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 MicromodulTM-Steckverbinder, Raster 1,27 mm MicromodulTM connectors, pitch 1.27 mm Connecteurs MicromodulTM, pas 1,27 mm
MICS MICS-D MicromodulTM-Messerleiste, stehend MICS: mit Haltekrallen, Lotkontakte doppelreihig versetzt MICS-D: ohne Haltekrallen, Lotkontakte doppelreihig parallel
1. Temperaturbereich -40 C/+105 C PA GF CuZn, unternickelt und verzinnt, vergoldet auf Anfrage
MICS
MICS-D
2. Werkstoffe Kontakttrager Kontaktmesser 3. Mechanische Daten
Reg.-Nr. B584
(R) (R)
Reg.-Nr. B584
Ausdruckkraft Kontaktmesser aus Kontakttrager Kontaktierung mit 4. Elektrische Daten Bemessungsstrom Bemessungsspannung1 Prufspannung Isolationswiderstand nach DIN EN 60664/IEC 60664
7N Steckverbinder MICA 1,2 A 32 V AC 750 V/60 s > 1 G
1
MICS
MICS-D
*b
*e *g *f *g
www.lumberg.com
11/2009
MicromodulTM-Steckverbinder, Raster 1,27 mm MicromodulTM connectors, pitch 1.27 mm Connecteurs MicromodulTM, pas 1,27 mm
MICS MICS-D MicromodulTM tab header, upright MICS: with retaining hooks, solder contacts dual row staggered MICS-D: without retaining hooks, solder contacts dual row parallel
1. Temperature range 2. Materials Insulating body Contact tab 3. Mechanical data Expression force contact tab from insulating body Mating with 4. Electrical data Rated current Rated voltage1 Test voltage Insulation resistance
1
MICS MICS-D Reglette a couteaux MicromodulTM, droite MICS: avec crochets de fixation, contacts a souder sur deux rangees espacees MICS-D: sans crochets de fixation, contacts a souder sur deux rangees paralleles
1. Temperature d'utilisation 2. Materiaux Corps isolant Contact a couteau 3. Caracteristiques mecaniques Force d'expression contact a couteau du corp isolant Raccordement avec 4. Caracteristiques electriques Courant assigne Tension assignee1 Tension d'essai Resistance d'isolement 1 suivant DIN EN 60664/CEI 60664 -40 C/+105 C PA GF CuZn, sous-nickele et etame, dore sur demande 7N connecteurs MICA 1,2 A 32 V AC 750 V/60 s > 1 G
-40 C/+105 C PA GF CuZn, pre-nickeled and tinned, gilded on request
7N connectors MICA 1.2 A 32 V AC 750 V/60 s > 1 G
according to DIN EN 60664/IEC 60664
*a gekropfter Lotkontakt (ab 20-polig) bended solder contact (from 20 poles on) contact a souder coude (a partir de 20 poles) *b Kontakt 1 contact 1 *c Freiraum fur Werkzeug (Abziehzange AZ30) space for tool (pull-off tongs AZ30) espace pour outil (pince de separation AZ30) *d Bestuckungsflache (A x 7) component area (A x 7) espace a equiper (A x 7) *e Lochbild in der Leiterplatte, von der Lotseite gesehen printed circuit board layout, solder side view modele de la carte imprimee, vue du cote a souder *f Bohrung fur gekropften Lotkontakt bore hole for bended solder contact percage pour contact a souder coude
*g Lochbild in der Leiterplatte, von der Lotseite gesehen, fur Polzahlen 20 und 26, mit Bohrungen fur gekropfte Lotkontakte printed circuit board layout, solder side view, for pole numbers 20 and 26, with bore holes for bended solder contacts modele de la carte imprimee, vue du cote a souder, pour nombre de poles 20 et 26, avec percages pour contacts a souder coudes
Bestellbezeichnung Designation Designation
Polzahl Poles Poles
Verpackungseinheit Package unit Unite d'emballage
Abmessungen Dimensions Dimensions A (mm) B (mm)
MICS 04 MICS 06 MICS 08 MICS 10 MICS 12 MICS 14 MICS 16 MICS 18 MICS 20 MICS 26 MICS-D 04 MICS-D 06 MICS-D 08 MICS-D 10 MICS-D 12 MICS-D 14 MICS-D 16 MICS-D 18 MICS-D 20 MICS-D 26
4 6 8 10 12 14 16 18 20 26 4 6 8 10 12 14 16 18 20 26
1000 1000 1000 1000 500 500 500 500 500 500 1000 1000 1000 1000 500 500 500 500 500 500
8,86 11,40 13,94 16,48 19,02 21,56 24,10 26,64 29,18 36,80 8,86 11,40 13,94 16,48 19,02 21,56 24,10 26,64 29,18 36,80
7,41 9,95 12,49 15,03 17,57 20,11 22,65 25,19 27,73 35,35 7,41 9,95 12,49 15,03 17,57 20,11 22,65 25,19 27,73 35,35
Verpackung: lose im Karton Packaging: in bulk, in a cardboard box Emballage: en vrac, dans un carton
www.lumberg.com
11/2009


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