleveljustbelowtheliquiduspointof thesolder.
Process zone P3 is the solder reflow zone. In zone P3, the temperature is quickly raised above the liquidus pointofsolderto260C(500F)foroptimumresults.The dwell time above the liquidus point of solder should be between60and90seconds.Thisistoassurepropercoalescing of the solder paste into liquid solder and the formation of good solder connections. Beyond the recommended dwell time the intermetallic growth within the solder connections becomes excessive, resulting in the formation of weak and unreliable connections. The temperature is then rapidly reduced to a point below thesolidustemperatureofthesoldertoallowthesolder withintheconnectionstofreezesolid. Process zone P4 is the cool down after solder freeze. The cool down rate, R5, from the liquidus point of the solder to 25C (77F) should not exceed 6C per second maximum. This limitation is necessary to allow the PC boardandASDL-3023pinstochangedimensionsevenly, puttingminimalstressesontheASDL-3023. Itisrecommendedtoperformreflowsolderingnomore thantwice.
Appendix A: ASDL-3023 SMT Assembly Application Note Solder Pad, Mask and Metal Stencil
Figure A1. Stencil and PCBA
Recommended land pattern for ASDL-3023-021
Mounting Centre
Recommended land pattern for ASDL-3023- 008
Mounting Centre 0.44 0.4 1.05 0.17 0.7
1.55 0.1 0.775 FIDUCIAL 1.75 0.55 1.05 1.35 3.75 7.5
1.74
1.60 0.55 1.05 1.35 3.75 7.5
UNIT:mm
Figure A2a. Recommended land pattern, ASDL-3023-021
UNIT:mm
Recommended land pattern for ASDL-3023- S21
1.3 Mounting Centre 1.5 0.3
Figure A2c. Recommended land pattern, ASDL-3023-008
1.55 0.775
0.1
1.75 0.55 1.05 1.35 3.75 7.5
UNIT:mm
Figure A2b. Recommended land pattern, ASDL-3023-S21
Recommended Metal solder Stencil Aperture
It is recommended that only a 0.11 mm (0.004 inch) or a 0.127 mm (0.005 inch) thick stencil be used for solder pasteprinting.Thisistoensureadequateprintedsolder pastevolumeandnoshorting.SeetheTable1belowthe drawing for combinations of metal stencil aperture and metal stencil thickness that should be used. Aperture opening for shield pad is 2.6 mm x 1.5 mm(for ASDL3023-S1) as per land pattern. Compared to 0.127mm stencil thickness 0.11mm stencil thickness has longer length in land pattern. It is extended outwardly from transceivertocapturemoresolderpastevolume.
Adjacent Land Keepout and Solder Mask Areas
Adjacent land keepout is the maximum space occupied bytheunitrelativetothelandpattern.Thereshouldbe nootherSMDcomponentswithinthisarea.Theminimum solderresiststripwidthrequiredtoavoidsolderbridging adjacentpadsis0.2mm.Itisrecommendedthattwofiduciallycrossesbeplacedatmidlengthofthepadsforunit alignment.
Note:Wet/LiquidPhoto-imaginablesolderresist/maskisrecommended
j
h
k
l Solder Mask
Figure A3. Solder stencil aperture
Table 1.
Stencil thickness, t(mm)
0.127mm 0.11mm
Aperture size(mm) Length,l
1.75+/-0.05 2.4+/-0.05
Dimension Width,w
0.55+/-0.05 0.55+/-0.05 h l k j
mm
0.2 3.0 3.85 10.1
Appendix B: PCB Layout Suggestion
TheeffectsofEMIandpowersupplynoisecanpotentially reducethesensitivityofthereceiver,resultinginreduced linkdistance.ThePCBlayoutplayedanimportantroleto obtainagoodPSRRandEMimmunityresultingingood electricalperformance.Thingstonote: 1. The ground plane should be continuous under the part,butshouldnotextendundertheshieldtrace. 2. The shield trace is a wide, low inductance trace back tothesystemground.CX1,CX2,CX3,CX4andCX5are optionalsupplyfiltercapacitors;theymaybeleftoutif acleanpowersupplyisused. 3. VLED can be connected to either unfiltered or unregulated power supply. The bypass capacitors should be connection before the current limiting resistor R2 respectively. In a noisy environment, including capacitor CX3and CX4 can enhance supply rejection.CX3thatisgenerallyaceramiccapacitorof lowinductanceprovidingawidefrequencyresponse whileCX4istantalumcapacitorofbigvolumeandfast frequency response. The use of a tantalum capacitor ismorecriticalontheVLEDline,whichcarriesahigh current. 4. VCC pin can be connected to either unfiltered or unregulated power supply. The Resistor, R1 together withthecapacitors,CX1andCX2actsasthelowpass filter. 5. IOVCC is connected to the ASIC voltage supply or theVCCsupply.Thecapacitor,CX5actsasthebypass capacitor.
Noise sources to be placed as far away from the transceiver as possible Top Layer
CX1 CX2 CX5 CX3 CX4
6. Preferably a multi-layered board should be used to provide sufficient ground plane. Use the layer underneath and near the transceiver module as Vcc, and sandwich that layer between ground connected board layers. The diagram below demonstrate an exampleofa4layerboard: * TopLayer: Connectthemetalshieldand modulegroundpintobottom groundlayer; Placethebypasscapacitorswithin 0.5cmfromtheVCCandground pinofthemodule. * Layer2: Criticalgroundplanezone.3 cminalldirectionaroundthe module.Connecttoaclean, noiselessgroundnode(eg bottomlayer). * Layer3: Keepdatabusawayfromcritical groundplanezone. * Bottomlayer: Groundlayer.Groundnoise<75 mVp-p.Shouldbeseparatedfrom groundusedbynoisysources. Theareaunderneaththemoduleatthesecondlayer,and 3cminalldirectionaroundthemoduleisdefinedasthe critical ground plane zone.The ground plane should be maximizedinthiszone.RefertoapplicationnoteAN1114 or the AvagoTechnologies IrDA Data Link Design Guide fordetails.Thelayoutbelowisbasedona2-layerPCB.
R 1
R 2
Top Layer
Layer 3 Layer 2
Bottom Layer
Legend: ground via Bottom Layer (GND)
Appendix C: General Application Guide for the ASDL-3023 infrared IrDA Compliant 4 Mb/s Transceiver. Description
TheASDL-3023,awide-voltageoperatingrangeinfrared transceiver is a low-cost and small form factor device that is designed to address the mobile computing marketsuchasPDAs,aswellassmallembeddedmobile productssuchasdigitalcamerasandcellularphones.Itis spectrallysuitedtouniversalremotecontroltransmission functionat940nmtypically.ItisfullycomplianttoIrDA 1.4lowpowerspecification up 4Mb/s and support most remote control codes The design of ASDL-3023 also includes the following unique features: * Spectrally suited to universal remote control transmissionfunctionat940nmtypically; * Lowpassivecomponentcount; * Shutdown mode for low power consumption requirement; * DirectinterfacewithI/Ologiccircuit.
Interface to the Recommended I/O chip
The ASDL-3023's TXD data input is buffered to allow for CMOS drive levels. No peaking circuit or capacitor is required. Data rate from 9.6kb/s to 4Mb/s is available at RXD pin.TheTXD_RC, pin6 together with LEDA, pin1 is used to selected the remote control transmit mode. Alternatively,theTXD_IR,pin2togetherwithLEDA,pin1is usedforinfraredtransmitselection. Following shows the hardware reference design with ASDL-3023 *Detail configuration of ASDL-3023 with the controller chipisshowninFigure3. Theuseoftheinfraredtechniquesfordatacommunicationhasincreaserapidlylatelyandalmostallmobileapplication processors have built in the IR port. This does awaywiththeexternalEndecandsimplifiestheinterfacingtoadirectconnectionbetweentheprocessorandthe transceiver.Thenextsectiondiscussesinterfacingconfigurationwithageneralprocessor.
Selection of Resistor R2
ResistorR2shouldbeselectedtoprovidetheappropriate peakpulseIRandRCLEDcurrentrespectivelyatdifferent rangesofVccasshownonpage3under"Recommended Applicationcircuitcomponents".
STN/TFT LCD Panel Key Pad
LCD Control Touch Panel A/D
Peripherial interface PWM
LCD Backlight Contrast
*ASDL-3023 Mobile Application chipset IrDA interface AC97 sound Memory Expansion Logic Bus Driver Memory I/F Baseband I2S controller Audio Input
PCM Sound
ROM FLASH SDRAM
Power Management
Antenna
Figure 2. Mobile Application Platform
General mobile application processor
The transceiver is directly interface with the microprocessor provided its support infrared communication commonly known as Infrared Communications Port (ICP).TheICPsupportsbothSIRdataratesupto115.2kps and sometimes FIR data with data rates up to 4Mbps. The remote control commands can be sent one of the available General Purpose IO pins or the UART block withIrDAfunctionality.Itshouldbeshouldbeobserved that although both IrDA data transmission and Remote control transmission is possible simultaneously by the hardware, hence the software is required to resolve this issuetopreventthemixingandcorruptionofdatawhile being transmitted over the free air. The above Figure 3 illustrates a reference interfacing to implement both IR andRCfunctionalitywithASDL-3023.
Remote Control Operation
The ASDL-3023 is spectrally suited to universal remote controltransmissionfunctionat940nmtypically.Remote control applications are not governed by any standards, owing to which there are numerous remote codes in market. Each of those standards results in receiver modules with different sensitivities, depending on the carriesfrequenciesandresponsivelytotheincidentlight wavelength. Remote control carrier frequencies are in therangeof30KHzto60KHz(fordetailsofsomethefrequentlyusedcarrierfrequencies,pleaserefertoAN1314). Some common carrier frequencies and the corresponding SA-1110 UART frequency and baud rate divisor are showninTable3.
Table 3.
Remote Control Carrier Frequency (KHz)
30 32,33 36,36.7,38,39.2,40 56
SA-1110 UART Frequency (KHz)
28.8 32.9 38.4 57.6
Baud Rate Divisor
8 7 6 4
VCC R1 IOVCC CX1 CX2 VCC IOVCC CX5 GPIO IR_RXD GPIO IR_TXD 100Kohm VLED GND TXD_RC RXD SD TXD_IR R3 VLEDA 100Kohm GND CX3 CX4 HSDL3021 GND GND
IOVCC
GND
GND
Figure 3. ASDL-3023 configuration with general mobile architecture processor
0
Appendix E: Window Design for ASDL-3023 Optical Port Dimensions for ASDL-3023
ToensureIrDAcompliance,someconstraintsontheheightandwidthofthewindowexist.Theminimumdimensions ensurethattheIrDAconeanglesaremetwithoutvignetting.Themaximumdimensionsminimizetheeffectsofstray light.Theminimumsizecorrespondstoaconeangleof30andthemaximumsizecorrespondstoaconeangleof60.
IR TRANSPARENT WINDOW
OPAQUE MATERIAL
Y
IR TRANSPARENT WINDOW
X K
OPAQUE MATERIAL
Z
A
D
T
Z
IR TRANSPARENT WINDOW
Inthefigureabove,Xisthewidthofthewindow,YistheheightofthewindowandZisthedistancefromtheASDL3023tothebackofthewindow.ThedistancefromthecenteroftheLEDlenstothecenterofthephotodiodelens,K,is 5.5mm.Theequationsforcomputingthewindowdimensionsareasfollows: X=K+2*(Z+D)*tanA Y=2*(Z+D)*tanA Theaboveequationsassumethatthethicknessofthewindowisnegligiblecomparedtothedistanceofthemodule fromthebackofthewindow(Z).Iftheyarecomparable, W1=0.33*T, W2=0.66*T, whereTisthewindowthicknessandtherefractiveindexofthewindowmaterialis1.586. The depth of the LED image inside the ASDL-3023, D, is 3.17mm.`A' is the required half angle for viewing. For IrDA compliance,theminimumis15andthemaximumis30.Theequationsresultinthefollowingtablesandgraphs.The graphsareplottedassumingthatthethicknessofthewindowisnegligible. Module Depth (Z) mm
0 1 2 3 4 5 6 7 8 9
Aperture Width (X, mm) Min
7.20+W1 7.73+W1 8.27+W1 8.81+W1 9.34+W1 9.88+W1 10.41+W1 10.95+W1 11.49+W1 12.02+W1
Aperture Width (X) vs Module Depth (Z) 16.00 Aperture Height (Y) mm 14.00 12.00 10.00 8.00 6.00 4.00 2.00 0.00 0 1 2
Aperture height (Y, mm) Max Min
1.70+W1 2.23+W1 2.77+W1 3.31+W1 3.84+W1 4.38+W1 4.91+W1 5.45+W1 5.99+W1 6.52+W1
Max
3.66+W2 4.82+W2 5.97+W2 7.12+W2 8.28+W2 9.43+W2 10.59+W2 11.74+W2 12.90+W2 14.05+W2
9.16+W2 10.32+W2 11.47+W2 12.62+W2 13.78+W2 14.93+W2 16.09+W2 17.24+W2 18.40+W2 19.55+W2
22.00 20.00 18.00 16.00 14.00 12.00 10.00 8.00 6.00 4.00 2.00 0.00
Aperture Height (Y) vs Module Depth (Z)
Ymin Ymax
Aperture Width (X) mm
Xmin Xmax
0
1
2
3 4 5 6 Module Depth (Z) mm
7
8
9
3 4 5 6 7 Module Depth (Z) mm
8
9
Itisrecommendedthatthetoleranceforassemblybeconsideredaswell.Therecommendedminimumwindowsize whichwilltakeintoaccountoftheassemblytoleranceisdefinedas: Xmin+assemblytolerance=Xmin+2*(assemblytolerance)(Dimensionsareinmm) Ymin+assemblytolerance=Ymin+2*(assemblytolerance)(Dimensionsareinmm)
Window Material
Almost any plastic material will work as a window material. Polycarbonate is recommended. The surface finish of the plastic should be smooth, without any texture. An IR filter dye may be used in the window to make it look black to the eye, but the total optical loss of the window should be 10% or less for best optical performance. Light loss should be measured at 875 nm. Therecommendedplasticmaterialsforuseasacosmetic windowareavailablefromGeneralElectricPlastics.
Shape of the Window
From an optics standpoint, the window should be flat. This ensures that the window will not alter either the radiationpatternoftheLED,orthereceivepatternofthe photodiode.Ifthewindowmustbecurvedformechanicalorindustrialdesignreasons,placethesamecurveon thebacksideofthewindowthathasanidenticalradiusas thefrontside.Whilethiswillnotcompletelyeliminatethe lenseffectofthefrontcurvedsurface,itwillsignificantly reducetheeffects.Theamountofchangeintheradiation pattern is dependent upon the material chosen for the window,theradiusofthefrontandbackcurves,andthe distance from the back surface to the transceiver. Once theseitemsareknown,alensdesigncanbemadewhich will eliminate the effect of the front surface curve. The followingdrawingsshowtheeffectsofacurvedwindow ontheradiationpattern.Inallcases,thecenterthickness ofthewindowis1.5mm,thewindowismadeofpolycarbonate plastic, and the distance from the transceiver to thebacksurfaceofthewindowis3mm.
Recommended Plastic Materials:
Material #
Lexan141 Lexan920A Lexan940A
Light Transmission
88% 85% 85%
Haze
1% 1% 1%
Refractive Index
1.586 1.586 1.586
Note:920Aand940Aaremoreflameretardantthan141.
RecommendedDye:Violet#21051 (IRtransmissantabove625mm)
Flat Window, (First Choice)
Curved Front and Back, (Second Choice)
Curved Front, Flat Back, (Do not use)
Appendix F: General Application Guide for the ASDL-3023 Remote Control Drive Modes
The ASDL-3023 can operate in the single-TxD programmablemodeorthetwo-TxDdirecttransmissionmode.
Two-TxD Direct Transmission Mode
In the two-TxD direct transmission mode, the LED can bedrivenseparatelyforIrDAandRCmodeofoperation through the TxD_IR and TxD_RC pins respectively. This mode can be used when the external controller utilizes separatetransmitpinsforIrDAandRCoperationmodes, therebyeliminatingtheneedforexternalmultiplexing. Please refer to the Transceiver I/O truth table for more detail. Transceiver Control I/O Truth Table for Two-TxD Direct TransmissionMode SD
0 0 0 0 1
Single-TxD Programmable Mode
In the single-TxD programmable mode, only one input pin (TxD_IR input pin) is used to drive the LED in both IrDAmodeaswellasRemoteControlmodeofoperation. Thismodecanbeusedwhentheexternalcontrolleruses only one transmit pin for both IrDA as well RC mode of operation. transceiver is in default mode (IrDA-SIR) when powered up.Theuserneedstoapplythefollowingprogramming sequencetoboththeTxD_IRandSDinputstoenablethe transceivertooperateineithertheIrDAorremotecontrol mode.
TxIR
0 0 1 1 0
TxRC
0 1 0 1 0
LED
OFF ON ON OFF
Remarks
IRRxenabled.Idlemode Remotecontroloperation IrDATxoperation Notrecommended (BothTransmittersoff ) Shutdownmode*
* Theshutdownconditionwillsetthetransceivertothedefaultmode (IrDA-SIR) tC tTL SHUTDOWN (ACTIVE HIGH) TxIR (ACTIVE HIGH) SHUTDOWN TxRC (GND) DRIVE IrDA LED RC MODE DRIVE RC LED DRIVE IrDA LED tA tB tH tH tC tH
RESET
Mode Programming Timing Table
Thefollowingtimingsdescribeinputconstraintsrequiredusingtheactiveserialinterfaceformodeprogrammingwith pinsSD,TxIR,andTxRC: Parameter
Shutdowninputpulsewidth,atpinSD SDmodesetuptime TxIRpulsewidthforRCmode SDprogrammingpulsewidth Note:(tA+tB)Symbol
tSDPW tA tB tC tS tH
Min
30 200 200 50 50
Typ
-
Max
5.0 -
Unit
s Ns Ns s Ns Ns
Notes
Willactivate completeshutdown Setupformode programming RCdriveenabled withpinTxIR Pulsewidthmode programming SetuptimeforIrDA bandwidthselection HoldtimeforIrDAorRC modes
4
Bandwidth Selection Timing
The power on state should be the IrDA SIR mode. The data transfer rate must be set by a programming sequence using the TxD_IR and SD inputs as described below. Note: SD should not exceed the maximum, tC 5s, to preventshutdown.
Setting to the High Bandwidth MIR/FIR Mode (0.576Mbits/s to 4Mbits/s)
1. SetSDinputtologic"HIGH".WaittA200ns 2. SetTxD_IRinputtologic"HIGH".WaittS50ns. 3. SetSDtologic"LOW"(thisnegativeedgelatchesstate ofTxD_IR,whichdeterminesspeedsetting). 4. After waiting tH 50ns TxD_IR can be set to logic "LOW". TxD_IR is now re-enabled as normal IrDA transmitinputfortheHighBandwidthMIR/FIRmode.
Setting to the LOW Bandwidth SIR Mode (2.4kbits/s to 115.2kbits/s)
1. SetSDinputtologic"HIGH". 2. SetTxIRinputtologic"LOW".WaittS50ns. 3. SetSDtologic"LOW"(thisnegativeedgelatchesstate ofTxIR,whichdeterminesspeedsetting). 4. TxIRmustbeheldfortS50ns.TxIRisnowre-enabled asnormalIrDAtransmitinputfortheLowBandwidth SIRmode.
50%
SD
tA 50% TxI R
tC tS
50%
tH
High: MIR/FIR
50%
Low: SIR
Power-Up Sequencing
TohaveaproperoperationforASDL-3023,thefollowingpower-upsequencingmustbefollowed. (a)It'sstronglyrecommendedthatVccmustcomepriortoIOVcc.
V CC IOV CC t SDDL > 30us - SD t SDPW > 30us - t IOVccDL > 0us -
(b)ItisnotrecommendedtoturnonIOVccbeforeVccwhileSDislow. However,forapplicationthatIOVcccomepriortoVccwhileSDislow,SDpinhastosethightoassureproperfunctionality.
V CC IOV CC SD t SDDL > 30us - t SDPW > 30us -
(c)SettingIOVcchighbeforeVccwhileSDishighisforbidden.
V CC IOV CC SD Note: t IOVccDL : IOVcc delay time t SDDL : SD delay time t SDPW : Shutdown Input Pulse Width
For company and product information, please go to our web site: WWW.liteon.com or
http://optodatabook.liteon.com/databook/databook.aspx
Data subject to change. Copyright (c) 00 Lite-On Technology Corporation. All rights reserved.

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