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LITE-ON TECHNOLOGY CORPORATOIN
Property of Lite-On Only
Features
* Low power consumption. * High efficiency. * Versatile mounting on p.c. board or CBI. * I.C. compatible/low current requirement. * Narrow viewing angle for more brightness.
Package Dimensions
Part No.
LTL102SFK Notes:
Lens
Water Clear
Source Color
AlInGaP Yellow Orange
1. All dimensions are in millimeters (inches). 2. Tolerance is 0.25mm(.010") unless otherwise noted. 3. Protruded resin under flange is 1.0mm(.04") max. 4. Lead spacing is measured where the leads emerge from the package. 5. Specifications are subject to change without notice. Part No. : LTL102SFK BNS-OD-C131/A4 Page : 1 of 8
LITE-ON TECHNOLOGY CORPORATOIN
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Absolute Maximum Ratings at TA=25
Parameter Power Dissipation Peak Forward Current (1/10 Duty Cycle, 0.1ms Pulse Width) Continuous Forward Current Derating Linear From 50 Reverse Voltage Operating Temperature Range Storage Temperature Range Lead Soldering Temperature [1.6mm(.063") From Body] 90 50 0.6 5 -40 to + 100 -55 to + 100 260 for 5 Seconds mA mA mA/ V Maximum Rating 120 Unit mW
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LITE-ON TECHNOLOGY CORPORATOIN
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Electrical / Optical Characteristics at TA=25
Parameter
Symbol
Min.
Typ.
Max.
Unit
Test Condition IF = 20mA Note 1 Note 2 (Fig.5) Measurement @Peak (Fig.1) Note 4
Luminous Intensity
IV 21/2 P d
4500
7200
mcd
Viewing Angle
15
deg
Peak Emission Wavelength
610
nm
Dominant Wavelength
605
nm
Spectral Line Half-Width
17
nm
Forward Voltage
VF
2.0
2.4
V A
IF = 20mA
Reverse Current
IR
100
VR = 5V
Capacitance
C
40
pF
VF = 0 , f = 1MHz
NOTE: 1. Luminous intensity is measured with a light sensor and filter combination that approximates the CIE eye-response curve. 2. 1/2 is the off-axis angle at which the luminous intensity is half the axial luminous intensity. 3. Iv classification code is marked on each packing bag. 4. The dominant wavelength, d is derived from the CIE chromaticity diagram and represents the single wavelength which defines the color of the device.
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LITE-ON TECHNOLOGY CORPORATOIN
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Typical Electrical / Optical Characteristics Curves
(25 Ambient Temperature Unless Otherwise Noted)
Part No. : LTL102SFK BNS-OD-C131/A4
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LITE-ON TECHNOLOGY CORPORATOIN
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Bin Code List For Reference
Luminous Intensity Bin Code V W X Y Min. 4500 5500 7200 9300 Unit : mcd @20mA Max. 5500 7200 9300 12000
Dominant Wavelength Bin Code H23 H24 H25 Min. 600.0 603.0 606.5
Unit : nm @20mA Max. 603.0 606.5 610.0
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LITE-ON TECHNOLOGY CORPORATOIN
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CAUTIONS
1. Application
The LEDs described here are intended to be used for ordinary electronic equipment (such as office equipment, communication equipment and household applications).Consult Lite-on's Sales in advance for information on applications in which exceptional reliability is required, particularly when the failure or malfunction of the LEDs may directly jeopardize life or health (such as in aviation, transportation, traffic control equipment, medical and life support systems and safety devices).
2. Storage
The storage ambient for the LEDs should not exceed 30C temperature or 70% relative humidity . It is recommended that LEDs out of their original packaging are used within three months. For extended storage out of their original packaging, it is recommended that the LEDs be stored in a sealed container with appropriate desiccant or in a dessicator with nitrogen ambient.
3. Cleaning
Use alcohol-based cleaning solvents such as isopropyl alcohol to clean the LEDs if necessary.
4. Lead Forming & Assembly
During lead forming, the leads should be bent at a point at least 3mm from the base of LED lens. Do not use the base of the leadframe as a fulcrum during forming. Lead forming must be done before soldering, at normal temperature. During assembly on PCB, use minimum clinch force possible to avoid excessive mechanical stress.
5. Soldering
When soldering, leave a minimum of 2mm clearance from the base of the lens to the soldering point. Dipping the lens into the solder must be avoided. Do not apply any external stress to the lead frame during soldering while the LED is at high temperature. Recommended soldering condition : Soldering iron Temperature Soldering time 300C Max. 3 sec. Max. (one time only) Wave soldering
100C Max. Pre-heat 60 sec. Max. Pre-heat time 260C Max. Solder wave 10 sec. Max. Soldering time Note.: Excessive soldering temperature and / or time might result in deformation of the LED lens or catastrophic failure of the LED. Part No. : LTL102SFK BNS-OD-C131/A4 Page : 6 of 8
LITE-ON TECHNOLOGY CORPORATOIN
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6. Drive Method An LED is a current operated device. In order to ensure intensity uniformity on multiple LEDs connected in parallel in an application, it is recommended that a current limiting resistor be incorporated in the drive circuit. in series with each LED as shown in Circuit A below. (A) Recommended circuit. Circuit model A
LED
Circuit model B
LED
(B) The brightness of each LED might appear different due to the differences in the I-V characteristics of those LEDs
7. ESD (Electrostatic Discharge) Static Electricity or power surge will damage the LED. Suggestions to prevent ESD damage: Use a conductive wrist band or anti- electrostatic glove when handling these LEDs. All devices, equipment and machinery must be properly grounded. Work tables , storage racks , etc. should be properly grounded. Use ion blower to neutralize the static charge which might have built up on surface of the LED's plastic lens as a result of friction between LEDs during storage and handling. ESD-damaged LEDs will exhibit abnormal characteristics such as high reverse leakage current, low forward voltage, or "no lightup" at low currents. To verify for ESD damage, check for "lightup" and Vf of the suspect LEDs at low currents. The Vf of "good" LEDs should be >2.0V@0.1mA for InGaN product and >1.4V@0.1mA for AlInGaP product. Chip ESD level InGaN/Sapphire AlInGaP InGaN / SiC Machine Mode 100 V 200 V 600 V Human Body Mode 300 V 500 V 1000 V
8. Reliability Test
Classification Test Item Test Condition
Ta= UNDER ROOM TEMPERATURE AS PER DATA SHEET MAXIMUM RATING *TEST TIME= 1000HRS (-24HRS, +72HRS)
Reference Standard
MIL-STD-750D : 1026 (1995) MIL-STD-883D : 1005 (1991) JIS C 7021 : B-1 (1982)
ENDURANCE TEST OPERATION LIFE
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LITE-ON TECHNOLOGY CORPORATOIN
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Classification
Test Item
Ta= 655 RH= 90 95%
Test Condition
Reference Standard
MIL-STD-202F: 103B(1980) JIS C 7021 : B-11(1982)
ENDURANCE TEST HIGH TEMPERATURE HIGH HUMIDITY STORAGE HIGH TEMPERATURE HIGH HUMIDITY REVERSE BIAS HIGH TEMPERATURE STORAGE LOW TEMPERATURE STORAGE ENVIRONMENTAL TEST TEMPERATURE CYCLING
TEST TIME= 240HRS2HRS
Ta= 655 RH= 90 95% VR=5V TEST TIME= 500HRS (-24HRS, +48HRS) Ta= 1055 TEST TIME= 1000HRS (-24HRS, +72HRS)
JIS C 7021 : B-11(1982)
MIL-STD-883D : 1008 (1991) JIS C 7021 : B-10 (1982)
Ta= -555 TEST TIME= 1000HRS (-24HRS, +72HRS)
JIS C 7021 : B-12 (1982)
105 25 -55 25 30mins 5mins 30mins 5mins
MIL-STD-202F : 107D (1980) MIL-STD-750D : 1051(1995) MIL-STD-883D : 1010 (1991) JIS C 7021 : A-4(1982)
10CYCLES
THERMAL SHOCK 105 5 -55 5 10mins 10CYCLES SOLDER RESISTANCE T.sol= 260 5 DWELL TIME= 10 1secs 10mins
MIL-STD-202F : 107D(1980) MIL-STD-750D : 1051(1995) MIL-STD-883D : 1011 (1991) MIL-STD-202F : 210A(1980) MIL-STD-750D : 2031(1995) JIS C 7021 : A-1(1982)
SOLDERABILITY
T.sol= 230 5 DWELL TIME= 5 1secs
MIL-STD-202F : 208D(1980) MIL-STD-750D : 2026(1995) MIL-STD-883D : 2003(1991) JIS C 7021 : A-2(1982)
9. Others The appearance and specifications of the product may be modified for improvement, without prior notice. Part No. : LTL102SFK BNS-OD-C131/A4 Page : 8 of 8

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